INTEL 82845MX

R
Intel® 845 Family Chipset-Mobile:
82845MP/82845MZ Chipset Memory
Controller Hub Mobile (MCH-M)
Datasheet
April 2002
Order Number: 250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in
medical, life saving, or life sustaining applications.
Actual system-level properties, such as skin temperature, are a function of various factors, including component placement, component power
characteristics, system power and thermal management techniques, software application usage and general system design. Intel is not responsible for its
customers’ system designs, nor is Intel responsible for ensuring that its customers’ products comply with all applicable laws and regulations. Intel provides
this and other thermal design information for informational purposes only. System design is the sole responsibility of Intel’s customers, and Intel’s customers
should not rely on any Intel-provided information as either an endorsement or recommendation of any particular system design characteristics.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future
definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The 845MP/845 MZ Memory Controller Hub (MCH-M) may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
I2C is a 2-wire communications bus/protocol developed by Philips. SMBus is a subset of the I2C bus/protocol and was developed by Intel. Implementations
of the I2C bus/protocol may require licenses from various entities, including Philips Electronics N.V. and North American Philips Corporation.
Alert on LAN* is a result of the Intel-IBM Advanced Manageability Alliance and a trademark of IBM
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from:
Intel Corporation
www.intel.com
or call 1-800-548-4725
Intel®, Pentium®, and SpeedStep™ are registered trademarks or trademarks of Intel Corporation and its subsidiaries in the United States and other
countries.
*Other brands and names may be claimed as the property of others.
Copyright © Intel Corporation 2002
2
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Contents
1.
Overview .................................................................................................................................... 14
1.1.
1.2.
1.3.
1.4.
1.5.
1.6.
1.7.
2.
Signal Description ...................................................................................................................... 20
2.1.
2.2.
2.3.
2.4.
2.5.
2.6.
2.7.
3.
Host Interface Signals ................................................................................................... 21
DDR Interface................................................................................................................ 23
Hub Interface Signals .................................................................................................... 24
AGP Interface Signals ................................................................................................... 24
2.4.1.
AGP Addressing Signals ............................................................................. 24
2.4.2.
AGP Flow Control Signals ........................................................................... 25
2.4.3.
AGP Status Signals..................................................................................... 25
2.4.4.
AGP Strobes ............................................................................................... 26
2.4.5.
AGP/PCI Signals-Semantics ....................................................................... 27
Clocks, Reset, and Miscellaneous ................................................................................ 30
Voltage References, PLL Power ................................................................................... 31
Pin State Table .............................................................................................................. 31
Register Description................................................................................................................... 36
3.1.
3.2.
3.3.
3.4.
3.5.
3.6.
3.7.
250687-002
System Architecture ...................................................................................................... 15
Mobile Intel Pentium 4 Processor-M Host Interface .................................................... 15
1.2.1.
System Bus Error Checking ........................................................................ 16
System Memory Interface ............................................................................................. 16
AGP Interface................................................................................................................ 18
Hub Interface................................................................................................................. 18
MCH-M Clocking ........................................................................................................... 18
System Interrupts .......................................................................................................... 19
Conceptual Overview of the Platform Configuration Structure...................................... 36
Standard PCI Bus Configuration Mechanism................................................................ 36
Routing Configuration Accesses ................................................................................... 37
3.3.1.
PCI Bus #0 Configuration Mechanism ........................................................ 37
3.3.2.
Primary PCI and Downstream Configuration Mechanism........................... 37
3.3.3.
AGP Configuration Mechanism ................................................................... 38
MCH-M Register Introduction........................................................................................ 38
I/O Mapped Registers ................................................................................................... 39
3.5.1.
CONFIG_ADDRESS – Configuration Address Register............................. 39
3.5.2.
CONFIG_DATA - Configuration Data Register ........................................... 41
Memory Mapped Register Space .................................................................................. 42
3.6.1.
DRAMWIDTH—DRAM Width Register....................................................... 43
3.6.2.
DQCMDSTR – Strength Control Register for DQ and CMD Signal
Groups ........................................................................................................ 44
3.6.3.
CKESTR – Strength Control Register for CKE Signal Group ..................... 45
3.6.4.
CSBSTR – Strength Control Register for CS# Signal Group...................... 46
3.6.5.
CKSTR – Strength Control Register for CK Signal Group (CK / CK#)........ 47
3.6.6.
RCVENSTR – Strength Control Register for RCVENOUT# Signals........... 48
Host-Hub Interface Bridge Device Registers – Device #0............................................. 48
3.7.1.
VID – Vendor Identification Register – Device#0 ........................................ 51
3.7.2.
DID – Device Identification Register – Device#0......................................... 51
3.7.3.
PCICMD – PCI Command Register – Device #0 ........................................ 52
3.7.4.
PCISTS – PCI Status Register – Device #0................................................ 53
Datasheet
3
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.5.
3.7.6.
3.7.7.
3.7.8.
3.7.9.
3.7.10.
3.7.11.
3.7.12.
3.7.13.
3.7.14.
3.7.15.
3.7.16.
3.7.17.
3.7.18.
3.7.19.
3.7.20.
3.7.21.
3.7.22.
3.7.23.
3.7.24.
3.8.
4
RID – Revision Identification Register – Device #0..................................... 54
SUBC – Sub-Class Code Register – Device #0.......................................... 54
BCC – Base Class Code Register – Device #0........................................... 54
MLT – Master Latency Timer Register – Device #0.................................... 55
HDR – Header Type Register – Device #0 ................................................. 55
APBASE – Aperture Base Configuration Register – Device #0 .................. 56
SVID – Subsystem Vendor ID – Device #0 ................................................. 57
SID – Subsystem ID – Device #0 ................................................................ 57
CAPPTR – Capabilities Pointer – Device #0............................................... 57
AGPM- AGP Miscellaneous Configuration.................................................. 58
DRB[0:7] – DRAM Row Boundary Registers – Device #0 .......................... 58
DRA[0:7] – DRAM Row Attribute Registers – Device #0 ............................ 59
DRT – DRAM Timing Register – Device #0 ................................................ 60
DRC – DRAM Controller Mode Register – Device #0 ................................. 61
DERRSYN – DRAM Error Syndrome Register ........................................... 63
EAP – Error Address Pointer Register – Device #0 .................................... 63
PAM[0:6] – Programmable Attribute Map Registers – Device #0 ............... 64
FDHC – Fixed DRAM Hole Control Register – Device #0........................... 68
SMRAM – System Management RAM Control Register – Device #0 ......... 69
ESMRAMC – Extended System Mgmt RAM Control Register
– Device #0 ................................................................................................. 70
3.7.25.
ACAPID – AGP Capability Identifier Register – Device #0.......................... 71
3.7.26.
AGPSTAT – AGP Status Register – Device #0 .......................................... 72
3.7.27.
AGPCMD – AGP Command Register – Device #0..................................... 73
3.7.28.
AGPCTRL – AGP Control Register............................................................. 74
3.7.29.
APSIZE – Aperture Size – Device #0 .......................................................... 75
3.7.30.
ATTBASE – Aperture Translation Table Base Register – Device #0.......... 76
3.7.31.
AMTT – AGP Interface Multi-Transaction Timer Register – Device #0 ...... 77
3.7.32.
LPTT – AGP Low Priority Transaction Timer Register – Device #0............ 78
3.7.33.
TOM – Top of Low Memory Register – Device #0 ...................................... 79
3.7.34.
MCH-MCFG – MCH-M Configuration Register – Device #0 ....................... 80
3.7.35.
ERRSTS – Error Status Register – Device #0 ............................................ 81
3.7.36.
ERRCMD – Error Command Register – Device #0 .................................... 82
3.7.37.
SMICMD – SMI Command Register – Device #0 ....................................... 83
3.7.38.
SCICMD – SCI Command Register – Device #0 ........................................ 83
3.7.39.
SKPD – Scratchpad Data – Device #0........................................................ 84
3.7.40.
CAPID – Product Specific Capability Identifier ............................................ 84
AGP Bridge Registers – Device #1 ............................................................................... 85
3.8.1.
VID1 – Vendor Identification Register – Device #1 ..................................... 87
3.8.2.
DID1 – Device Identification Register – Device #1...................................... 87
3.8.3.
PCICMD1 – PCI-PCI Command Register – Device #1............................... 88
3.8.4.
PCISTS1 – PCI-PCI Status Register – Device #1....................................... 89
3.8.5.
RID1 – Revision Identification Register – Device #1................................... 90
3.8.6.
SUBC1- Sub-Class Code Register – Device #1.......................................... 90
3.8.7.
BCC1 – Base Class Code Register – Device #1......................................... 91
3.8.8.
MLT1 – Master Latency Timer Register – Device #1.................................. 91
3.8.9.
HDR1 – Header Type Register – Device #1 ............................................... 91
3.8.10.
PBUSN1 – Primary Bus Number Register – Device #1 .............................. 92
3.8.11.
SBUSN1 – Secondary Bus Number Register – Device #1 ......................... 92
3.8.12.
SUBUSN1 – Subordinate Bus Number Register – Device #1 .................... 92
3.8.13.
SMLT1 – Secondary Master Latency Timer Register – Device #1 ............. 93
3.8.14.
IOBASE1 – I/O Base Address Register – Device #1 .................................. 94
3.8.15.
IOLIMIT1 – I/O Limit Address Register – Device #1 ................................... 94
3.8.16.
SSTS1 – Secondary PCI-PCI Status Register – Device #1 ........................ 95
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.8.17.
3.8.18.
3.8.19.
3.8.20.
3.8.21.
3.8.22.
3.8.23.
3.8.24.
4.
System Address Map ............................................................................................................... 105
4.1.
4.2.
4.3.
4.4.
4.5.
5.
Memory Address Ranges ............................................................................................ 105
4.1.1.
VGA and MDA Memory Space.................................................................. 106
4.1.2.
PAM Memory Spaces................................................................................ 107
4.1.3.
ISA Hole Memory Space ........................................................................... 108
4.1.4.
TSEG SMM Memory Space ...................................................................... 108
4.1.5.
System Bus Interrupt APIC Memory Space .............................................. 109
4.1.6.
High SMM Memory Space ........................................................................ 109
4.1.7.
AGP Aperture Space (Device #0 BAR) ..................................................... 109
4.1.8.
AGP Memory and Prefetchable Memory................................................... 109
4.1.9.
Hub Interface A Subtractive Decode ......................................................... 110
AGP Memory Address Ranges ................................................................................... 110
4.2.1.
AGP DRAM Graphics Aperture ................................................................. 110
System Management Mode (SMM) Memory Range ................................................... 111
4.3.1.
SMM Space Definition............................................................................... 111
4.3.2.
SMM Space Restrictions ........................................................................... 112
I/O Address Space ...................................................................................................... 112
MCH-M Decode Rules and Cross-Bridge Address Mapping ...................................... 112
4.5.1.
Decode Rules for the Hub Interface A ...................................................... 112
4.5.2.
AGP Interface Decode Rules .................................................................... 113
Functional Description.............................................................................................................. 114
5.1.
5.2.
5.3.
250687-002
MBASE1 – Memory Base Address Register – Device #1 ........................... 96
MLIMIT1 – Memory Limit Address Register – Device #1............................ 97
PMBASE1 – Prefetchable Memory Base Address Register – Device #1 ... 98
PMLIMIT1 – Prefetchable Memory Limit Address Register – Device #1 .... 99
BCTRL1 – PCI-PCI Bridge Control Register – Device #1 ......................... 100
ERRCMD1 – Error Command Register – Device #1 ................................ 101
DWTMC – DRAM Write Thermal Management Control ........................... 102
DRTMC – DRAM Read Thermal Management Control ............................ 104
Host Interface Overview .............................................................................................. 114
5.1.1.
Dynamic Bus Inversion.............................................................................. 114
5.1.2.
System Bus Interrupt Delivery................................................................... 114
5.1.3.
Upstream Interrupt Messages................................................................... 115
System Memory Interface ........................................................................................... 115
5.2.1.
DDR Interface Overview............................................................................ 115
5.2.2.
Memory Organization and Configuration................................................... 116
5.2.2.1.
Configuration Mechanism for SO-DIMMs..................................... 116
5.2.2.1.1.
Memory Detection and Initialization............................ 116
5.2.2.1.2.
SMBus Configuration and Access of the Serial
Presence Detect Ports................................................ 116
5.2.2.1.3.
Memory Register Programming ................................. 116
5.2.3.
DRAM Performance Description ............................................................... 117
5.2.3.1.
Data Integrity (ECC) ..................................................................... 117
AGP Interface Overview.............................................................................................. 117
5.3.1.
AGP Target Operations............................................................................. 118
5.3.2.
AGP Transaction Ordering........................................................................ 119
5.3.3.
AGP Signal Levels .................................................................................... 119
5.3.4.
4x AGP Protocol........................................................................................ 119
5.3.5.
Fast Writes ................................................................................................ 119
5.3.6.
AGP FRAME# Transactions on AGP........................................................ 120
Datasheet
5
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
5.3.6.1.
5.4.
5.5.
5.6.
6.
MCH-M Target and Initiator Operations for AGP FRAME#
Transactions ................................................................................. 120
Power and Thermal Management ............................................................................... 122
5.4.1.
Various States ........................................................................................... 123
5.4.2.
General Description of Supported CPU States ......................................... 123
5.4.3.
General Description of ACPI System States ............................................. 124
5.4.4.
Power Transitions...................................................................................... 124
®
5.4.5.
Intel SpeedStep Technology.................................................................... 125
MCH-M Clocking ......................................................................................................... 125
MCH-M System Reset and Power Sequencing........................................................... 125
Electrical Characteristics.......................................................................................................... 126
6.1.
6.2.
6.3.
Absolute Maximum Ratings......................................................................................... 126
Thermal Characteristics .............................................................................................. 126
Power Characteristics ................................................................................................. 127
7.
Signal Groups .......................................................................................................................... 128
8.
DC Characteristics ................................................................................................................... 130
9.
Ballout and Package Information ............................................................................................. 133
9.1.
9.2.
9.3.
9.4.
6
Ballout Diagram ........................................................................................................... 133
Ballout Table................................................................................................................ 135
Package Mechanical Information ................................................................................ 139
Testability .................................................................................................................... 143
9.4.1.
XOR Test Mode Initialization..................................................................... 143
9.4.2.
XOR Chains .............................................................................................. 144
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Figures
®
Figure 1. Intel 845MP/845MZ Chipset System Block Diagram .............................................. 14
Figure 2. Configuration Address Register ................................................................................ 39
Figure 3. Configuration Data Register...................................................................................... 41
Figure 4. PAM Register Attributes............................................................................................ 66
Figure 5. Addressable Memory Space................................................................................... 105
Figure 6. Detailed DOS Compatible Area Address Map........................................................ 106
Figure 7. Detailed Extended Memory Range Address Map................................................... 108
Figure 8. MCH-M BGA Package Dimensions (Top View)...................................................... 139
Figure 9. MCH-M BGA Package Dimensions (Side View)..................................................... 140
Figure 10. MCH-M BGA Package Dimensions (Bottom View) .............................................. 141
Figure 11. XOR–Tree Chain .................................................................................................. 143
250687-002
Datasheet
7
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Tables
Table 1. DDR Memory Capacity .............................................................................................. 16
Table 2. DDR Device Configurations ....................................................................................... 17
Table 3. MCH-M Clock Ratio Table ......................................................................................... 19
Table 4. Host Interface Signal Descriptions............................................................................. 21
Table 5. DDR Interface Signal Descriptions ............................................................................ 23
Table 6. Hub Interface Signal Descriptions.............................................................................. 24
Table 7. AGP Addressing Signal Descriptions......................................................................... 24
Table 8. AGP Flow Control Signal Descriptions....................................................................... 25
Table 9. AGP Status Signal Descriptions................................................................................. 25
Table 10. AGP Strobe Descriptions ......................................................................................... 26
Table 11. AGP/PCI Signal Semantics Descriptions................................................................. 27
Table 12. Clocks, Reset, and Miscellaneous Descriptions ...................................................... 30
Table 13. Voltage Reference Descriptions .............................................................................. 31
Table 14. Host Signals ............................................................................................................. 32
Table 15. DDR Signals............................................................................................................. 33
Table 16. AGP Signals............................................................................................................. 34
Table 17. Clock/Miscellaneous Signals ................................................................................... 35
Table 18. Hub Interface Signals............................................................................................... 35
Table 19. Device Number Assignment .................................................................................... 36
Table 20. Nomenclature for Access Attributes ........................................................................ 48
Table 21. MCH-M Configuration Space for Device #0............................................................. 49
Table 22. Control Signals for Various Memory Segments ....................................................... 65
Table 23. PAM Register Details ............................................................................................... 67
Table 24. Nomenclature for Access Attributes ........................................................................ 85
Table 25. MCH-M Configuration Space - Device #1................................................................ 85
Table 26. SMM Space............................................................................................................ 111
Table 27. Relation of DBI Bits to Data Bits ............................................................................ 114
Table 28. Data Bytes on SO-DIMM Used for Programming DRAM Registers ...................... 117
Table 29. AGP Commands Supported by the MCH-M When Acting as an AGP Target....... 118
Table 30. Fast Write Initialization........................................................................................... 120
Table 31. PCI Commands Supported by the MCH-M When Acting as a FRAME# Target ... 120
Table 32. Power Management State Combinations .............................................................. 123
Table 33. Intel 845MP/845MZ Power Transitions .................................................................. 124
Table 34. Absolute Maximum Ratings ................................................................................... 126
Table 35. Intel 845MP/845MZ Chipset MCH-M Package Thermal Resistance..................... 126
Table 36. Power Characteristics ............................................................................................ 127
Table 37. Signal Groups ........................................................................................................ 128
Table 38. DC Characteristics ................................................................................................. 130
Table 39. Top View (Left Side)............................................................................................... 133
Table 40. Top View (Right Side) ............................................................................................ 134
Table 41. FCBGA Handling Zone Description ....................................................................... 142
Table 42. XOR Chains ........................................................................................................... 144
8
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Revision History
Rev.
250687-002
Description
Date
001
Initial release
March 2002
002
Included 845MZ data
April 2002
Datasheet
9
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Reference Documents
Document
Document
Number/Location
Mobile Intel® Pentium® 4 Processor-M and Intel® 845MP/845MZ Chipset Platform
Design Guide
www.developer.intel.com
Intel® 82801CAM I/O Controller Hub 3 (ICH3-M) Datasheet
www.developer.intel.com
®
www.developer.intel.com
®
Intel DDR266 JEDEC Specification Addendum, Revision 0.9
www.developer.intel.com
JEDEC Double Data Rate (DDR) SDRAM Specification, Revision 2.0
www.jedec.org
JEDEC PC2100 DDR SDRAM Un-buffered SO-DIMM Reference Design Specification
(includes PC1600 DDR SDRAM)
www.jedec.org
Accelerated Graphics Port Interface Specification Rev 2.0
http://www.agpforum.org/
PCI Local Bus Specification Rev. 2.1
www.pcisig.com
PCI-PCI Bridge Specification Rev. 1.0
www.pcisig.com
PCI Bus Power Management Interface Specification Rev. 1.0
www.pcisig.com
Advanced Configuration and Power Interface Specification (ACPI) Rev. 1.0b
www.teleport.com/~acpi/
Intel DDR200 JEDEC Specification Addendum, Revision 1.0
Note:
10
See Mobile Intel® Pentium® 4 Processor-M and Intel® 845MP/845MZ Chipset Platform Design Guide
for an expanded set of related documents.
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Terminology
MCH-M - The Mobile Memory Controller Hub-M component that contains the processor interface,
DRAM controller, and AGP interface. It communicates with the I/O controller hub (ICH3-M) and other
IO controller hubs over proprietary interconnect called the hub interface.
ICH3-M - The Mobile I/O Controller Hub 3-M component that contains the primary PCI interface, LPC
interface, USB, ATA-100, AC’97, and other IO functions. It communicates with the Intel®
845MP/845MZ Chipset MCH-M over a proprietary interconnect called hub interface.
Host - This term is used synonymously with processor.
Core - The internal base logic in the MCH-M.
System Bus - Processor-to-MCH-M interface. The Enhanced Mode of the Scalable Bus is the P6 Bus
plus enhancements, consisting of source synchronous transfers for address and data, and system bus
interrupt delivery. The Mobile Intel Pentium 4 Processor-M implements a subset of Enhanced Mode.
Hub interface - The proprietary hub interconnect that ties the MCH-M to the ICH3-M. In this document
hub interface cycles originating from or destined for the primary PCI interface on the ICH3-M is
generally referred to as hub interface cycles.
Accelerated Graphics Port (AGP) - Refers to the AGP interface that is in the MCH-M. It supports
AGP 2.0 compliant components only with 1.5V signaling level. PIPE# and SBA addressing cycles and
their associated data phases are generally referred to as AGP transactions. FRAME# cycles over the AGP
bus are generally referred to as AGP/PCI transactions.
PCI_A - The physical PCI bus, driven directly by the ICH3-M component. It supports 5-V, 32-bit, 33MHz PCI 2.2 compliant components. Communication between PCI_A and MCH-M occurs over hub
interface. Note: Even though it is referred to as PCI_A it is not PCI Bus #0 from a configuration
standpoint.
Full Reset - A Full MCH-M Reset is defined in this document when RSTIN# is asserted.
System Bus - Synonymous with Host or Front Side Bus
GART - Graphics Aperture Re-map Table. This table contains the page re-map information used during
AGP aperture address translations.
GTLB - Graphics Translation Look-aside Buffer. A cache used to store frequently used GART entries.
UP – Uniprocessor
DBI – Dynamic Bus inversion
MSI – Message Signaled Interrupts. MSI’s allow a device to request interrupt service via a standard
Memory Write transaction instead of through a hardware signal.
IPI – Inter Processor Interrupt
Word – 16 bits = 2 bytes
Dword (DW) – Doubleword: 32bits = 4 bytes
250687-002
Datasheet
11
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Qword (QW) – Quadword: 8bytes = 4 words
DQword (DQW) – Double Quadword: 16 bytes or 8 words. This is sometimes referred to as a
Superword (SW of Sword), and is also referred to as a “Cache Line”.
12
Datasheet
250687-002
R
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
Intel® 845 Chipset MCH-M Features
Processor/Host Bus Support
 Supports the Mobile Intel Pentium 4 Processor-M
CPU
 Supports the Intel Pentium 4 processor subset of
the Enhanced Mode Scaleable Bus Protocol
 2x Address, 4x Data
 Mobile Intel Pentium 4 Processor-M System Bus
interrupt delivery
 Supports system bus at 400 MT/s (100 MHz)
 Supports host bus Dynamic Bus Inversion (DBI)
 Supports 32-bit host bus addressing
 12 deep In-Order Queue
 AGTL+ bus driver technology with integrated
AGTL termination resistors
Memory System
 Directly supports one DDR channel, 64b wide (72b
with ECC).
 Supports 200 and 266-MHz DDR compliant
devices (845MZ supports 200 MHz DDR only)
 Supports 64-Mb, 128-Mb, 256-Mb and 512-Mb
technologies for x16 devices and x8 devices.
 All supported devices have 4 banks
 Configurable optional ECC operation (single bit
Error Correction and multiple bit Error Detection)
 Supports up to 16 simultaneous open pages
 Supports page sizes of 2 KB, 4 KB, 8 KB, and 16
KB. Page size is individually selected for every
row.
 Thermal throttling scheme to selectively throttle
reads and/or writes. Throttling can be triggered by
preset read/write bandwidth limits.
 Max of 2 double-sided (4 rows populated) with
unbuffered PC2100 DDR (with or without ECC)
SO-DIMMs (845MZ supports only 200-MHz
DDR).
 Largest memory supported is 1 GB (845MZ
supports only up to 512 MB).
System Interrupts
 Supports only System Bus interrupt delivery
mechanism
 Supports interrupts signaled as upstream Memory
Writes from AGP/PCI (PCI semantics only) and
hub interface
 MSI direct to the System Bus
 Supports peer MSI between hub interface and AGP
 Provides redirection for IPI and upstream
interrupts to the System Bus
250687-002
Datasheet
Accelerated Graphics Port (AGP) Interface
 Supports a single AGP device (either a connector
or on the motherboard)
 AGP Support
 Supports AGP 2.0 including 1x, 2x, and 4x AGP
data transfers and 2x/4x Fast Write protocol
 Supports only 1.5-V AGP electricals
 32 deep AGP request queue
 PCI semantic (FRAME# initiated) accesses to
DRAM are snooped
 High priority access support
 Hierarchical PCI configuration mechanism
 Delayed transaction support for AGP-to-DRAM
FRAME# semantic reads that can not be serviced
immediately
 32-bit upstream address support for inbound AGP
and PCI cycles
 32-bit downstream address support for outbound
PCI and Fast Write cycles
 AGP Busy/Stop Protocol
 AGP Clamping and Sense Amp Control
Hub Interface to ICH3-M
 266-MB/s, point-to-point hub interface to ICH3-M
 66-MHz base clock
 Supports the following traffic types to the ICH3-M
 Hub interface-to-AGP memory writes
 Hub interface-to-DRAM
 CPU-to-hub interface
 Messaging
 MSI Interrupt messages
 Power Management state change
 SMI, SCI and SERR error indication
Power Management
 SMRAM space remapping to A0000h (128 KB)
 Supports extended SMRAM space above 256 MB,
additional 128K/256K/512K TSEG from Top of
Memory, cacheable (cacheability controlled by
CPU)
 APM Rev 1.2 compliant power management
 Suspend to System Memory
 ACPI 2.0 Support
 Intel SpeedStep technology support
 Cache coherency with CPU in sleep mode
 Dynamic Memory Power-down
Package
 Package options
 593-pin FC-BGA (37.5 x 37.5 mm)
13
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
1.
Overview
®
Figure 1. Intel 845MP/845MZ Chipset System Block Diagram
®
Sys Mem
Intel® 845MP or
845MZ Chipset
(MCH-M)
AGP
USB
Sys Mem
®
Mobile Intel Pentium
4 Processor-M
PCI Bus
ICH3-M
AC’97 Codec
SIO
Device
AC’97 Codec
Primary & Secondary
IDE
FWH
The Intel 845MP/845MZ Chipset Memory Controller Hub-M (MCH-M) is designed for use with the
Mobile Intel Pentium 4 Processor-M. The Intel 845MP/845MZ Chipset MCH-M manages the flow of
information between its four interfaces: the System Bus, the memory interface, the AGP port, and the hub
interface. The MCH-M arbitrates between the four interfaces when each initiates an operation. While
doing so, the MCH-M must support data coherency via snooping and must perform address translation
for access to AGP Aperture memory.
The Intel 845MP/845MZ Chipset Memory Controller Hub-M (MCH-M) may contain design defects or
errors known as errata, which may cause the product to deviate from published specifications.
14
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
1.1.
System Architecture
The Intel 845MP/845MZ Chipset Memory Controller Hub-M (MCH-M) component provides the
processor interface, DRAM interface, AGP interface, and hub interface. The CPU interface supports the
Mobile Intel Pentium 4 Processor-M subset of the Extended Mode of the Scalable Bus Protocol. The
Intel 845MP/845MZ Chipset is optimized for the Mobile Intel Pentium 4 Processor-M. It supports a
single channel of DDR memory. The MCH-M contains advanced power management logic. The Intel
845MP/845MZ Chipset platform supports the third generation mobile I/O Controller Hub (ICH3-M) to
provide the features required by a mobile platform.
The Intel 845 Chipset-Mobile Family (MCH-M) is in a 593-pin FC-BGA package and contains the
following functionality:
• Supports single Mobile Intel Pentium 4 Processor-M configurations at 400 MT/s
• AGTL+ host bus with integrated termination supporting 32-bit host addressing
• 845MP supports up to 1 GB of PC2100 Memory
• 845MZ supports up to 512 MB of PC1600 Memory
• 1.5-V AGP interface with 4x SBA/PIPE# Data Transfer and Fast Write capability
• 1.8-V, 8-bit, 66-MHz 4x hub interface to ICH3-M
• Deeper Sleep
• Intel SpeedStep® technology
• Distributed arbitration for highly concurrent operation
1.2.
Mobile Intel Pentium 4 Processor-M Host Interface
The Intel 845MP/845MZ Chipset MCH-M is optimized for the Mobile Intel Pentium 4 Processor-M. The
primary enhancements over the Compatible Mode P6 bus protocol are:
• Source synchronous double pumped address
• Source synchronous quad pumped data
• System bus interrupt and side-band signal delivery
In this mode, the MCH-M supports a 64B cache line size. Only one processor is supported at a System
bus frequency of 400 MT/s. The MCH-M integrates AGTL+ termination resistors on all of the AGTL+
signals. The MCH-M supports 32-bit host addresses, allowing the CPU to access the entire 4 GB of the
MCH-M memory address space.
The MCH-M has a 12-deep In-Order Queue to support up to 12 outstanding pipelined address requests
on the host bus. The MCH-M supports two outstanding defer cycles at a time; however, only one to any
particular IO interface. Host initiated I/O cycles are positively decoded to AGP/PCI or MCH-M
configuration space and subtractively decoded to the hub interface. Host initiated memory cycles are
positively decoded to AGP/PCI or DRAM. AGP semantic memory accesses initiated from AGP/PCI to
DRAM are not snooped on the host bus. Memory accesses initiated from AGP/PCI using PCI semantics
and from the hub interface to DRAM will be snooped on the System bus. Memory accesses whose
250687-002
Datasheet
15
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
addresses lie within the AGP aperture are translated using the AGP address translation table, regardless
of the originating interface.
1.2.1.
System Bus Error Checking
The Intel 845MP/845MZ Chipset MCH-M does not generate nor check parity for Data, Address/Request,
and Response signals on the processor bus.
1.3.
System Memory Interface
The Intel 845MP/845MZ Chipset memory controller directly supports one channel of PC1600 or
PC2100 (845MZ PC1600 only) SO-DIMM DDR memory. The Intel 845MP/845MZ Chipset memory
interface supports DDR devices with densities of 64-Mb, 128-Mb, 256-Mb, and 512-Mb technology.
The maximum memory support is two, double-sided SO-DIMMs (four rows populated). The Intel
845MP/845MZ Chipset memory interface also supports variable page sizes of 2 KB, 4 KB, 8 KB, and 16
KB. Page size is individually selected for every row and a maximum of 16 pages may be opened
simultaneously.
Table 1. DDR Memory Capacity
Technology
845MP/845MZ Maximum
64 Mb
128 MB/128 MB
128 Mb
256 MB/256 MB
256 Mb
512 MB/512 MB
512 Mb
1 GB/ 512 MB
The memory interface provides optional ECC error checking for DRAM data integrity. During DRAM
writes, ECC is generated on a QWORD (64 bit) basis. Because the Intel 845MP/845MZ Chipset MCHM stores only entire cache lines in its internal buffers, partial QWORD writes initially cause a read of the
underlying data, and their write-back into memory is no different from that of a complete cache line.
During DRAM reads and the read of the data that underlies partial writes, the MCH-M supports
detection of single-bit and multiple-bit errors, and will correct single bit errors when correction is
enabled.
16
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Table 2. DDR Device Configurations
SODIMM
Capacity
SO-DIMM
Organization
Density
DDR
Organization
# of
Components
Package
Type
# of
Physical
Banks
# of
Banks
in DDR
# Address
Bits
(row/col)
64 MB
8M x 64
64 Mbit
4M x 16
8
66 lead
TSOP
2
4
12/8
64 MB
8M x 64
128 Mbit
8M x 16
4
66 lead
TSOP
1
4
12/9
64 MB
8M x 72
128 Mbit
8M x 16
5
66 lead
TSOP
1
4
12/9
128 MB
16M x 64
128 Mbit
8M x 16
8
66 lead
TSOP
2
4
12/9
128 MB
16M x 64
256 Mbit
16M x 16
4
66 lead
TSOP
1
4
13/9
128 MB
16M x 72
256 Mbit
16M x 16
5
66 lead
TSOP
1
4
13/9
256 MB
32M x 64
256 Mbit
16M x 16
8
66 lead
TSOP
2
4
13/9
256 MB
32M x 64
512 Mbit
32M x 16
4
66 lead
TSOP
1
4
13/10
256 MB
32M x 72
512 Mbit
32M x 16
5
66 lead
TSOP
1
4
13/10
512 MB
64M x 64
512 Mbit
32M x 16
8
66 lead
TSOP
2
4
13/10
64 MB
8M x 64
64 Mbit
8M x 8
8
66 lead
TSOP
1
4
12/9
128 MB
16M x 64
128 Mbit
16M x 8
8
66 lead
TSOP
1
4
12/10
256 MB
32M x 64
256 Mbit
32M x 8
8
66 lead
TSOP
1
4
13/10
512 MB
64M x 64
512 Mbit
64M x 8
8
66 lead
TSOP
1
4
13/11
250687-002
Datasheet
17
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
1.4.
AGP Interface
A single AGP component or connector (not both) is supported by the Intel 845MP/845MZ Chipset
MCH-M AGP interface. The AGP buffers operate only in 1.5-V mode. They are not 3.3-V safe.
The AGP interface supports 1x/2x/4x AGP signaling and 2x/4x Fast Writes. AGP semantic cycles to
DRAM are not snooped on the host bus. PCI semantic cycles to DRAM are snooped on the host bus. The
MCH-M supports PIPE# or SBA[7:0] AGP address mechanisms, but not both simultaneously. Either the
PIPE# or the SBA[7:0] mechanism must be selected during system initialization. Both upstream and
downstream addressing is limited to 32 bits for AGP and AGP/PCI transactions. The MCH-M contains a
32-deep AGP request queue. High priority accesses are supported. All accesses from the AGP/PCI
interface that fall within the Graphics Aperture address range pass through an address translation
mechanism with a fully associative 20 entry TLB. Accesses between AGP and hub interface are limited
to memory writes originating from the hub interface destined for AGP. The AGP interface is clocked
from a dedicated 66MHz clock (66IN). The AGP-to-host/core interface is asynchronous.
Consult the latest AGP Busy and Stop Protocol Specification for more information.
1.5.
Hub Interface
The 8-bit hub interface connects the MCH-M to the ICH3-M. All communication between the MCH-M
and the ICH3-M occurs over the hub interface. The hub interface runs at 66 MHz/266 MB/s. Aside from
the obvious traffic types, the following communication also occur over hub interface:
• Interrupt related messages
• Power management events as messages
• SMI, SCI, and SERR error indication messages
It is assumed that the hub interface is always connected to an ICH3-M. This is a proprietary interconnect
between the MCH-M and the ICH3-M.
1.6.
MCH-M Clocking
The MCH-M has the following clock input pins:
• Differential BCLK[1:0] for the host interface
• 66-MHz clock input for the AGP and hub interface
Clock Synthesizer chip(s) are responsible for generating the system Host clocks, AGP and hub interface
clocks, PCI clocks, and DRAM clocks. The Host target speed is 400 MT/s. The MCH-M does not
require any relationship between the HCLKIN host clock and the 66-MHz clock generated for AGP and
hub interface; they are totally asynchronous from each other. The AGP and hub interface runs at a
constant 66-MHz base frequency. The hub interface runs at 4x, while AGP transfers may be 1x, 2x, or
4x.
The following tables indicate the frequency ratios between the various interfaces that the MCH-M
supports.
18
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Table 3. MCH-M Clock Ratio Table
1.7.
Interface
Speed
CPU System Bus Frequency Ratio
System Memory
DDR 200 MHz
1:1 synchronous
AGP
66 MHz
Asynchronous
Hub interface
66 MHz
Asynchronous
System Interrupts
The Intel 845MP/845MZ Chipset MCH-M supports both 8259 and Intel Mobile Pentium 4 Processor-M
interrupt delivery mechanisms. The serial APIC interrupt mechanism is not supported.
The 8259 support consists of flushing inbound hub interface write buffers when an Interrupt
Acknowledge cycle is forwarded from the system bus to the hub interface.
The Intel 845MP/845MZ Chipset MCH-M supports the Mobile Intel Pentium 4 Processor-M interrupt
delivery mechanism. PCI MSI interrupts are generated as Memory Writes. The MCH-M decodes
upstream Memory Writes to the range 0FEE0_0000h - 0FEEF_FFFFh from AGP and the hub interface
as message based interrupts. The MCH-M forwards the Memory Writes, along with the associated write
data, to the system bus as an Interrupt Message transaction. Note that since this address does not decode
as part of main memory, the write cycle and the write data does not get forwarded to DRAM via the write
buffer. The Intel 845MP/845MZ Chipset MCH-M provides the response and TRDY# for all Interrupt
Message cycles including the ones originating from the MCH-M. The Intel 845MP/845MZ Chipset
MCH-M supports interrupt re-direction for inter-processor interrupts (IPIs) as well as upstream interrupt
memory writes.
For message based interrupts, system write buffer coherency is maintained by relying on strict ordering
of Memory Writes. The Intel 845MP/845MZ Chipset MCH-M ensures that all Memory Writes received
from a given interface prior to an interrupt message Memory Write are delivered to the system bus for
snooping in the same order that they occur on the given interface.
250687-002
Datasheet
19
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
2.
Signal Description
This section provides a detailed description of Intel 845MP/845MZ Chipset MCH-M signals. The signals
are arranged in functional groups according to their associated interface. The states of all of the signals
during reset are provided in the System Reset section.
The “#” symbol at the end of a signal name indicates that the active, or asserted state occurs when the
signal is at a low voltage level. When “#” is not present after the signal name, the signal is asserted when
at the high voltage level.
The following notations are used to describe the signal type:
I
Input pin
O
Output pin
I/O
Bi-directional Input/Output pin
s/t/s
Sustained Tristate. This pin is driven to its inactive state prior to tri-stating.
as/t/s
Active Sustained Tristate. This applies to some of the hub interface signals. This pin
is weakly driven to its last driven value.
The signal description also includes the type of buffer used for the particular signal:
Note:
20
AGTL+
Open Drain AGTL+ interface signal. Refer to the AGTL+ I/O Specification for
complete details. The Intel®845MP/845MZ Chipset MCH-M integrates AGTL+
termination resistors.
AGP
AGP interface signals. These signals are compatible with AGP 2.0 1.5v Signaling
Environment DC and AC Specifications. The buffers are not 3.3v tolerant.
CMOS
CMOS buffers.
Ref
Voltage reference signal.
System address and data bus signals are logically inverted signals. The actual values are inverted of what
appears on the system bus. This must be taken into account and the addresses and data bus signals must
be inverted inside the Intel 845MP/845MZ Chipset MCH-M. All processor control signals follow normal
convention. A “0” indicates an active level (low voltage) if the signal is followed by “#” symbol, and a
“1” indicates an active level (high voltage) if the signal has no “#” suffix.
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
2.1.
Host Interface Signals
Table 4. Host Interface Signal Descriptions
Signal Name
Type
Description
ADS#
I/O
AGTL+
Address Strobe: The system bus owner asserts ADS# to indicate the first of two
cycles of a request phase.
BNR#
I/O
AGTL+
Block Next Request: Used to block the current request bus owner from issuing a
new request. This signal is used to dynamically control the system bus pipeline
depth.
BPRI#
O
AGTL+
Bus Priority Request: The MCH-M is the only Priority Agent on the system bus. It
asserts this signal to obtain the ownership of the address bus. This signal has
priority over symmetric bus requests and will cause the current symmetric owner to
stop issuing new transactions unless the HLOCK# signal was asserted.
BR0#
I/O
AGTL+
Bus Request 0#: The MCH-M pulls the processor bus’ BR0# signal low during
CPURST#. The signal is sampled by the processor on the active-to-inactive
transition of CPURST#. The minimum setup time for this signal is 4 HCLKs. The
minimum hold time is 2 clocks and the maximum hold time is 20 HCLKs. BR0#
should be tristated after the hold time requirement has been satisfied.
CPURST#
O
AGTL+
CPU Reset: The CPURST# pin is an output from the MCH-M. The MCH-M asserts
CPURST# while RSTIN# (PCIRST# from ICH3-M) is asserted and for
approximately 1 ms after RSTIN# is deasserted. The CPURST# allows the
processor’s to begin execution in a known state.
DBSY#
I/O
AGTL+
Data Bus Busy: Used by the data bus owner to hold the data bus for transfers
requiring more than one cycle.
DEFER#
O
AGTL+
Defer Response: Signals that the MCH-M will terminate the transaction currently
being snooped with either a deferred response or with a retry response.
DBI[3:0]#
I/O
AGTL+ 4x
Dynamic Bus Inversion: Driven along with the HD[63:0]# signals. Indicates if the
associated signals are inverted or not. DBI[3:0]# are asserted such that the
number of data bits driven electrically low (low voltage) within the corresponding
16-bit group never exceeds 8.
DBI[x]#
Data Bits
DBI3#
DBI2#
DBI1#
DBI0#
DRDY#
I/O
AGTL+
HD[63:48]#
HD[47:32]#
HD[31:16]#
HD[15:0]#
Data Ready: Asserted for each cycle that data is transferred.
HA[31:3]#
I/O
AGTL+ 2x
Host Address Bus: HA[31:3]# connect to the system address bus. During
processor cycles the HA[31:3]# are inputs. The MCH-M drives HA[31:3]# during
snoop cycles on behalf of hub interface and AGP/Secondary PCI initiators.
HA[31:3]# are transferred at 2x rate. Note that the address is inverted on the
system bus.
HADSTB[1:0]#
I/O
AGTL+ 2x
Host Address Strobe: The source synchronous strobes used to transfer
HA[31:3]# and HREQ[4:0]# at the 2x transfer rate.
Address Bits
Strobe
HADSTB0#
HADSTB1#
250687-002
HA[16:3]#, HREQ[4:0]#
HA[31:17]#
Datasheet
21
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Signal Name
Type
Description
HD[63:0]#
I/O
AGTL+ 4x
Host Data: These signals are connected to the system data bus. HD[63:0]# are
transferred at 4x rate. Note that the data signals are inverted on the system bus.
HDSTBP[3:0]#
I/O
AGTL+ 4x
Differential Host Data Strobes: The differential source synchronous strobes used
to transfer HD[63:0]# and DBI[3:0]# at the 4x transfer rate.
HDSTBN[3:0]#
Strobe
Data Bits
HDSTBP3#, HDSTBN3#
HDSTBP2#, HDSTBN2#
HDSTBP1#, HDSTBN1#
HDSTBP0#, HDSTBN0#
HD[63:48]#, DBI3#
HD[47:32]#, DBI2#
HD[31:16]#, DBI1#
HD[15:0]#, DBI0#
HIT#
I/O
AGTL+
Hit: Indicates that a caching agent holds an unmodified version of the requested
line. Also, driven in conjunction with HITM# by the target to extend the snoop
window.
HITM#
I/O
AGTL+
Hit Modified: Indicates that a caching agent holds a modified version of the
requested line and that this agent assumes responsibility for providing the line.
Also, driven in conjunction with HIT# to extend the snoop window.
HLOCK#
I
AGTL+
Host Lock: All system bus cycles sampled with the assertion of HLOCK# and
ADS#, until the negation of HLOCK# must be atomic, i.e. no hub interface or
AGP snoopable access to DRAM are allowed when HLOCK# is asserted by the
processor.
HREQ[4:0]#
I/O
AGTL+ 2x
Host Request Command: Defines the attributes of the request. In Enhanced
Mode HREQ[4:0]# are transferred at 2x rate. Asserted by the requesting agent
during both halves of Request Phase. In the first half the signals define the
transaction type to a level of detail that is sufficient to begin a snoop request. In the
second half the signals carry additional information to define the complete
transaction type.
The transactions supported by the MCH-M Host Bridge are defined in the Host
Interface section of this document.
HTRDY#
O
AGTL+
Host Target Ready: Indicates that the target of the processor transaction is able
to enter the data transfer phase.
RS[2:0]#
O
AGTL+
Response Status: Indicates type of response according to the following the table:
RS[2:0]
000
001
010
011
100
101
110
111
22
Response type
Idle state
Retry response
Deferred response
Reserved (not driven by MCH-M)
Hard Failure (not driven by MCH-M)
No data response
Implicit Write back
Normal data response
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
2.2.
DDR Interface
Table 5. DDR Interface Signal Descriptions
Signal Name
SCS#[3:0]
Type
O
CMOS
Description
Chip Select: These pins select the particular DDR components during the active
state.
Note: There is one SCS# per DDR-SDRAM Physical SO-DIMM device row. These
signals can be toggled on every rising System Memory Clock edge.
SMA[12:0]
O
CMOS
Multiplexed Memory Address: These signals are used to provide the multiplexed
row and column address to DDR.
SBS[1:0]
O
CMOS
Memory Bank Address: These signals define the banks that are selected within
each DDR row. The SMA and SBS signals combine to address every possible
location within a DDR device.
SRAS#
O
CMOS
DDR Row Address Strobe: SRAS# may be heavily loaded and requires 2 DDR
clock cycles for setup time to the DDRs: Used with SCAS# and SWE# (along with
SCS#) to define the DRAM commands.
SCAS#
O
CMOS
DDR Column Address Strobe: SCAS# may be heavily loaded and requires 2 DDR
clock cycles for setup time to the DDRs. Used with SRAS# and SWE# (along with
SCS#) to define the DRAM commands.
SWE#
I/O
CMOS
Write Enable: Used with SCAS# and SRAS# (along with SCS#) to define the
DRAM commands. SWE# is asserted during writes to DDR. SWE# may be heavily
loaded and requires 2 DDR clock cycles for setup time to the DDRs.
SDQ[63:0]
I/O
CMOS 2X
Data Lines: These signals are used to interface to the DDR data bus.
SCB[7:0]
I/O
CMOS 2X
Data Lines: These signals are used to interface to the SDRAM ECC signals (to be
used if SO-DIMMs support ECC).
SDQS[8:0]
I/O
CMOS
Data Strobes:
There is an associated data strobe (DQS) for each data strobe (DQ) and check
bit (CB) group.
SDQS8 -> SCB[7:0]
SDQS7 -> SDQ[63:56]
SDQS6 -> SDQ[55:48]
SDQS5 -> SDQ[47:40]
SDQS4 -> SDQ[39:32]
SDQS3 -> SDQ[31:24]
SDQS2 -> SDQ[23:16]
SDQS1 -> SDQ[15:8]
SDQS0 -> SDQ[7:0]
250687-002
SCKE[3:0]
O
CMOS
Clock Enable: These pins are used to signal a self-refresh or power down
command to a DDR array when entering system suspend. SCKE is also used to
dynamically power down inactive DDR rows. There is one SCKE per DDR row.
These signals can be toggled on every rising SCLK edge.
RCVENOUT#
O
CMOS
Clock Output: Used to emulate source-synch clocking for reads. Connects to
RCVENIN#.
RCVENIN#
I
CMOS
Clock Input: Used to emulate source-synch clocking for reads. Connects to
RCVENOUT#.
Datasheet
23
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
2.3.
Hub Interface Signals
Table 6. Hub Interface Signal Descriptions
Signal Name
Type
Description
HI_[10:0]
I/O
CMOS
Hub Interface Signals: Signals used for the hub interface.
HI_STB
I/O
CMOS
Hub Interface Strobe: One of two differential strobe signals used to transmit or
receive packet data over hub interface.
HI_STB#
I/O
CMOS
Hub Interface Strobe Compliment: One of two differential strobe signals used to
transmit or receive packet data over hub interface.
2.4.
AGP Interface Signals
2.4.1.
AGP Addressing Signals
Table 7. AGP Addressing Signal Descriptions
Signal Name
PIPE#
Type
Description
I
AGP
Pipelined Read: This signal is asserted by the AGP master to indicate a full width
address is to be enqueued on by the target using the AD bus. One address is placed
in the AGP request queue on each rising clock edge while PIPE# is asserted. When
PIPE# is deasserted no new requests are queued across the AD bus.
During SBA Operation: This signal is not used if SBA (Side Band Addressing) is
selected.
During FRAME# Operation: This signal is not used during AGP FRAME#
operation.
PIPE# is a sustained tri-state signal from the AGP masters (graphics controller) and
is an MCH-M input.
SBA[7:0]
I
AGP
Side-band Address: These signals are used by the AGP master (graphics
controller) to place addresses into the AGP request queue. The SBA bus and AD
bus operate independently. That is, transaction can proceed on the SBA bus and
the AD bus simultaneously.
During PIPE# Operation: These signals are not used during PIPE# operation.
During FRAME# Operation: These signal are not used during AGP FRAME#
operation.
Note: When sideband addressing is disabled, these signals are isolated (no
external/internal pull-ups are required).
NOTE:
24
The above table contains two mechanisms, SBA and PIPE#, to queue requests by the AGP master. Note
that the master can only use one mechanism. The master may not switch methods without a full reset of
the system. When PIPE# is used to queue addresses, the master is not allowed to queue addresses
using the SBA bus. For example, during configuration time, if the master indicates that it can use either
mechanism, the configuration software will select which mechanism the master will use. Once this choice
has been made, the master must continue to use the mechanism selected until the master is reset (and
reprogrammed) to use the other mode. This change of modes is not a dynamic mechanism, but rather a
static decision when the device is first being configured after reset.
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
2.4.2.
AGP Flow Control Signals
Table 8. AGP Flow Control Signal Descriptions
Signal Name
RBF#
Type
Description
I
AGP
Read Buffer Full: Indicates if the master is ready to accept previously requested
low priority read data. When RBF# is asserted, the MCH-M is not allowed to initiate
the return of low priority read data. That is, the MCH-M can only finish returning the
data for the request currently being serviced. RBF# is only sampled at the
beginning of a cycle.
If the AGP master is always ready to accept return read data then it is not required
to implement this signal.
During FRAME# Operation: This signal is not used during AGP FRAME#
operation.
WBF#
I
AGP
Write-Buffer Full: indicates if the master is ready to accept Fast Write data from
the MCH-M. When WBF# is asserted the MCH-M is not allowed to drive Fast Write
data to the AGP master. WBF# is only sampled at the beginning of a cycle.
If the AGP master is always ready to accept fast write data then it is not required to
implement this signal.
During FRAME# Operation: This signal is not used during AGP FRAME#
operation.
2.4.3.
AGP Status Signals
Table 9. AGP Status Signal Descriptions
Signal Name
ST[2:0]
Type
Description
O
AGP
Status: Provides information from the arbiter to an AGP Master on what it may do.
ST[2:0] only have meaning to the master when its GNT# is asserted. When GNT#
is deasserted these signals have no meaning and must be ignored. Refer to the
AGP Interface Specification revision 2.0 for further explanation of the ST[2:0]
values and their meanings.
During FRAME# Operation: These signals are not used during FRAME# based
operation; except that a ‘111’ indicates that the master may begin a FRAME#
transaction.
250687-002
Datasheet
25
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
2.4.4.
AGP Strobes
Table 10. AGP Strobe Descriptions
Signal Name
26
Type
Description
AD_STB0
I/O
(s/t/s)
AGP
Address/Data Bus Strobe-0: provides timing for 2x and 4x data on AD[15:0] and
C/BE[1:0]# signals. The agent that is providing the data will drive this signal.
AD_STB0#
I/O
(s/t/s)
AGP
Address/Data Bus Strobe-0 Complement: With AD STB0, forms a differential
strobe pair that provides timing information for the AD[15:0] and C/BE[1:0]#
signals. The agent that is providing the data will drive this signal.
AD_STB1
I/O
(s/t/s)
AGP
Address/Data Bus Strobe-1: Provides timing for 2x and 4x data on AD[31:16]
and C/BE[3:2]# signals. The agent that is providing the data will drive this signal.
AD_STB1#
I/O
(s/t/s)
AGP
Address/Data Bus Strobe-1 Complement: With AD STB1, forms a differential
strobe pair that provides timing information for the AD[15:0] and C/BE[1:0]# signals
in 4X mode. The agent that is providing the data will drive this signal.
SB_STB
I
AGP
Sideband Strobe: Provides timing for 2x and 4x data on the SBA[7:0] bus. The
AGP master drives it after the system has been configured for 2x or 4x sideband
address mode.
SB_STB#
I
AGP
Sideband Strobe Complement: The differential complement to the SB_STB
signal. It is used to provide timing 4x mode.
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
2.4.5.
AGP/PCI Signals-Semantics
For transactions on the AGP interface carried using AGP FRAME# protocol these signals operate similar
to their semantics in the PCI 2.1 specification the exact role of all AGP FRAME# signals are defined
below.
Table 11. AGP/PCI Signal Semantics Descriptions
Signal Name
G_FRAME#
Type
I/O
s/t/s
AGP
Description
G_FRAME: Frame
During PIPE# and SBA Operation: Not used by AGP SBA and PIPE# operations.
During Fast Write Operation: Used to frame transactions as an output during
Fast Writes.
During FRAME# Operation: G_FRAME# is an output when the MCH-M acts as
an initiator on the AGP Interface. G_FRAME# is asserted by the MCH-M to indicate
the beginning and duration of an access. G_FRAME# is an input when the MCH-M
acts as a FRAME#-based AGP target. As a FRAME#-based AGP target, the MCHM latches the C/BE[3:0]# and the AD[31:0] signals on the first clock edge on which
MCH-M samples FRAME# active.
G_IRDY#
I/O
s/t/s
AGP
G_IRDY#: Initiator Ready
During PIPE# and SBA Operation: Not used while enqueueing requests via AGP
SBA and PIPE#, but used during the data phase of PIPE# and SBA transactions.
During FRAME# Operation: G_IRDY# is an output when MCH-M acts as a
FRAME#-based AGP initiator and an input when the MCH-M acts as a FRAME#based AGP target. The assertion of G_IRDY# indicates the current FRAME#-based
AGP bus initiator's ability to complete the current data phase of the transaction.
During Fast Write Operation: In Fast Write mode, G_IRDY# indicates that the
AGP-compliant master is ready to provide all write data for the current transaction.
Once G_IRDY# is asserted for a write operation, the master is not allowed to insert
wait states. The master is never allowed to insert a wait state during the initial data
transfer (32 bytes) of a write transaction. However, it may insert wait states after
each 32-byte block is transferred.
G_TRDY#
I/O
s/t/s
AGP
G_TRDY#: Target Ready
During PIPE# and SBA Operation: Not used while enqueueing requests via AGP
SBA and PIPE#, but used during the data phase of PIPE# and SBA transactions.
During FRAME# Operation: G_TRDY# is an input when the MCH-M acts as an
AGP initiator and is an output when the MCH-M acts as a FRAME#-based AGP
target. The assertion of G_TRDY# indicates the target’s ability to complete the
current data phase of the transaction.
During Fast Write Operation: In Fast Write mode, G_TRDY# indicates the AGPcompliant target is ready to receive write data for the entire transaction (when the
transfer size is less than or equal to 32 bytes) or is ready to transfer the initial or
subsequent block (32 bytes) of data when the transfer size is greater than 32 bytes.
The target is allowed to insert wait states after each block (32 bytes) is transferred
on write transactions.
250687-002
Datasheet
27
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Signal Name
G_STOP#
Type
I/O
s/t/s
AGP
Description
G_STOP#: Stop
During PIPE# and SBA Operation: This signal is not used during PIPE# or SBA
operation.
During FRAME# Operation: G_STOP# is an input when the MCH-M acts as a
FRAME#-based AGP initiator and is an output when the MCH-M acts as a
FRAME#-based AGP target. G_STOP# is used for disconnect, retry, and abort
sequences on the AGP interface
G_DEVSEL#
I/O
s/t/s
AGP
G_ DEVSEL#: Device Select
During PIPE# and SBA Operation: This signal is not used during PIPE# or SBA
operation.
During FRAME# Operation: G_DEVSEL#, when asserted, indicates that a
FRAME#-based AGP target device has decoded its address as the target of the
current access. The MCH-M asserts G_DEVSEL# based on the SDRAM address
range being accessed by a PCI initiator. As an input, G_DEVSEL# indicates
whether the AGP master has recognized a PCI cycle to it.
G_REQ#
I
AGP
G_REQ#: Request
During SBA Operation: This signal is not used during SBA operation.
During PIPE# and FRAME# Operation: G_REQ#, when asserted, indicates that
the AGP master is requesting use of the AGP interface to run a FRAME#- or
PIPE#-based operation.
G_GNT#
G_AD[31:0]
O
AGP
I/O
AGP
G_GNT#: Grant
During SBA, PIPE# and FRAME# Operation: G_GNT#, along with the
information on the ST[2:0] signals (status bus), indicates how the AGP interface will
be used next. Refer to the AGP Interface Specification, Revision 2.0 for further
explanation of the ST[2:0] values and their meanings.
G_AD[31:0]: Address/Data Bus
During PIPE# and FRAME# Operation: The G_AD[31:0] signals are used to
transfer both address and data information on the AGP interface.
During SBA Operation: The G_AD[31:0] signals are used to transfer data on the
AGP interface.
G_CBE[3:0]#
I/O
AGP
Command/Byte Enable
During FRAME# Operation: During the address phase of a transaction, the
G_CBE[3:0]# signals define the bus command. During the data phase, the
G_CBE[3:0]# signals are used as byte enables. The byte enables determine which
byte lanes carry meaningful data. The commands issued on the G_CBE# signals
during FRAME#-based AGP transactions are the same G_CBE# command
described in the PCI 2.2 specification.
During PIPE# Operation: When an address is enqueued using PIPE#, the C/BE#
signals carry command information. Refer to the AGP 2.0 Interface Specification,
Revision 2.0 for the definition of these commands. The command encoding used
during PIPE#-based AGP is different than the command encoding used during
FRAME#-based AGP cycles (or standard PCI cycles on a PCI bus).
During SBA Operation: These signals are not used during SBA operation.
28
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Signal Name
G_PAR
Type
I/O
AGP
Description
Parity
During FRAME# Operation: G_PAR is driven by the MCH-M when it acts as a
FRAME#-based AGP initiator during address and data phases for a write cycle,
and during the address phase for a read cycle. G_PAR is driven by the MCH-M
when it acts as a FRAME#-based AGP target during each data phase of a
FRAME#-based AGP memory read cycle. Even parity is generated across
G_AD[31:0] and G_CBE[3:0]#.
During SBA and PIPE# Operation: This signal is not used during SBA and PIPE#
operation.
NOTE:
250687-002
PCIRST# from the ICH3-M is connected to RSTIN# and is used to reset AGP interface logic within the
MCH-M. The AGP agent will also use PCIRST# provided by the ICH3-M as an input to reset its internal
logic.
Datasheet
29
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
2.5.
Clocks, Reset, and Miscellaneous
Table 12. Clocks, Reset, and Miscellaneous Descriptions
Signal Name
Type
Description
BCLK /
BCLK#
I
CMOS
Differential Host Clock In: These pins receive a differential host clock from the
external clock synthesizer. This clock is used by all of the MCH-M logic that is in
the Host clock domain.
66IN
I
CMOS
66-MHz Clock In: This pin receives a 66-MHz clock from the clock synthesizer.
This clock is used by AGP/PCI and hub interface clock domains.
Note: That this clock input is 3.3-V tolerant.
SCK[5:0]
O
CMOS
SDRAM Differential Clock (DDR): These signals deliver a source synchronous
clock to the SO-DIMMs. There are three per SO-DIMM.
SCK#[5:0]
O
CMOS
SDRAM Inverted Differential Clock (DDR): These signals are the complement to
the SCK[5:0] signals. There are three per SO-DIMM.
RSTIN#
I
CMOS
Reset In: When asserted this signal will asynchronously reset the MCH-M logic.
This signal is connected to the PCIRST# output of the ICH3-M. All AGP/PCI output
and bi-directional signals will also tri-state compliant to PCI Rev 2.0 and 2.1
specifications.
Note: That this input needs to be 3.3-V tolerant.
TESTIN#
30
I
CMOS
Test Input: This pin is used for manufacturing and board level test purposes.
Note: This signal has an internal pullup resistor.
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
2.6.
Voltage References, PLL Power
Table 13. Voltage Reference Descriptions
Signal Name
2.7.
Type
Description
HVREF
Ref
Host Reference Voltage. Reference voltage input for the Data, Address, and
Common clock signals of the Host AGTL+ interface
SDREF
Ref
DDR Reference Voltage: Reference voltage input for DQ, DQS, & RCVENIN#.
HI_REF
Ref
Hub Interface Reference: Reference voltage input for the hub interface.
AGPREF
Ref
AGP Reference: Reference voltage input for the AGP interface.
HLRCOMP
I/O
CMOS
Compensation for hub interface: This signal is used to calibrate the hub
interface I/O buffers.
GRCOMP
I/O
CMOS
Compensation for AGP: This signal is used to calibrate AGP buffers.
HRCOMP[1:0]
I/O
CMOS
Compensation for Host: This signal is used to calibrate the Host AGTL+ I/O
buffers.
HSWNG[1:0]
I
CMOS
Host Reference Voltage: Reference voltage input for the compensation logic.
SMRCOMP
I/O
CMOS
System Memory RCOMP
VCC1_5
The 1.5 V Power input pins
VCC1_8
The 1.8 V Power input pins
VCCSM
The SDRAM Power input pins. 2.5 V for DDR.
VCCA[1:0]
PLL power input pins.
VTT
The AGTL+ bus termination voltage inputs
VSS
GROUND
VSSA[1:0]
PLL Ground
Pin State Table
This section describes the expected states of the MCH-M I/O buffers. These tables only refer to the
contributions on the interface from the MCH-M and do NOT reflect any external influence (such as
external pullup/pulldown resistors or external drivers).
Legend :
Term H/L: Normal termination devices are turned on high/low
Pwrdn:
Power down
H/L:
Strong Drive low
Tri/High-Z:
High Impedance
IN:
Input buffer Enabled
PU, PD/PL:
Weak internal pull-up, Weak internal pull down
(Strap):
Strap input sampled during assertion or on the deassertion edge of RSTIN#
250687-002
Datasheet
31
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Table 14. Host Signals
32
Buffer
Type/I
O
Signal
Type
State
During
RSTIN#
Assertion
HA[31:3]#
GTL+
I/O
Term H
HD[63:0]#
GTL+
I/O
ADS#
GTL+
BNR#
State After
RSTIN#
Deassertion
C3
S1M
S3
S4-S5
G3
Term H
Term H
Term H
Pwrdn
Pwrdn
Pwrdn
Term H
Term H
Term H
Term H
Pwrdn
Pwrdn
Pwrdn
I/O
Term H
Term H
Term H
Term H
Pwrdn
Pwrdn
Pwrdn
GTL+
I/O
Term H
Term H
Term H
Term H
Pwrdn
Pwrdn
Pwrdn
BPRI#
GTL+
O
Term H
Term H
Term H
Term H
Pwrdn
Pwrdn
Pwrdn
DBSY#
GTL+
I/O
Term H
Term H
Term H
Term H
Pwrdn
Pwrdn
Pwrdn
DEFER#
GTL+
O
Term H
Term H
Term H
Term H
Pwrdn
Pwrdn
Pwrdn
DRDY#
GTL+
I/O
Term H
Term H
Term H
Term H
Pwrdn
Pwrdn
Pwrdn
HIT#
GTL+
I/O
Term H
Term H
Term H
Term H
Pwrdn
Pwrdn
Pwrdn
HITM#
GTL+
I/O
Term H
Term H
Term H
Term H
Pwrdn
Pwrdn
Pwrdn
HLOCK#
GTL+
I
Term H
Term H
N/a
N/a
N/a
N/a
N/a
HREQ[4:0]#
GTL+
I/O
Term H
Term H
Term H
Term H
Pwrdn
Pwrdn
Pwrdn
HTRDY#
GTL+
I/O
Term H
Term H
Term H
Term H
Pwrdn
Pwrdn
Pwrdn
RS[2:0]#
GTL+
O
Term H
Term H
Term H
Term H
Pwrdn
Pwrdn
Pwrdn
CPURST#
GTL+
O
Drive L
Term H after 1
ms
Term H
Term H
Pwrdn
Pwrdn
Pwrdn
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Table 15. DDR Signals
Buffer
Type/IO
Signal
Type
State
During
RSTIN#
Assertion
State After
RSTIN#
Deassertion
C3
S1M
S3
S4-S5
G3
SCK#[5:0]
SM common
O
TRI
DRIVE
Don’t
care
Don’t
care
Don’t care
Pwrdn
Pwrdn
SCK[4:0]
SM common
O
TRI
DRIVE
Don’t
care
Don’t
care
Don’t care
Pwrdn
Pwrdn
SCK[5]
SM common
O
TRI
DRIVE
L
L
L
Pwrdn
Pwrdn
SCKE[3:0]
SM common
O
DRIVE L
DRIVE L
L
L
L
Pwrdn
Pwrdn
SDQ[63:59]
SM common
I/O
PU
PU
Hi-Z
Hi-Z
PU or PD *
Pwrdn
Pwrdn
SDQ[58]
SM common
I/O
PU
PU
L
L
L
Pwrdn
Pwrdn
SDQ[57:56]
SM common
I/O
PU
PU
Hi-Z
Hi-Z
PU or PD *
Pwrdn
Pwrdn
SDQ[55]
SM common
I/O
PU
PU
L
L
L
Pwrdn
Pwrdn
SDQ[54:0]
SM common
I/O
PU
PU
Hi-Z
Hi-Z
PU or PD *
Pwrdn
Pwrdn
SCB[7:0]
SM common
I/O
PU
PU
Hi-Z
Hi-Z
PU or PD *
Pwrdn
Pwrdn
SDQS[8:0]
SM common
I/O
TRI
TRI
Hi-Z
Hi-Z
PU or PD *
Pwrdn
Pwrdn
RCVENIN#
SM common
I
IN
IN
Hi
Hi
Don’t care
Pwrdn
Pwrdn
RCVENOUT#
SM common
O
TRI
Drive H
Hi
Hi
PU or PD *
Pwrdn
Pwrdn
SBS[1:0]
SM common
O
TRI
DRIVE
Hi-Z
Hi-Z
PU or PD *
Pwrdn
Pwrdn
SRAS#
SM common
O
TRI
DRIVE
Hi-Z
Hi-Z
PU or PD *
Pwrdn
Pwrdn
SWE#
SM common
O
TRI
DRIVE
L
L
L
Pwrdn
Pwrdn
SCAS#
SM common
O
TRI
DRIVE
Hi-Z
Hi-Z
PU or PD *
Pwrdn
Pwrdn
SMA[12:0]
SM common
O
TRI
DRIVE
Hi-Z
Hi-Z
PU or PD *
Pwrdn
Pwrdn
SCS#[3:0]
SM common
O
TRI
Drive H
Hi-Z
Hi-Z
PU or PD *
Pwrdn
Pwrdn
* There is an indeterminate number of non-CKE DDR pins that will be pull-down in S3.
250687-002
Datasheet
33
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Table 16. AGP Signals
Buffer
Type
IO
34
Signal
Type
State
During
RSTIN#
Assertion
State After
RSTIN#
Deassertion
Pull
Up/Pull
Down
C3
S1M
S3
S4-S5
G3
PIPE#
CMOS
Input
PU
PU
8.2K Int
Pullup
H
H
Pwrdn
Pwrdn
Pwrdn
SBA[7:0]
CMOS
Input
PU (Strap)
PU
8.2K Int
Pullup
H
H
Pwrdn
Pwrdn
Pwrdn
RBF#
CMOS
Input
PU (Strap)
PU
8.2K Int
Pullup
H
H
Pwrdn
Pwrdn
Pwrdn
WBF#
CMOS
Input
PU (Strap)
PU
8.2K Int
Pullup
H
H
Pwrdn
Pwrdn
Pwrdn
ST[2:0]
CMOS
Output
PU (Strap)
DRIVE L
Hi-Z
Hi-Z
Pwrdn
Pwrdn
Pwrdn
AD_STB0
CMOS
I/O
PU
PU
8.2K Int
Pullup
PU
PU
Pwrdn
Pwrdn
Pwrdn
AD_STB0
#
CMOS
I/O
PD
PD
8.2K Int
Pulldwn
PL
PL
Pwrdn
Pwrdn
Pwrdn
AD_STB1
CMOS
I/O
PU
PU
8.2K Int
Pullup
PU
PU
Pwrdn
Pwrdn
Pwrdn
AD_STB1
#
CMOS
I/O
PD
PD
8.2K Int
Pulldwn
PD
PD
Pwrdn
Pwrdn
Pwrdn
SB_STB
CMOS
I
PU
PU
8.2K Int
Pullup
PU
PU
Pwrdn
Pwrdn
Pwrdn
SB_STB#
CMOS
I
PD
PD
8.2K Int
Pulldwn
PD
PD
Pwrdn
Pwrdn
Pwrdn
G_FRAM
E#
CMOS
I/O
PU
PU
8.2K Int
Pullup
PU
PU
Pwrdn
Pwrdn
Pwrdn
G_IRDY#
CMOS
I/O
PU
PU
8.2K Int
Pullup
PU
PU
Pwrdn
Pwrdn
Pwrdn
G_TRDY
#
CMOS
I/O
PU
PU
8.2K Int
Pullup
PU
PU
Pwrdn
Pwrdn
Pwrdn
G_STOP
#
CMOS
I/O
PU
PU
8.2K Int
Pullup
PU
PU
Pwrdn
Pwrdn
Pwrdn
G_DEVS
EL#
CMOS
I/O
PU
PU
8.2K Int
Pullup
PU
PU
Pwrdn
Pwrdn
Pwrdn
G_REQ#
CMOS
Input
PU
PU
8.2K Int
Pullup
PU
PU
Pwrdn
Pwrdn
Pwrdn
G_GNT#
CMOS
Output
PU (Strap)
DRIVE H
8.2K Int
Pullup
PU
PU
Pwrdn
Pwrdn
Pwrdn
G_AD[31:
0]
CMOS
I/O
TRI
TRI
Hi-Z
Hi-Z
Pwrdn
Pwrdn
Pwrdn
G_C/BE[3
:0]#
CMOS
I/O
TRI
TRI
Hi-Z
Hi-Z
Pwrdn
Pwrdn
Pwrdn
G_PAR
CMOS
I/O
TRI
TRI
Hi-Z
Hi-Z
Pwrdn
Pwrdn
Pwrdn
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Table 17. Clock/Miscellaneous Signals
Buffer
Type/IO
State
During
RSTIN#
Assertion
Signal
Type
State After
RSTIN#
Deassertion
C3
S1M
S3
S4-S5
G3
BCLK/#
CMOS
I
IN
IN
Running
Stopped(L)
Pwrdn
Pwrdn
Pwrdn
66IN
CMOS
I
N/A
N/A
Running
Stopped(L)
Pwrdn
Pwrdn
Pwrdn
RSTIN#
CMOS
I
IN
IN
H
H
L
L
Pwrdn
GRCOMP
CMOS
I/O
Tri
N/A
Hi-Z
Hi-Z
Pwrdn
Pwrdn
Pwrdn
HLRCOMP
CMOS
I/O
Tri
N/A
Hi-Z
Hi-Z
Pwrdn
Pwrdn
Pwrdn
Table 18. Hub Interface Signals
Buffer
Type/I
O
Signal
Type
State
During
RSTIN#
Assertion
State After
RSTIN#
Deassertion
Pull
Up/Pull
Down
C3
S1M
S3
S4-S5
G3
HI_STB
CMOS
I/O
N/A
N/A
N/A
N/A
N/A
Pwrdn
Pwrdn
Pwrdn
HI_STB#
CMOS
I/O
N/A
N/A
N/A
N/A
N/A
Pwrdn
Pwrdn
Pwrdn
HI_[10:0]
CMOS
I/O
N/A
N/A
N/A
N/A
N/A
Pwrdn
Pwrdn
Pwrdn
250687-002
Datasheet
35
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.
Register Description
3.1.
Conceptual Overview of the Platform Configuration
Structure
The Intel 845MP/845MZ Chipset MCH-M and ICH3-M are physically connected by hub interface A.
From a configuration standpoint, the hub interface A is PCI bus #0. As a result, all devices internal to the
MCH-M and ICH3-M appear to be on PCI bus #0. The system’s primary PCI expansion bus is physically
attached to the ICH3-M and from a configuration perspective, appears to be a hierarchical PCI bus
behind a PCI-to-PCI bridge and therefore has a programmable PCI Bus number. Note that the primary
PCI bus is referred to as PCI_A in this document and is not PCI bus #0 from a configuration
standpoint. The AGP appears to system software to be a real PCI bus behind PCI-to-PCI bridges
resident as devices on PCI bus #0.
The MCH-M contains two PCI devices within a single physical component. The configuration registers
for the four devices are mapped as devices residing on PCI bus #0.
• Device 0: Host-hub interface Bridge/DRAM Controller. Logically this appears as a PCI device
residing on PCI bus #0. Physically Device 0 contains the standard PCI registers, DRAM registers,
the Graphics Aperture controller, and other MCH-M specific registers.
• Device 1: Host-AGP Bridge. Logically this appears as a “virtual” PCI-to-PCI bridge residing on
PCI bus #0. Physically Device 1 contains the standard PCI-to-PCI bridge registers and the standard
AGP/PCI configuration registers (including the AGP I/O and memory address mapping).
The following table shows the Device # assignment for the various internal MCH-M devices.
Table 19. Device Number Assignment
NOTE:
3.2.
MCH-M Function
Bus #0, Device#
DRAM Controller/8 bit HI_A Controller
Device #0
Host-to-AGP Bridge (virtual P2P)
Device #1
A physical PCI bus #0 does not exist. The hub interface and the internal devices in the Intel 845MP/845MZ
Chipset MCH-M and ICH3-M logically constitute PCI Bus #0 to configuration software.
Standard PCI Bus Configuration Mechanism
The PCI Bus defines a slot based "configuration space" that allows each device to contain up to 8
functions with each function containing up to 256 8-bit configuration registers. The PCI specification
defines two bus cycles to access the PCI configuration space: Configuration Read and Configuration
Write. Memory and I/O spaces are supported directly by the CPU. Configuration space is supported by a
mapping mechanism implemented within the MCH-M. The PCI specification defines two mechanisms to
access configuration space, Mechanism #1 and Mechanism #2. The MCH-M supports only Mechanism
#1.
36
Datasheet
250687-002
R
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
The configuration access mechanism makes use of the CONFIG_ADDRESS Register (at I/O address
0CF8h though 0CFBh) and CONFIG_DATA Register (at I/O address 0CFCh though 0CFFh). To
reference a configuration register a Dword I/O write cycle is used to place a value into
CONFIG_ADDRESS that specifies the PCI bus, the device on that bus, the function within the device,
and a specific configuration register of the device function being accessed. CONFIG_ADDRESS[31]
must be 1 to enable a configuration cycle. CONFIG_DATA then becomes a window into the four bytes
of configuration space specified by the contents of CONFIG_ADDRESS. Any read or write to
CONFIG_DATA will result in the MCH-M translating the CONFIG_ADDRESS into the appropriate
configuration cycle.
The MCH-M is responsible for translating and routing the CPU’s I/O accesses to the
CONFIG_ADDRESS and CONFIG_DATA registers to internal MCH-M configuration registers, hub
interface, or AGP.
3.3.
Routing Configuration Accesses
The MCH-M supports two bus interfaces: the hub interface and AGP. PCI configuration cycles are
selectively routed to one of these interfaces. The MCH-M is responsible for routing PCI configuration
cycles to the proper interface. PCI configuration cycles to the ICH3-M internal devices, and Primary PCI
(including downstream devices) are routed to the ICH3-M via the hub interface. AGP configuration
cycles are routed to AGP. The AGP interface is treated as a separate PCI bus from the configuration
point of view. Routing of configuration AGP is controlled via the standard PCI-PCI bridge mechanism
using information contained within the PRIMARY BUS NUMBER, the SECONDARY BUS NUMBER,
and the SUBORDINATE BUS NUMBER registers of the corresponding PCI-PCI bridge device.
A detailed description of the mechanism for translating CPU I/O bus cycles to configuration cycles on
one of the buses is described below.
3.3.1.
PCI Bus #0 Configuration Mechanism
The MCH-M decodes the Bus Number (bits 23:16) and the Device Number fields of the
CONFIG_ADDRESS register. If the Bus Number field of CONFIG_ADDRESS is 0 the configuration
cycle is targeting a PCI Bus #0 device.
• The Host-HI Bridge entity within the MCH-M is hardwired as Device #0 on PCI Bus #0.
• The Host-AGP Bridge entity within the MCH-M is hardwired as Device #1 on PCI Bus #0.
Configuration cycles to any of the MCH-M’s internal devices are confined to the MCH-M and not sent
over hub interface. Accesses to disabled MCH-M internal devices will be forwarded over the hub
interface as Type0 Configuration Cycles.
3.3.2.
Primary PCI and Downstream Configuration Mechanism
If the Bus Number in the CONFIG_ADDRESS is non-zero, and is less than the value in the Host-AGP
device’s SECONDARY BUS NUMBER register, or greater than the value in the Host-AGP device’s
SUBORDINATE BUS NUMBER register, the MCH-M will generate a Type 1 hub interface
Configuration Cycle. The ICH3-M compares the non-zero Bus Number with the SECONDARY BUS
NUMBER and SUBORDINATE BUS NUMBER registers of its P2P bridges to determine if the
configuration cycle is meant for Primary PCI or a downstream PCI bus.
250687-002
Datasheet
37
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.3.3.
AGP Configuration Mechanism
From the chipset configuration perspective, AGP is seen as a PCI bus interface residing on a Secondary
Bus side of the “virtual” PCI-PCI bridges referred to as the MCH-M Host-AGP bridge. On the Primary
Bus side, the “virtual” PCI-PCI bridge is attached to PCI Bus #0. Therefore, the PRIMARY BUS
NUMBER register is hardwired to “0”. The “virtual” PCI-PCI bridge entity converts Type #1 PCI Bus
Configuration cycles on PCI Bus #0 into Type 0 or Type 1 configuration cycles on the AGP interface.
Type 1 configuration cycles on PCI Bus #0 that have a BUS NUMBER that matches the SECONDARY
BUS NUMBER of the MCH-M’s “virtual” Host-to-PCI_B/AGP bridge will be translated into Type 0
configuration cycles on the AGP interface.
If the Bus Number is non-zero, greater than the value programmed into the SECONDARY BUS
NUMBER register, and less than or equal to the value programmed into the SUBORDINATE BUS
NUMBER register, the MCH-M will generate a Type 1 PCI configuration cycle on AGP.
3.4.
MCH-M Register Introduction
The MCH-M contains two sets of software accessible registers, accessed via the Host CPU I/O address
space:
1.
Control registers I/O mapped into the CPU I/O space, which control access to PCI and AGP
configuration space (see section entitled I/O Mapped Registers).
2.
Internal configuration registers residing within the MCH-M are partitioned into four logical device
register sets (“logical” since they reside within a single physical device). The first register set is
dedicated to Host-HI Bridge functionality (i.e. DRAM configuration, other chip-set operating
parameters and optional features). The second register block is dedicated to Host-AGP Bridge
functions (controls AGP interface configurations and operating parameters).
The MCH-M supports PCI configuration space accesses using the mechanism denoted as Configuration
Mechanism #1 in the PCI specification.
The MCH-M internal registers (I/O Mapped and Configuration registers) are accessible by the Host
CPU. The registers can be accessed as Byte, Word (16-bit), or Dword (32-bit) quantities, with the
exception of CONFIG_ADDRESS, which can only be accessed as a Dword. All multi-byte numeric
fields use "little-endian" ordering (i.e., lower addresses contain the least significant parts of the field).
Reserved Bits:
Some of the MCH-M registers described in this section contain reserved bits. These bits are labeled
"Reserved”. Software must deal correctly with fields that are reserved. On reads, software must use
appropriate masks to extract the defined bits and not rely on reserved bits being any particular value. On
writes, software must ensure that the values of reserved bit positions are preserved. That is, the values of
reserved bit positions must first be read, merged with the new values for other bit positions and then
written back. Note the software does not need to perform read, merge, and write operation for the
configuration address register.
Reserved Registers:
In addition to reserved bits within a register, the MCH-M contains address locations in the configuration
space of the Host-HI Bridge entity that are marked either "Reserved" or “Intel Reserved”. When a
38
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
“Reserved” register location is read, a random value is returned. (“Reserved” registers can be 8-bit, 16bit, or 32-bit in size.) Writes to “Intel Reserved” registers may cause system failure. Reads to “Intel
Reserved” registers may return a non-zero value.
Default Value Upon Reset:
Upon a full Reset, the MCH-M sets all of its internal configuration registers to predetermined default
states. Some register values at reset are determined by external strapping options. The default state
represents the minimum functionality feature set required to successfully bring up the system. Hence, it
does not represent the optimal system configuration. It is the responsibility of the system initialization
software (usually BIOS) to properly determine the DRAM configurations, operating parameters and
optional system features that are applicable, and to program the MCH-M registers accordingly.
3.5.
I/O Mapped Registers
The MCH-M contains two registers that reside in the CPU I/O address space: the Configuration Address
(CONFIG_ADDRESS) Register and the Configuration Data (CONFIG_DATA) Register. The
Configuration Address Register enables/disables the configuration space and determines what portion of
configuration space is visible through the Configuration Data window.
3.5.1.
CONFIG_ADDRESS – Configuration Address Register
I/O Address:
Default Value:
Access:
Size:
0CF8h Accessed as a Dword
00000000h
Read/Write
32 bits
CONFIG_ADDRESS is a 32-bit register that can be accessed only as a Dword. A Byte or Word
reference will "pass through" the Configuration Address Register and the hub interface, onto the PCI bus
as an I/O cycle. The CONFIG_ADDRESS register contains the Bus Number, Device Number, Function
Number, and Register Number for which a subsequent configuration access is intended.
Figure 2. Configuration Address Register
31 30
0
24 23
R
16 15
0
11 10
0
8 7
0
0
2 1 0 Bit
R Default
Reserved
Register Number
Function Number
Device Number
Bus Number
Reserved
Enable
250687-002
Datasheet
39
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Bit
Descriptions
31
Configuration Enable (CFGE): When this bit is set to 1, accesses to PCI configuration space are
enabled. If this bit is reset to 0, accesses to PCI configuration space are disabled.
30:24
Reserved (These bits are read only and have a value of 0).
23:16
Bus Number: When the Bus Number is programmed to 00h the target of the Configuration Cycle is a
hub interface agent (MCH-M, ICH3-M, etc.).
The Configuration Cycle is forwarded to hub interface if the Bus Number is programmed to 00h and the
MCH-M is not the target (the device number is >= 2).
If the Bus Number is non-zero and matches the value programmed into the SECONDARY BUS
NUMBER Register of device #1, a Type 0 PCI configuration cycle will be generated on AGP.
If the Bus Number is non-zero, greater than the value in the SECONDARY BUS NUMBER register of
device #1 and less than or equal to the value programmed into the SUBORDINATE BUS NUMBER
Register of device #1 a Type 1 PCI configuration cycle will be generated on AGP.
If the Bus Number is non-zero, and does not fall within the ranges enumerated by device #1’s
SECONDARY BUS NUMBER or SUBORDINATE BUS NUMBER Register, then a hub interface Type 1
Configuration Cycle is generated.
15:11
Device Number: This field selects one agent on the PCI bus selected by the Bus Number. When the
Bus Number field is “00” the MCH-M decodes the Device Number field. The MCH-M is always Device
Number 0 for the Host-hub interface bridge entity and Device Number 1 for the Host-AGP entity.
Therefore, when the Bus Number =0 and the Device Number=0-1 the internal MCH-M devices are
selected.
If the Bus Number is non-zero and matches the value programmed into the SECONDARY BUS
NUMBER Register, a Type 0 PCI configuration cycle will be generated on AGP. The MCH-M will decode
the Device Number field[15:11] and assert the appropriate GAD signal as an IDSEL. For PCI-to-PCI
Bridge translation, one of the 16 IDSELs is generated. When bit [15] = 0 bits [14:11] are decoded to
assert a signal AD[31:16] IDSEL. GAD16 is asserted to access Device #0, GAD17 for Device #1 and so
forth up to Device #15 for which will assert AD31. All device numbers higher than 15 cause a type 0
configuration access with no IDSEL asserted, which will result in a Master Abort reported in the MCH-M’s
“virtual” PCI-PCI bridge registers.
For Bus Numbers resulting in hub interface configuration cycles, the MCH-M propagates the device
number field as A[15:11]. For bus numbers resulting in AGP type 1 configuration cycles, the device
number is propagated as GAD[15:11].
40
10:8
Function Number: This field is mapped to GAD[10:8] during AGP Configuration cycles and A[10:8]
during hub interface configuration cycles. This allows the configuration registers of a particular function in
a multi-function device to be accessed. The MCH-M ignores configuration cycles to its internal Devices if
the function number is not equal to 0.
7:2
Register Number: This field selects one register within a particular Bus, Device, and Function as
specified by the other fields in the Configuration Address Register. This field is mapped to GAD[7:2]
during AGP Configuration cycles and A[7:2] during hub interface Configuration cycles.
1:0
Reserved
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.5.2.
CONFIG_DATA - Configuration Data Register
I/O Address:
Default Value:
Access:
Size:
0CFCh
00000000h
Read/Write
32 bits
CONFIG_DATA is a 32-bit read/write window into configuration space. The portion of configuration
space that is referenced by CONFIG_DATA is determined by the contents of CONFIG_ADDRESS.
Figure 3. Configuration Data Register
31
0
0
Bit
Default
Configuration Data Window
Bit
31:0
250687-002
Descriptions
Configuration Data Window (CDW). If bit 31 of CONFIG_ADDRESS is 1 any I/O access that to the
CONFIG_DATA register will be mapped to configuration space using the contents of
CONFIG_ADDRESS.
Datasheet
41
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.6.
Memory Mapped Register Space
All System Memory control functions have been consolidated into a new memory mapped address region
within Device 0 Function 0. This space will be accessed using a new Base Address Register (BAR)
located at Dev 0 Func 0 (Offset 14h). By default this BAR will be invisible (i.e., Read-Only zeros).
Note:
All accesses to these Memory Mapped Registers must be made as a single DWORD (4 bytes) or less.
Access must be aligned on a natural boundary.
The high-level breakout of these memory-mapped registers is as follows.
42
Address
Register Group
020h-02Bh
Reserved
2Ch
DRAM Width Register
02Dh-02Fh
Reserved
030h-034h
Strength Registers
040h-0DFh
Reserved
140h-1DFh
Reserved
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.6.1.
DRAMWIDTH—DRAM Width Register
Address Offset:
Default Value:
Access:
Size:
2Ch
00h
R/W
8 bits
This register determines the width of SDRAM devices populated in each row of memory.
Bit
7:4
Note:
250687-002
Descriptions
Reserved.
3
Row 3 Width. Width of devices in Row 3
0 = 16-bit wide devices, or Unpopulated (default)
1 = 8-bit wide devices
2
Row 2 Width. Width of devices in Row 2
0 = 16-bit wide devices, or Unpopulated (default)
1 = 8-bit wide devices
1
Row 1 Width. Width of devices in Row 1
0 = 16-bit wide devices, or Unpopulated (default)
1 = 8-bit wide devices
0
Row 0 Width. Width of devices in Row 0
0 = 16-bit wide devices, or Unpopulated (default)
1 = 8-bit wide devices
Since there are multiple clock signals assigned to each row of a DIMM, it is important to clarify exactly
which row width field affects which clock signal.
Row Parameters
DDR Clocks Affected
0
SCK[2:0]/SCK[2:0]#
1
SCK[2:0]/SCK[2:0]#
2
SCK[5:3]/SCK[5:3]#
3
SCK[5:3]/SCK[5:3]#
Datasheet
43
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.6.2.
DQCMDSTR – Strength Control Register for DQ and CMD
Signal Groups
Address Offset:
Default Value:
Access:
Size:
30h
00h
Read Only, Read/Write
8 bits
This register controls the drive strength of the I/O buffers for the DQ/DQS and CMD signal groups.
Bit
7
6:4
3
2:0
44
Descriptions
Reserved
CMD Strength Control (RAS#, CAS#, WE#, MA[12:0], BS[1:0])
000 = 0.75 X (default)
001 = 1.00 X
010 = 1.25 X
011 = 1.50 X
100 = 2.00 X
101 = 2.50 X
110 = 3.00 X
111 = 4.00 X
Reserved
DQ/DQS Strength Control: Sets drive strength as shown below:
000 = 0.75 X (default)
001 = 1.00 X
010 = 1.25 X
011 = 1.50 X
100 = 2.00 X
101 = 2.50 X
110 = 3.00 X
111 = 4.00 X
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.6.3.
CKESTR – Strength Control Register for CKE Signal Group
Address Offset:
Default Value:
Access:
Size:
31h
00h
Read Only, Read/Write
8 bits
This register controls the drive strength of the I/O buffers for the CKE signal group. This group has two
possible loadings depending on the width of SDRAM devices used in each Row of memory (x8 or x16).
The proper strength can be independently programmed for each configuration. The actual strength used
for each signal is determined by the DRAM Width Register (offset 2Ch).
Bit
7
6:4
3
2:0
250687-002
Descriptions
Reserved
CKE x16 Strength Control: Sets drive strength as shown below
000 = 0.75 X (default)
001 = 1.00 X
010 = 1.25 X
011 = 1.50 X
100 = 2.00 X
101 = 2.50 X
110 = 3.00 X
111 = 4.00 X
Reserved.
CKE x8 Strength Control: Sets drive strength as shown below:
000 = 0.75 X (default)
001 = 1.00 X
010 = 1.25 X
011 = 1.50 X
100 = 2.00 X
101 = 2.50 X
110 = 3.00 X
111 = 4.00 X
Datasheet
45
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.6.4.
CSBSTR – Strength Control Register for CS# Signal Group
Address Offset:
Default Value:
Access:
Size:
32h
00h
Read Only, Read/Write
8 bits
This register controls the drive strength of the I/O buffers for the CS# signal group. This group has two
possible loadings depending on the width of SDRAM devices used in each Row of memory (x8 or x16).
The proper strength can be independently programmed for each configuration. The actual strength used
for each signal is determined by the DRAM Width register (offset 2Ch).
Bit
7
6:4
3
2:0
46
Descriptions
Reserved
CS# x16 Strength Control: Sets drive strength as shown below:
000 = 0.75 X (default)
001 = 1.00 X
010 = 1.25 X
011 = 1.50 X
100 = 2.00 X
101 = 2.50 X
110 = 3.00 X
111 = 4.00 X
Reserved
CS# x8 Strength Control: Sets drive strength as shown below:
000 = 0.75 X (default)
001 = 1.00 X
010 = 1.25 X
011 = 1.50 X
100 = 2.00 X
101 = 2.50 X
110 = 3.00 X
111 = 4.00 X
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.6.5.
CKSTR – Strength Control Register for CK Signal Group (CK /
CK#)
Address Offset:
Default Value:
Access:
Size:
33h
00h
Read Only, Read/Write
8 bits
This register controls the drive strength of the I/O buffers for the CK signal group, which includes both
the CK and CK# signals. This group has two possible loadings depending on the width of SDRAM
devices used in each Row of memory (x8 or x16). The proper strength can be independently programmed
for each configuration. The actual strength used for each signal is determined by the DRAM Width
register (offset 2Ch).
Bit
7
6:4
3
2:0
250687-002
Descriptions
Reserved
CK x16 Strength Control: Sets drive strength as shown below:
000 = 0.75 X (default)
001 = 1.00 X
010 = 1.25 X
011 = 1.50 X
100 = 2.00 X
101 = 2.50 X
110 = 3.00 X
111 = 4.00 X
Reserved
CK x8 Strength Control: Sets drive strength as shown below:
000 = 0.75 X (default)
001 = 1.00 X
010 = 1.25 X
011 = 1.50 X
100 = 2.00 X
101 = 2.50 X
110 = 3.00 X
111 = 4.00 X
Datasheet
47
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.6.6.
RCVENSTR – Strength Control Register for RCVENOUT#
Signals
Address Offset:
Default Value:
Access:
Size:
34h
00h
Read Only, Read/Write
8 bits
This register controls the drive strength of the I/O buffers for the Receive Enable Out (RCVENOUT#)
signal.
Bit
3.7.
Descriptions
7:3
Reserved
2:0
RCVEnOut# Strength Control: Sets drive strength as shown below:
000 = 0.75 X (default)
001 = 1.00 X
010 = 1.25 X
011 = 1.50 X
100 = 2.00 X
101 = 2.50 X
110 = 3.00 X
111 = 4.00 X
Host-Hub Interface Bridge Device Registers – Device
#0
Table 20 shows the access attributes for the configuration space. An “s” in the Default Value field means
that a strap determines the power-up default value for that bit. Table 21 below summarizes the MCH-M
configuration space for Device #0.
Table 20. Nomenclature for Access Attributes
RO
Read Only. If a register is read only, writes to this register have no effect.
R/W
Read/Write. A register with this attribute can be read and written.
R/W/L
Read/Write/Lock A register with this attribute can be read, written, and Lock.
R/WC
Read/Write Clear. A register bit with this attribute can be read and written. However, a write of a 1
clears (sets to 0) the corresponding bit and a write of a 0 has no effect.
R/WO
Read/Write Once. A register bit with this attribute can be written to only once after power up. After the
first write, the bit becomes read only.
L
48
Lock. A register bit with this attribute becomes Read Only after a lock bit is set.
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Table 21. MCH-M Configuration Space for Device #0
Address
Offset
Register
Symbol
Register Name
Default
Value
Access
00-01h
VID
Vendor Identification
8086h
RO
02-03h
DID
Device Identification
1A30h
RO
04-05h
PCICMD
PCI Command Register
0006h
RO, R/W
06-07h
PCISTS
PCI Status Register
0090h
RO, R/WC
08h
RID
Revision Identification
Dependent on
silicon
revision
RO
09h
Reserved.
0Ah
SUBC
Sub-Class Code
00h
RO
0Bh
BCC
Base Class Code
06h
RO
0Dh
MLT
Master Latency Timer
00h
RO
0Eh
HDR
Header Type
00h
RO
00000008h
RO, R/W
0Fh
10-13h
Reserved.
APBASE
14-2Bh
Reserved.
2C-2Dh
SVID
Subsystem Vendor Identification
0000h
R/WO
2E-2Fh
SID
Subsystem Identification
0000h
R/WO
A0h
RO
AGP Miscellaneous Config
00h
RW
DRAM Row Boundary Registers
00h
R/W
00h
R/W
30-33h
34h
Reserved.
CAPPTR
35-50h
51h
AGPM
52-5Fh
Reserved.
60-67h
DRB[0:7]
70-73h
Capabilities Pointer
Reserved.
68-6Fh
Reserved.
DRA[0:7]
73-77h
DRAM Row Attribute Registers
Reserved.
78-7Bh
DRT
DRAM Timing Register
00000010h
R/W
7C-7Fh
DRC
DRAM Controller Mode Register
0000h
R/W, RO
00h
RO
80-85h
86h
Reserved.
DERRSYN
87-8Bh
DRAM Error Syndrome Register
Reserved.
8C-8Fh
EAP
Error Address Pointer Register
00000000h
RO
90-96h
PAM[0:6]
Programmable Attribute Map Registers
00000000000
000h
RO, R/W
97h
FDHC
Fixed DRAM Hole Control Register
00h
RO, R/W
98-9Ch
250687-002
Aperture Base Configuration
Reserved
Datasheet
49
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Address
Offset
Register
Symbol
Register Name
Default
Value
Access
9Dh
SMRAM
System Management RAM Control Register
02h
RO, R/W
9Eh
ESMRAMC
Extended System Mgmt RAM Control Register
38h
RO, R/W,
RWC
9Fh
Reserved
A0-A3h
ACAPID
AGP Capability Identifier
00200002h
RO
A4-A7h
AGPSTAT
AGP Status Register
1F000217h
RO
A8-Abh
AGPCMD
AGP Command Register
00000000h
RO, R/W
AC-Afh
Reserved
B0-B3h
AGPCTRL
AGP Control Register
00000000h
RO, R/W
B4h
APSIZE
Aperture Size
00h
RO, R/W
B5-B7h
Reserved
B8-BBh
ATTBASE
Aperture Translation Table Base Register
00000000h
RO, R/W
BCh
AMTT
AGP MTT Control Register
00h
RO, R/W
BDh
LPTT
AGP Low Priority Transaction Timer Register
00h
RO, R/W
BE-C3h
Reserved
C4-C5h
TOM
Top of Low Memory Register
0000h
R/W
C6-C7h
MCHCFG
MCH-M Configuration Register
0000h
RO, R/W
C8-C9h
ERRSTS
Error Status Register
0000h
RO, R/W
CA-CBh
ERRCMD
Error Command Register
0000h
RO, R/W
CC-CDh
SMICMD
SMI Command Register
0000h
RO, R/W
CE-CFh
SCICMD
SCI Command Register
0000h
RO, R/W
0000h
RO, R/W
F104A009h
RO
D0-DDh
DE-DFh
Reserved
SKPD
E0-E3h
E4-E7h
E8-FFh
50
Scratchpad Data Register
Reserved
CAPID
Product Specific Capability ID
Reserved
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.1.
VID – Vendor Identification Register – Device#0
Address Offset:
Default Value:
Attribute:
Size:
00 - 01h
8086h
Read Only
16 bits
The VID Register contains the vendor identification number. This 16-bit register combined with the
Device Identification Register uniquely identifies any PCI device. Writes to this register have no effect.
Bit
15:0
3.7.2.
Description
Vendor Identification Number. This is a 16-bit value assigned to Intel. Intel VID = 8086h.
DID – Device Identification Register – Device#0
Address Offset:
Default Value:
Attribute:
Size:
02 - 03h
1A 30h
Read Only
16 bits
This 16-bit register combined with the Vendor Identification register uniquely identifies any PCI device.
Writes to this register have no effect.
Bit
15:0
250687-002
Description
Device Identification Number. This is a 16-bit value assigned to the MCH-M Host-hub interface
Bridge Function #0.
Datasheet
51
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.3.
PCICMD – PCI Command Register – Device #0
Address Offset:
Default:
Access:
Size
04-05h
0006h
Read/Write, Read Only
16 bits
Since MCH-M Device #0 does not physically reside on PCI0 many of the bits are not implemented.
Bit
15:10
Descriptions
Reserved
9
Fast Back-to-Back Enable (RO). This bit controls whether or not the master can do fast back-toback writes to different targets. Since device #0 is strictly a target this bit is not implemented and is
hardwired to 0. Writes to this bit position have no effect.
8
SERR Enable (SERRE) (R/W). This bit is a global enable bit for Device #0 SERR messaging. The
MCH-M does not have an SERR# signal. The MCH-M communicates the SERR# condition by
sending an SERR message to the ICH3-M. If this bit is set to a 1, the MCH-M is enabled to generate
SERR messages over hub interface for specific Device #0 error conditions that are individually
enabled in the ERRCMD register. The error status is reported in the ERRSTS and PCISTS registers.
If SERRE is reset to 0, then the SERR message is not generated by the MCH-M for Device #0.
NOTE: This bit only controls SERR message for the Device #0. Device 1 has its own SERRE bits to
control error reporting for error conditions occurring on their respective devices.
52
7
Address/Data Stepping (RO). Address/data stepping is not implemented in the MCH-M, and this bit
is hardwired to 0. Writes to this bit position have no effect.
6
Parity Error Enable (PERRE) (R/W). PERR# is not implemented by the MCH-M, and this bit is
hardwired to 0. Writes to this bit position have no effect.
5
VGA Palette Snoop (RO). The MCH-M does not implement this bit and it is hardwired to a 0. Writes
to this bit position have no effect.
4
Memory Write and Invalidate Enable(MWIE) (RO). The MCH-M does not implement this bit and it
is hardwired to a 0. Writes to this bit position have no effect.
3
Special Cycle Enable(SCE) (RO). The MCH-M does not implement this bit and it is hardwired to a
0. Writes to this bit position have no effect.
2
Bus Master Enable (BME) (RO). The MCH-M is always enabled as a master on hub interface A.
This bit is hardwired to a “1”. Writes to this bit position have no effect.
1
Memory Access Enable (MAE) (RO). The MCH-M always allows access to main memory. This bit
is not implemented and is hardwired to 1. Writes to this bit position have no effect.
0
I/O Access Enable (IOAE) (RO). This bit is not implemented in the MCH-M and is hardwired to a 0.
Writes to this bit position have no effect.
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.4.
PCISTS – PCI Status Register – Device #0
Address Offset:
Default Value:
Access:
Size:
06-07h
0090h
Read Only, Read/Write Clear
16 bits
PCISTS is a 16-bit status register that reports the occurrence of error events on Device #0’s on the hub
interface. Since MCH-M Device #0 is the host-to-hub interface A bridge, many of the bits are not
implemented.
Bit
15
Reserved
14
Signaled System Error (SSE) (R/WC). This bit is set to 1 when MCH-M Device #0 generates an
SERR message over hub interface for any enabled Device #0 error condition. Device #0 error
conditions are enabled in the PCICMD and ERRCMD registers. Device #0 error flags are read/reset
from the PCISTS or ERRSTS registers. Software sets SSE to 0 by writing a 1 to this bit.
13
Received Master Abort Status (RMAS) (R/WC). This bit is set when the MCH-M generates a hub
interface request that receives a Master Abort completion packet or Master Abort Special Cycle.
Software clears this bit by writing a 1 to it.
12
Received Target Abort Status (RTAS) (R/WC). This bit is set when the MCH-M generates a hub
interface request that receives a Target Abort completion packet or Target Abort Special Cycle.
Software clears this bit by writing a 1 to it.
11
Signaled Target Abort Status (STAS) (RO). The MCH-M will not generate a Target Abort hub
interface completion packet or Special Cycle. This bit is not implemented in the MCH-M and is
hardwired to a 0. Writes to this bit position have no effect.
10:9
DEVSEL Timing (DEVT). Hub interface does not comprehend DEVSEL# protocol. These bits are
hardwired to “00”. Writes to these bit positions have no effect.
8
Master Data Parity Error Detected (DPD) (RO). PERR signaling and messaging are not
implemented by the MCH-M therefore this bit is hardwired to 0. Writes to this bit position have no
effect.
7
Fast Back-to-Back Capable (FB2B). This bit is hardwired to 1. Writes to this bit position have no
effect.
6:5
4
3:0
250687-002
Description
Reserved
Capability List (CLIST) (RO). This bit is set to 1 to indicate to the configuration software that this
device/function implements a list of new capabilities. A list of new capabilities is accessed via register
CAPPTR at configuration address offset 34h. Register CAPPTR contains an offset pointing to the
start address within configuration space of this device where the AGP Capability standard register
resides.
Reserved
Datasheet
53
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.5.
RID – Revision Identification Register – Device #0
Address Offset:
Default Value:
Access:
Size:
08h
00h
Read Only
8 bits
This register contains the revision number of the MCH-M Device #0. These bits are read only and writes
to this register have no effect.
Bit
7:0
Description
Revision Identification Number. This is an 8-bit value that indicates the revision identification
number for the MCH-M Device #0.
For the B-1 Stepping, this value is 05h.
3.7.6.
SUBC – Sub-Class Code Register – Device #0
Address Offset:
Default Value:
Access:
Size:
0Ah
00h
Read Only
8 bits
This register contains the Sub-Class Code for the MCH-M Device #0. This code is 00h indicating a Host
Bridge device. The register is read only.
Bit
7:0
3.7.7.
Description
Sub-Class Code (SUBC). This is an 8-bit value that indicates the category of Bridge into which the
MCH-M falls. The code is 00h indicating a Host Bridge.
BCC – Base Class Code Register – Device #0
Address Offset:
Default Value:
Access:
Size:
0Bh
06h
Read Only
8 bits
This register contains the Base Class Code of the MCH-M Device #0. This code is 06h indicating a
Bridge device. This register is read only.
Bit
7:0
54
Description
Base Class Code (BASEC). This is an 8-bit value that indicates the Base Class Code for the MCHM. This code has the value 06h, indicating a Bridge device.
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.8.
MLT – Master Latency Timer Register – Device #0
Address Offset:
Default Value:
Access:
Size:
0Dh
00h
Read Only
8 bits
The hub interface does not comprehend the concept of Master Latency Timer. Therefore, this register is
not implemented.
Bit
7:0
3.7.9.
Description
These bits are hardwired to 0. Writes have no effect.
HDR – Header Type Register – Device #0
Offset:
Default:
Access:
Size:
0Eh
00h
Read Only
8 bits
This register identifies the header layout of the configuration space. No physical register exists at this
location.
Bit
7:0
250687-002
Description
This read only field always returns 0 when read and writes have no effect.
Datasheet
55
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.10.
APBASE – Aperture Base Configuration Register – Device #0
Offset:
Default:
Access:
Size:
10-13h
0000_0008h
Read/Write, Read Only
32 bits
The APBASE is a standard PCI Base Address register that is used to set the base of the Graphics
Aperture. The standard PCI Configuration mechanism defines the base address configuration register
such that only a fixed amount of space can be requested (dependent on which bits are hardwired to “0” or
behave as hardwired to “0”). To allow for flexibility (of the aperture), an additional register called
APSIZE is used as a “back-end” register to control which bits of the APBASE will behave as hardwired
to “0”. This register will be programmed by the MCH-M specific BIOS code that will run before any of
the generic configuration software is run.
Note:
Bit 9 of the MCH-MCFG register is used to prevent accesses to the aperture range before this register is
initialized by the configuration software and the appropriate translation table structure has been
established in the main memory.
Bit
31:28
Description
Upper Programmable Base Address (R/W). These bits are part of the aperture base set by
configuration software to locate the base address of the graphics aperture. They correspond to bits
[31:28] of the base address in the CPU's address space that will cause a graphics aperture
translation to be inserted into the path of any memory read or write.
Default = 0000
27:22
Middle “Hardwired”/Programmable Base Address: These bits are part of the aperture base set
by configuration software to locate the base address of the graphics aperture. They correspond to
bits [27:4] of the base address in the CPU's address space that will cause a graphics aperture
translation to be inserted into the path of any memory read or write. These bits can behave as
though they were hardwired to "0" if programmed to do so by the APSIZE bits of the APSIZE register.
This will cause configuration software to understand that the granularity of the graphics aperture base
address is either finer or coarser, depending upon the bits set by MCH-M-specific configuration
software in APSIZE.
21:4
Lower “Hardwired”: This forces minimum aperture size selected by this register to be 4MB.
3
Prefetchable (RO). This bit is hardwired to “1” to identify the Graphics Aperture range as
prefetchable as per the PCI Specification for the base address registers.
There are no side effects on reads, the device returns all bytes on reads regardless of the byte
enables, and the MCH-M may merge processor writes into this range without causing errors.
2:1
0
56
Type (RO). These bits determine addressing type and they are hardwired to “00” to indicate that
address range defined by the upper bits of this register can be located anywhere in the 32-bit address
space.
Memory Space Indicator (RO). Hardwired to “0” to identify aperture range as a memory range.
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.11.
SVID – Subsystem Vendor ID – Device #0
Offset:
Default:
Access:
Size:
2C-2Dh
0000h
Read/Write Once
16 bits
This value is used to identify the vendor of the subsystem.
Bit
15:0
3.7.12.
Description
Subsystem Vendor ID (R/WO). The default value is 00h. This field should be programmed during
boot-up. After this field is written once, it becomes read only.
SID – Subsystem ID – Device #0
Offset:
Default:
Access:
Size:
2E-2Fh
0000h
Read/Write Once
16 bits
This value is used to identify a particular subsystem.
Bit
15:0
3.7.13.
Description
Subsystem ID (R/WO). The default value is 00h. This field should be programmed during boot-up.
After this field is written once, it becomes read only.
CAPPTR – Capabilities Pointer – Device #0
Offset:
Default:
Access:
Size:
34h
E4h
Read Only
8 bits
The CAPPTR provides the offset that is the pointer to the location where the AGP standard registers are
located.
Bit
7:0
250687-002
Description
Pointer to the start of AGP standard register block. This pointer tells software where it can find
the beginning of the AGP register block. The value in this field is E4h.
Datasheet
57
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.14.
AGPM- AGP Miscellaneous Configuration
Offset:
Default:
Access:
Size:
51h
00h
Read/Write
8 bits
Bit
3.7.15.
Description
7:2
Reserved
1
Aperture Access Global Enable (APEN): This bit is used to prevent access to the graphics aperture
from any port (CPU, HI_A, or AGP/PCI_B) before the aperture range is established by the
configuration software and the appropriate translation table in the main DRAM has been initialized.
The default value is "0", so this field must be set after system is fully configured in order to enable
aperture accesses.
0
Reserved
DRB[0:7] – DRAM Row Boundary Registers – Device #0
Offset:
Default:
Access:
Size:
60-67h
00h
Read/Write
8 bits
The DRAM Row Boundary Register defines the upper boundary address of each pair of DRAM rows
with a granularity of 32 MB. Each row has its own single-byte DRB register. For example, a value of 1
in DRB0 indicates that 32 MB of DRAM has been populated in the first row.
Row0:
60h
Row1:
61h
Row2:
62h
Row3:
Row4:
Row5:
Row6:
Row7:
63h
64h **
65h **
66h **
67h **
DRB0 = Total memory in row0 (in 32MB increments)
DRB1 = Total memory in row0 + row1 (in 32MB increments)
---DRB3 = Total memory in row0 + row1 + row2 + row3 (in 32MB increments)
** When in DDR mode DRB[4:7] must be programmed with value contained in DRB3.
Each Row is represented by a byte. Each byte has the following format.
Bit
7:0
58
Description
DRAM Row Boundary Address: This 8-bit value defines the upper and lower addresses for each
DRAM row. This 8-bit value is compared against a set of address lines to determine the upper
address limit of a particular row.
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.16.
DRA[0:7] – DRAM Row Attribute Registers – Device #0
Offset:
Default:
Access:
Size:
70-73h
00h
Read/Write
8 bits
The DRAM Row Attribute Register defines the page sizes to be used when accessing different pairs of
rows. Each nibble of information in the DRA registers describes the page size of a pair of rows:
Row0, 1:
Row2, 3:
Row4, 5:
Row6, 7:
Note:
70h
71h
72h (Not Used; see note)
73h (Not Used; see note)
Must contain default value of 00h
7
R
6
Row attribute for Row1
4
3
R
2
Row Attribute for Row0
0
7
R
6
Row attribute for Row3
4
3
R
2
Row Attribute for Row2
0
7
R
6
Row attribute for Row5
4
3
R
2
Row Attribute for Row4
0
7
6
3
2
Rsv
4
Row attribute for Row7
4
Rsv Row Attribute for Row6
Bit
7
6:4
0
Description
Reserved
Row Attribute for odd-numbered row: This 3-bit field defines the page size of the corresponding
row.
001: 2 KB
010: 4 KB
011: 8 KB
100: 16 KB
Others: Reserved
3
2:0
Reserved
Row Attribute for even-numbered row: This 3-bit field defines the page size of the corresponding
row.
001: 2 KB
010: 4 KB
011: 8 KB
100: 16 KB
Others: Reserved
250687-002
Datasheet
59
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.17.
DRT – DRAM Timing Register – Device #0
Offset:
Default:
Access:
Size:
78-7Bh
00000010h
Read/Write
32 bits
Bit
Description
31:19
Reserved
18:16
DRAM Idle Timer: This field determines the number of clocks the DRAM controller will remain in the
idle state before it begins precharging all pages.
000 Infinite
001 0
010 8 DRAM clocks
011 16 DRAM clocks
100 64 DRAM clocks
Others: reserved
15:11
Reserved
10:9
Activate to Precharge delay (tRAS). This bit controls the number of DRAM clocks for tRAS.
00 7 Clocks
01 6 Clocks
10 5 Clocks
11 Reserved
8:6
Reserved
5:4
CAS# Latency (tCL). This bit controls the number of DRAM Clocks between when a read command
is sampled by the SDRAMs and when the MCH-M samples read data from the SDRAMs.
00:
01:
10:
11:
60
2.5
2 Clocks
Reserved
Reserved
3
Reserved
2
DRAM RAS# to CAS# Delay (tRCD). This bit controls the number of clocks inserted between a row
activate command and a read or write command to that row.
Encoding
tRCD
0:
3 DRAM Clocks (Default)
1:
2 DRAM Clocks
1
Reserved
0
DRAM RAS# Precharge (tRP). This bit controls the number of clocks that are inserted between a
row precharge command and an activate command to the same row.
Encoding
tRP
0:
3 DRAM Clocks(Default)
1:
2 DRAM Clocks
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.18.
DRC – DRAM Controller Mode Register – Device #0
Offset:
Default:
Access:
Size:
7C-7Fh
00000000h
Read/Write
32 bits
Bit
Description
31:30
Revision Number (REV): Reflects the revision number of the format used for DDR register
definition. Currently, this field must be “00”, since this (rev “00”) is the only existing version of the
specification.
29
Initialization Complete (IC): This bit is used for communication of software state between the
memory controller and the BIOS. BIOS sets this bit to 1 after initialization of the DRAM memory
array is complete.
28
Dynamic Power-down mode Enable: When set, the DRAM controller will put pair of rows into
power down mode when all banks are pre-charged (closed). Once a bank is accessed, the relevant
pair of rows is taken out of Power Down mode.
The entry into power down mode is performed by de-activation of CKE. The exit is performed by
activation of CKE.
0:
1:
27:24
DRAM Power-down disabled
DRAM Power-down enabled
Active DDR Rows: Implementations may use this field to limit the maximum number of DDR rows
that may be active at once.
0000
Others:
23:22
Reserved
21:20
DRAM Data Integrity Mode (DDIM): These bits select one of 4 DRAM data integrity modes.
DDIM Operation
00
Non-ECC mode
10
Error checking with correction.
Other
Reserved
19:11
Reserved
10:8
Refresh Mode Select (RMS): This field determines whether refresh is enabled and, if so, at what
rate refreshes will be executed.
000:
001:
010:
011:
111:
Other:
7
250687-002
All rows allowed to be in the active state
Reserved.
Refresh disabled
Refresh enabled. Refresh interval 15.6 µSec
Refresh enabled. Refresh interval 7.8 µsec
Refresh enabled. Refresh interval 64 µsec
Refresh enabled. Refresh interval 64 clocks (fast refresh mode)
Reserved
Reserved
Datasheet
61
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Bit
6:4
Description
Mode Select (SMS). These bits select the special operational mode of the DRAM interface. The
special modes are intended for initialization at power up.
000: Post Reset state – When the MCH-M exits reset (power-up or otherwise), the mode select field
is cleared to “000”.
During any reset sequence, while power is applied and reset is active, the MCH-M asserts all CKE
signals. After internal reset is de-asserted, CKE signals remain de-asserted until this field is written to
a value different than “000”. On this event, all CKE signals are asserted.
During suspend, MCH-M internal signal triggers DRAM controller to flush pending commands and
enter all rows into Self-Refresh mode. As part of resume sequence, MCH-M will be reset – which will
clear this bit field to “000” and maintain CKE signals de-asserted. After internal reset is de-asserted,
CKE signals remain de-asserted until this field is written to a value different than “000”. On this event,
all CKE signals are asserted.
During entry to other low power states (C3, S1M), MCH-M internal signal triggers DRAM controller to
flush pending commands and enter all rows into Self-Refresh mode. During exit to normal mode,
MCH-M signal triggers DRAM controller to exit Self-Refresh and resume normal operation without
S/W involvement.
001: NOP Command Enable – All CPU cycles to DRAM result in a NOP command on the DRAM
interface.
010: All Banks Pre-charge Enable – All CPU cycles to DRAM result in an “all banks precharge”
command on the DRAM interface.
011: Mode Register Set Enable – All CPU cycles to DRAM result in a “mode register” set command
on the DRAM interface. Host address lines are mapped to memory address lines in order to specify
the command sent. Host address lines [15:3] are mapped to MA[12:0].
100: Extended Mode Register Set Enable – All processor cycles to SDRAM result in an “extended
mode register set” command on the DRAM interface (DDR only). Host address lines are mapped to
DDR address lines in order to specify the command sent. Host address lines [15:3] are mapped to
MA[12:0].
101: Reserved
110: CBR Refresh Enable – In this mode all CPU cycles to DRAM result in a CBR cycle on the DDR
interface
111: Normal operation
3:0
62
Reserved
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.19.
DERRSYN – DRAM Error Syndrome Register
Address Offset:
Default Value:
Access:
Size:
86h
00hb
Read Only
8 bits
This register is used to report the ECC syndromes for each quadword of a 32-Byte aligned data quantity
read from the DRAM array.
Bit
7:0
Description
DRAM ECC Syndrome (DECCSYN) (RO): After a DRAM ECC error, hardware loads this field with
a syndrome that describes the set of bits found to be in error.
Note: that this field is locked from the time that it is loaded up to the time when the error flag is
cleared by software. If the first error was a single bit, correctable error, then a subsequent multiple
bit error will overwrite this field. In all other cases, an error that occurs after the first error and
before the error flag has been cleared by software will escape recording.
3.7.20.
EAP – Error Address Pointer Register – Device #0
Address Offset:
Default Value:
Access:
Size:
8C-8Fh
0000_0000h
Read Only
32 bits
This register stores the DRAM address when an ECC error occurs.
Bit
Description
31:30
Reserved
29:1
Error Address Pointer (EAP): This field is used to store the 4-KB block of main memory of which
an error (single bit or multi-bit error) has occurred.
Note: that the value of this bit field represents the address of the first single or the first multiple bit
error occurrence after the error flag bits in the ERRSTS register have been cleared by software. A
multiple bit error will overwrite a single bit error. Once the error flag bits are set as a result of an error,
this bit field is locked and doesn’t change as a result of a new error.
0
250687-002
Reserved
Datasheet
63
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.21.
PAM[0:6] – Programmable Attribute Map Registers – Device #0
Address Offset:
Default Value:
Attribute:
Size:
90-96h
00h
Read/Write, Read Only
8 bits
The MCH-M allows programmable memory attributes on 13 Legacy memory segments of various sizes
in the 640 Kbytes to 1 Mbytes address range. Seven Programmable Attribute Map (PAM) Registers are
used to support these features. Cacheability of these areas is controlled via the MTRR registers in the
processor. Two bits are used to specify memory attributes for each memory segment. These bits apply to
host initiator only access to the PAM areas. MCH-M will forward to main memory for any A.G.P., PCI,
or hub interface A initiated accesses to the PAM areas. These attributes are:
RE Read Enable. When RE = 1, the host read accesses to the corresponding memory segment
are claimed by the MCH-M and directed to main memory. Conversely, when RE = 0, the host read
accesses are directed to PCI0.
WE Write Enable. When WE = 1, the host write accesses to the corresponding memory segment
are claimed by the MCH-M and directed to main memory. Conversely, when WE = 0, the host write
accesses are directed to PCI0.
The RE and WE attributes permit a memory segment to be Read Only, Write Only, Read/Write, or
disabled. For example, if a memory segment has RE = 1 and WE = 0, the segment is Read Only.
Each PAM Register controls two regions, typically 16 Kbytes in size. Each of these regions has a 4-bit
field. The four bits that control each region have the same encoding and are defined in the following
table.
64
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Table 22. Control Signals for Various Memory Segments
Bits [7, 3]
Reserved
Bits [6, 2]
Reserved
Bits [5, 1]
WE
Bits [4, 0]
RE
Description
X
x
0
0
Disabled. DRAM is disabled and all accesses are
directed to the hub interface A. The MCH-M does not
respond as a PCI target for any read or write access to
this area.
X
x
0
1
Read Only. Reads are forwarded to DRAM and writes
are forwarded to the hub interface A for termination.
This write protects the corresponding memory
segment. The MCH-M will respond as an AGP or the
hub interface A target for read accesses but not for
any write accesses.
X
x
1
0
Write Only. Writes are forwarded to DRAM and reads
are forwarded to the hub interface for termination. The
MCH-M will respond as an AGP or hub interface A
target for write accesses but not for any read
accesses.
X
x
1
1
Read/Write. This is the normal operating mode of
main memory. Both read and write cycles from the
host are claimed by the MCH-M and forwarded to
DRAM. The MCH-M will respond as an AGP or the
hub interface A target for both read and write
accesses.
At the time that a hub interface or AGP accesses to the PAM region may occur, the targeted PAM
segment must be programmed to be both readable and writeable.
As an example, consider BIOS that is implemented on the expansion bus. During the initialization
process, the BIOS can be shadowed in main memory to increase the system performance. When BIOS is
shadowed in main memory, it should be copied to the same address location. To shadow the BIOS, the
attributes for that address range should be set to write only. The BIOS is shadowed by first doing a read
of that address. This read is forwarded to the expansion bus. The host then does a write of the same
address, which is directed to main memory. After the BIOS is shadowed, the attributes for that memory
area are set to read only so that all writes are forwarded to the expansion bus. Figure 4 and Table 23
show the PAM registers and the associated attribute bits:
250687-002
Datasheet
65
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Figure 4. PAM Register Attributes
Offset
PAM6
PAM5
PAM4
PAM3
PAM2
PAM1
PAM0
96h
95h
94h
93h
92h
91h
90h
7
6
5
4
3
2
1
0
R
R
WE
RE
R
R
WE
RE
Read Enable (R/W)
1=Enable
0=Disable
Reserved
Reserved
Write Enable (R/W)
1=Enable
0=Disable
Read Enable (R/W)
1=Enable
0=Disable
Write Enable (R/W)
1=Enable
0=Disable
Reserved
Reserved
pam
66
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Table 23. PAM Register Details
PAM Reg
Attribute Bits
Offset
Memory Segment
PAM0[3:0]
Comments
90h
Reserved
PAM0[7:4]
R
R
WE
90h
0F0000h - 0FFFFFh
BIOS Area
90h
PAM1[3:0]
R
R
WE
91h
0C0000h - 0C3FFFh
ISA Add-on BIOS
91h
PAM1[7:4]
R
R
WE
91h
0C4000h - 0C7FFFh
ISA Add-on BIOS
91h
PAM2[3:0]
R
R
WE
92h
0C8000h - 0CBFFFh
ISA Add-on BIOS
92h
PAM2[7:4]
R
R
WE
92h
0CC000h- 0CFFFFh
ISA Add-on BIOS
92h
PAM3[3:0]
R
R
WE
93h
0D0000h- 0D3FFFh
ISA Add-on BIOS
93h
PAM3[7:4]
R
R
WE
93h
0D4000h- 0D7FFFh
ISA Add-on BIOS
93h
PAM4[3:0]
R
R
94h
0D8000h- 0DBFFFh
ISA Add-on BIOS
94h
PAM4[7:4]
R
R
WE
94h
0DC000h- 0DFFFFh
ISA Add-on BIOS
94h
PAM5[3:0]
R
R
WE
95h
0E0000h- 0E3FFFh
BIOS Extension
95h
PAM5[7:4]
R
R
WE
95h
0E4000h- 0E7FFFh
BIOS Extension
95h
PAM6[3:0]
R
R
WE
96h
0E8000h- 0EBFFFh
BIOS Extension
96h
PAM6[7:4]
R
R
WE
96h
0EC000h- 0EFFFFh
BIOS Extension
96h
For details on overall system address mapping scheme see the Address Decoding Section of this
document.
DOS Application Area (00000h-9FFFh)
The DOS area is 640 KB in size and it is further divided into two parts. The 512-KB area at 0 to 7FFFFh
is always mapped to the main memory controlled by the MCH-M, while the 128-KB address range from
080000 to 09FFFFh can be mapped to PCI0 or to main DRAM. By default this range is mapped to main
memory and can be declared as a main memory hole (accesses forwarded to PCI0) via MCH-M FDHC
configuration register.
Video Buffer Area (A0000h-BFFFFh)
Attribute bits do not control this 128-KB area. The host -initiated cycles in this region are always
forwarded to either PCI0 or AGP unless this range is accessed in SMM mode. Routing of accesses is
controlled by the Legacy VGA control mechanism of the “virtual” PCI-PCI bridge device
embedded within the MCH-M.
This area can be programmed as SMM area via a special configuration register. When used as SMM
space this range cannot be accessed from the hub interface or AGP.
Expansion Area (C0000h-DFFFFh)
This 128-KB area is divided into eight 16-KB segments, which can be assigned with different attributes
via PAM control register as defined by above.
250687-002
Datasheet
67
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Extended System BIOS Area (E0000h-EFFFFh)
This 64-Kbytes area is divided into four 16-Kbytes segments which can be assigned with different
attributes via PAM control register as defined by the table above.
System BIOS Area (F0000h-FFFFFh)
This area is a single 64-Kbytes segment, which can be assigned with different attributes via PAM control
register as defined by the table above.
3.7.22.
FDHC – Fixed DRAM Hole Control Register – Device #0
Address Offset:
Default Value:
Access:
Size:
97h
00h
Read/Write, Read Only
8 bits
This 8-bit register controls a fixed DRAM hole: 15 MB-16 MB.
Bit
7
Description
Hole Enable (HEN). This field enables a memory hole in DRAM space. Host cycles matching an
enabled hole are passed on to ICH3-M through the hub interface. The hub interface cycles matching
an enabled hole will be ignored by the MCH-M. Note that a selected hole is not re-mapped.
0
1
6:0
68
Disabled. No hole
15 M-16 M (1 MB Hole)
Reserved
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.23.
SMRAM – System Management RAM Control Register – Device
#0
Address Offset:
Default Value:
Access:
Size:
9Dh
02h
Read/Write, Read Only, Lock
8 bits
The SMRAMC register controls how accesses to Compatible and Extended SMRAM spaces are treated.
The Open, Close, and Lock bits function only when G_SMRAME bit is set to a 1. Also, the OPEN bit
must be reset before the LOCK bit is set.
Bit
Description
7
Reserved
6
SMM Space Open (D_OPEN): When D_OPEN=1 and D_LCK=0, the SMM space DRAM is made
visible even when SMM decode is not active. This is intended to help BIOS initialize SMM space.
Software should ensure that D_OPEN=1 and D_CLS=1 are not set at the same time. When D_LCK
is set to a 1, D_OPEN is reset to 0 and becomes read only.
5
SMM Space Closed (D_CLS): When D_CLS = 1 SMM space DRAM is not accessible to data
references, even if SMM decode is active. Code references may still access SMM space DRAM. This
will allow SMM software to reference “through” SMM space to update the display even when SMM is
mapped over the VGA range. Software should ensure that D_OPEN=1 and D_CLS=1 are not set at
the same time.
Note that the D_CLS bit only applies to Compatible SMM space.
4
SMM Space Locked (D_LCK): When D_LCK is set to 1 then D_OPEN is reset to 0 and D_LCK,
D_OPEN, C_BASE_SEG, H_SMRAM_EN, TSEG_SZ and TSEG_EN become “Read Only”. D_LCK
can be set to 1 via a normal configuration space write but can only be cleared by a Full Reset. The
combination of D_LCK and D_OPEN provide convenience with security. The BIOS can use the
D_OPEN function to initialize SMM space and then use D_LCK to “lock down” SMM space in the
future so that no application software (or BIOS itself) can violate the integrity of SMM space, even if
the program has knowledge of the D_OPEN function.
3
Global SMRAM Enable (G_SMRAME). If set to a 1, then Compatible SMRAM functions is enabled,
providing 128 KB of DRAM accessible at the A0000h address while in SMM (ADS# with SMM
decode). To enable Extended SMRAM function this bit has to be set to 1.
Once D_LCK is set, this bit becomes read only.
2:0
250687-002
Compatible SMM Space Base Segment (C_BASE_SEG) (RO). This field indicates the location of
SMM space. “SMM DRAM” is not remapped. It is simply “made visible” if the conditions are right to
access SMM space, otherwise the access is forwarded to the hub interface. C_BASE_SEG is
hardwired to 010 to indicate that the MCH-M supports the SMM space at A0000h-BFFFFh.
Datasheet
69
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.24.
ESMRAMC – Extended System Mgmt RAM Control Register –
Device #0
Address Offset:
Default Value:
Access:
Size:
9Eh
38h
Read Only, Read/Write, Read/Write Clear, Lock
8 bits
The Extended SMRAM register controls the configuration of Extended SMRAM space. The Extended
SMRAM (E_SMRAM) memory provides a write-back cacheable SMRAM memory space that is above 1
MByte.
Bit
7
Description
H_SMRAM_EN (H_SMRAME): Controls the SMM memory space location (i.e. above 1 MByte or
below 1 MByte) When G_SMRAME is 1 and H_SMRAME this bit is set to 1, the high SMRAM
memory space is enabled. SMRAM accesses from FEDA_0000h to FEDB_FFFFh are remapped to
DRAM address 000A0000h to 000BFFFFh.
Once D_LCK is set, this bit becomes read only.
6
E_SMRAM_ERR (E_SMERR): This bit is set when host accesses the defined memory ranges in
Extended SMRAM (High Memory and T-segment) while not in SMM space and with the D-OPEN bit =
0. It is software’s responsibility to clear this bit. The software must write a 1 to this bit to clear it
5
SMRAM_Cache (SM_CACHE): This bit is hardwired to ‘1’.
4
SMRAM_L1_EN (SM_L1): This bit is hardwired to ‘1’.
3
SMRAM_L2_EN (SM_L2): This bit is hardwired to ‘1’.
2:1
TSEG_SZ[1-0] (T_SZ): Selects the size of the TSEG memory block if enabled. This memory is
taken from the top of DRAM space (i.e. TOM - TSEG_SZ), which is no longer claimed by the memory
controller (all accesses to this space are sent to the hub interface if TSEG_EN is set). This field
decodes as follows:
TSEG_SZ[1,0]
00
01
10
11
Description
(TOM-128K) to TOM
(TOM-256K) to TOM
(TOM-512K) to TOM
(TOM-1M) to TOM (845MP Only)
Once D_LCK is set, this bit becomes read only.
0
TSEG_EN (T_EN): Enabling of SMRAM memory (TSEG, 128 Kbytes, 256 Kbytes, 512 Kbytes or 1
Mbytes of additional SMRAM memory) for Extended SMRAM space only. When G_SMRAME =1 and
TSEG_EN = 1, the TSEG is enabled to appear in the appropriate physical address space.
Once D_LCK is set, this bit becomes read only.
70
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.25.
ACAPID – AGP Capability Identifier Register – Device #0
Address Offset:
Default Value:
Access:
Size:
A0-A3h
0020_0002h
Read Only
32 bits
This register provides standard identifier for AGP capability.
Bit
Description
31:24
Reserved.
23:20
Major AGP Revision Number (MAJREV): These bits provide a major revision number of AGP
specification to which this version of MCH-M conforms. This field is hardwired to value of “0010b” (i.e.
implying Rev 2.x).
19:16
Minor AGP Revision Number (MINREV): These bits provide a minor revision number of AGP
specification to which this version of MCH-M conforms. This number is hardwired to value of “0000”
(i.e. implying Rev x.0)
Together with major revision number, this field identifies MCH-M as an AGP REV 2.0 compliant
device.
250687-002
15:8
Next Capability Pointer (NCAPTR): AGP capability is the first and the last capability described via
the capability pointer mechanism and therefore these bits are hardwired to “0” to indicate the end of
the capability linked list.
7:0
AGP Capability ID (CAPID): This field identifies the linked list item as containing AGP registers. This
field has a value of 0000_0010b assigned by the PCI SIG.
Datasheet
71
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.26.
AGPSTAT – AGP Status Register – Device #0
Address Offset:
Default Value:
Access:
Size:
A4-A7h
1F00_0217h
Read Only
32 bits
This register reports AGP device capability/status.
Bit
Description
31:24
Request Queue (RQ): This field is hardwired to 1Fh to indicate a maximum of 32 outstanding AGP
command requests can be handled by the MCH-M. This field contains the maximum number of AGP
command requests the MCH-M is configured to manage.
Default =1Fh to allow a maximum of 32 outstanding AGP command requests.
23:10
9
8:6
Reserved
Side Band Addressing Support (SBA): This bit indicates that the MCH-M supports side band
addressing. It is hardwired to 1.
Reserved
5
Greater that 4 GB Support (4GB): This bit indicates that the MCH-M does not support addresses
greater than 4 gigabytes. It is hardwired to 0.
4
Fast Write Support (FW): This bit indicates that the MCH-M supports Fast Writes from the host to
the AGP master. It is hardwired to a 1.
3
Reserved
2:0
Data Rate Support (RATE): After reset the MCH-M reports its data transfer rate capability. Bit 0
identifies if MCH-M supports 1x data transfer mode, bit 1 identifies if MCH-M supports 2x data
transfer mode, and bit 2 identifies if MCH-M supports 4x data transfer mode. 1x, 2x, and 4x data
transfer modes are supported by the MCH-M and therefore this bit field has a Default Value = 111.
Note that the selected data transfer mode applies to both AD bus and SBA bus. It also applies to Fast
Writes if they are enabled.
72
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.27.
AGPCMD – AGP Command Register – Device #0
Address Offset:
Default Value:
Access:
Size:
A8-ABh
0000_0000h
Read/Write, Read Only
32 bits
This register provides control of the AGP operational parameters.
Bit
31:10
Description
Reserved
9
SBA Enable (SBAEN): When this bit is set to 1, the side band addressing mechanism is enabled.
8
AGP Enable (AGPEN): When this bit is reset to 0, the MCH-M will ignore all AGP operations,
including the sync cycle. Any AGP operations received while this bit is set to 1 will be serviced even if
this bit is subsequently reset to 0. If this bit transitions from a 1 to a 0 on a clock edge in the middle of
an SBA command being delivered in 1X mode the command will be issued.
0 = MCH-M will ignore all AGP operations, including the sideband strobe sync cycle.
1 = MCH-M will respond to AGP operations delivered via PIPE#, or to operations delivered via SBA if
the AGP Side Band Enable bit is also set to 1.
7:5
Reserved
4
FW Enable (FWEN): When this bit is set, the MCH-M will use the Fast Write protocol for Memory
Write transactions from the MCH-M to the AGP master. Fast Writes will occur at the data transfer
rate selected by the data rate bits (2:0) in this register. When this bit is cleared, or when the data rate
bits are set to 1x mode, the Memory Write transactions from the MCH-M to the AGP master use
standard PCI protocol.
3
Reserved
2:0
Data Rate (DRATE): The settings of these bits determine the AGP data transfer rate. One (and only
one) bit in this field must be set to indicate the desired data transfer rate.
Encoding
Description
001
010
100
1x transfer mode
2x transfer mode
4x transfer mode
Configuration software will update this field by setting only one bit that corresponds to the capability of
AGP master (after that capability has been verified by accessing the same functional register within
the AGP masters’ configuration space.)
NOTE: This field applies to G_AD and SBA buses. It also applies to Fast Writes if they are enabled.
250687-002
Datasheet
73
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.28.
AGPCTRL – AGP Control Register
Address Offset:
Default Value:
Access:
Size:
B0-B3h
0000_0000h
Read/Write, Read Only
32 bits
This register provides for additional control of the AGP interface.
Bit
31:8
7
Description
Reserved
GTLB Enable (and GTLB Flush Control) (R/W): When this bit is set, it enables normal operations
of the Graphics Translation Lookaside Buffer. If it is zero, the GTLB is flushed by clearing the valid
bits associated with each entry.
Default=0 (GTLB disabled)
6:0
74
Reserved
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.29.
APSIZE – Aperture Size – Device #0
Address Offset:
Default Value:
Access:
Size:
B4h
00h
Read/Write, Read Only
8 bits
This register determines the effective size of the Graphics Aperture used for a particular MCH-M
configuration. This register can be updated by the MCH-M specific BIOS configuration sequence before
the PCI standard bus enumeration sequence takes place. If the register is not updated then a default value
will select an aperture of maximum size (i.e. 256 MB). The size of the table that will correspond to a
256-MB aperture is not practical for most applications and therefore, these bits must be programmed to a
smaller practical value that will force adequate address range to be requested via APBASE register from
the PCI configuration software.
Bit
Description
7:6
Reserved
5:0
Graphics Aperture Size (APSIZE) (R/W): Each bit in APSIZE[5:0] operates on similarly ordered bits
in APBASE[27:22] of the Aperture Base configuration register. When a particular bit of this field is “0”
it forces the similarly ordered bit in APBASE[27:22] to behave as “hardwired” to 0. When a particular
bit of this field is set to “1” it allows the corresponding bit of the APBASE[27:22] field to be read/write
accessible. Only the following combinations are allowed:
5 4 3 2 1 0
Aperture Size
1 1 1 1 1 1
4 MB
1 1 1 1 1 0
8 MB
1 1 1 1 0 0
16 MB
1 1 1 0 0 0
32 MB
1 1 0 0 0 0
64 MB
1 0 0 0 0 0
128 MB
0 0 0 0 0 0
256 MB
Default for APSIZE[5:0]=000000b forces default APBASE[27:22] =000000b (i.e. all bits respond as
“hardwired” to 0). This provides maximum aperture size of 256 MB. As another example,
programming APSIZE[5:0]=111000b hardwires APBASE[24:22]=000b and while enabling
APBASE[27:25] as read/write.
250687-002
Datasheet
75
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.30.
ATTBASE – Aperture Translation Table Base Register – Device
#0
Address Offset:
Default Value:
Access:
Size:
B8-BBh
0000_0000h
Read/Write, Read Only
32 bits
This register provides the starting address of the Graphics Aperture Translation Table Base located in the
main DRAM. This value is used by the MCH-M Graphics Aperture address translation logic (including
the GTLB logic) to obtain the appropriate address translation entry required during the translation of the
aperture address into a corresponding physical DRAM address. The ATTBASE register may be
dynamically changed.
Note:
The address provided via ATTBASE is 4-KB aligned.
Bit
31:12
Description
Aperture Translation Table Base (TTABLE): This field contains a pointer to the base of the
translation table used to map memory space addresses in the aperture range to addresses in main
memory.
NOTE: It should be modified only when the GTLB has been disabled.
11:0
76
Reserved
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.31.
AMTT – AGP Interface Multi-Transaction Timer Register –
Device #0
Address Offset:
Default Value:
Access:
Size:
BCh
00h
Read/Write, Read Only
8 bits
AMTT is an 8-bit register that controls the amount of time that the MCH-M arbiter allows an AGP
master to perform multiple back-to-back transactions. The MCH-M AMTT mechanism is used to
optimize the performance of an AGP master (using PCI protocol operations) that performs multiple
back-to-back transactions to fragmented memory ranges (and as a consequence it can not use long burst
transfers). The AMTT mechanism applies to the host-AGP transactions as well and it guarantees to the
processor a fair share of the AGP interface bandwidth.
The number of clocks programmed in the AMTT represents the guaranteed time slice (measured in 66MHz clocks) allotted to the current agent (either AGP master or Host bridge) after which the AGP arbiter
may grant the bus to another agent. The default value of AMTT is 00h and disables this function. The
AMTT value can be programmed with 8-clock granularity. For example, if the AMTT is programmed to
18h, then the selected value corresponds to the time period of 24 AGP (66 MHz) clocks.
Bit
250687-002
Description
7:3
Multi-Transaction Timer Count Value (MTTC): The number programmed in these bits represents
the guaranteed time slice (measured in eight 66-MHz clock granularity) allotted to the current agent
(either AGP master or MCH-M) after which the AGP arbiter may grant the bus to another agent.
2:0
Reserved
Datasheet
77
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.32.
LPTT – AGP Low Priority Transaction Timer Register – Device
#0
Address Offset:
Default Value:
Access:
Size:
BDh
00h
Read/Write, Read Only
8 bits
LPTT is an 8-bit register similar in a function to AMTT. This register is used to control the minimum
tenure on the AGP for low priority data transaction (both reads and writes) issued using PIPE# or SBA
mechanisms.
The number of clocks programmed in the LPTT represents the guaranteed time slice (measured in 66
MHz clocks) allotted to the current low priority AGP transaction data transfer state. This does not
necessarily apply to a single transaction, but can span multiple low-priority transactions of the same type.
After this time expires the AGP arbiter may grant the bus to another agent if there is a pending request.
The LPTT does not apply in the case of high-priority request where ownership is transferred directly to
high-priority requesting queue. The default value of LPTT is 00h and disables this function. The LPTT
value can be programmed with 8-clock granularity. For example, if the LPTT is programmed to 10h,
then the selected value corresponds to the time period of 16 AGP (66 MHz) clocks.
78
Bit
Description
7:3
Low Priority Transaction Timer Count Value (LPTTC): The number of clocks programmed in these
bits represents the guaranteed time slice (measured in eight 66-MHz clock granularity) allotted to the
current low priority AGP transaction data transfer state.
2:0
Reserved
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.33.
TOM – Top of Low Memory Register – Device #0
Address Offset:
Default Value:
Access:
Size:
C4-C5h
0100h
Read/Write
16 bits
This register contains the maximum address below 4 GB that should be treated as a memory access. Note
that this register must be set to a value of 0100h (16 MB) or greater. Usually it will sit below the areas
configured for the hub interface, PCI memory, and the graphics aperture.
Bit
15:4
Description
Top of Low Memory (TOM): This register contains the address that corresponds to bits 31 to 20 of
the maximum DRAM memory address that lies below 4 GB. Configuration software should set this
value to either the maximum amount of memory in the system or to the minimum address allocated
for PCI memory or the graphics aperture, whichever is smaller.
Programming example: 400h = 1 GB. An access to 4000_0000h or above will be considered above
the TOM and therefore not routed to DRAM. It may go to AGP, aperture, or subtractively decode to
Hub Interface.
3:0
250687-002
Reserved
Datasheet
79
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.34.
MCH-MCFG – MCH-M Configuration Register – Device #0
Offset:
Default:
Access:
Size:
C6-C7h
0000h
Read/Write Once, Read/Write, Read Only
16 bits
Bit
15:12
11
Description
Reserved
System Memory Frequency Select: This bit must be programmed prior to memory initialization.
This bit must be programmed/set to “0” prior to memory initialization in order to guarantee proper
operation of the Intel®845MZ.
10:6
5
0:
System Memory frequency is set to 100 MHz
1:
System Memory frequency is set to 133 MHz (845MP only)
Reserved
Monochrome Display adapter Present (MDAP): This bit works with the VGA Enable bit in the
BCTRL register of device 1 to control the routing of host initiated transactions targeting MDA
compatible I/O and memory address ranges. This bit should not be set when the VGA Enable bit is
not set in device 1 BCTRL1 register. When the MDAP bit is set, accesses to MDA resources are
forwarded to hub interface A. MDA resources are defined as the following:
Memory addresses: 0B0000h - 0B7FFFh
I/O addresses: 3B4h, 3B5h, 3B8h, 3B9h, 3BAh, and 3BFh,
including ISA address aliases, (A[15:10] are not used in decode)
Any I/O reference that includes the I/O locations listed above, or their aliases, will be forwarded to the
hub interface A even if the reference also includes I/O locations not listed above.
Please refer to the System Address Map section of this document for further information.
4:3
2
Reserved
In-Order Queue Depth (IOQD): This bit reflects the value sampled on HA[7]# on the deassertion of
the CPURST#. It indicates the depth of the host bus in-order queue (i.e. level of host bus pipelining).
If IOQD is set to 1 (HA[7]# sampled “1” i.e. undriven on the host bus), then the depth of the host bus
in-order queue is configured to the maximum allowed by the host bus protocol (i.e. 12). Note that the
MCH-M has an 12 deep IOQ and will assert BNR# on the bus to limit the number of queued bus
transactions to 12. If the IOQD bit is set to 0 (HA[7]# is sampled asserted , i.e., “0”), then depth of
the host bus in-order queue is set to 1 (i.e. no pipelining support on the host bus).
Note that HA[7]# is not driven by the MCH-M during CPURST#. If an IOQ size of 1 is desired, HA[7]#
must be driven low during CPURST# by an external source.
80
1
Reserved
0
Reserved
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.35.
ERRSTS – Error Status Register – Device #0
Address Offset:
Default Value:
Access:
Size:
C8-C9h
0000h
Read Only, Read/Write Clear
16 bits
This register is used to report various error conditions via the hub interface messages to ICH3-M. An
SERR, SMI, or SCI error message may be generated via the hub interface A on a zero to one transition of
any of these flags when enabled in the PCICMD/ERRCMD, SMICMD, or SCICMD registers
respectively. These bits are set regardless of whether or not the SERR is enabled and generated.
Bit
15:10
9
8:7
250687-002
Description
Reserved
LOCK to non-DRAM Memory Flag (LCKF): When this bit is set it indicates that a host initiated
LOCK cycle targeting non-DRAM memory space occurred. Software must write a “1” to clear this
status bit.
Reserved
6
SERR on hub interface A Target Abort (TAHLA): When this bit is set, the MCH-M has detected that
an MCH-M originated hub interface A cycle was terminated with a Target Abort completion packet or
special cycle. Software must write a “1” to clear this bit.
5
MCH-M Detects Unimplemented hub interface Special Cycle (HIAUSC): When this bit is set the
MCH-M detected an Unimplemented Special Cycle on the hub interface. Software must write a “1” to
clear this bit.
4
AGP Access Outside of Graphics Aperture Flag (OOGF): When this bit is set it indicates that an
AGP access occurred to an address that is outside of the graphics aperture range. Software must
write a 1 to clear this status bit.
3
Invalid AGP Access Flag (IAAF): When this bit is set to 1 it indicates that an AGP access was
attempted outside of the graphics aperture and either to the 640k-1M range or above top of the
memory or illegal aperture access. Software must write a 1 to clear this status bit.
2
Invalid Graphics Aperture Translation Table Entry (ITTEF): When this bit is set to 1 it indicates
that an invalid translation table entry was returned in response to an AGP access to the graphics
aperture. Software must write a 1 to clear this bit.
1
Multiple-bit DRAM ECC Error Flag (DMERR): If this bit is set to 1, a memory read data transfer had
an uncorrectable multiple-bit error. When this bit is set the address and device number that caused
the error are logged in the EAP register. Software uses bits [1:0] to detect whether the logged error
address is for Single or Multiple-bit error. Once software completes the error processing, a value of ‘1’
is written to this bit field to clear the value (back to 0) and unlock the error logging mechanism.
0
Single-bit DRAM ECC Error Flag (DSERR): If this bit is set to 1, a memory read data transfer had a
single-bit correctable error and the corrected data was sent for the access. When this bit is set the
address, channel number, and device number that caused the error are logged in the EAP register.
Once this bit is set the EAP, CN, DN, and ES fields are locked to further single bit error updates until
the processor clears this bit by writing a 1. Software must write a “1” to clear this bit and unlock the
error logging mechanism.
Datasheet
81
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.36.
ERRCMD – Error Command Register – Device #0
Address Offset:
Default Value:
Access:
Size:
CA-CBh
0000h
Read Only, Read/Write
16 bits
This register enables various errors to generate an SERR message via the hub interface A. Since the
MCH-M does not have an SERR# signal, SERR messages are passed from the MCH-M to the ICH3-M
over the hub interface. When a bit in this register is set, an SERR message will be generated on hub
interface whenever the corresponding flag is set in the ERRSTS register. The actual generation of the
SERR message is globally enabled for Device #0 via the PCI Command register.
Note:
An error can generate one and only one error message via the hub interface A. It is software’s
responsibility to make sure that when an SERR error message is enabled for an error condition; SMI and
SCI error messages are disabled for that same error condition.
Bit
15:10
9
8:7
82
Description
Reserved
SERR on Non-DRAM Lock (LCKERR): When this bit is asserted, the MCH-M will generate a hub
interface A SERR special cycle whenever a processor lock cycle is detected that does not hit DRAM
Reserved
6
SERR on Target Abort on hub interface A Exception (TAHLA_SERR): When this bit is set, the
generation of the hub interface A SERR message is enabled when an MCH-M originated hub
interface A cycle is completed with “Target Abort” completion packet or special cycle status.
5
SERR on Detecting Hub Interface A Unimplemented Special Cycle (HIAUSCERR): When this bit
is set to 1 the MCH-M generates an SERR message over hub interface A when an Unimplemented
Special Cycle is received on the hub interface. When this bit is set to 0 the MCH-M does not generate
an SERR message for this event. SERR messaging for Device 0 is globally enabled in the PCICMD
register.
4
SERR on AGP Access Outside of Graphics Aperture (OOGF_SERR): When this bit is set, the
generation of the hub interface A SERR message is enabled when an AGP access occurs to an
address outside of the graphics aperture.
3
SERR on Invalid AGP Access (IAAF_SERR): When this bit is set, the generation of the hub
interface A SERR message is enabled when an AGP access occurs to an address outside of the
graphics aperture and either to the 640K - 1M range or above the top of memory.
2
SERR on Invalid Translation Table Entry (ITTEF_SERR): When this bit is set, the generation of the
hub interface A SERR message is enabled when an invalid translation table entry was returned in
response to an AGP access to the graphics aperture.
1
SERR Multiple-Bit DRAM ECC Error (DMERR_SERR): When this bit is set, the generation of the
hub interface A SERR message is enabled when the MCH-M DRAM controller detects a multiple-bit
error. For systems not supporting ECC this bit must be disabled.
0
SERR on Single-bit ECC Error (DSERR): When this bit is set, the generation of the hub interface A
SERR message is enabled when the MCH-M DRAM controller detects a single bit error. For systems
that do not support ECC this bit must be disabled.
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.37.
SMICMD – SMI Command Register – Device #0
Address Offset:
Default Value:
Access:
Size:
CC-CDh
0000h
Read/Write, Read Only
16 bits
This register enables various errors to generate an SMI message via the hub interface A.
Note:
An error can generate one and only one error message via the hub interface A. It is software’s
responsibility to make sure that when an SMI error message is enabled for an error condition; SERR and
SCI error messages are disabled for that same error condition.
Bit
15:2
3.7.38.
Description
Reserved
1
SMI on Multiple-bit DRAM ECC Error (DMERR): When this bit is set, the generation of the hub
interface A SMI message is enabled when the MCH-M DRAM controller detects a multiple-bit error.
For systems not supporting ECC this bit must be disabled.
0
SMI on Single-bit ECC Error (DSERR): When this bit is set, the generation of the hub interface A
SMI message is enabled when the MCH-M DRAM controller detects a single bit error. For systems
that do not support ECC this bit must be disabled.
SCICMD – SCI Command Register – Device #0
Address Offset:
Default Value:
Access:
Size:
CE-CDh
0000h
Read/Write, Read Only
16 bits
This register enables various errors to generate a SCI message via the hub interface A.
Note:
An error can generate one and only one error message via the hub interface A. It is software’s
responsibility to make sure that when an SCI error message is enabled for an error condition, SERR and
SMI error messages are disabled for that same error condition.
Bit
15:2
250687-002
Description
Reserved
1
SCI on Multiple-Bit DRAM ECC Error (DMERR): When this bit is set, the generation of the hub
interface A SCI message is enabled when the MCH-M DRAM controller detects a multiple-bit error.
For systems not supporting ECC this bit must be disabled.
0
SCI on Single-bit ECC Error (DSERR): When this bit is set, the generation of the hub interface A
SCI message is enabled when the MCH-M DRAM controller detects a single bit error. For systems
that do not support ECC this bit must be disabled.
Datasheet
83
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.7.39.
SKPD – Scratchpad Data – Device #0
Address Offset:
Default Value:
Access:
Size:
DE-DFh
0000h
Read/Write
16 bits
Bit
15:0
3.7.40.
Description
Scratchpad [15:0]. These bits are simply R/W storage bits that have no affect on the MCH-M
functionality.
CAPID – Product Specific Capability Identifier
Address Offset:
Default Value:
Access:
Size:
E4h
B104A009h
Read Only
32 bits
Bit
31
Description
Dual Data Rate System Memory Capability
1 = Component supports Dual Data Rate (DDR) SDRAM memory.
30
Mobile Power Management Capability:
1 = Component is capable of all Mobile Power Management features.
0 = Component is NOT capable of all Mobile Power Management features
29
Reserved
28
System Memory Capability
1 = Component supports up to a 266-MHz DDR memory system, and more than 512 MB of maximum
physical memory.
0 = Component supports 200-MHz DDR memory system, will support up to 512 MB of physical
memory.
84
27:24
CAPID Version: This field has the value 0001b to identify the first revision f the CAPID register
definition.
23:16
CAPID Length: This field has the value 04h to indicate the structure length (4 bytes).
15:8
Next Capability Pointer: This field has the value A0h to point to the next Capability ID in this device
(ACAPID – AGP Capability ID Register).
7:0
CAP_ID: This field has the value 1001b to identify the CAP_ID assigned by the PCI SIG for vendor
dependent capability pointers.
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.8.
AGP Bridge Registers – Device #1
Table 24 shows the access attributes for configuration space.
Table 24. Nomenclature for Access Attributes
RO
Read Only. If a register is read only, writes to this register have no effect.
R/W
Read/Write. A register with this attribute can be read and written.
R/WC
Read/Write Clear. A register bit with this attribute can be read and written. However, a write of a 1
clears (sets to 0) the corresponding bit and a write of a 0 has no effect.
Table 25 summarizes the MCH-M configuration space for Device #1.
Table 25. MCH-M Configuration Space - Device #1
Address Offset
Register Symbol
Default Value
Access
00-01h
VID1
Vendor Identification
8086h
RO
02-03h
DID1
Device Identification
1A31hh
RO
04-05h
PCICMD1
PCI Command Register
0000h
RO, R/W
06-07h
PCISTS1
PCI Status Register
00A0h
RO, R/WC
08
RID1
Revision Identification
Silicon Revision
RO
09
Reserved
0Ah
SUBC1
Sub-Class Code
04h
RO
0Bh
BCC1
Base Class Code
06h
RO
0Ch
Reserved
0Dh
MLT1
Master Latency Timer
00h
RO, R/W
0Eh
HDR1
Header Type
01h
RO
0F-17h
250687-002
Register Name
Reserved
18h
PBUSN1
Primary Bus Number
00h
RO
19h
SBUSN1
Secondary Bus Number
00h
R/W
1Ah
SUBUSN1
Subordinate Bus Number
00h
R/W
1Bh
SMLT1
Secondary Bus Master Latency
Timer
00h
RO, R/W
1Ch
IOBASE1
I/O Base Address Register
F0h
RO, R/W
1Dh
IOLIMIT1
I/O Limit Address Register
00h
RO, R/W
1E-1Fh
SSTS1
Secondary Status Register
02A0h
RO, R/WC
20-21h
MBASE1
Memory Base Address Register
FFF0h
RO, R/W
22-23h
MLIMIT1
Memory Limit Address Register
0000h
RO, R/W
24-25h
PMBASE1
Prefetchable Memory Base
Address Reg.
FFF0h
RO, R/W
Datasheet
85
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Address Offset
26-27h
Register Symbol
PMLIMIT1
28-3Dh
3Eh
BCTRL1
Access
0000h
RO, R/W
Bridge Control Register
00h
RO, R/W
00h
RO, R/W
Reserved
ERRCMD1
41h-4Fh
Error Command
Reserved
50-57h
DWTMC
DRAM Write Thermal Mgnt. Control
00000000h
RWL
58-5Fh
DRTMC
DRAM Read Thermal Mgnt. Control
00000000h
RWL
59-FFh
86
Prefetchable Memory Limit
Address Reg.
Default Value
Reserved
3Fh
40h
Register Name
Reserved
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.8.1.
VID1 – Vendor Identification Register – Device #1
Address Offset:
Default Value:
Attribute:
Size:
00 - 01h
8086h
Read Only
16 bits
The VID Register contains the vendor identification number. This 16-bit register combined with the
Device Identification Register uniquely identifies any PCI device. Writes to this register have no effect.
Bit
15:0
3.8.2.
Description
Vendor Identification Number. This is a 16-bit value assigned to Intel. Intel VID = 8086h.
DID1 – Device Identification Register – Device #1
Address Offset:
Default Value:
Attribute:
Size:
02 - 03h
1A31h
Read Only
16 bits
This 16-bit register combined with the Vendor Identification register uniquely identifies any PCI device.
Writes to this register have no effect.
Bit
15:0
250687-002
Description
Device Identification Number. This is a 16-bit value assigned to the MCH-M device #1.
MCH-M1 device #1 DID =1A31h.
Datasheet
87
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.8.3.
PCICMD1 – PCI-PCI Command Register – Device #1
Address Offset:
Default:
Access:
Size
04-05h
0000h
Read Only, Read/Write
16 bits
Bit
15:10
Descriptions
Reserved
9
Fast Back-to-Back Enable (FB2BEn): Not Applicable. Hardwired to “0.”
8
SERR Message Enable (SERRE1): This bit is a global enable bit for Device #1 SERR messaging.
The MCH-M does not have an SERR# signal. The MCH-M communicates the SERR# condition by
sending an SERR message to the ICH3-M. If this bit is set to a 1, the MCH-M is enabled to generate
SERR messages over the hub interface for specific Device #1 error conditions that are individually
enabled in the BCTRL register. The error status is reported in the PCISTS1 register. If SERRE1 is
reset to 0, then the SERR message is not generated by the MCH-M for Device #1.
NOTE: This bit only controls SERR messaging for the Device #1. Device #0 has its own SERRE bit to
control error reporting for error conditions occurring on Device #0.
88
7
Address/Data Stepping (ADSTEP): Not applicable. Hardwired to “0.”
6
Parity Error Enable (PERRE1): Parity checking is not supported on the primary side of this device.
Hardwired to ‘0’
5
Reserved
4
Memory Write and Invalidate Enable (MWIE): This bit is implemented as Read Only and returns a
value of 0 when read.
3
Special Cycle Enable (SCE): This bit is implemented as Read Only and returns a value of 0 when
read.
2
Bus Master Enable (BME1): This bit is not functional. It is a RW bit for compatibility with compliance
testing software.
1
Memory Access Enable (MAE1): This bit must be set to 1 to enable the Memory and Prefetchable
memory address ranges defined in the MBASE1, MLIMIT1, PMBASE1, and PMLIMIT1 registers.
When set to 0 all of device #1’s memory space is disabled.
0
I/O Access Enable (IOAE1): This bit must be set to1 to enable the I/O address range defined in the
IOBASE1, and IOLIMIT1 registers. When set to 0 all of device #1’s I/O space is disabled.
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.8.4.
PCISTS1 – PCI-PCI Status Register – Device #1
Address Offset:
Default Value:
Access:
Size:
06-07h
00A0h
Read Only, Read/Write Clear
16 bits
PCISTS1 is a 16-bit status register that reports the occurrence of error conditions associated with primary
side of the “virtual” PCI-PCI bridge embedded within the MCH-M. Since this device does not
physically reside on PCI_A it reports the optimum operating conditions so that it does not restrict the
capability of PCI_A.
Bit
15
Detected Parity Error (DPE1): Not Applicable - hardwired to “0.”
14
Signaled System Error (SSE1): This bit is set to 1 when MCH-M Device #1 generates an SERR
message over the hub interface A for any enabled Device #1 error condition. Device #1 error
conditions are enabled in the ERRCMD, PCICMD1 and BCTRL1 registers. Device #1 error flags are
read/reset from the ERRSTS and SSTS1 register. Software clears this bit by writing a 1 to it.
13
Received Master Abort Status (RMAS1): Not Applicable - hardwired to “0.”
12
Received Target Abort Status (RTAS1): Not Applicable - hardwired to “0.”
11
Signaled Target Abort Status (STAS1): Not Applicable - hardwired to “0.”
10:9
DEVSEL# Timing (DEVT1): This bit field is hardwired to “00b” to indicate that the device #1 uses the
fastest possible decode.
8
Data Parity Detected (DPD1): Not Applicable - hardwired to “0”.
7
Fast Back-to-Back Capable (FB2B1): This bit is hardwired to “1” to indicate that the AGP port
supports fast back to back transactions when the transactions are to different targets.
6
Reserved
5
66-MHz Capability (CAP66): This bit is hardwired to “1” to indicate that the AGP port is 66-MHz
capable.
4:0
250687-002
Descriptions
Reserved
Datasheet
89
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.8.5.
RID1 – Revision Identification Register – Device #1
Address Offset:
Default Value:
Access:
Size:
08h
Dependent on Silicon Revision
Read Only
8 bits
This register contains the revision number of the MCH-M device #1. These bits are read only and writes
to this register have no effect. For the A-0 stepping, this value is 00h.
3.8.6.
Bit
Description
7:0
Revision Identification Number (RID): This is an 8-bit value that indicates the revision identification
number for the MCH-M device #1.
SUBC1- Sub-Class Code Register – Device #1
Address Offset:
Default Value:
Access:
Size:
0Ah
04h
Read Only
8 bits
This register contains the Sub-Class Code for the MCH-M device #1. This code is 04h indicating a PCIPCI Bridge device. The register is read only.
90
Bit
Description
7:0
Sub-Class Code (SUBC1): This is an 8-bit value that indicates the category of Bridge into which the
MCH-M falls. The code is 04h indicating a Host Bridge.
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.8.7.
BCC1 – Base Class Code Register – Device #1
Address Offset:
Default Value:
Access:
Size:
0Bh
06h
Read Only
8 bits
This register contains the Base Class Code of the MCH-M device #1. This code is 06h indicating a
Bridge device. This register is read only.
3.8.8.
Bit
Description
7:0
Base Class Code (BASEC): This is an 8-bit value that indicates the Base Class Code for the MCH-M
device #1. This code has the value 06h, indicating a Bridge device.
MLT1 – Master Latency Timer Register – Device #1
Address Offset:
Default Value:
Access:
Size:
0Dh
00h
Read/Write
8 bits
This functionality is not applicable. It is described here since these bits should be implemented as a
read/write to prevent standard PCI-PCI bridge configuration software from getting “confused.”
Bit
3.8.9.
Description
7:3
Not applicable but supports read/write operations. (Reads return previously written data.)
2:0
Reserved
HDR1 – Header Type Register – Device #1
Offset:
Default:
Access:
Size:
0Eh
01h
Read Only
8 bits
This register identifies the header layout of the configuration space.
Bit
7:0
250687-002
Descriptions
This read only field always returns 01h when read. Writes have no effect.
Datasheet
91
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.8.10.
PBUSN1 – Primary Bus Number Register – Device #1
Offset:
Default:
Access:
Size:
18h
00h
Read Only
8 bits
This register identifies that “virtual” PCI-PCI Bridge is connected to bus #0.
Bit
7:0
3.8.11.
Descriptions
Bus Number. Hardwired to “0.”
SBUSN1 – Secondary Bus Number Register – Device #1
Offset:
Default:
Access:
Size:
19h
00h
Read /Write
8 bits
This register identifies the bus number assigned to the second bus side of the “virtual” PCI-PCI bridge
i.e. to AGP. This number is programmed by the PCI configuration software to allow mapping of
configuration cycles to AGP.
Bit
7:0
3.8.12.
Descriptions
Bus Number. Programmable. Default = “00h”.
SUBUSN1 – Subordinate Bus Number Register – Device #1
Offset:
Default:
Access:
Size:
1Ah
00h
Read /Write
8 bits
This register identifies the subordinate bus (if any) that resides at the level below AGP. This number is
programmed by the PCI configuration software to allow mapping of configuration cycles to AGP.
Bit
7:0
92
Descriptions
Bus Number. Programmable. Default = “00h”.
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.8.13.
SMLT1 – Secondary Master Latency Timer Register – Device
#1
Address Offset:
Default Value:
Access:
Size:
1Bh
00h
Read/Write, Read Only
8 bits
This register controls the bus tenure of the MCH-M on AGP. SMLT1 is an 8-bit register that controls the
amount of time the MCH-M as an AGP/PCI bus master, can burst data on the AGP Bus. The Count
Value is an 8-bit quantity, however SMLT1[2:0] are reserved and assumed to be 0 when determining the
Count Value. The MCH-M’s SMLT1 is used to guarantee the AGP master a minimum amount of system
resources. When the MCH-M begins the first AGP FRAME# cycle after being granted the bus, the
counter is loaded and enabled to count from the assertion of FRAME#. If the count expires while the
MCH-M’s grant is removed (due to an AGP master request), then the MCH-M will lose the use of the
bus, and the AGP master may be granted the bus. If MCH-M’s bus grant is not removed, the MCH-M
will continue to own the AGP bus regardless of the SMLT1 expiration or idle condition.
The number of clocks programmed in the SMLT1 represents the guaranteed time slice (measured in 66MHz AGP clocks) allotted to the MCH-M, after which it must complete the current data transfer phase
and then surrender the bus as soon as its bus grant is removed. For example, if the SMLT1 is
programmed to 18h, then the value is 24 AGP clocks. The default value of SMLT1 is 00h and disables
this function. When the SMLT1 is disabled, the burst time for the MCH-M is unlimited (i.e. the MCH-M
can burst forever).
Bit
250687-002
Description
7:3
Secondary MLT counter value. Default=0, i.e. SMLT1 disabled
2:0
Reserved
Datasheet
93
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.8.14.
IOBASE1 – I/O Base Address Register – Device #1
Address Offset:
Default Value:
Access:
Size:
1Ch
F0h
Read/Write, Read Only
8 bits
This register controls the hosts to AGP I/O access routing based on the following formula:
IO_BASE=< address =<IO_LIMIT
Only the upper 4 bits are programmable. For the purpose of address decode address bits A[11:0] are
treated as 0. Thus the bottom of the defined I/O address range will be aligned to a 4-KB boundary.
Bit
3.8.15.
Description
7:4
I/O Address Base. Corresponds to A[15:12] of the I/O address. Default=Fh
3:0
Reserved
IOLIMIT1 – I/O Limit Address Register – Device #1
Address Offset:
Default Value:
Access:
Size:
1Dh
00h
Read/Write, Read Only
8 bits
This register controls the hosts to AGP I/O access routing based on the following formula:
IO_BASE=< address =<IO_LIMIT
Only the upper 4 bits are programmable. For the purpose of address decode address bits A[11:0] are
assumed to be FFFh. Thus, the top of the defined I/O address range will be at the top of a 4-KB aligned
address block.
Bit
94
Description
7:4
I/O Address Limit. Corresponds to A[15:12] of the I/O address. Default=0h
3:0
Reserved (Only 16-bit addressing supported)
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.8.16.
SSTS1 – Secondary PCI-PCI Status Register – Device #1
Address Offset:
Default Value:
Access:
Size:
1E-1Fh
02A0h
Read Only, Read/Write Clear
16 bits
SSTS1 is a 16-bit status register that reports the occurrence of error conditions associated with secondary
side (i.e. AGP side) of the “virtual” PCI-PCI bridge embedded within MCH-M.
Bit
Descriptions
15
Detected Parity Error (DPE1): This bit is set to a 1 to indicate MCH-M’s detection of a parity error in
the address or data phase of AGP bus transactions. Software sets DPE1 to 0 by writing a 1 to this bit.
14
Reserved
13
Received Master Abort Status (RMAS1): When the MCH-M terminates a Host-to-AGP with an
unexpected master abort, this bit is set to 1. Software resets this bit to 0 by writing a 1 to it.
12
Received Target Abort Status (RTAS1): When an MCH-M-initiated transaction on AGP is
terminated with a target abort, RTAS1 is set to 1. Software resets RTAS1 to 0 by writing a 1 to it.
11
Signaled Target Abort Status (STAS1): STAS1 is hardwired to a 0, since the MCH-M does not
generate target abort on AGP.
10:9
DEVSEL# Timing (DEVT1): This 2-bit field indicates the timing of the DEVSEL# signal when the
MCH-M responds as a target on AGP, and is hardwired to the value 01b (medium) to indicate the
time when a valid DEVSEL# can be sampled by the initiator of the PCI cycle.
8
Master Data Parity Error Detected (DPD1): Hardwired to 0. MCH-M does not implement G_PERR#
signal.
7
Fast Back-to-Back Capable (FB2B1): This bit is hardwired to 1, since MCH-M as a target supports
fast back-to-back transactions to different targets on the AGP interface.
6
Reserved
5
66 MHz Capable (CAP66): This bit is hardwired to 1 to indicate that AGP bus is capable of 66-MHz
operation.
4:0
250687-002
Reserved
Datasheet
95
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.8.17.
MBASE1 – Memory Base Address Register – Device #1
Address Offset:
Default Value:
Access:
Size:
20-21h
FFF0h
Read/Write, Read Only
16 bits
This register controls the host to AGP non-prefetchable memory accesses routing based on the following
formula:
MEMORY_BASE1=< address =<MEMORY_LIMIT1
The upper 12 bits of the register are read/write and correspond to the upper 12 address bits A[31:20] of
the 32-bit address. The bottom 4 bits of this register are read-only and return zeros when read.
Configuration software must initialize this register. For the purpose of address decode, address bits
A[19:0] are assumed to be 0. Thus, the bottom of the defined memory address range will be aligned to a
1-MB boundary.
Bit
96
Description
15:4
Memory Address Base 1 (MEM_BASE1). Corresponds to A[31:20] of the memory address.
3:0
Reserved
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.8.18.
MLIMIT1 – Memory Limit Address Register – Device #1
Address Offset:
Default Value:
Access:
Size:
22-23h
0000h
Read/Write, Read Only
16 bits
This register controls the host to AGP non-prefetchable memory accesses routing based on the following
formula:
MEMORY_BASE1=< address =<MEMORY_LIMIT1
The upper 12 bits of the register are read/write and correspond to the upper 12 address bits A[31:20] of
the 32-bit address. The bottom 4 bits of this register are read-only and return zeros when read. The
configuration software must initialize this register. For the purpose of address decode address bits
A[19:0] are assumed to be FFFFFh. Thus, the top of the defined memory address range will be at the top
of a 1-MB aligned memory block.
Bit
15:4
Description
Memory Address Limit 1(MEM_LIMIT1). Corresponds to A[31:20] of the memory address.
Default=000h
3:0
Note:
250687-002
Reserved
The memory range covered by MBASE1 and MLIMIT1 registers are used to map non-prefetchable AGP
address ranges (typically where control/status memory-mapped I/O data structures of the graphics
controller will reside), and PMBASE 1and PMLIMIT1 are used to map prefetchable address ranges
(typically graphics local memory). This segregation allows application of USWC space attribute to be
performed in a true plug-and-play manner to the prefetchable address range for improved host-AGP
memory access performance.
Datasheet
97
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.8.19.
PMBASE1 – Prefetchable Memory Base Address Register –
Device #1
Address Offset:
Default Value:
Access:
Size:
24-25h
FFF0h
Read/Write, Read Only
16 bits
This register controls the host to AGP prefetchable memory accesses routing based on the following
formula:
PREFETCHABLE_MEMORY_BASE1=< address =<PREFETCHABLE_MEMORY_LIMIT1
The upper 12 bits of the register are read/write and correspond to the upper 12 address bits A[31:20] of
the 32-bit address. The bottom 4 bits of this register are read-only and return zeros when read. The
configuration software must initialize this register. For the purpose of address decode address bits
A[19:0] are assumed to be 0. Thus, the bottom of the defined memory address range will be aligned to a
1-MB boundary.
Bit
98
Description
15:4
Prefetchable Memory Address Base 1(PMEM_BASE1). Corresponds to A[31:20] of the memory
address.
3:0
Reserved
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.8.20.
PMLIMIT1 – Prefetchable Memory Limit Address Register –
Device #1
Address Offset:
Default Value:
Access:
Size:
26-27h
0000h
Read/Write, Read Only
16 bits
This register controls the host to AGP prefetchable memory accesses routing based on the following
formula:
PREFETCHABLE_MEMORY_BASE1=< address =<PREFETCHABLE_MEMORY_LIMIT1
The upper 12 bits of the register are read/write and correspond to the upper 12 address bits A[31:20] of
the 32-bit address. The bottom 4 bits of this register are read-only and return zeroes when read. The
configuration software must initialize this register. For the purpose of address decode address bits
A[19:0] are assumed to be FFFFFh. Thus, the top of the defined memory address range will be at the top
of a 1-MB aligned memory block.
Bit
15:4
Description
Prefetchable Memory Address Limit 1(PMEM_LIMIT1). Corresponds to A[31:20] of the memory
address.
Default=000h
3:0
Note:
250687-002
Reserved
Prefetchable memory range is supported to allow segregation by the configuration software between the
memory ranges that must be defined as UC and the ones that can be designated as a USWC (i.e.
prefetchable) from the processor perspective.
Datasheet
99
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.8.21.
BCTRL1 – PCI-PCI Bridge Control Register – Device #1
Address Offset:
Default:
Access:
Size
3Eh
00h
Read Only, Read/Write
8 bits
This register provides extensions to the PCICMD1 register that are specific to PCI-PCI bridges. The
BCTRL provides additional control for the secondary interface (i.e. AGP) as well as some bits that affect
the overall behavior of the “virtual” PCI-PCI bridge embedded within MCH-M, e.g. VGA compatible
address ranges mapping.
Bit
Descriptions
7
Fast Back to Back Enable (FB2BEN): Normally this bit controls whether the bridge will generate
Fast Back to Back cycles to different targets. However, since there is only one target allowed on the
AGP interface, this bit is meaningless. This bit is hardwired to “0”.
6
Secondary Bus Reset (SRESET): MCH-M does not support generation of reset via this bit on the
AGP and therefore this bit is hardwired to “0”. Note that the only way to perform a hard reset of the
AGP bus is via the system reset either initiated by software or hardware via ICH3-M.
5
Master Abort Mode (MAMODE): This bit is hardwired to “0”. This means when acting as a master
on AGP the MCH-M will discard data on writes and return all 1s during reads when a Master Abort
occurs.
4
Reserved
3
VGA Enable (VGAEN1): Controls the routing of host initiated transactions targeting VGA compatible
I/O and memory address ranges. When this bit is set , the MCH-M will forward the following hostinitiated accesses to the AGP bus:
1) memory accesses in the range 0A0000h to 0BFFFFh
2) I/O addresses where A[9:0] are in the ranges 3B0h to 3BBh or 3C0h to 3DFh
(inclusive of ISA address aliases - A[15:10] are not decoded)
When this bit is set, forwarding of these accesses issued by the host is independent of the I/O
address and memory address ranges that are defined by the previously defined base and limit
registers. Forwarding of these accesses is also independent of the settings of bit 2 (ISA Enable) of
this register if this bit is “1”.
If this bit is “0” (default) , then VGA compatible memory and I/O range accesses are not forwarded to
AGP. Instead they are mapped to the hub interface unless they are mapped to AGP via I/O and
memory range registers defined above (IOBASE1, IOLIMIT1, MBASE1, MLIMIT1, PMBASE1,
PMLIMIT1). Please refer to the System Address Map section of this document for further information.
100
2
ISA Enable (ISAEN): Modifies the response by the MCH-M to an I/O access issued by the host that
targets ISA I/O addresses. This applies only to I/O addresses that are enabled by the IOBASE and
IOLIMIT registers. When this bit is set to 1 MCH-M will not forward to AGP any I/O transactions
addressing the last 768 bytes in each 1-KB block even if the addresses are within the range defined
by the IOBASE and IOLIMIT registers. Instead of going to AGP these cycles will be forwarded to the
hub interface. If this bit is “0” (default) then all addresses defined by the IOBASE and IOLIMIT for
host I/O transactions will be mapped to AGP.
1
Reserved
0
Parity Error Response Enable (PEREN): Controls MCH-M’s response to data phase parity errors on
AGP. G_PERR# is not implemented by the MCH-M. However, when this bit is set to 1, address and
data parity errors detected on AGP are reported via hub interface SERR# messaging mechanism, if
further enabled by SERRE1. If this bit is reset to 0, then address and data parity errors on AGP are
not reported via the MCH-M hub interface SERR# messaging mechanism. Other types of error
conditions can still be signaled via SERR# messaging independent of this bit’s state.
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.8.22.
ERRCMD1 – Error Command Register – Device #1
Address Offset:
Default Value:
Access:
Size:
40h
00h
Read/Write, Read Only
8 bits
Bit
7:1
0
250687-002
Description
Reserved
SERR on Receiving Target Abort (SERTA): When this bit is 1 the MCH-M generates an SERR
message over hub interface A upon receiving a target abort on AGP. When this bit is set to 0, the
MCH-M does not assert an SERR message upon receipt of a target abort on AGP. SERR
messaging for Device 1 is globally enabled in the PCICMD1 register.
Datasheet
101
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.8.23.
DWTMC – DRAM Write Thermal Management Control
Offset:
Default:
Access:
Size:
50h-57h
0000_0000_0000_0000h
Read/Write/Lock
64 bits
Bit
Description
63:52
Reserved
51:50
TM Lock: These bits secure the DRAM Thermal Management control registers. The bits default to
‘0’. Once a ‘1’ is written to either bit, the configuration register bits specified in DWTMC and DRTMC
registers become read-only:
00
Not locked: All bits in DWTMC or DRTMC are writeable.
01
Start Mode bits are not locked: All bits in DWTMC and DRTMC except for SWMT and
SRMT are locked and become Read Only.
10
All bits locked: All of the bits in the DWTMC or DRTMC are locked and become Read
Only.
11
Reserved
49
Reserved
48:41
Global DRAM Write Sampling Window (GDWSW): This eight bit value is multiplied by 4*105 to
define the length of time in host clocks over which the number of hexwords(32-Byte chunk) written is
counted. If the number of hexwords written during this window exceeds the Global Write Hexword
Threshold (GWHT) defined below, then the thermal management mechanism will be invoked.
40:28
Global Write Hexword Threshold (GWHT): The thirteen-bit value held in this field is multiplied by
215 to arrive at the number of hexwords that must be written within the Global DRAM Write Sampling
Window(GDWSW) in order to cause the thermal management mechanism to be invoked.
27:22
Write Thermal Management Time (WTMT): This value provides a multiplier between 0 and 63,
which specifies how long thermal management remains in effect as a number of Global DRAM Write
Sampling Windows*. For example, if GDWSW is programmed to
1000_0000b and WTT is set to 01_0000b, then thermal management will be performed for 8192*105
host clocks (at 100 MHz) seconds once invoked (128 * 4*105 host clocks * 16).
102
21:15
Write Thermal Management Monitoring Window (WTMMW): The value in this register is padded
with 4 0’s to specify a window of 0-2047 host clocks with 16 clock granularity. While the thermal
management mechanism is invoked, DRAM writes are monitored during this window. If the number of
hexwords written during the window reaches the Write Thermal Management Hexword Maximum,
then write requests are blocked for the remainder of the window.
14:3
Write Thermal Management Hexword Maximum (WTMHM): The Write Thermal Management
Hexword Maximum defines the maximum number of hexwords between 0-4095, which are permitted
to be written to DRAM within one Write Thermal Management Monitoring Window.
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
2:1
0
250687-002
Write Thermal Management Mode (WTMMode):
00
Thermal management via Counters and Hardware Thermal Management_on signal
mechanisms disabled.
01
Hardware Thermal Management_on signal mechanism is enabled. In this mode, as
long as the Thermal Management_on signal is asserted, write thermal management is in
effect based on the settings in WTMW and WTHM. When the Thermal Management_on
signal is de-asserted, write thermal management stops and the counters associated with
the WTMW and WTHM are reset. When the hardware Thermal Management_on signal
mechanism is not enabled, the Thermal Management_on signal has no effects.
10
Counter mechanism controlled through GDWSW and GWHT is enabled. When the
threshold set in GDWSW and GWHT is reached, thermal management start/stop cycles
occur based on the settings in WTMT, WTMMW and WTMHM.
11
Reserved
START Write Thermal Management (SWTM): When this bit is set to ‘1’ write thermal management
begins based on the settings in WTMW and WTHM, and remains to be in effect until this bit is reset
to ‘0’. When this bit is reset to ‘0’, write thermal management stops and the counters associated with
WTMW and WTHM are reset. Software writes to this bit to start and stop write thermal management.
Datasheet
103
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
3.8.24.
DRTMC – DRAM Read Thermal Management Control
Offset:
Default:
Access:
Size:
58h-5Fh
0000_0000_0000_0000h
Read/Write/Lock
64 bits
Bit
63:49
Reserved
48:41
Global DRAM Read Sampling Window (GDRSW): This eight bit value is multiplied by 4*105 to
define the length of time in host clocks over which the number of hexwords read from the DRAM is
counted. If the number of hexwords read during this window exceeds the Global Read Hexword
Threshold (GRHT) defined below, then the thermal management mechanism will be invoked.
40:28
Global Read Hexword Threshold (GRHT): The thirteen-bit value held in this field is multiplied by 215
to arrive at the number of hexwords that must be written within the Global DRAM Read Sampling
Window(GDRSW) in order to cause the thermal management mechanism to be invoked.
27:22
Read Thermal Management Time (RTMT): This value provides a multiplier between 0 and 63 which
specifies how long thermal management remains in effect as a number of Global DRAM Read
Sampling Windows. For example, if GDRSW is programmed to 1000_0000b and WTT is set to
01_0000b, then thermal management will be performed for 8192*105 host clocks (at 100 MHz)
seconds once invoked (128 * 4*105 host clocks * 16).
21:15
Read Thermal Management Monitoring Window (RTMMW): The value in this register is padded
with 4 0’s to specify a window of 0-2047 host clocks with 16 clock granularity. While the thermal
management mechanism is invoked, DRAM reads are monitored during this window. If the number of
hexwords read during the window reaches the Write Thermal Management Hexword Maximum, then
read requests are blocked for the remainder of the window.
14:3
Read Thermal Management Hexword Maximum (RTMHM): The Read Thermal Management
Hexword Maximum defines the maximum number of hexwords between 0-4095, which are permitted
to be read to DRAM within one Write Thermal Management Monitoring Window.
2:1
Read Thermal Management Mode (RTMMode):
0
104
Description
00
Thermal management via Counters and Hardware Thermal Management_on signal
mechanisms disabled.
01
Hardware Thermal Management_on signal mechanism is enabled. In this mode, as
long as the Thermal Management_on signal is asserted, write thermal management is in
effect based on the settings in RTMW and RTHM. When the Thermal Management_on
signal is de-asserted, read thermal management stops and the counters associated with
the RTMW and RTHM are reset. When the hardware Thermal Management_on signal
mechanism is not enabled, the Thermal Management_on signal has no effects.
10
Counter mechanism controlled through GDRSW and GRHT is enabled. When the
threshold set in GDRSW and GRHT is reached, thermal management start/stop cycles
occur based on the settings in RTMT, RTMMW and RTMHM.
11
Reserved
START Read Thermal Management (SRTM): When this bit is set to ‘1’ read thermal management
begins based on the settings in RTMW and RTHM, and remains to be in effect until this bit is reset to
‘0’. When this bit is reset to ‘0’, read thermal management stops and the counters associated with
RTMW and RTHM are reset. Software writes to this bit to start and stop read thermal management.
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
4.
System Address Map
A system based on the Intel 845MP/845MZ Chipset supports 4 GB of addressable memory space and 64
KB+3 of addressable I/O space. The I/O and memory spaces are divided by system configuration
software into regions. The memory ranges are useful either as system memory or as specialized memory,
while the I/O regions are used solely to control the operation of devices in the system.
4.1.
Memory Address Ranges
The system memory map is broken into two categories:
Extended Memory Range (1MB to 4GB) - Extended memory, existing between 1 MB and 4 GB. It
contains a 32-bit memory space, which is used for mapping PCI, AGP, APIC, SMRAM, and BIOS
memory spaces.
DOS Compatible Area (below 1 MB) - A DOS legacy space, which is used for BIOS and legacy
devices on the LPC interface.
Figure 5. Addressable Memory Space
4 GB
Hublink_A
PCI Memory Address
Range
Main Memory Address
Range
Graphics
Aperture
IO
Aperture
APICs
Top of Low Memory
1 MB
DOS legacy Address
Range
AGP
Independently
Programmable
Non-overlapping
Windows
These address ranges are always mapped to system memory, regardless of the system configuration.
Memory may be carved out of the MAINMEM segment for use by System Management Mode (SMM)
hardware and software. The Top of Low Memory (TOM) register defines the top of Main Memory.
Note:
The address of the highest 16-MB quantity of valid memory in the system is placed into the GBA15
register.
For memory populations less than 3 GB, this value will be the same as the one programmed into the
TOM register. For other memory configurations, the two are unlikely to be the same, since the PCI
configuration portion of the BIOS software will program the TOM register to the maximum value that is
less than the amount of memory in the system and that allows enough room for all populated PCI
devices.
250687-002
Datasheet
105
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Figure 6. Detailed DOS Compatible Area Address Map
1MB
Upper, Lower,
Expansion Card BIOS
and Buffer Area
0C0000h
0B8000h
Standard PCI/ISA
Video Memory
(SMM Memory)
0B0000h
Controlled by
PAM[6:0].
768 KB
Monchrome Display
Adapter Space
0A0000h
736 KB
704 KB
Controlled by
VGA Enable and
MDA enable.
640 KB
Key
= Optionally AGP
= Optionally DRAM
= DRAM
4.1.1.
VGA and MDA Memory Space
VGAA
From
0_000A_0000
To
0_000A_FFFF
MDA
0_000B_0000
0_000B_7FFF
VGAB
0_000B_8000
0_000B_FFFF
Video cards use the VGAA, MDA, and VGAB legacy address ranges defined above to map a frame
buffer or a character-based video buffer. By default, accesses to these ranges are forwarded to hub
interface. However, if the VGAEN bit is set in the BCTRL1 configuration register, then transactions
within these VGA and MDA memory spaces are sent to AGP instead of the hub interface.
Note:
The VGA_EN bit may be set in the BCTRL registers. Software must not set more than one of the
VGA_EN bits.
If the configuration bit MCH-MCFG.MDAP is set, then accesses that fall within the MDA range
(0B0000h – 0B7FFFh) will be sent to hub interface without regard for the state of the VGAEN bit (but
accesses to the VGAA and VGAB ranges will still be sent to AGP). Legacy support requires the ability
to have a second graphics controller (monochrome) in the system. In an Intel 845MP/845MZ Chipset
system, accesses in the standard VGA range are forwarded to AGP when VGAEN is set. Since the
monochrome adapter may be on the hub interface bus (or other expansion bus), the MCH-M must be able
to decode cycles in the MDA range and forward them to the hub interface. This capability is controlled
by the MDAP configuration bit. In addition to the memory range B0000h to B7FFFh, the MCH-M can
decode I/O cycles at 3B4h, 3B5h, 3B8h, 3B9h, 3BAh, and 3BFh and forwards them to hub interface.
106
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
4.1.2.
PAM Memory Spaces
PAMC0
From
0_000C_0000
To
0_000C_3FFF
PAMC4
0_000C_4000
0_000C_7FFF
PAMC8
0_000C_8000
0_000C_BFFF
PAMCC
0_000C_C000
0_000C_FFFF
PAMD0
0_000D_0000
0_000D_3FFF
PAMD4
0_000D_4000
0_000D_7FFF
PAMD8
0_000D_8000
0_000D_BFFF
PAMDC
0_000D_C000
0_000D_FFFF
PAME0
0_000E_0000
0_000E_3FFF
PAME4
0_000E_4000
0_000E_7FFF
PAME8
0_000E_8000
0_000E_BFFF
PAMEC
0_000E_C000
0_000E_FFFF
PAMF0
0_000F_0000
0_000F_FFFF
The 256-KB PAM region is divided into three parts:
• ISA expansion region, a 128-KB area between 0_000C_0000h – 0_000D_FFFFh
• Extended BIOS region, a 64-KB area between 0_000E_0000h – 0_000E_FFFFh
• System BIOS region, a 64-KB area between 0_000F_0000h – 0_000F_FFFFh.
The ISA expansion region is divided into eight 16 KB segments. Each segment can be assigned one of
four Read/Write states: read-only, write-only, read/write, or disabled. Typically, these blocks are
mapped through MCH-M and are subtractively decoded to ISA space.
The extended System BIOS region is divided into four 16 Kbytes segments. Each segment can be
assigned independent read and write attributes so it can be mapped either to main DRAM or to hub
interface. Typically, this area is used for RAM or ROM.
The system BIOS region is a single 64-Kbytes segment. This segment can be assigned read and write
attributes. It is by default (after reset) Read/Write disabled and cycles are forwarded to hub interface.
By manipulating the read/write attributes, the MCH-M can “shadow” BIOS into main DRAM.
250687-002
Datasheet
107
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
4.1.3.
ISA Hole Memory Space
BIOS software may optionally open a “window” between 15 MB and 16 MB (0_00F0_0000h to
0_00FF_FFFF) that relays transactions to hub interface instead of completing them with a system
memory access. This window is opened with the FDHC.HEN configuration field.
Figure 7. Detailed Extended Memory Range Address Map
High BIOS, optional
extended SMRAM
1_0000_0000 (4GB)
Key
FF00_0000
=
Hub interface_A (always)
=
Region allowed for AGP/PCI
=
DRAM Region
=
Optional DRAM Region
FEF0_0000
Local Apic Space
FEE0_0000
Hub interface_D-E I/O
Apic Space
Hub interface_A I/O
Apic Space
Extended SMRAM
Space
Extended SMRAM
(translated to < 1MB)
FED0_0000
FEC8_0000
FEC0_0000
Top of Low Memory (TOM)
TEM - TSEG
100C_0000
100A_0000
0100_0000 (16 MB)
ISA Hole
00F0_0000 (15 MB)
0010_0000 (1MB)
4.1.4.
TSEG SMM Memory Space
TSEGSMM
From
TOM – TSEG
To
TOM
The TSEG SMM space allows system management software to partition a region of main memory just
below the top of low memory (TOM) that is accessible only by system management software. This
region may be 128 kB, 256 kB, 512 kB, or 1 MB in size, depending upon the ESMRAMC.TSEG_SZ
field. SMM memory is globally enabled by SMRAM.G_SMRARE. Requests may access SMM system
memory when either SMM space is open (SMRAM.D_OPEN) or the MCH-M receives an SMM code
request on its system bus. In order to access the TSEG SMM space, the TSEG must be enabled by
ESMRAMC.T_EN. When all of these conditions are met, then a system bus access to the TSEG space
(between TOM-TSEG and TOM) is sent to system memory. If the high SMRAM is not enabled or if the
TSEG is not enabled, then all memory requests from all interfaces are forwarded to system memory. If
the TSEG SMM space is enabled, and an agent attempts a non-SMM access to TSEG space, then the
transaction is specially terminated.
Hub interface and AGP originated accesses are not allowed to SMM space.
108
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
4.1.5.
System Bus Interrupt APIC Memory Space
SBINTR
From
0_FEE0_0000
To
0_FEEF_FFFF
The System Bus interrupt space is the address used to deliver interrupts to the system bus. Any device on
AGP or hub interface, D, E may issue a Memory Write to 0FEEx_xxxxh. The MCH-M will forward this
Memory Write along with the data to the system bus as an Interrupt Message Transaction. The MCH-M
terminates the system bus transaction by providing the response and asserting TRDY#. This Memory
Write cycle does not go to DRAM.
4.1.6.
High SMM Memory Space
HIGHSMM
From
0_FEDA_0000
To
0_FEDB_FFFF
The HIGHSMM space allows cacheable access to the compatible SMM space by re-mapping valid SMM
accesses between 0_FEDA_0000 and 0_FEDB_FFFF to accesses between 0_000A_0000 and
0_000B_FFFF. The accesses are remapped when SMRAM space is enabled, an appropriate access is
detected on the system bus, and when ESMRAMC.H_SMRAME allows access to high SMRAM space.
SMM memory accesses from any hub interface or AGP are specially terminated: reads are provided with
the value from address 0 while writes are ignored entirely.
4.1.7.
AGP Aperture Space (Device #0 BAR)
AGPAPP
From
APBASE
To
APBASE + APSIZE
Processors and AGP devices communicate through a special buffer called the “graphics aperture”. This
aperture acts as a window into the main DRAM memory and is defined by the APBASE and APSIZE
configuration registers of the Intel 845MP/845MZ Chipset MCH-M. Note that the AGP aperture must be
above the top of memory and must not intersect with any other address space.
4.1.8.
AGP Memory and Prefetchable Memory
M1
PM1
From
MBASE1
PMBASE1
To
MLIMIT1
PMLIMIT1
Plug-and-play software configures the AGP memory window in order to provide enough memory space
for the devices behind this PCI-to-PCI bridge. Accesses whose addresses fall within this window are
decoded and forwarded to AGP for completion. Note that these registers must be programmed with
values that place the AGP memory space window between the value in the TOM register and 4 GB. In
addition, neither region should overlap with any other fixed or relocatable area of memory.
250687-002
Datasheet
109
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
4.1.9.
Hub Interface A Subtractive Decode
HLA_SUB
From
TOM
To
4GB
All accesses that fall between the value programmed into the TOM register and 4GB are subtractively
decoded and forwarded to hub interface if they do not decode to a space that corresponds to another
device.
4.2.
AGP Memory Address Ranges
The MCH-M can be programmed to direct memory accesses to the AGP bus interface when addresses
are within either of two ranges specified via registers in MCH-M Device #1 configuration space. The
first range is controlled via the Memory Base Register (MBASE1) and Memory Limit Register
(MLIMIT1) registers. The second range is controlled via the Prefetchable Memory Base (PMBASE1)
and Prefetchable Memory Limit (PMLIMIT1) registers.
The MCH-M positively decodes memory accesses to AGP memory address space as defined by the
following equations:
•
Memory_Base_Address <= Address =< Memory_Limit_Address
•
Prefetchable_Memory_Base_Address =< Address <= Prefetchable_Memory_Limit_Address
Plug-and-play configuration software programs the effective size of the range, which depends on the size
of memory claimed by the AGP device.
Note:
4.2.1.
The MCH-M Device #1 memory range registers described above are used to allocate memory address
space for any devices sitting on AGP bus that requires such a window.
AGP DRAM Graphics Aperture
Memory-mapped, graphics data structures can reside in a Graphics Aperture to main DRAM memory.
This aperture is an address range defined by the APBASE and APSIZE configuration registers of the
MCH-M device #0. The APBASE register follows the standard base address register template as defined
by the PCI 2.1 specification. The size of the range claimed by the APBASE is programmed via “backend” register APSIZE (programmed by the chip-set specific BIOS before plug-and-play session is
performed). APSIZE allows the BIOS software to pre-configure the aperture size to be 4 MB, 8 MB, 16
MB, 32 MB, 64 MB, 128 MB or 256 MB. By programming APSIZE to specific size, the corresponding
lower bits of APBASE are forced to “0” (behave as hardwired). The default value of APSIZE forces an
aperture size of 256 MB. The aperture address range is naturally aligned.
Accesses within the aperture range are forwarded to the main DRAM subsystem. The MCH-M will
translate the originally issued addresses via a translation table maintained in main memory. The aperture
range should be programmed as non-cacheable in the processor caches.
Note:
110
Plug-and-play software configuration model does not allow overlap of different address ranges.
Therefore, the AGP Graphics Aperture and AGP Memory Address Range are independent address
ranges that may abut, but cannot overlap one another.
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
4.3.
System Management Mode (SMM) Memory Range
The MCH-M supports the use of main memory as System Management RAM (SMRAM) enabling the
use of System Management Mode. The MCH-M supports three SMRAM options: Compatible SMRAM
(C_SMRAM), High Segment (HSEG), and Top of Memory Segment (TSEG). System Management
RAM (SMRAM) space provides a memory area that is available for the SMI handler’s and code and data
storage. This memory resource is normally hidden from the system OS so that the processor has
immediate access to this memory space upon entry to SMM. MCH-M provides three SMRAM options:
• Below 1 MByte option that supports compatible SMI handlers.
• Above 1 MByte option that allows new SMI handlers to execute with write-back cacheable
SMRAM.
• Optional larger write-back cacheable T_SEG area from 128 KB to 1MB in size above 1 MByte that
is reserved from the highest area in system DRAM memory. The above 1 MByte solutions require
changes to compatible SMRAM handlers’ code to properly execute above 1 MByte.
Note:
4.3.1.
Masters from the hub interface and AGP are not allowed to access the SMM space.
SMM Space Definition
The addressed SMM space and the DRAM SMM space define SMM space. The addressed SMM space
is defined as the range of bus addresses used by the processor to access SMM space. DRAM SMM space
is defined as the range of physical DRAM memory locations containing the SMM code. SMM space can
be accessed at one of three transaction address ranges: Compatible, High and TSEG. The Compatible
and TSEG SMM space is not remapped and therefore the addressed and DRAM SMM space is the same
address range. Since the High SMM space is remapped the addressed and DRAM SMM space is a
different address range. Note that the High DRAM space is the same as the Compatible Transaction
Address space. Therefore the table below describes three unique address ranges:
• Compatible Transaction Address (Adr C)
• High Transaction Address (Adr H)
• TSEG Transaction Address (Adr T)
These abbreviations are used later in the table describing SMM Space Transaction Handling.
Table 26. SMM Space
Note:
SMM Space Enabled
Transaction Address Space (Adr)
DRAM Space (DRAM)
Compatible©
A0000h to BFFFFh
A0000h to BFFFFh
High (H)
0FEDA0000h to 0FEDBFFFFh
A0000h to BFFFFh
TSEG (T)
(TOM-TSEG_SZ) to TOM
(TOM-TSEG_SZ) to TOM
High SMM: Note that this is different than in previous chipsets. In previous chipsets the High segment
was the 384-KB region from A0000h to FFFFFh. However, C0000h to FFFFFh was not practically
useful so it is deleted in MCH-M.
TSEG SMM: Note that this is different than in previous chip sets. In previous chip sets the TSEG
address space was offset by 256 MB to allow for simpler decoding and the TSEG was remapped to just
under the TOM. In the MCH-M 256 MB do not offset the TSEG region and it is not remapped.
250687-002
Datasheet
111
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
4.3.2.
SMM Space Restrictions
If any of the following conditions are violated the results of SMM accesses are unpredictable and may
cause the system to hang:
1. The Compatible SMM space must not be set-up as cacheable.
2. High or TSEG SMM transaction address space must not overlap address space assigned to system
DRAM, the AGP aperture range, or to any “PCI” devices (including hub interface and AGP
devices). This is a BIOS responsibility.
3. Both D_OPEN and D_CLOSE must not be set to 1 at the same time.
4. When TSEG SMM space is enabled, the TSEG space must not be reported to the OS as available
DRAM. This is a BIOS responsibility.
5. Any address translated through the AGP Aperture GTLB must not target DRAM from 000A0000h
to 000FFFFFh.
4.4.
I/O Address Space
The Intel 845MP/845MZ Chipset MCH-M does not support the existence of any other I/O devices beside
itself on the system bus. The MCH-M generates either hub interface A or AGP bus cycles for all
processor I/O accesses. The MCH-M contains two internal registers in the processor I/O space,
Configuration Address Register (CONFIG_ADDRESS) and the Configuration Data Register
(CONFIG_DATA). These locations are used to implement configuration space access mechanism and as
described in the Configuration Register section.
The processor allows 64K+3 bytes to be addressed within the I/O space. The MCH-M propagates the
processor I/O address without any translation on to the destination bus and therefore provides
addressability for 64K+3 byte locations. Note that the upper three locations can be accessed only during
I/O address wrap-around when signal A16# address signal is asserted. A16# is asserted on the system
bus whenever an I/O access is made to 4 bytes from address 0FFFDh, 0FFFEh, or 0FFFFh. A16# is also
asserted when an I/O access is made to 2 bytes from address 0FFFFh.
The I/O accesses (other than ones used for configuration space access) are forwarded normally to the hub
interface A unless they fall within the AGP I/O address range as defined by the mechanisms explained
below. The MCH-M will not post I/O write cycles to IDE.
The MCH-M never responds to I/O or configuration cycles initiated on AGP or any of the hub interfaces.
Hub interface transactions requiring completion are terminated with “master abort” completion packets
on the hub interfaces. Hub interface write transactions not requiring completion are dropped. AGP/PCI
I/O reads are never acknowledged by the MCH-M.
4.5.
MCH-M Decode Rules and Cross-Bridge Address
Mapping
The address map described above applies globally to accesses arriving on any of the three interfaces i.e.
Host bus, the hub interface A or AGP.
4.5.1.
Decode Rules for the Hub Interface A
The MCH-M accepts accesses from the hub interface A with the following address ranges:
112
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
• All memory read and write accesses to Main DRAM (except SMM space).
• All memory write accesses from the hub interface A to AGP memory range defined by MBASE1,
MLIMIT1, PMBASE1, and PMLIMIT1.
• All memory read/write accesses to the Graphics Aperture defined by APBASE and APSIZE.
• Memory writes to VGA range on AGP if enabled.
All memory reads from the hub interface A that are targeted > 4 GB memory range will be terminated
with Master Abort completion, and all memory writes (>4 GB) from the hub interface A will be ignored.
4.5.2.
AGP Interface Decode Rules
Cycles Initiated Using AGP FRAME# Protocol
The MCH-M does not support any AGP FRAME# access targeting the hub interface A. The MCH-M
will claim AGP initiated memory read and write transactions decoded to the main DRAM range or the
Graphics Aperture range. All other memory read and write requests will be master-aborted by the AGP
initiator as a consequence of MCH-M not responding to a transaction.
The MCH-M forwards AGP/PCI accesses addressed to the DOS Compatibility ranges between
0C0000h-0FFFFFh to main memory, regardless of the configuration of the Programmable Attributes
Map registers (PAM registers). The PAM registers govern the destination of host CPU accesses to the
DOS Compatibility ranges but do not similarly affect the destination of AGP/PCI accesses to this range.
MCH-M will forward to main memory any AGP/PCI initiated access to the PAM areas. Note that the
MCH-M may hang if an AGP originated access occurs to a Read Disabled or Write Disabled PAM
segment. Therefore, the following critical restriction is placed on the programming of the PAM regions:
at the time that an AGP accesses to a PAM region occurs, the targeted PAM segment must be
programmed to be both readable and writable. If an AGP master issues an I/O, PCI Configuration or PCI
Special Cycle transaction, the MCH-M will not respond and cycle will result in a master-abort.
Cycles Initiated Using AGP PIPE# or SBA Protocol
All cycles must reference main memory i.e. main DRAM address range (including PAM) or Graphics
Aperture range (also physically mapped within DRAM but using different address range). AGP accesses
to SMM space are not allowed. AGP protocol cycles that target DRAM are not snooped on the host bus,
even if they fall outside of the AGP aperture range.
If a cycle is outside of main memory range then it will terminate as follows:
• Reads: remapped to memory address 0h, data returned from address 0h, and IAAF error bit set in
ERRSTS register in device #0
• Writes: dropped “on the floor” i.e. terminated internally without affecting any buffers or main
memory
AGP Accesses to MCH-M that Cross Device Boundaries
The MCH-M will disconnect AGP FRAME# transactions on 4KB boundaries.
AGP PIPE# and SBA accesses are limited to 256 bytes and must hit DRAM. Read accesses crossing out
of DRAM will return invalid data, and the IAAF Error bit will be set. Write accesses crossing out of
DRAM will be discarded, and the IAAF Error bit will be set.
250687-002
Datasheet
113
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
5.
Functional Description
5.1.
Host Interface Overview
The Intel 845MP/845MZ Chipset MCH-M supports the Mobile Intel Pentium 4 Processor-M at 100MHz bus frequency; the address signals run at 200 MT/s for a maximum address queue rate of 50M
addresses/sec. The data is quad pumped and an entire 64B cache line can be transferred in two bus
clocks. At 100-MHz bus frequency, the data signals run at 400 MT/s for a maximum bandwidth of 3.2
GB/s. A 12-deep IOQ is supported by the 845MP/845MZ Chipset.
The Intel 845MP/845MZ Chipset MCH-M supports two outstanding deferred transactions on the system
bus. The two transactions must target different IO interfaces as only one deferred transaction can be
outstanding to any single IO interface at a time.
5.1.1.
Dynamic Bus Inversion
The Intel 845MP/845MZ Chipset MCH-M supports Dynamic Bus Inversion (DBI) when driving, and
when receiving data from the Host Bus. DBI limits the number of data signals that are driven to a low
voltage on each quad pumped data phase. This decreases the power consumption of the MCH-M.
DINV[3:0]# indicates if the corresponding 16 bits of data are inverted on the bus for each quad pumped
data phase:
Table 27. Relation of DBI Bits to Data Bits
DINV[3:0]#
Data Bits
DBI0#
HD[15:0]#
DIBI1#
HD[31:16]#
DBI2#
HD[47:32]#
DBI3#
HD[63:48]#
Whenever the CPU or the MCH-M drives data, each 16-bit segment is analyzed. If more than 8 of the 16
signals would normally be driven low on the bus the corresponding DBI# signal will be asserted and the
data will be inverted prior to being driven on the bus. Whenever the CPU or the MCH-M receives data it
monitors DBI[3:0]# to determine if the corresponding data segment should be inverted.
5.1.2.
System Bus Interrupt Delivery
The Mobile Intel Pentium 4 Processor-M supports System Bus interrupt delivery, but they do not support
the APIC serial bus interrupt delivery mechanism. Interrupt related messages are encoded on the System
Bus as “Interrupt Message Transactions”. In an Intel 845MP/845MZ Chipset platform, System Bus
interrupts may originate from the processor on the System Bus, or from a downstream device on hub
interface, or AGP. In the later case the MCH-M drives the “Interrupt Message Transaction” onto the
System Bus.
114
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
In an Intel 845MP/845MZ Chipset platform and its interrupts are generated as upstream hub interface
Memory Writes. Furthermore, PCI 2.2 defines MSI’s (Message Signaled Interrupts) that are also in the
form of Memory Writes. A PCI 2.2 device may generate an interrupt as an MSI cycle on it’s PCI bus.
The MSI may be directed directly to the System bus. The target of an MSI is dependent on the address of
the interrupt Memory Write. The Intel 845MP/845MZ Chipset MCH-M forwards inbound hub interface
and AGP (PCI semantic only) Memory Writes to address 0FEEx_xxxxh, to the System bus as “Interrupt
Message Transactions”.
5.1.3.
Upstream Interrupt Messages
The MCH-M accepts message based interrupts from AGP (PCI semantics only) or its hub interface and
forwards them to the System bus as Interrupt Message Transactions. The interrupt messages presented to
the MCH-M are in the form of Memory Writes to address 0FEEx_xxxxh. At the hub interface or AGP
interface the Memory Write interrupt message is treated like any other Memory Write; it is either posted
into the inbound data buffer (if space is available) or retried (if data buffer space is not immediately
available). Once posted, the Memory Write from AGP or the hub interface, to address 0FEEx_xxxxh, is
decoded as a cycle that needs to be propagated by the MCH-M to the System bus as an Interrupt
Message Transaction.
5.2.
System Memory Interface
5.2.1.
DDR Interface Overview
The Intel 845MP Chipset MCH-M supports DDR at 200 and 266 MHz and includes support for:
• Up to 1 GB of PC2100 DDR
• PC2100, unbuffered, 200-pin DDR SO-DIMMs
• Maximum of 2 SO-DIMMs, Single-sided and/or Double-sided b
• Configurable optional ECC
The Intel 845MZ Chipset MCH-M supports DDR at 200 MHz and includes support for:
• Up to 512 MB of PC1600 DDR
• PC1600, unbuffered, 200-pin DDR SO-DIMMs
• Maximum of 2 SO-DIMMs, Single-sided and/or Double-sided
• Configurable optional ECC
The 2 bank select lines SBS[1:0] and the 13 Address lines SMA[12:0] allow the Intel 845MP/845MZ
MCH-M to support 64 bit wide SO-DIMMs using 64-Mb, 128-Mb, 256-Mb, and 512-Mb DDR
technology. While address lines SMA[9:0] determine the starting address for a burst, burst lengths can
be 2, 4, or 8. Four chip selects SCS# lines allow a maximum of two rows of single-sided DDR SODIMMs and four rows of double-sided DDR SO-DIMMs.
Intel 845MP/845MZ main memory controller targets CAS latencies of 2 and 2.5 for DDR. Intel
845MP/845MZ provides refresh functionality with a programmable rate (normal DDR rate is 1
refresh/15.6 us). For write operations of less than a Qword in size, the MCH-M will perform a byte-wise
write.
250687-002
Datasheet
115
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
5.2.2.
Memory Organization and Configuration
Refer to Section 1.3.
5.2.2.1.
Configuration Mechanism for SO-DIMMs
Detection of the type of DDR installed on the SO-DIMM is supported via Serial Presence Detect
mechanism as defined in the JEDEC 200-pin SO- DIMM specification. This uses the SCL, SDA, and
SA[2:0] pins on the SO-DIMMs to detect the type and size of the installed SO-DIMMs. No special
programmable modes are provided on Intel 845MP/845MZ MCH-M for detecting the size and type of
memory installed. Type and size detection must be done via the serial presence detection pins.
5.2.2.1.1.
Memory Detection and Initialization
Before any cycles to the memory interface can be supported, the Intel 845MP/845MZ MCH-M DDR
registers must be initialized. The Intel 845MP/845MZ MCH-M must be configured for operation with
the installed memory types. Detection of memory type and size is done via the System Management Bus
(SMB) interface on the ICH3-M. This two-wire bus is used to extract the DDR type and size information
from the Serial Presence Detect port on the DDR SO-DIMMs. DDR SO-DIMMs contain a 5 pin Serial
Presence Detect interface, including SCL (serial clock), SDA (serial data) and SA[2:0]. Devices on the
SMBus bus have a seven-bit address. For the DDR SO-DIMMs, the upper four bits are fixed at 1010.
The lower three bits are strapped on the SA[2:0] pins. SCL and SDA are connected directly to the
System Management Bus on the ICH3-M. Thus, data is read from the Serial Presence Detect port on the
SO-DIMMs via a series of IO cycles to the south bridge. BIOS essentially needs to determine the size
and type of memory used for each of the rows of memory in order to properly configure the Intel
845MP/845MZ MCH-M memory interface.
5.2.2.1.2.
SMBus Configuration and Access of the Serial Presence Detect Ports
Refer to the Intel® ICH3-M Datasheet for more detail.
5.2.2.1.3.
Memory Register Programming
This section provides an overview of how the required information for programming the DDR registers is
obtained from the Serial Presence Detect ports on the SO-DIMMs. The Serial Presence Detect ports are
used to determine Refresh Rate, MA and MD Buffer Strength, Row Type (on a row by row basis), DDR
Timings, Row Sizes, and Row Page Sizes. The following table lists a subset of the data available
through the onboard Serial Presence Detect ROM on each SO-DIMM.
116
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Table 28. Data Bytes on SO-DIMM Used for Programming DRAM Registers
Byte
Function
2
Memory Type (SDR SDRAM or DDR SDRAM)
3
# of Row Addresses, not counting Bank Addresses
4
# of Column Addresses
5
# of SO-DIMM banks
11
ECC, no ECC
12
Refresh Rate/Type
17
# Banks on each Device
The above table is only a subset of the defined SPD bytes on the SO-DIMMs. These bytes collectively
provide enough data for programming the Intel 845MP/845MZ MCH-M SDRAM registers.
5.2.3.
DRAM Performance Description
The overall memory performance is controlled by the DRAM timing register, which pipelines depth used
in Intel 845MP/845MZ MCH-M, memory speed grade and the type of SDRAM used in the system.
Besides this, the exact performance in a system is also dependent on the total memory supported,
external buffering and memory array layout. The most important contribution to overall performance by
the System Memory controller is to minimize the latency required to initiate and complete requests to
memory, and to support the highest possible bandwidth (full streaming, quick turn-arounds). One
measure of performance is the total flight time to complete a cache line request. A true discussion of
performance really involves the entire chipset, not just the System Memory controller.
5.2.3.1.
Data Integrity (ECC)
The Intel 845MP/845MZ MCH-M supports single-bit Error Correcting Code (or Error Checking and
Correcting) and multiple-bit EC (Error Checking) on the main memory interface. The Intel
845MP/845MZ MCH-M generates an 8-bit code word for each 64-bit Qword of memory. Intel
845MP/845MZ MCH-M performs two Qword writes at a time so two 8-bit codes are sent with each
write. Since the code word covers a full Qword, writes of less than a Qword require a read-merge-write
operation. Consider a Dword write to memory. In this case, when in ECC mode, the Intel
845MP/845MZ MCH-M will read the Qword where the addressed Dword will be written, merge in the
new Dword, generate a code covering the new Qword and finally write the entire Qword and code back
to memory. Any correctable (single-bit) errors detected during the initial Qword read are corrected
before merging the new Dword. The Intel 845MP/845MZ MCH-M also supports another data integrity
mode, EC (Error Checking) mode. In this mode, the Intel 845MP/845MZ MCH-M generates and stores
a code for each Qword of memory. It then checks the code for reads from memory but does not correct
any errors that are found. Thus, the read performance hit associated with ECC is not incurred.
5.3.
AGP Interface Overview
The Intel 845MP/845MZ Chipset MCH-M supports 1.5 V AGP 1x/2x/4x devices. The AGP signal
buffers are 1.5 V drive/receive (buffers are not 3.3-V tolerant). The MCH-M supports 2x/4x source
synchronous clocking transfers for read and write data, and sideband addressing. The MCH-M also
supports 1x, 2x and 4x clocking for Fast Writes initiated from the MCH-M (on behalf of the processor).
250687-002
Datasheet
117
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
AGP PIPE# or SBA[7:0] protocol transactions to DRAM do not get snooped and are, therefore, not
coherent with the processor caches. AGP FRAME# protocol transactions to DRAM are snooped. AGP
PIPE# and SBA[7:0] accesses to and from the hub interface are not supported. AGP FRAME# access
from an AGP master to the hub interface are also not supported. Only AGP FRAME# memory writes
from the hub interface are supported.
5.3.1.
AGP Target Operations
The MCH-M supports AGP cycles targeting main memory only. The MCH-M supports interleaved AGP
PIPE#] and AGP FRAME# transactions, or AGP SBA[7:0] and AGP FRAME# transactions.
Table 29. AGP Commands Supported by the MCH-M When Acting as an AGP Target
AGP
Command
Read
MCH-M Host Bridge
Cycle Destination
Response as PCIx Target
0000
Main Memory
Low Priority Read
0000
The Hub interface
Complete with random data; does not go to the hub
interface
0001
Main Memory
High Priority Read
0000
The Hub interface
Complete with random data; does not go to the hub
interface
Reserved
0010
N/A
No Response
Reserved
0011
N/A
No Response
Write
0100
Main Memory
Low Priority Write
0100
The Hub interface
Cycle goes to DRAM with BE’s inactive; does not go to
the hub interface
0101
Main Memory
High Priority Write
0101
The Hub interface
Cycle goes to DRAM with BE’s inactive; does not go to
the hub interface
Reserved
0110
N/A
No Response
Reserved
0111
N/A
No Response
Long Read
1000
Main Memory
Low Priority Read
The Hub interface
Complete with random data; does not go to the hub
interface
Main Memory
High Priority Read
The Hub interface
Complete with random data; does not go to the hub
interface
Hi-Priority Read
Hi-Priority Write
Hi-Priority Long
Read
118
C/BE[3:0]#
Encoding
1001
Flush
1010
MCH-M
Complete with QW of Random Data
Reserved
1011
N/A
No Response
Fence
1100
MCH-M
No Response - Flag inserted in MCH-M request queue
Reserved
1101
N/A
No Response
Reserved
1110
N/A
No Response
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
AGP
Command
C/BE[3:0]#
Encoding
Reserved
NOTE:
1111
MCH-M Host Bridge
Cycle Destination
N/A
Response as PCIx Target
No Response
N/A refers to a function that is not applicable.
As a target of an AGP cycle, the MCH-M supports all memory read and write transactions targeted at
main memory (summarized in the table above). The MCH-M supports both normal and high priority read
and write requests. The MCH-M does not support AGP cycles to the hub interface. PIPE# and SBA
cycles do not require coherency management and all AGP initiator accesses to main memory using AGP
PIPE# or SBA protocol are treated as non-snoopable cycles. These accesses are directed to the AGP
aperture in main memory that should be programmed as either uncacheable (UC) memory or write
combining (WC) in the processor’s MTRRs.
5.3.2.
AGP Transaction Ordering
The MCH-M observes transaction ordering rules as defined by the AGP Interface Specification Rev 2.0.
5.3.3.
AGP Signal Levels
The 1x/2x/4x data transfers use 1.5-V signaling levels as described in the AGP 2.0 specification.
5.3.4.
4x AGP Protocol
In addition to the 1x and 2x AGP protocol, the MCH-M supports 4x AGP read and write data transfers
and 4x sideband address. The 4x operation is compliant with the AGP 2.0 specification.
The MCH-M indicates that it supports 4x data transfers through RATE[2] (bit 2) of the AGP Status
Register. When DATA_RATE[2] of the AGP Command Register is set to 1 during system initialization,
the MCH-M performs AGP read/write data transactions using 4x protocol. This bit is not dynamic. Once
this bit is set during initialization, the data transfer rate may not be changed.
The 4x data rate transfer provides 1.06 GB/s transfer rates. The control signal protocol for the 4x data
transfer protocol is identical to 1x/2x protocol. In 4x mode 16 bytes of data are transferred on every 66MHz clock edge. The minimum throttleable block size remains four 66-MHz clocks, which means 64
bytes of data are transferred per block. Three additional signal pins are required to implement the 4x data
transfer protocol. These signal pins are complementary data transfer strobes for the AD bus (2) and the
SBA bus (1).
5.3.5.
Fast Writes
MCH-M supports 2x and 4x Fast Writes from the MCH-M to the graphics controller on AGP. Fast Write
operation is compliant with the AGP 2.0 specification.
The MCH-M will not generate Fast Back to Back (FB2B) cycles in 1x mode, but will generate FB2B
cycles in 2x and 4x Fast Write modes.
To use the Fast Write protocol, the Fast Write Enable configuration bit, AGPCMD[FWEN] (bit 4 of the
AGP Command Register), must be set to 1.
250687-002
Datasheet
119
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Memory writes originating from the host or from the hub interface use the Fast Write protocol when it is
both capability enabled and enabled. The data rate used to perform the Fast Writes is dependent on the
bits set in the AGP Command Register bits 2:0 (DATA_RATE). If bit 2 of the
AGPCMD[DATA_RATE] field is 1, the data transfers occur using 4x strobing. If bit 1 of
AGPCMD[DATA_RATE] field is 1, the data transfers occur using 2x strobing. If bit 0 of
AGPCMD[DATA_RATE] field is 1, Fast Writes are disabled and data transfers occur using standard
PCI protocol. Note that only one of the three DATA_RATE bits may be set by initialization software.
This is summarized in the following table.
Table 30. Fast Write Initialization
5.3.6.
FWEN
DATA_RATE
[2]
DATA_RATE
[1]
DATA_RATE
[0]
MCH-M =>AGP Master Write
Protocol
0
X
x
x
1x
1
0
0
1
1x
1
0
1
0
2x Strobing
1
1
0
0
4x Strobing
AGP FRAME# Transactions on AGP
The MCH-M accepts and generates AGP FRAME# transactions on the AGP bus. The MCH-M
guarantees that AGP FRAME# accesses to DRAM are kept coherent with the processor caches by
generating snoops to the host bus. LOCK#, SERR#, and PERR# signals are not supported.
5.3.6.1.
MCH-M Target and Initiator Operations for AGP FRAME# Transactions
The following table summarizes MCH-M target operation for AGP FRAME# initiators. The only cycles
that will be claimed are memory accesses to main memory.
Table 31. PCI Commands Supported by the MCH-M When Acting as a FRAME# Target
MCH-M
PCI Command
Cycle Destination
Response as aFRAME#
Target
Interrupt Acknowledge
0000
N/A
No Response
Special Cycle
0001
N/A
No Response
I/O Read
0010
N/A
No Response
I/O Write
0011
N/A
No Response
Reserved
0100
N/A
No Response
Reserved
0101
N/A
No Response
Memory Read
0110
Main Memory
Read
0110
The Hub interface
No Response
0111
Main Memory
Post Data
0111
The Hub interface
No Response
1000
N/A
No Response
Memory Write
Reserved
120
C/BE[3:0]# Encoding
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
MCH-M
PCI Command
C/BE[3:0]# Encoding
Cycle Destination
Response as aFRAME#
Target
Reserved
1001
N/A
No Response
Configuration Read
1010
N/A
No Response
Configuration Write
1011
N/A
No Response
Memory Read Multiple
1100
Main Memory
Read
1100
The Hub interface
No Response
Dual Address Cycle
1101
N/A
No Response
Memory Read Line
1110
Main Memory
Read
1110
The Hub interface
No Response
1111
Main Memory
Post Data
1111
The Hub interface
No Response
Memory Write and
Invalidate
NOTE:
N/A refers to a function that is not applicable.
As a target of an AGP FRAME# cycle, the MCH-M only supports the following transactions:
• Memory Read. Recommended for reads of 32 bytes or less.
• Memory Read Line, and Memory Read Multiple. These commands are supported identically by the
MCH-M and allow the MCH-M to continuously supply data during MRL and MRM burst.
Recommended for reads of more than 32 bytes. The MCH-M does not support reads of the hub
interface bus from AGP.
• Memory Write and Memory Write and Invalidate. These commands are aliased and processed
identically. The MCH-M does not support writes of the hub interface bus from AGP.
• Other Commands. Other commands such as I/O R/W and Configuration R/W are not supported by
the MCH-M as a target and result in master abort.
• Exclusive Access. The MCH-M does not support PCI locked cycles as a target.
• Fast Back-to-Back Transactions. MCH-M as a target supports fast back-to-back cycles from an
AGP FRAME# initiator.
As an initiator of AGP FRAME# cycle, the MCH-M only supports the following transactions:
• Memory Read and Memory Read Line. MCH-M uses these commands to support read requests from
host to AGP. MCH-M does not support memory reads from the hub interface to AGP.
• Memory Read Multiple. This command is not supported by the MCH-M as an AGP FRAME#
initiator.
• Memory Write. MCH-M initiates AGP FRAME# write cycles on behalf of the host or the hub
interface. MCH-M does not issue Memory Write and Invalidate as an initiator. MCH-M does not
support write merging or write collapsing. MCH-M allows non-snoopable write transactions from
the hub interface to the AGP bus.
• I/O Read and Write. I/O reads and writes from the host are sent to the AGP bus if they fall within
the I/O base and limit address range for the AGP bus as programmed in the MCH-M’s PCI
configuration registers. All other host-initiated I/O accesses that do not correspond to this
250687-002
Datasheet
121
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
programmed address range are forwarded to the hub interface. MCH-M does not support I/O
accesses from the hub interface to AGP.
• Exclusive Access. MCH-M does not issue a locked cycle on the AGP bus on behalf of either the host
or the hub interface. The hub interface and host locked transactions to AGP are initiated as unlocked
transactions by the MCH-M on the AGP bus.
• Configuration Read and Write. Host Configuration cycles to AGP are forwarded as Type 1
Configuration Cycles. MCH-M does not support configuration reads or writes from the hub
interface to AGP.
• Fast Back-to-Back Transactions. MCH-M as an initiator does not perform fast back-to-back cycles.
MCH-M Retry/Disconnect Conditions
The MCH-M generates retry/disconnect according to the AGP Specification rules when being accessed
as a target by the AGP master using a FRAME# protocol cycle.
Delayed Transactions
When an AGP FRAME#-to-DRAM read cycle is retried by the MCH-M, it is processed internally as a
Delayed Transaction.
The MCH-M supports the Delayed Transaction mechanism on the AGP target interface for the
transactions issued using AGP FRAME# protocol. This mechanism is compatible with the PCI 2.1
Specification. The process of latching all information required to complete the transaction, terminating
with Retry, and completing the request without holding the master in wait-states is called a Delayed
Transaction. The MCH-M latches the Address and Command when establishing a Delayed Transaction.
The MCH-M generates a Delayed Transaction on the AGP only for AGP FRAME# to DRAM read
accesses. The MCH-M does not allow more than one Delayed Transaction access from AGP at any time.
5.4.
Power and Thermal Management
An Intel 845MP/845MZ Chipset platform is compliant with the following specifications:
• APM Rev 1.2
• ACPI Rev 1.0b
• ACPI Rev 2.0
• PCI Power Management Rev 1.0
• PC'99, Rev 1.0
• PC'99A
• PC’01, Rev 1.0
122
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
5.4.1.
Various States
Table 32. Power Management State Combinations
Global (G) Sleep (S)
state
State
5.4.2.
CPU (C)
State
CPU
Clock
(FCLK)
MCH-M
Host Clock
(DCLK)
System Memory
Processor State
G0
S0
C0
On
On
On
Full On
G0
S0
C1
On
On
On
Auto-Halt
G0
S0
C2
On
On
On
Stop Grant
G0
S0
C3
Off
On
PwrDown Self Refresh
Deep Sleep
G0
S0
C4
Off
On
PwrDown Self Refresh
DeepER Sleep
G1
S1M
N/A
Off
Off
PwrDown Self Refresh
G1
S3
N/A
Off
Off
PwrDown Self Refresh
G1
S4
N/A
Off
Off
PwrDown Self Refresh
G2
S5
N/A
Off
Off
PwrDown Self Refresh
G3
N/A
N/A
Off
Off
Off
General Description of Supported CPU States
• C0 (Full On): This is the only state that runs software. All clocks are running, STPCLK# is
deasserted and the processor core is active. The processor can service snoops and maintain cache
coherency in this state.
• C1 (Auto Halt): The first level of power reduction occurs when the processor executes an AutoHalt instruction. This stops the execution of the instruction stream and reduces the processor’s
power consumption. The processor can service snoops and maintain cache coherency in this state.
• C2 (Stop Grant): To enter this low power state, STPCLK# is asserted. The processor can still
service snoops and maintain cache coherency in this state.
• C3 (Sleep or Deep Sleep): In these states the processor clock is stopped. The MCH-M assumes
that no AGP, AGP/PCI, or HubLink cycles (except special cycles) will occur while the MCH-M is
in this state. The processor cannot snoop its caches to maintain coherency while in the C3 state.
• C4 (DeepER Sleep): The C4 state appears to Intel 845MP/845MZ as identical to the C3 state, but
in this state the processor core voltage is lowered. There are no internal events in Intel
845MP/845MZ for the C4 state that differ from the C3 state.
250687-002
Datasheet
123
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
5.4.3.
General Description of ACPI System States
• S0 (Awake): In this state all power planes are active.
• S1-M (Powered on Suspend for Mobile Systems): Power is maintained to the CPU and all system
components, but most clocks are stopped by the clock synthesizer.
• S2: ACPI S2 state is not supported in the Intel 845MP/845MZ Chipset platform.
• S3 (Suspend To RAM): The next level of power reduction occurs when the clock synthesizer and
core well power planes for the processor and chipset are shut down, but the main memory power
plane and the ICH3-M resume well remain active. This is the Suspend To RAM (STR) state. All
clocks from synthesizers are shut down during the S3 state.
• S4 (Suspend to Disk) and S5 (Soft Off): In these states the main memory power plane is shut
down in addition to the clock synthesizer and core well power planes for the processor and chipset.
The ICH3-M resume well is still powered.
• G3 (Mechanical Off): In this state only the RTC (Real Time Clock) well is powered. The system
can only be reactivated via the power switch.
5.4.4.
Power Transitions
Table 33. Intel 845MP/845MZ Power Transitions
124
ACPI
State/Feature
CO
C1
C2/S1D
C3/C4
S1M
DDR
Active/Standby
& Nap
Active/Standby
& Nap
Nap, Active, &
Standby
Power-down
Power-down
RAC
Active
Active
Active
Power-down
Power-down
DRCG
Running
Running
Running
Clock Stop
Mode
Power-down
Clock Gating
Yes (during
writes)
Yes (during
writes)
Yes (enabled
during snoops)
Yes
Yes
GTL Control
Buffer Sense
Amp Disable
No
No
No
Yes
Yes
Hublink Interface
Active
Active
Active
Active
Power-down
REQ1
CPU PLL
Running
Running
Running
Running
Running
AGP/Hublink
PLL
Running
Running
Running
Running
Running
Intel SpeedStep
Technology
Transition
No
No
No
No
No
Dynamic RAC
Power
Reduction
Enabled
Enabled
Enabled
Enabled
Enabled
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
5.4.5.
Intel SpeedStep® Technology
Intel SpeedStep® technology allows the system to operate in multiple performance states. Intel SpeedStep
technology offers two CPU/system operational modes:
Maximum Performance Mode: Maximum CPU Core Frequency.
Battery Optimized Mode: Reduced CPU core frequency to extend battery life.
Intel SpeedStep technology transitions states only when AC power is connected or disconnected. It
transitions by changing the CPU PLL multiplier, which can only be done in the Deep Sleep CPU state
(clock going to the CPU is stopped), which is the C3 CPU power state.
Most of the control for Intel SpeedStep technology is done in the ICH3-M. However, the MCH-M must
cooperate on certain functions.
5.5.
MCH-M Clocking
The CK408 compliant clock synthesizer supports the Intel 845MP/845MZ Chipset. For details refer to
the Intel® Pentium® 4 Processor in the 478 Pin Package and Intel®845MP/845MZ Chipset Platform
Design Guide.
5.6.
MCH-M System Reset and Power Sequencing
Please refer to the Intel® Pentium® 4 Processor in the 478 Pin Package and Intel® 845MP/845MZ
Chipset Platform Design Guide for details.
250687-002
Datasheet
125
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
6.
Electrical Characteristics
This chapter contains the absolute maximum operating ratings, power characteristics, and DC
characteristics for the 845MP/845MZ MCH-M.
6.1.
Absolute Maximum Ratings
Table 34 lists the Intel 845MP/845MZ Chipset MCH-M maximum environmental stress ratings.
Functional operation at the absolute maximum and minimum is neither implied nor guaranteed.
Functional operating parameters are listed in the AC and DC tables.
Warning:
Stressing the device beyond the “Absolute Maximum Ratings” may cause permanent damage. These are
stress ratings only. Operating beyond the “operating conditions” is not recommended and extended
exposure beyond “operating conditions” may affect reliability.
Table 34. Absolute Maximum Ratings
Symbol
6.2.
Parameter
Min
Max
Unit
Tdie
Die Temperature under Bias (with heatsink)
0
98
°C
Tdie
Die Temperature under Bias (without heatsink)
0
104
°C
Tstorage
Storage Temperature
-55
150
°C
VCC1_5
1.5 V Supply Voltage with respect to Vss
-0.72
2.69
V
VCC1_8
1.8 V Supply Voltage with respect to Vss
-0.88
2.5
V
VCCSM
2.5 V DDR Supply Voltage with respect to Vss
-3.60
6.3
V
VTT
AGTL+ buffer DC input voltage with respect to Vss
-0.55
2.3
V
VIL, VIH
(DDR)
Voltage on 2.5 V DDR tolerant input pins with
respect to Vss
-3.60
6.30
V
Notes
Thermal Characteristics
The Intel 845MP/845MZ Chipset MCH-M is designed for operation at die temperatures between 0°C
and 104°C. The thermal resistance of the package is given in Table 35.
Table 35. Intel 845MP/845MZ Chipset MCH-M Package Thermal Resistance
Parameter
0 m/s
1 m/s
Ψjt (°C/Watt)**
0.5
1.8
Θja (°C/Watt)**
20.0
17.3
NOTE:
126
Airflow Velocity in Meters/Second
** Typical value measured in accordance with EIA/JESD 51-2 testing standard.
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
6.3.
Power Characteristics
Table 36. Power Characteristics
Symbol
Parameter
Min
Typ
Max
4.6
Unit
Notes
W
1
TDP
Thermal Design Power
IVTT
Intel 845MP/845MZ Chipset MCH-M
VTT supply Current
2.4
A
2
IVCC1_5_CORE
1.5 V Core Supply Current
1.9
A
2,3
IVCC1_5_AGP
1.5 V AGP Supply Current
0.37
A
2,3
IVCC1_8
1.8 V Hub Interface Supply Current
0.20
A
2
IVCCSM
DDR System Memory Interface (2.5
V) Supply Current
1.9
A
2
ISUS_VCCSM
DDR System Memory Interface (2.5
V) Standby Supply Current
25
mA
ISDREF
DDR System Memory Interface
Reference Voltage (1.25 V) Supply
Current
10
mA
ISUS_SDREF
DDR System Memory Interface
Reference Voltage (1.25 V) Standby
Supply Current
1
mA
ITTRC
DDR System Memory Interface
Resister Compensation Voltage (1.25
V) Supply Current
40
mA
ISUS_TTRC
DDR System Memory Interface
Resister Compensation Voltage (1.25
V) Standby Supply Current
0
mA
NOTES:
1. This spec is the Thermal Design Power and it is the estimated maximum possible expected power generated in
a component by a realistic application. It is based on extrapolations in both hardware and software technology
over the life of the component. It does not represent the expected power generated by a power virus. Studies
by Intel indicate that no application will cause thermally significant power dissipation exceeding this
specification, although it is possible to concoct higher power synthetic workloads that write but never read.
Under realistic read/write conditions, this higher power workload can only be transient, and is accounted in the
Icc (Max) spec.
2. Pre-silicon specs have a +20% / -10% tolerance.
3. These current levels can happen simultaneously, and can be summed into one supply.
250687-002
Datasheet
127
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
7.
Signal Groups
The signal description includes the type of buffer used for the particular signal.
AGTL+
Open Drain AGTL+ interface signal. Refer to the AGTL+ I/O Specification for complete
details. The Intel 845MP/845MZ Chipset MCH-M integrates most AGTL+ termination
resistors.
AGP
AGP interface signals. These signals are compatible with AGP 2.0 1.5 V Signaling
Environment DC and AC Specifications. The buffers are not 3.3 V tolerant.
HI CMOS
Hub Interface 1.8 V CMOS buffers.
DDR CMOS DDR System memory 2.5 V CMOS buffers.
Table 37. Signal Groups
Signal Group
Signal Type
Signals
Notes
Host Interface Signal Groups
(a)
AGTL+ I/O
ADS#, BNR#, BR0#,DBSY#, DBI[3:0]#, DRDY#,
HA[31:3]#, HADSTB[1:0] #,
HD[63:0]#,HDSTBP[3:0]#, HDSTBN[3:0]#, HIT#,
HITM#, HREQ[4:0]#
(b)
AGTL+ Common
Clock Output
BPRI#, CPURST#, DEFER#, HTRDY#, RS[2:0]#
(c)
AGTL+ Common
Clock Input
HLOCK#
(d)
Host Reference
Voltages
HVREF, HSWING[1:0]
AGP Interface Signal Groups
(e)
AGP I/O
AD_STB0, AD_STB0#, AD_STB1, AD_STB1#,
G_FRAME#, G_IRDY#, G_TRDY#, G_STOP#,
G_DEVSEL#, G_AD[31:0], G_CBE[3:0]#, G_PAR
(f)
AGP Input
PIPE#, SBA[7:0], RBF#, WBF#, SB_STB,
SB_STB#, G_REQ#
(g)
AGP Output
ST[2:0], G_GNT#
(h)
AGP Reference
Voltage
AGPREF
Hub Interface Signal Groups
(i)
Hub Interface’s
CMOS I/O
HI_[10:0], HI_STB, HI_STB#
(j)
Hub Interface
Reference
Voltage
HI_REF
DDR Interface Signal Groups
128
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Signal Group
Signal Type
Signals
(k)
DDR CMOS I/O
SDQ[63:0], SCB[7:0], SDQS[8:0]
(l)
DDR CMOS
Output
SCS[3:0]#, SMA[12:0], SBS[1:0], SRAS#, SCAS#,
SWE#, SCKE[3:0], RCVENOUT#, SCK[5:0],
SCK[5:0]#
(m)
DDR CMOS Input
RCVENIN#
(n)
DDR Reference
Voltage
SDREF
Notes
Clocks, Reset, and Miscellaneous Signal Groups
(o)
CMOS Input
TESTIN#
(p)
CMOS Input
RSTIN#(3.3V)
(q)
CMOS Clock
Input
HCLKINP, HCLKINN
(v)
CMOS Clock
Input
GCLKIN
I/O Buffer Supply Voltages
250687-002
(r)
AGTL+
Termination
Voltage
VTT
(s)
1.5 V Core and
AGP Voltage
VCC1_5
(t)
1.8 V Hub
Interface Voltage
VCC1_8
(u)
2.5 V DDR Supply
Voltage
VCCSM
Datasheet
129
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
8.
DC Characteristics
Table 38. DC Characteristics
Symbol
Signal
Group
Parameter
Min
Nom
Max
Unit
Notes
I/O Buffer Supply Voltage
VCCSM
(u)
DDR I/O Supply Voltage
2.375
2.5
2.625
V
VCC1_8
(t)
1.8V I/O Supply Voltage
1.71
1.8
1.89
V
VCC1_5
(s)
Core and AGP Voltage
1.425
1.5
1.575
V
VTT
(r)
Host AGTL+ Termination
Voltage
1.75
V
VTTactive
(r)
BK-M Active Range
VTTsleep
®
BK-M Inactive Range
N/A
N/A
1.0-5%
1.5+5%
0.85-2.5%
1.5+2.5%
Reference Voltages
HVREF
(d)
Host Address and Data
Reference Voltage
2/3 x VTT – 2%
2/3 x VTT
2/3 x VTT + 2%
V
HSWING
(d)
Host Compensation
Reference Voltage
1/3 x VTT – 2%
1/3 x VTT
1/3 x VTT + 2%
V
HIREF
(j)
Hub Interface Reference
Voltage
0.48 x VCC1_8
1/2 x VCC1_8
0.52 x VCC1_8
V
SDREF
(n)
DDR Reference Voltage
0.48 x VCCSM
1/2 x VCCSM
0.52 x VCCSM
V
AGPREF
(h)
AGP Reference Voltage
0.48 x VCC1_5
1/2 x VCC1_5
0.52 x VCC1_5
V
(2/3 x VTT) – 0.1
V
Host Interface
VIL_H
(a,c)
Host AGTL+ Input Low
Voltage
VIH_H
(a,c)
Host AGTL+ Input High
Voltage
VOL_H
(a,b)
Host AGTL+ Output Low
Voltage
VOH_H
(a,b)
Host AGTL+ Output High
Voltage
IOL_H
(a,b)
Host AGTL+ Output Low
Current
ILEAK_H
(a,c)
Host AGTL+ Input
Leakage Current
CPAD
(a,c)
Host AGTL+ Input
Capacitance
(2/3 x VTT) + 0.1
V
(1/3 x VTT) + 0.1
VTT-0.1
V
V
VTTmax / 0.75Rttmin
mA
Rttmin=45Ω
±15
µA
VOL<Vpad<
VTT
1.0
pF
DDR Interface
VIL(DC)
130
(k,m)
DDR Input Low Voltage
SDREF – 0.15
Datasheet
V
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Symbol
Signal
Group
Parameter
VIH(DC)
(k,m)
DDR Input High Voltage
VIL(AC)
(k,m)
DDR Input Low Voltage
VIH(AC)
(k,m)
DDR Input High Voltage
Min
Nom
Max
SDREF + 0.15
Unit
Notes
V
SDREF – 0.31
SDREF + 0.31
V
V
DDR Interface cont.
VOL
(k,l)
DDR Output Low Voltage
VOH
(k,l)
DDR Output High Voltage
IOL
(k,l)
DDR Output Low Current
IOH
(k,l)
DDR Output High Current
ILeak
(k,m)
Input Leakage Current
Rsus_pullup
(k,m)
Internal Pull-up to Vccsm
in suspend
CI/O
(k, l, m)
DDR Input/Output Pin
Capacitance
0,975
1.80
V
9.375
-9.375
mA
mA
10
16
4.690
V
uA
KΩ
5.370
pF
0.4 x VCC1_5
V
2.
1.5 V AGP Interface
VIL_A
(e,f)
AGP Input Low Voltage
VIH_A
(e,f)
AGP Input High Voltage
VOL_A
(e,g)
AGP Output Low Voltage
VOH_A
(e,g)
AGP Output High Voltage
IOL_A
(e,g)
AGP Output Low Current
IOH_A
(e,g)
AGP Output High Current
ILEAK_A
(e,f)
AGP Input Leakage
Current
CIN_A
(e,f)
AGP Input Capacitance
0.6 x VCC1_5
V
0.15 x VCC1_5
0.85 x VCC1_5
V
1
mA
@VOL_A max
mA
@VOH_A max
±15
µA
0<Vin<
VCC1_5
1.92
pF
HIREF - 0.15
V
-0.2
1.32
V
1.8 V Hub Interface
250687-002
VIL_HI
(i)
Hub Interface Input Low
Voltage
VIH_HI
(i)
Hub Interface Input High
Voltage
VOL_HI
(i)
Hub Interface Output Low
Voltage
VOH_HI
(i)
Hub Interface Output High
Voltage
IOL_HI
(i)
Hub Interface Output Low
Current
IOH_HI
(i)
Hub Interface Output High
Current
ILEAK_HI
(i)
Hub Interface Input
Leakage Current
CIN_HI
(i)
Hub Interface Input
Capacitance
HIREF + 0.15
V
0.1 x VCC1_8
0.9 x VCC1_8
1
Datasheet
IOL= 1 mA
V
IOH = 1 mA
mA
@VOL_HI max
mA
@VOH_HI max
-150, +15
µA
0<Vin<
VCC1_8
3.17
pF
-1
2.58
V
131
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Symbol
Signal
Group
Parameter
Min
Nom
Max
Unit
HIREF - 0.15
V
Notes
Miscellaneous Signals
VIL
(o)
Input Low Voltage
VIH
(o)
Input High Voltage
VOL
(o)
Output Low Voltage
VOH
(o)
Output High Voltage
IOL
(o)
Output Low Current
IOH
(o)
Output High Current
ILEAK
(o)
Input Leakage Current
CIN
(o)
Input Capacitance
VIL
(p)
Input Low Voltage
VIH
(p)
Input High Voltage
ILEAK
(p)
Input Leakage Current
CIN
(p)
Input Capacitance
VIL
(q)
Input Low Voltage
VIH
(q)
Input High Voltage
0.660
0.710
0.850
V
VCROSS
(q)
Crossing Voltage
0.45x(VIH - VIL)
0.5x(VIH - VIL)
0.55x(VIH - VIL)
V
CIN
(q)
Input Capacitance
0.94
1.1
pF
VIL
(v)
Input Low Voltage
0.8
V
VIH
(v)
Input High Voltage
2.4
CIN
(v)
Input Capacitance
1.2
HIREF + 0.15
V
0.1 x VCC1_8
0.9 x VCC1_8
1
IOL= 1 mA
V
IOH = 1 mA
mA
@VOL_HI max
mA
@VOH_HI max
-150, +15
µA
0<Vin<
VCC1_8
3.17
pF
0.8
V
-1
2.58
V
2.0
V
4.690
±100
µA
5.370
pF
0
0<Vin<VCC3_3
V
V
1.4
pF
NOTES:
1. Determined with 0.75x MCH-M DDR buffer strength setting.
2. In suspend, not all non-CKE pins will be pulled up; there will be an indeterminate number that will
be pulled low.
132
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
9.
Ballout and Package Information
9.1.
Ballout Diagram
Table 39. Top View (Left Side)
29
28
AJ
VCC1_5
VSS
VCC1_5
HD56#
HD55#
HD54#
SB_STB
SB_STB#
VSS
ST1
VCC1_5
PIPE#
VSS
VTT
VSS
VTT
VSS
HD59#
VSS
SBA5
VCC1_5
SBA7
SBA6
WBF#
RBF#
VTT
VSS
VTT
VSS
CPURST#
HD63#
HD60#
NC
NC
GRCOMP
G_AD31
VCC1_5
VSS
VCC1_5
VTT
VSS
VTT
HD62#
VSS
DBI3#
AD_STB1
VSS
G_AD28
G_AD29
VSS
G_AD30
VSS
VSS
VTT
VSS
HD58#
G_AD20
G_AD22
G_AD19
G_AD27
G_AD24
VSS
VCC1_5
VTT
VSS
VTT
HVREF
VSS
VSS
G_AD21
VCC1_5
G_AD26
G_AD25
G_CBE3#
VCC1_5
AGPREF
G_AD16
G_AD17
G_CBE2#
G_FRAME
#
G_AD23
VSS
G_IRDY#
VSS
G_PAR
G_TRDY#
G_STOP#
VCC1_5
G_AD9
G_AD8
G_CBE0#
G_AD15
G_CBE1#
VSS
G_AD6
VCC1_5
G_AD14
G_AD13
G_AD11
VCC1_5
VSSA1
VCC1_5
VSS
G_AD5
G_AD4
G_AD2
G_AD12
G_AD10
VSS
VCCA1
VSS
VCC1_5
G_AD1
G_AD0
VSS
G_AD3
AD_STB0
AD_STB0#
VCC1_5
VSS
VCC1_5
VSS
HLRCOMP
HI_REF
HI_0
HI_1
HI_3
66IN
VCC1_5
VSS
VCC1_5
HI_STB
HI_STB#
VCC1_8
VSS
VSS
VCC1_5
VSS
VCC1_8
HI_8
HI_4
HI_5
HI_10
VSS
VCC1_8
VCC1_8
HI_6
HI_7
VSS
VCC1_8
VSS
VCCSM
VSS
VSS
VCCSM
RSVD
VCCSM
RSVD
VCCSM
RSTIN#
VSS
RSVD
SCK1
RSVD
VSS
SDREF
RSVD
TESTIN#
SDQ4
VCCSM
SCKE2
VCCSM
VSS
VCCSM
VSS
VCCSM
VSS
VCCSM
VSS
SDQ5
VSS
SCK#1
SCK#4
SCKE0
SMA12
SMA7
SMA8
SMA4
SMA3
RSVD
RSVD
SCK3
SDQ1
SDQS0
SDQ6
VSS
SCKE3
VCCSM
SMA9
VSS
SMA6
VCCSM
SMA1
VSS
SCK#0
VSS
SMRCOMP
VCCSM
SDQ0
VSS
SDQ3
SDQ8
VSS
SDQ15
SCK4
SDQ17
SCKE1
SDQ19
SMA11
SDQ29
SMA5
SDQ31
SMA2
SDQS8
SDQ13
SDQ14
VCCSM
SDQ16
VCCSM
SDQ22
VSS
SDQ25
VCCSM
SDQ27
VSS
SCB1
VCCSM
SDQ2
SDQ9
SDQS1
SDQ11
SDQ20
SDQS2
SDQ18
SDQ24
SDQ28
SDQ26
SDQ30
SCB5
SCB0
SCB6
SDQ7
SDQ12
SDQ10
SDQ21
SDQ23
SDQS3
SCB4
SCB2
VSS
VCCSM
VSS
VCCSM
VSS
VCCSM
VSS
D
C
HDSTBP3# HDSTBN3#
HI_2
F
E
HD57#
HI_9
H
G
HD61#
VSS
K
J
VSS
VSS
VSS
M
L
VSS
VTT
P
N
15
VSS
G_AD7
VSS
16
VTT
T
R
VTT
17
VSS
G_AD18
VSS
18
VTT
G_DEVSEL
VCC1_5
#
VSS
VTT
19
G_REQ#
SBA4
G_GNT#
20
ST0
V
U
VTT
21
ST2
Y
W
22
SBA1
AB
AA
VCC1_5
23
SBA3
VCC1_5 AD_STB1#
VSS
24
SBA0
AD
AC
25
SBA2
AF
AE
26
VSS
AH
AG
27
VCCSM
B
A
29
250687-002
28
27
26
25
24
23
22
Datasheet
21
20
19
18
17
16
15
133
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Table 40. Top View (Right Side)
15
14
13
12
11
10
9
8
7
6
5
4
3
2
AJ
VSS
VSS
VSS
VSS
VSS
VSS
VSS
HD57#
HD49#
HD44#
DBI2#
HD24#
HD31#
HD25#
HD20#
HD17#
HD54#
HD52#
HD48#
HD45#
HD42#
HD43#
HD38#
HD27#
HD28#
HD29#
HD16#
DBI1#
HD22#
VSS
HD51#
VSS
HD47#
VSS
HD41#
VSS
HD30#
VSS
HD19#
VSS
HD26#
HD21#
HD60#
HD53#
HD46#
HD40#
HDSTBN2#
HD36#
HD34#
HD18#
HD23#
VSS
HD8#
DBI3#
VSS
HSWNG
1
VSS
HDSTBP2#
VSS
HD37#
VSS
HD10#
VSS
DBI0#
HDSTBN3#
HD50#
HRCOM
P1
HD33#
HD32#
HD39#
HD35#
HD14#
HD11#
HD12#
HD5#
VSS
HD13#
VSS
VSS
VSS
VSS
HVREF
VSS
VSS
VTT
HD9#
VSS
HD1#
HD4#
HD3#
VTT
VSS
HSWNG0
HD7#
HD2#
VSS
HD6#
HVREF
BPRI#
VSS
HIT#
DEFER#
HITM#
VSS
RS1#
RS2#
HLOCK#
VSS
BNR#
VSS
BR0#
VSS
DBSY#
DRDY#
ADS#
HDSTBP1# HDSTBN1#
VCC1_5
VSSA0
VTT
HTRDY#
HREQ0#
HREQ3#
VSS
HA6#
VCC1_5
VSS
VCCA0
VSS
HREQ1#
VSS
HA4#
HA3#
HA5#
VSS
VCC1_5
VSS
HVREF
HREQ2#
HA11#
HADSTB0#
VSS
HA7#
VCC1_5
VSS
VCC1_5
VSS
HA8#
VSS
HA12#
HA10#
HA13#
VSS
VCC1_5
VSS
VSS
HA15#
HADSTB1#
HA28#
VSS
HA16#
VTT
HVREF
HA30#
HA24#
HA18#
HA19#
VSS
HA31#
VSS
HA21#
VSS
HA20#
BCLK#
VSS
VCCSM
VSS
HA17#
HA22#
SDREF
BCLK
VCCSM
VSS
VCCSM
VSS
HA25#
HD15#
HRCOMP0
HD0#
RS0#
HREQ4#
HA9#
HA14#
HA26#
HA23#
RSVD
SCK5
HA27#
RCVENOU
T#
SCK3
SCK#3
SBS1
SBS0
SWE#
RSVD
RSVD
SCAS#
SCK#2
SCK2
SDQ63
VCCSM
RCVENIN#
SCK#0
VCCSM
SMA10
VSS
SRAS#
VCCSM
SCS#2
VSS
SCS#1
VCCSM
SCK#5
SDQ58
SDQ59
SDQS8
SCK0
SDQ32
SMA0
SDQ44
SDQ40
SCS#0
SDQ43
SCS#3
SDQ52
SDQ55
VSS
SDQS7
VCCSM
SCB7
VSS
SDQS4
VCCSM
SDQ39
VSS
SDQ42
VCCSM
SDQ49
VSS
SDQ50
SDQ57
SCB6
SCB3
SDQ37
SDQ33
SDQ38
SDQ35
SDQ41
SDQS5
SDQ47
SDQ48
SDQS6
SDQ54
SDQ56
SDQ61
SDQ60
SDQ51
VSS
VCCSM
VSS
VCCSM
VSS
VCCSM
VSS
134
11
10
9
8
7
Datasheet
6
5
4
3
VSS
W
VSS
U
VSS
R
VSS
N
VSS
L
K
RSVD
SDQ53
AA
M
VCCSM
SDQ46
VSS
P
VSS
SDQ45
AC
T
VCCSM
SDQ34
VSS
V
VSS
SDQ36
AE
Y
VCCSM
12
VSS
AB
VSS
SCB2
AG
AD
VCCSM
13
VSS
AF
VSS
14
AH
HDSTBN0# HDSTBP0#
VSS
15
1
VSS
J
H
HA29#
VCCSM
G
F
SDQ62
VSS
E
D
VCCSM
C
B
A
2
1
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
9.2.
Ballout Table
Signal Name
Ball #
Signal Name
Ball #
Signal Name
Ball #
66IN
P22
G_AD12
T24
GRCOMP
AD25
AD_STB0
R24
G_AD13
U24
HA3#
T4
AD_STB0#
R23
G_AD14
U25
HA4#
T5
AD_STB1
AC27
G_AD15
V24
HA5#
T3
AD_STB1#
AC28
G_AD16
Y27
HA6#
U3
ADS#
V3
G_AD17
Y26
HA7#
R3
AGPREF
AA21
G_AD18
AA28
HA8#
P7
BCLK#
K8
G_AD19
AB25
HA9#
R2
BCLK
J8
G_AD20
AB27
HA10#
P4
BNR#
W3
G_AD21
AA27
HA11#
R6
BPRI#
Y7
G_AD22
AB26
HA12#
P5
BR0#
V7
G_AD23
Y23
HA13#
P3
CPURST#
AE17
G_AD24
AB23
HA14#
N2
DBSY#
V5
G_AD25
AA24
HA15#
N7
DEFER#
Y4
G_AD26
AA25
HA16#
N3
DBI0#
AD5
G_AD27
AB24
HA17#
K4
DBI1#
AG4
G_AD28
AC25
HA18#
M4
DBI2#
AH9
G_AD29
AC24
HA19#
M3
DBI3#
AD15
G_AD30
AC22
HA20#
L3
DRDY#
V4
G_AD31
AD24
HA21#
L5
G_AD0
R27
G_CBE0#
V25
HA22#
K3
G_AD1
R28
G_CBE1#
V23
HA23#
J2
G_AD2
T25
G_CBE2#
Y25
HA24#
M5
G_AD3
R25
G_CBE3#
AA23
HA25#
J3
G_AD4
T26
G_DEVSEL#
W28
HA26#
L2
G_AD5
T27
G_FRAME#
Y24
HA27#
H4
G_AD6
U27
G_GNT#
AH25
HA28#
N5
G_AD7
U28
G_IRDY#
W27
HA29#
G2
G_AD8
V26
G_PAR
W25
HA30#
M6
G_AD9
V27
G_REQ#
AG24
HA31#
L7
G_AD10
T23
G_STOP#
W23
HADSTB0#
R5
G_AD11
U23
G_TRDY#
W24
HADSTB1#
N6
250687-002
Datasheet
135
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Signal Name
Ball #
Signal Name
Ball #
Signal Name
Ball #
HD0#
AA2
HD36#
AE10
HI_0
P25
HD1#
AB5
HD37#
AD9
HI_1
P24
HD2#
AA5
HD38#
AG9
HI_2
N27
HD3#
AB3
HD39#
AC10
HI_3
P23
HD4#
AB4
HD40#
AE12
HI_4
M26
HD5#
AC5
HD41#
AF10
HI_5
M25
HD6#
AA3
HD42#
AG11
HI_6
L28
HD7#
AA6
HD43#
AG10
HI_7
L27
HD8#
AE3
HD44#
AH11
HI_8
M27
HD9#
AB7
HD45#
AG12
HI_9
N28
HD10#
AD7
HD46#
AE13
HI_10
M24
HD11#
AC7
HD47#
AF12
HI_REF
P26
HD12#
AC6
HD48#
AG13
HI_STB
N25
HD13#
AC3
HD49#
AH13
HI_STB#
N24
HD14#
AC8
HD50#
AC14
HIT#
Y5
HD15#
AE2
HD51#
AF14
HITM#
Y3
HD16#
AG5
HD52#
AG14
HLOCK#
W5
HD17#
AG2
HD53#
AE14
HLRCOMP
P27
HD18#
AE8
HD54#
AG15
HRCOMP0
AC2
HD19#
AF6
HD55#
AG16
HRCOMP1
AC13
HD20#
AH2
HD56#
AG17
HREQ0#
U6
HD21#
AF3
HD57#
AH15
HREQ1#
T7
HD22#
AG3
HD58#
AC17
HREQ2#
R7
HD23#
AE5
HD59#
AF16
HREQ3#
U5
HD24#
AH7
HD60#
AE15
HREQ4#
U2
HD25#
AH3
HD61#
AH17
HSWNG0
AA7
HD26#
AF4
HD62#
AD17
HSWNG1
AD13
HD27#
AG8
HD63#
AE16
HTRDY#
U7
HD28#
AG7
HDSTBN0#
AD4
HVREF
M7,R8,Y8,AB11, AB17
HD29#
AG6
HDSTBP0#
AD3
HD30#
AF8
HDSTBN1#
AE6
NC
AD26,AD27
HD31#
AH5
HDSTBP1#
AE7
PIPE#
AF22
HD32#
AC11
HDSTBN2#
AE11
RBF#
AE22
HD33#
AC12
HDSTBP2#
AD11
RCVENIN#
G3
HD34#
AE9
HDSTBN3#
AC15
RCVENOUT#
H3
HD35#
AC9
HDSTBP3#
AC16
RS0#
W2
RS1#
W7
136
Datasheet
250687-002
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Signal Name
Ball #
Signal Name
Ball #
Signal Name
Ball #
RS2#
W6
SCS#3
E7
SDQ35
C10
RSTIN#
J27
SDQ0
G28
SDQ36
B13
RSVD
G9,G10,G16,G17,H6,H
7,H27J23,J25,K23,K25,
E15
SDQ1
F27
SDQ37
C13
SDQ2
C28
SDQ38
C11
SBA0
AH28
SDQ3
E28
SDQ39
D10
SBA1
AH27
SDQ4
H25
SDQ40
E10
SBA2
AG28
SDQ5
G27
SDQ41
C9
SBA3
AG27
SDQ6
F25
SDQ42
D8
SBA4
AE28
SDQ7
B28
SDQ43
E8
SBA5
AE27
SDQ8
E27
SDQ44
E11
SBA6
AE24
SDQ9
C27
SDQ45
B9
SBA7
AE25
SDQ10
B25
SDQ46
B7
SB_STB
AF27
SDQ11
C25
SDQ47
C7
SB_STB#
AF26
SDQ12
B27
SDQ48
C6
SCAS#
G8
SDQ13
D27
SDQ49
D6
SCK0
E14
SDQ14
D26
SDQ50
D4
SCK1
J24
SDQ15
E25
SDQ51
B3
SCK2
G6
SDQ16
D24
SDQ52
E6
SCK3
G15
SDQ17
E23
SDQ53
B5
SCK4
E24
SDQ18
C22
SDQ54
C4
SCK5
H5
SDQ19
E21
SDQ55
E5
SBS0
G12
SDQ20
C24
SDQ56
C3
SBS1
G13
SDQ21
B23
SDQ57
D3
SCK#0
F15
SDQ22
D22
SDQ58
F4
SCK#1
G25
SDQ23
B21
SDQ59
F3
SCK#2
G7
SDQ24
C21
SDQ60
B2
SCK#3
G14
SDQ25
D20
SDQ61
C2
SCK#4
G24
SDQ26
C19
SDQ62
E2
SCK#5
F5
SDQ27
D18
SDQ63
G5
SCKE0
G23
SDQ28
C20
SCB0
C16
SCKE1
E22
SDQ29
E19
SCB1
D16
SCKE2
H23
SDQ30
C18
SCB2
B15
SCKE3
F23
SDQ31
E17
SCB3
C14
SCS#0
E9
SDQ32
E13
SCB4
B17
SCS#1
F7
SDQ33
C12
SCB5
C17
SCS#2
F9
SDQ34
B11
SCB6
C15
250687-002
Datasheet
137
®
Intel 82845MP/82845MZ Chipset-Mobile (MCH-M)
R
Signal Name
Ball #
Signal Name
Ball #
Signal Name
Ball #
SCB7
D14
VCC1_5
VSSA1
U17
SDQS0
F26
N14,N16,P13,P15,P17,
R14,R16,T15,U14,U16
VSSA0
U13
SDQS1
C26
VTT
SDQS2
C23
SDQS3
B19
SDQS4
D12
M8,U8,AA9,AB8,
AB18,AB20,AC19,AD1
8,AD20,AE19,AE21,AF
18,AF20,
AG19,AG21,AG23,AJ1
9,AJ21,AJ23
SDQS5
C8
WBF#
AE23
SDQS6
C5
SDQS7
E3
SDQS8
E15
SDREF
J9,J21
SMA0
E12
SMA1
F17
SMA2
E16
SMA3
G18
SMA4
G19
SMA5
E18
SMA6
F19
SMA7
G21
SMA8
G20
SMA9
F21
SMA10
F13
SMA11
E20
SMA12
G22
SMRCOMP
J28
SRAS#
F11
ST0
AG25
ST1
AF24
ST2
AG26
SWE#
G11
TESTIN#
H26
VCC1_5
R22,R29,U22,U26,W22
,W29,AA22,
AA26,AB21,AC29,AD2
1,AD23,AE26,AF23,AG
29,AJ25
138
VCCA1
T17
VCCA0
T13
VCC1_8
L25,L29,M22,N23,N26
VCCSM
A5,A9,A13,A17,
A21,A25,C1,C29,
D7,D11,D15,D19,
D23,D25,F6,F10,
F14,F18,F22,G1,
G4,G29,H8,H10,
H12,H14,H16,H18,H20,
H22,H24,J5,J7,K6,K22,
K24,K26, L23
VSS
A3,A7,A11,A15,A19,A2
3,A27,D5,D9,
D13,D17,D21,E1,
E4,E26,E29,F8,F12,F1
6,F20,F24,G26,H9,H11
,H13,H15,
H17,H19,H21,J1,J4,J6,
J22,J26,J29,K5,K7,K27
,L1,L4,L6,
L8,L22,L24,L26,
M23,N1,N4,N8,N13,N1
5,N17,N22,N29,P6,P8,
P14,P16,R1,R4,R13,R1
5,R17,
R26,T6,T8,T14,T16,T2
2,U1,U4,U15,
U29,V6,V8,V22,W1,W4
,W8,W26,Y6,Y22,AA1,
AA4,AA8,
AA29,AB6,AB9,
AB10,AB12,AB13,AB1
4,AB15,AB16,AB19,AB
22,AC1,
AC4,AC18,AC20,
AC21,AC23,AC26,AD6,
AD8,AD10,
AD12,AD14,AD16,AD1
9,AD22,AE1,
AE4,AE18,AE20,
AE29,AF5,AF7,AF9,AF
11,AF13,AF15,AF17,A
F19,AF21,
AF25,AG1,AG18,
AG20,AG22,AH19,AH2
1,AH23,AJ3,
AJ5,AJ7,AJ9,AJ11,AJ1
3,AJ15,AJ17, AJ27
Datasheet
250687-002
®
R
9.3.
Intel 845MZ Chipset:82845MZ(MCH-M) Datasheet
Package Mechanical Information
Figure 8. MCH-M BGA Package Dimensions (Top View)
250687-001
139
®
Intel 845MZ Chipset:82845MZ (MCH-M)
R
Figure 9. MCH-M BGA Package Dimensions (Side View)
140
Datasheet
250687-002
®
Intel 845MZ Chipset:82845MZ (MCH-M)
R
Figure 10. MCH-M BGA Package Dimensions (Bottom View)
250687-001
Datasheet
141
®
Intel 845MZ Chipset:82845MZ (MCH-M)
R
Figure 13. FCBGA Handling Zone Description
Handling Area
Capacitor Area
Table 41. FCBGA Handling Zone Description
Handling Zone
Description
142
Value
Label
37.5 mm x 37.5 mm
Substrate Edges
7 mm
Ax, Ay
Substrate Corners
8 mm
Bx, By
Datasheet
250687-002
®
Intel 845MZ Chipset:82845MZ (MCH-M)
R
9.4.
Testability
In the MCH-M, testability for Automated Test Equipment (ATE) board level testing has been implemented
as and XOR chain. An XOR-tree is a chain of XOR gates, each with one input pin connected to it. Refer to
Figure 11 for an example XOR chain.
Figure 11. XOR–Tree Chain
VCC1_8
XOR
Out
Input
Input
Input
Input
Input
xor.vsd
The algorithm used for in –circuit test is as follows
• Drive all input pins to an initial logic level ‘1’. Observe the output corresponding to scan chain being
tested.
• Toggle pins one at a time starting from the first pin in the chain, continuing to the last pin, from its
initial logic level to the opposite logic level. Observe the output changes with each pin toggle.
9.4.1.
XOR Test Mode Initialization
XOR test mode can be entered by pulling three shared pins (reset straps) low through the rising transition
of RSTINB. The signals that need to be pulled are as follows:
GGNTB = 0 (Global strap enable)
SBA[1] = 0 (XOR strap)
ST[2]
= 0 (PLL Bypass mode; it is recommended to enter PLL Bypass in XOR test mode)
250687-001
Datasheet
143
®
Intel 845MZ Chipset:82845MZ (MCH-M)
R
9.4.2.
XOR Chains
Table 42. XOR Chains
144
Chain 0 Ball
Element #
DDR Signal Name
Note
Initial Logic Level
AE6
1
HDSTBP1#
Input
1
AD3
2
HDSTBP0#
Input
1
V3
3
ADS#
Input
1
U6
4
HREQ0#
Input
1
U3
5
HA6#
Input
1
U2
6
HREQ4#
Input
1
U5
7
HREQ3#
Input
1
T5
8
HA4#
Input
1
T7
9
HREQ1#
Input
1
T4
10
HA3#
Input
1
R7
11
HREQ2#
Input
1
R5
12
HADSTB0#
Input
1
R3
13
HA7#
Input
1
P3
14
HA13#
Input
1
R2
15
HA9#
Input
1
R6
16
HA11#
Input
1
T3
17
HA5#
Input
1
N3
18
HA16#
Input
1
P5
19
HA12#
Input
1
P4
20
HA10#
Input
1
P7
21
HA8#
Input
1
N2
23
HA14#
Input
1
N7
24
HA15#
Input
1
N5
25
HA28#
Input
1
M4
26
HA18#
Input
1
L3
27
HA20#
Input
1
M3
28
HA19#
Input
1
L2
29
HA26#
Input
1
K3
30
HA22#
Input
1
M5
31
HA24#
Input
1
K3
32
HA23#
Input
1
K4
33
HA17#
Input
1
J3
34
HA25#
Input
1
Datasheet
250687-002
®
Intel 845MZ Chipset:82845MZ (MCH-M)
R
250687-001
Chain 0 Ball
Element #
DDR Signal Name
Note
Initial Logic Level
L5
35
HA21#
Input
1
H4
36
HA27#
Input
1
M6
37
HA30#
Input
1
L7
38
HA31#
Input
1
G2
39
HA29#
Input
1
H6
40
RSVD
Input
1
H3
41
RCVENOUT#
Input
1
G3
42
RCVENIN#
Input
1
H5
43
SCK5
Input
1
G6
44
SCK2
Input
1
E7
45
SCS#3
Input
1
G8
46
SCAS#
Input
1
G9
47
RSVD
Input
1
AH28
48
SBA0
Output
N/A
Chain 1 Ball
Element #
DDR Ball Name
Note
Initial Logic Level
N6
1
HADSTB1#
Input
1
H7
2
SCK#5
Input
1
G10
3
RSVD
Input
1
G5
4
SDQ63
Input
1
F4
5
SDQ58
Input
1
F3
6
SDQ59
Input
1
C2
7
SDQ61
Input
1
B2
8
SDQ60
Input
1
E2
9
SDQ62
Input
1
D3
10
SDQ57
Input
1
E3
11
SDQS7
Input
1
G7
12
SCK#2
Input
1
C3
13
SDQ56
Input
1
E5
14
SDQ55
Input
1
F7
15
SCS#1
Input
1
D4
16
SDQ50
Input
1
C4
17
SDQ54
Input
1
C5
18
SDQS6
Input
1
E6
19
SDQ52
Input
1
D6
20
SDQ49
Input
1
Datasheet
145
®
Intel 845MZ Chipset:82845MZ (MCH-M)
R
146
Chain 1 Ball
Element #
DDR Ball Name
Note
Initial Logic Level
B3
21
SDQ51
Input
1
C6
22
SDQ48
Input
1
B5
23
SDQ53
Input
1
C7
24
SDQ47
Input
1
B7
25
SDQ46
Input
1
E8
26
SDQ43
Input
1
C8
27
SDQ35
Input
1
C9
28
SDQ41
Input
1
D8
29
SDQ42
Input
1
E10
30
SDQ40
Input
1
B9
31
SDQ45
Input
1
E11
32
SDQ44
Input
1
E9
33
SCS#0
Input
1
AH27
34
SBA1
Output
N/A
Datasheet
250687-002
®
Intel 845MZ Chipset:82845MZ (MCH-M)
R
250687-001
Chain 2 Ball
Element #
DDR Ball Name
Note
Initial Logic Level
D10
1
SDQ39
Input
1
C10
2
SDQ35
Input
1
C11
3
SDQ38
Input
1
F9
4
SCS#2
Input
1
B11
5
SDQ34
Input
1
B13
6
SDQ36
Input
1
G11
7
SWE#
Input
1
C12
8
SDQ33
Input
1
F11
9
SRAS#
Input
1
C13
10
SDQ37
Input
1
D12
11
SDQS4
Input
1
E12
12
SMA0
Input
1
E13
13
SDQ32
Input
1
G14
14
SCK#3
Input
1
G13
15
SBS1
Input
1
F15
16
SCK#0
Input
1
E15
17
SDQS8
Input
1
G16
18
RSVD
Input
1
E16
19
SMA2
Input
1
E18
20
SMA5
Input
1
F17
21
SMA1
Input
1
F19
22
SMA6
Input
1
G18
23
SMA3
Input
1
G20
24
SMA8
Input
1
G19
25
SMA4
Input
1
F21
26
SMA9
Input
1
G21
27
SMA7
Input
1
E22
28
SCKE1
Input
1
G24
29
SCK#4
Input
1
G23
30
SCKE0
Input
1
G25
31
SCK#1
Input
1
H23
32
SCKE2
Input
1
J25
33
RSVD
Input
1
AG28
34
SBA2
Output
N/A
Datasheet
147
®
Intel 845MZ Chipset:82845MZ (MCH-M)
R
148
Chain 3 Ball
Element #
DDR Ball Name
Note
Initial Logic Level
G10
1
RSVD
Input
1
G12
2
SBS0
Input
1
G15
3
SCK3
Input
1
F13
4
SMA10
Input
1
C14
5
SCB3
Input
1
E14
6
SCK0
Input
1
D14
7
SCB7
Input
1
C15
8
SCB6
Input
1
G17
9
RSVD
Input
1
C16
10
SCB0
Input
1
D16
11
SCB1
Input
1
B15
12
SCB2
Input
1
C17
13
SCB5
Input
1
B17
14
SCB4
Input
1
D18
15
SDQ27
Input
1
E17
16
SDQ31
Input
1
B19
17
SDQS3
Input
1
C18
18
SDQ30
Input
1
E19
19
SDQ29
Input
1
C19
20
SDQ26
Input
1
C20
21
SDQ28
Input
1
D20
22
SDQ25
Input
1
C21
23
SDQ24
Input
1
E20
24
SMA11
Input
1
B21
25
SDQ23
Input
1
E21
26
SDQ19
Input
1
C22
27
SDQ18
Input
1
D22
28
SDQ22
Input
1
C24
29
SDQ20
Input
1
C23
30
SDQS2
Input
1
B23
31
SDQ21
Input
1
D24
32
SDQ16
Input
1
G22
33
SMA12
Input
1
E23
34
SDQ17
Input
1
B25
35
SDQ10
Input
1
C25
36
SDQ11
Input
1
Datasheet
250687-002
®
Intel 845MZ Chipset:82845MZ (MCH-M)
R
250687-001
Chain 3 Ball
Element #
DDR Ball Name
Note
Initial Logic Level
C27
37
SDQ9
Input
1
D27
38
SDQ13
Input
1
B27
39
SDQ12
Input
1
C26
40
SDQS1
Input
1
F23
41
SCKE3
Input
1
E24
42
SCK4
Input
1
E25
43
SDQ15
Input
1
E27
44
SDQ8
Input
1
N24
45
HL_STB#
Input
1
R24
46
AD_STB0
Input
1
AG27
47
SBA3
Output
N/A
Datasheet
149
®
Intel 845MZ Chipset:82845MZ (MCH-M)
R
150
Chain 4 Ball
Element #
DDR Ball Name
Note
Initial Logic Level
D26
1
SDQ14
Input
1
F25
2
SDQ6
Input
1
B28
3
SDQ7
Input
1
C28
4
SDQ2
Input
1
E28
5
SDQ3
Input
1
J24
6
SCK1
Input
1
F26
7
SDQS0
Input
1
H25
8
SDQ4
Input
1
K25
9
RSVD
Input
1
J23
10
RSVD
Input
1
F27
11
SDQ1
Input
1
K23
12
RSVD
Input
1
G28
13
SDQ0
Input
1
G27
14
SDQ5
Input
1
M27
15
RQM
Input
1
M24
16
PSTOP
Input
1
N28
17
RQI
Input
1
L28
18
HL_6
Input
1
M25
19
HL_5
Input
1
N27
20
HL_2
Input
1
M26
21
HL_4
Input
1
N25
22
HL_STB
Input
1
L27
23
HL_7
Input
1
P25
24
HL_0
Input
1
P23
25
HL_3
Input
1
P24
26
HL_1
Input
1
R27
27
G_AD0
Input
1
R28
28
G_AD1
Input
1
U27
29
G_AD6
Input
1
R25
30
G_AD3
Input
1
T27
31
G_AD5
Input
1
T36
32
G_AD4
Input
1
U28
33
G_AD7
Input
1
R24
34
AD_STB0
Input
1
V27
35
G_AD9
Input
1
T25
36
G_AD2
Input
1
Datasheet
250687-002
®
Intel 845MZ Chipset:82845MZ (MCH-M)
R
250687-001
Chain 4 Ball
Element #
DDR Ball Name
Note
Initial Logic Level
U27
37
G_AD8
Input
1
T24
38
G_AD12
Input
1
U24
39
G_AD13
Input
1
U25
40
G_AD14
Input
1
T23
41
G_AD10
Input
1
V24
42
G_AD15
Input
1
U23
43
G_AD11
Input
1
AE28
44
SBA4
Output
N/A
Datasheet
151
®
Intel 845MZ Chipset:82845MZ (MCH-M)
R
152
Chain 5 Ball
Element #
DDR Ball Name
Note
Initial Logic Level
V25
1
G_CBE0#
Input
1
W28
2
G_DEVSEL#
Input
1
W25
3
G_PAR
Input
1
Y25
4
G_CBE2#
Input
1
W27
5
G_IRDY#
Input
1
V23
6
G_CBE1#
Input
1
Y24
7
G_FRAME#
Input
1
W24
8
G_TRDY#
Input
1
AE23
9
WBF#
Input
1
W23
10
G_STOP#
Input
1
AA23
11
G_CBE3#
Input
1
AA28
12
G_AD18
Input
1
Y26
13
G_AD17
Input
1
Y27
14
G_AD16
Input
1
AB27
15
G_AD20
Input
1
AB26
16
G_AD22
Input
1
AA25
17
G_AD26
Input
1
AA24
18
G_AD25
Input
1
AA27
19
G_AD21
Input
1
AC27
20
AD_STB1
Input
1
Y23
21
G_AD23
Input
1
AC25
22
G_AD28
Input
1
AB25
23
G_AD19
Input
1
AB23
24
G_AD24
Input
1
AB24
25
G_AD31
Input
1
AC24
26
G_AD29
Input
1
AC22
27
G_AD30
Input
1
AB24
28
G_AD27
Input
1
AE22
29
RBF#
Input
1
AF24
30
ST1
Input
1
AF22
31
PIPE#
Input
1
AF27
32
SB_STB
Input
1
AH25
33
G_GNT#
Input
1
AG25
34
ST0
Input
1
AG24
35
G_REQ#
Input
1
AG26
36
ST2
Input
1
Datasheet
250687-002
®
Intel 845MZ Chipset:82845MZ (MCH-M)
R
250687-001
Chain 5 Ball
Element #
DDR Ball Name
Note
Initial Logic Level
AH17
37
HD61#
Input
1
AG16
38
HD55#
Input
1
AG17
39
HD56#
Input
1
AC16
40
HDSTBP3#
Input
1
AE11
41
HDSTBP2#
Input
1
AE27
42
SBA5
Output
N/A
Datasheet
153
®
Intel 845MZ Chipset:82845MZ (MCH-M)
R
154
Chain 6 Ball
Element #
DDR Ball Name
Note
Initial Logic Level
AC27
1
AD_STB1
Input
1
AF27
2
SB_STB
Input
1
AE17
3
CPURST#
Input
1
AD17
4
HD62#
Input
1
AE16
5
HD63#
Input
1
AH15
6
HD57#
Input
1
AG15
7
HD54#
Input
1
AF16
8
HD59#
Input
1
AC16
9
HDSTBN3#
Input
1
AE15
10
HD60#
Input
1
AG14
11
HD52#
Input
1
AC17
12
HD58#
Input
1
AF14
13
HD51#
Input
1
AE14
14
HD53#
Input
1
AH13
15
HD49#
Input
1
AD15
16
DBI3#
Input
1
AG13
17
HD48#
Input
1
AC14
18
HD50#
Input
1
AF12
19
HD47#
Input
1
AG12
20
HD45#
Input
1
AE12
21
HD40#
Input
1
AE13
22
HD46#
Input
1
AH9
23
DBI2#
Input
1
AG10
24
HD43#
Input
1
AH11
25
HD44#
Input
1
AG9
26
HD38#
Input
1
AG11
27
HD42#
Input
1
AE11
28
HDSTBN2#
Input
1
AF10
29
HD41#
Input
1
AE10
30
HD36#
Input
1
AC12
31
HD33#
Input
1
AC11
32
HD32#
Input
1
AC10
33
HD39#
Input
1
AE9
34
HD34#
Input
1
AC9
35
HD35#
Input
1
AD9
36
HD37#
Input
1
Datasheet
250687-002
®
Intel 845MZ Chipset:82845MZ (MCH-M)
R
250687-001
Chain 6 Ball
Element #
DDR Ball Name
Note
Initial Logic Level
AH7
37
HD24#
Input
1
AH5
38
HD31#
Input
1
AG8
39
HD27#
Input
1
Y4
40
DEFER#
Input
1
W7
41
RS1#
Input
1
AE24
42
SBA6
Output
N/A
Datasheet
155
®
Intel 845MZ Chipset:82845MZ (MCH-M)
R
156
Chain 7 Ball
Element #
DDR Ball Name
Note
Initial Logic Level
AG6
1
HD29#
Input
1
AG5
2
HD16#
Input
1
AG7
3
HD28#
Input
1
AF6
4
HD19#
Input
1
AF8
5
HD30#
Input
1
AE6
6
HDSTBN1#
Input
1
AG4
7
DBI1#
Input
1
AH3
8
HD25#
Input
1
AE8
9
HD18#
Input
1
AG2
10
HD17#
Input
1
AF4
11
HD26#
Input
1
AH2
12
HD20#
Input
1
AE5
13
HD23#
Input
1
AG3
14
HD22#
Input
1
AF3
15
HD21#
Input
1
AD7
16
HD10#
Input
1
AC7
17
HD11#
Input
1
AC8
18
HD14#
Input
1
AD5
19
DBI0#
Input
1
AC6
20
HD12#
Input
1
AE2
21
HD15#
Input
1
AB7
22
HD9#
Input
1
AE3
23
HD8#
Input
1
AD4
24
HDSTBN0#
Input
1
AC3
25
HD13#
Input
1
AB5
26
HD1#
Input
1
AC5
27
HD5#
Input
1
AA6
28
HD7#
Input
1
AA5
29
HD2#
Input
1
AB3
30
HD3#
Input
1
AA3
31
HD6#
Input
1
AB4
32
HD4#
Input
1
AA2
33
HD0#
Input
1
Y5
34
HIT#
Input
1
Y7
35
BPRI#
Input
1
W6
36
RS2#
Input
1
Datasheet
250687-002
®
Intel 845MZ Chipset:82845MZ (MCH-M)
R
Chain 7 Ball
Element #
DDR Ball Name
Note
Initial Logic Level
Y3
37
HITM#
Input
1
U7
38
HTRDY#
Input
1
W5
39
HLOCK#
Input
1
V7
40
BR0#
Input
1
W3
41
BNR#
Input
1
W2
41
RS0#
Input
1
V5
43
DBSY#
Input
1
V4
44
DRDY#
Input
1
AE25
45
SBA7
Output
N/A
NOTE:
250687-001
RSTINB, TESTINB, all Rcomp buffers are not part of any XOR chain.
Datasheet
157