SN74AUC04 HEX INVERTER www.ti.com SCES444 – JUNE 2003 – REVISED JUNE 2005 FEATURES • VCC 1 14 2 13 6A 3 12 6Y 4 11 5A 5 6 10 5Y 9 4A 7 8 4Y • • • • • 1Y 2A 2Y 3A 3Y 1A • RGY PACKAGE (TOP VIEW) Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation Ioff Supports Partial-Power-Down Mode Operation Sub-1-V Operable Max tpd of 1.5 ns at 1.8 V Low Power Consumption, 10-µA Max ICC ±8-mA Output Drive at 1.8 V Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) GND • DESCRIPTION/ORDERING INFORMATION This hex inverter is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation. The SN74AUC04 performs the Boolean function Y = A. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION PACKAGE (1) TA –40°C to 85°C (1) QFN – RGY ORDERABLE PART NUMBER Tape and reel SN74AUC04RGYR TOP-SIDE MARKING MS04 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (EACH INVERTER) INPUT A OUTPUT Y H L L H LOGIC DIAGRAM, EACH INVERTER (POSITIVE LOGIC) A Y Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2003–2005, Texas Instruments Incorporated SN74AUC04 HEX INVERTER www.ti.com SCES444 – JUNE 2003 – REVISED JUNE 2005 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 3.6 V VI Input voltage range (2) –0.5 3.6 V –0.5 3.6 V –0.5 VCC + 0.5 state (2) UNIT VO Voltage range applied to any output in the high-impedance or power-off VO Output voltage range (2) IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±20 mA ±100 mA Continuous current through VCC or GND θJA Package thermal Tstg Storage temperature range (1) (2) (3) impedance (3) –65 V 47 °C/W 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-5. Recommended Operating Conditions (1) VCC Supply voltage VCC = 0.8 V VIH High-level input voltage VCC = 1.1 V to 1.95 V VCC = 2.3 V to 2.7 V MIN MAX 0.8 2.7 UNIT V VCC 0.65 × VCC V 1.7 VCC = 0.8 V 0 VIL Low-level input voltage VCC = 1.1 V to 1.95 V 0.35 × VCC VI Input voltage 0 3.6 V VO Output voltage 0 VCC V VCC = 2.3 V to 2.7 V IOH High-level output current IOL Low-level output current ∆t/∆v Input transition rise or fall rate TA Operating free-air temperature (1) 2 V 0.7 VCC = 0.8 V –0.7 VCC = 1.1 V –3 VCC = 1.4 V –5 VCC = 1.65 V –8 VCC = 2.3 V –9 VCC = 0.8 V 0.7 VCC = 1.1 V 3 VCC = 1.4 V 5 VCC = 1.65 V 8 VCC = 2.3 V 9 –40 mA mA 20 ns/V 85 °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. SN74AUC04 HEX INVERTER www.ti.com SCES444 – JUNE 2003 – REVISED JUNE 2005 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VOH VOL VCC MIN TYP (1) MAX IOH = –100 µA 0.8 V to 2.7 V IOH = –0.7 mA 0.8 V IOH = –3 mA 1.1 V 0.8 IOH = –5 mA 1.4 V 1 IOH = –8 mA 1.65 V 1.2 IOH = –9 mA 2.3 V 1.8 IOL = 100 µA 0.8 V to 2.7 V IOL = 0.7 mA 0.8 V IOL = 3 mA 1.1 V 0.3 IOL = 5 mA 1.4 V 0.4 IOL = 8 mA 1.65 V 0.45 IOL = 9 mA 2.3 V 0.6 UNIT VCC – 0.1 0.55 V 0.2 0.25 V VI = VCC or GND 0 to 2.7 V ±5 µA Ioff VI or VO = 2.7 V 0 ±10 µA ICC VI = VCC or GND, 0.8 V to 2.7 V 10 µA Ci VI = VCC or GND II (1) A inputs IO = 0 2.5 V 2.5 pF All typical values are at TA = 25°C. Switching Characteristics over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1) PARAMETER VCC = 1.2 V ± 0.1 V VCC = 1.5 V ± 0.1 V VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V FROM (INPUT) TO (OUTPUT) VCC = 0.8 V TYP MIN MAX MIN MAX MIN TYP MAX MIN MAX A Y 4.8 0.7 3.3 0.5 2.9 0.5 0.8 1.5 0.4 1 tpd UNIT ns Switching Characteristics over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 1) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A Y VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V UNIT MIN TYP MAX MIN MAX 0.6 1.4 2.5 0.5 2 ns Operating Characteristics TA = 25°C PARAMETER Cpd Power dissipation capacitance TEST CONDITIONS VCC = 0.8 V VCC = 1.2 V VCC = 1.5 V VCC = 1.8 V VCC = 2.5 V TYP TYP TYP TYP TYP f = 10 MHz 16 17 17 17 19 UNIT pF 3 SN74AUC04 HEX INVERTER www.ti.com SCES444 – JUNE 2003 – REVISED JUNE 2005 PARAMETER MEASUREMENT INFORMATION 2 × VCC S1 RL From Output Under Test Open GND CL (see Note A) TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND RL LOAD CIRCUIT VCC CL RL V∆ 0.8 V 1.2 V ± 0.1 V 1.5 V ± 0.1 V 1.8 V ± 0.15 V 2.5 V ± 0.2 V 1.8 V ± 0.15 V 2.5 V ± 0.2 V 15 pF 15 pF 15 pF 15 pF 15 pF 30 pF 30 pF 2 kΩ 2 kΩ 2 kΩ 2 kΩ 2 kΩ 1 kΩ 500 Ω 0.1 V 0.1 V 0.1 V 0.15 V 0.15 V 0.15 V 0.15 V VCC Timing Input VCC/2 0V tw tsu th VCC VCC/2 Input VCC/2 VCC VCC/2 Data Input VCC/2 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC VCC/2 Input VCC/2 0V tPHL tPLH VOH VCC/2 Output VCC/2 VOL tPHL VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VCC/2 VCC/2 0V tPZL tPLZ VCC VCC/2 tPZH VOH Output Output Waveform 1 S1 at 2 × VCC (see Note B) tPLH VCC/2 VCC Output Control Output Waveform 2 S1 at GND (see Note B) VOL + V∆ VOL tPHZ VCC/2 VOH − V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, slew rate ≥ 1 V/ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 4 PACKAGE OPTION ADDENDUM www.ti.com 30-Mar-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing SN74AUC04RGYR ACTIVE QFN RGY Pins Package Eco Plan (2) Qty 14 1000 Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU MSL Peak Temp (3) Level-2-260C-1YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. 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