SCAS535C − SEPTEMBER 1995 − REVISED OCTOBER 2003 D 4.5-V to 5.5-V VCC Operation D Inputs Accept Voltages to 5.5 V D Max tpd of 10 ns at 5 V D Inputs Are TTL-Voltage Compatible SN54ACT08 . . . FK PACKAGE (TOP VIEW) 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 4B 4A 4Y 3B 3A 3Y 1Y NC 2A NC 2B 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 4A NC 4Y NC 3B 2Y GND NC 3Y 3A 1A 1B 1Y 2A 2B 2Y GND 1B 1A NC VCC 4B SN54ACT08 . . . J OR W PACKAGE SN74ACT08 . . . D, DB, N, NS, OR PW PACKAGE (TOP VIEW) NC − No internal connection description/ordering information The ’ACT08 devices are quadruple 2-input positive-AND gates. These devices perform the Boolean functions Y = A B or Y = A + B in positive logic. ORDERING INFORMATION PDIP − N SN74ACT08N Tube SN74ACT08D Tape and reel SN74ACT08DR SOP − NS Tape and reel SN74ACT08NSR ACT08 SSOP − DB Tape and reel SN74ACT08DBR AD08 Tube SN74ACT08PW Tape and reel SN74ACT08PWR CDIP − J Tube SNJ54ACT08J SNJ54ACT08J CFP − W Tube SNJ54ACT08W SNJ54ACT08W LCCC − FK Tube SNJ54ACT08FK SNJ54ACT08FK TSSOP − PW −55°C −55 C to 125 125°C C TOP-SIDE MARKING Tube SOIC − D −40°C −40 C to 85 85°C C ORDERABLE PART NUMBER PACKAGE† TA SN74ACT08N ACT08 AD08 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (each gate) INPUTS A B OUTPUT Y H H H L X L X L L Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated ! " #$%! " &$'(#! )!%* )$#!" # ! "&%##!" &% !+% !%" %," "!$%!" "!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)% !%"!/ (( &%!%"* &)$#!" #&(! ! 0122 (( &%!%" % !%"!%) $(%"" !+%-"% !%)* (( !+% &)$#!" &)$#! &#%""/ )%" ! %#%""(. #($)% !%"!/ (( &%!%"* POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCAS535C − SEPTEMBER 1995 − REVISED OCTOBER 2003 logic diagram, each gate (positive logic) A Y B absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) SN54ACT08 MAX MIN MAX 4.5 5.5 4.5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 0 VO IOH Output voltage 0 High-level output current IOL ∆t/∆v Low-level output current High-level input voltage SN74ACT08 MIN 2 2 0.8 Input transition rise or fall rate UNIT V V 0.8 V VCC VCC V −24 −24 mA 24 24 mA 8 8 ns/V VCC VCC 0 0 V TA Operating free-air temperature −55 125 −40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCAS535C − SEPTEMBER 1995 − REVISED OCTOBER 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = −50 µA A VOH IOH = −24 mA IOH = −50 mA† IOH = −75 mA† SN54ACT08 4.5 V 4.4 4.49 4.4 5.5 V 5.4 5.49 5.4 5.4 4.5 V 3.86 3.7 3.76 5.5 V 4.86 4.7 4.76 MIN MAX MIN MAX UNIT 4.4 V 3.85 5.5 V IOL = 24 mA SN74ACT08 MIN 5.5 V IOL = 50 µA A VOL TA = 25°C TYP MAX VCC 3.85 4.5 V 0.001 0.1 0.1 0.1 5.5 V 0.001 0.1 0.1 0.1 4.5 V 0.36 0.5 0.44 5.5 V 0.36 0.5 0.44 V IOL = 50 mA† IOL = 75 mA† 5.5 V II VI = VCC or GND 5.5 V "0.1 "1 "1 µA ICC VI = VCC or GND, IO = 0 One input at 3.4 V, Other inputs at GND or VCC 5.5 V 2 80 20 µA 1.6 1.5 mA DICC‡ 1.65 5.5 V 1.65 5.5 V 0.6 Ci VI = VCC or GND 5V 4.5 † Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms. ‡ This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC. pF switching characteristics over recommended operating free-air temperature range, VCC = 5 V " 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A or B Y MIN TA = 25°C TYP MAX SN54ACT08 SN74ACT08 MIN MAX MIN MAX 1 6.5 9 1 10 1 10 1 6.5 9 1 10 1 10 UNIT ns operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance CL = 50 pF, POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 f = 1 MHz TYP UNIT 20 pF 3 SCAS535C − SEPTEMBER 1995 − REVISED OCTOBER 2003 PARAMETER MEASUREMENT INFORMATION TEST S1 tPLH/tPHL Open From Output Under Test CL = 50 pF (see Note A) S1 Open 1.5 V 1.5 V 0V tPHL tPLH 2 × VCC 500 Ω 3V Input (see Note B) In-Phase Output 50% VCC tPLH tPHL 500 Ω Out-of-Phase Output LOAD CIRCUIT VOH 50% VCC VOL 50% VCC VOH 50% VCC VOL VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr v 2.5 ns, tf v 2.5 ns. C. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 9-Apr-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-89547022A ACTIVE LCCC FK 20 1 TBD 5962-8954702CA ACTIVE CDIP J 14 1 TBD POST-PLATE N / A for Pkg Type 5962-8954702DA ACTIVE CFP W 14 1 SN74ACT08D ACTIVE SOIC D 14 50 SN74ACT08DBLE OBSOLETE SSOP DB 14 SN74ACT08DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT08DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT08DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT08DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT08DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT08DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT08DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT08DRG3 PREVIEW SOIC D 14 2500 SN74ACT08DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) SN74ACT08N ACTIVE PDIP N 14 25 SN74ACT08NE4 ACTIVE PDIP N 14 25 SN74ACT08NSR ACTIVE SO NS 14 SN74ACT08NSRE4 ACTIVE SO NS SN74ACT08NSRG4 ACTIVE SO SN74ACT08PW ACTIVE SN74ACT08PWE4 A42 N / A for Pkg Type TBD A42 N / A for Pkg Type Green (RoHS & no Sb/Br) CU NIPDAU TBD TBD Call TI Call TI Level-1-260C-UNLIM Call TI Call TI CU NIPDAU Level-1-260C-UNLIM Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT08PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT08PWLE OBSOLETE TSSOP PW 14 TBD Call TI SN74ACT08PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT08PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT08PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54ACT08FK ACTIVE LCCC FK 20 1 TBD SNJ54ACT08J ACTIVE CDIP J 14 1 TBD Addendum-Page 1 Call TI POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 9-Apr-2010 Orderable Device Status (1) Package Type Package Drawing SNJ54ACT08W ACTIVE CFP W Pins Package Eco Plan (2) Qty 14 1 TBD Lead/Ball Finish A42 MSL Peak Temp (3) N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54ACT08, SN74ACT08 : • Enhanced Product: SN74ACT08-EP NOTE: Qualified Version Definitions: • Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74ACT08DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 SN74ACT08DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74ACT08DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74ACT08NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74ACT08PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ACT08DBR SSOP DB 14 2000 346.0 346.0 33.0 SN74ACT08DR SOIC D 14 2500 346.0 346.0 33.0 SN74ACT08DR SOIC D 14 2500 333.2 345.9 28.6 SN74ACT08NSR SO NS 14 2000 346.0 346.0 33.0 SN74ACT08PWR TSSOP PW 14 2000 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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