TI SN74AUC2G241YZPR

SN74AUC2G241
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES535C – DECEMBER 2003 – REVISED JANUARY 2007
FEATURES
•
•
•
•
•
•
•
•
Available in the Texas Instruments
NanoFree™ Package
Optimized for 1.8-V Operation and Is 3.6-V I/O
Tolerant to Support Mixed-Mode Signal
Operation
Ioff Supports Partial-Power-Down Mode
Operation
Sub-1-V Operable
Max tpd of 1.9 ns at 1.8 V
DCT PACKAGE
(TOP VIEW)
Low Power Consumption, 10 µA at 1.8 V
±8-mA Output Drive at 1.8 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
•
DCU PACKAGE
(TOP VIEW)
1OE
1
8
VCC
1A
2
7
2OE
2Y
3
6
1Y
GND
4
5
2A
1OE
1A
2Y
GND
1
8
2
7
3
6
4
5
YZP PACKAGE
(BOTTOM VIEW)
VCC
2OE
1Y
2A
GND
2Y
1A
1OE
4 5
3 6
2 7
1 8
2A
1Y
2OE
VCC
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This dual buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC
operation.
The SN74AUC2G241 is designed specifically to improve the performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented receivers and transmitters.
The device is organized as two 1-bit line drivers with separate output-enable (1OE, 2OE) inputs. When 1OE is
low or 2OE is high, the device passes data from the A inputs to the Y outputs. When 1OE is high or 2OE is low,
the outputs are in the high-impedance state.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
ORDERING INFORMATION
PACKAGE (1)
TA
–40°C to 85°C
(1)
(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING (2)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000
SN74AUC2G241YZPR
_ _ _U2_
SSOP – DCT
Reel of 3000
SN74AUC2G241DCTR
U41_ _ _
VSSOP – DCU
Reel of 3000
SN74AUC2G241DCUR
U2_
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2007, Texas Instruments Incorporated
SN74AUC2G241
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES535C – DECEMBER 2003 – REVISED JANUARY 2007
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor, and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is
determined by the current-sinking/current-sourcing capability of the driver.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
For more information about AUC Little Logic devices, please refer to the TI application report, Applications of
Texas Instruments AUC Sub-1-V Little Logic Devices, literature number SCEA027.
FUNCTION TABLES
INPUTS
1OE
1A
OUTPUT
1Y
L
H
H
L
L
L
H
X
Z
2OE
2A
OUTPUT
2Y
H
H
H
H
L
L
L
X
Z
INPUTS
LOGIC DIAGRAM (POSITIVE LOGIC)
1
1OE
1A
2
6
1Y
7
2OE
5
3
2A
2
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2Y
SN74AUC2G241
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES535C – DECEMBER 2003 – REVISED JANUARY 2007
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
3.6
V
VI
Input voltage range (2)
–0.5
3.6
V
–0.5
3.6
V
–0.5
VCC + 0.5
state (2)
UNIT
VO
Voltage range applied to any output in the high-impedance or power-off
VO
Output voltage range (2)
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±20
mA
±100
mA
Continuous current through VCC or GND
θJA
Tstg
(1)
(2)
(3)
Package thermal impedance (3)
DCT package
220
DCU package
227
YZP package
102
Storage temperature range
–65
150
V
°C/W
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
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3
SN74AUC2G241
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES535C – DECEMBER 2003 – REVISED JANUARY 2007
Recommended Operating Conditions (1)
VCC
Supply voltage
VCC = 0.8 V
VIH
High-level input voltage
MIN
MAX
0.8
2.7
VCC = 1.1 V to 1.95 V
0.65 × VCC
VI
Input voltage
0
VCC = 1.1 V to 1.95 V
0.35 × VCC
VCC = 2.3 V to 2.7 V
VO
Output voltage
IOH
High-level output current
IOL
Low-level output current
3.6
Active state
0
VCC
3-state
0
3.6
VCC = 0.8 V
–0.7
VCC = 1.1 V
–3
VCC = 1.4 V
–5
VCC = 1.65 V
–8
VCC = 2.3 V
–9
VCC = 0.8 V
0.7
VCC = 1.1 V
3
VCC = 1.4 V
5
VCC = 1.65 V
8
VCC = 0.8 V to 1.65
TA
(1)
(2)
(3)
4
Input transition rise or fall rate
V
mA
mA
20
20
VCC = 2.3 V to 2.7 V (3)
20
–40
85
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
The data was taken at CL = 15 pF, RL = 2 kΩ (see Figure 1).
The data was taken at CL = 30 pF, RL = 500 Ω (see Figure 1).
Submit Documentation Feedback
V
9
V (2)
VCC = 1.65 V to 1.95 V (3)
Operating free-air temperature
V
0.7
0
VCC = 2.3 V
∆t/∆v
V
1.7
VCC = 0.8 V
Low-level input voltage
V
VCC
VCC = 2.3 V to 2.7 V
VIL
UNIT
ns/V
°C
SN74AUC2G241
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES535C – DECEMBER 2003 – REVISED JANUARY 2007
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VOH
VOL
VCC
TYP (1) MAX
MIN
IOH = –100 µA
0.8 V to 2.7 V
IOH = –0.7 mA
0.8 V
IOH = –3 mA
1.1 V
0.8
IOH = –5 mA
1.4 V
1
IOH = –8 mA
1.65 V
1.2
IOH = –9 mA
2.3 V
1.8
IOL = 100 µA
0.8 V to 2.7 V
IOL = 0.7 mA
0.8 V
IOL = 3 mA
1.1 V
0.3
IOL = 5 mA
1.4 V
0.4
IOL = 8 mA
1.65 V
0.45
IOL = 9 mA
2.3 V
0.6
UNIT
VCC – 0.1
0.55
V
0.2
0.25
V
VI = VCC or GND
0 to 2.7 V
±5
µA
Ioff
VI or VO = 2.7 V
0
±10
µA
IOZ
VO = VCC or GND
2.7 V
±10
µA
ICC
VI = VCC or GND,
10
µA
CI
VI = VCC or GND
2.5 V
2.5
pF
Co
VO = VCC or GND
2.5 V
5.5
pF
II
(1)
All inputs
IO = 0
0.8 V to 2.7 V
All typical values are at TA = 25°C.
Switching Characteristics
over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1)
VCC = 1.2 V
± 0.1 V
VCC = 1.5 V
± 0.1 V
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
FROM
(INPUT)
TO
(OUTPUT)
VCC = 0.8 V
TYP
MIN
MAX
MIN
MAX
MIN
TYP
MAX
MIN
MAX
tpd
A
Y
5.1
1
3.5
0.8
2.3
0.7
1.2
1.9
0.6
1.4
ns
ten
OE or OE
Y
5.9
1.2
4.2
1
2.7
0.9
1.3
2
0.8
1.6
ns
tdis
OE or OE
Y
6.2
2.2
4.8
2.5
4.4
1
2.9
4.2
1.6
3.3
ns
PARAMETER
UNIT
Switching Characteristics
over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
ten
OE or OE
tdis
OE or OE
PARAMETER
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
UNIT
MIN
TYP
MAX
MIN
MAX
Y
0.9
1.6
2.5
0.8
1.8
ns
Y
1.1
1.7
2.8
1
2
ns
Y
1.9
2.3
3.6
0.9
2.1
ns
Submit Documentation Feedback
5
SN74AUC2G241
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES535C – DECEMBER 2003 – REVISED JANUARY 2007
Operating Characteristics
TA = 25°C
PARAMETER
Cpd
6
Power dissipation
capacitance
TEST
CONDITIONS
VCC = 0.8 V
VCC = 1.2 V
VCC = 1.5 V
VCC = 1.8 V
VCC = 2.5 V
TYP
TYP
TYP
TYP
TYP
f = 10 MHz
16
16
16
17
18
Submit Documentation Feedback
UNIT
pF
SN74AUC2G241
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES535C – DECEMBER 2003 – REVISED JANUARY 2007
PARAMETER MEASUREMENT INFORMATION
TEST
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
2 × VCC
S1
RL
From Output
Under Test
Open
S1
Open
2 × VCC
GND
GND
CL
(see Note A)
RL
LOAD CIRCUIT
VCC
CL
RL
VD
0.8 V
1.2 V ± 0.1 V
1.5 V ± 0.1 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
15 pF
15 pF
15 pF
15 pF
15 pF
30 pF
30 pF
2 kW
2 kW
2 kW
2 kW
2 kW
1 kW
500 W
0.1 V
0.1 V
0.1 V
0.15 V
0.15 V
0.15 V
0.15 V
VCC
Timing Input
VCC/2
0V
tW
tsu
VCC
Input
VCC/2
VCC/2
th
VCC
Data Input
VCC/2
VCC/2
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VCC
VCC/2
Input
VCC/2
0V
tPLH
VOH
VCC/2
VOL
tPHL
VCC/2
tPLZ
VCC
VCC/2
tPZH
VCC/2
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Waveform 2
S1 at GND
(see Note B)
VCC/2
0V
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPLH
VOH
Output
VCC/2
tPZL
tPHL
VCC/2
Output
VCC
Output
Control
VOL + VD
VOL
tPHZ
VCC/2
VOH – VD
VOH
»0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W,
slew rate ³ 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
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7
PACKAGE OPTION ADDENDUM
www.ti.com
15-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74AUC2G241DCTRE4
ACTIVE
SM8
DCT
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74AUC2G241DCTRG4
ACTIVE
SM8
DCT
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74AUC2G241DCURE4
ACTIVE
US8
DCU
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74AUC2G241DCURG4
ACTIVE
US8
DCU
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC2G241DCTR
ACTIVE
SM8
DCT
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC2G241DCUR
ACTIVE
US8
DCU
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC2G241YZPR
ACTIVE
DSBGA
YZP
8
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74AUC2G241DCUR
US8
DCU
8
3000
180.0
9.2
2.25
3.35
1.05
4.0
8.0
Q3
SN74AUC2G241YZPR
DSBGA
YZP
8
3000
180.0
8.4
1.02
2.02
0.63
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74AUC2G241DCUR
US8
DCU
8
3000
202.0
201.0
28.0
SN74AUC2G241YZPR
DSBGA
YZP
8
3000
220.0
220.0
34.0
Pack Materials-Page 2
MECHANICAL DATA
MPDS049B – MAY 1999 – REVISED OCTOBER 2002
DCT (R-PDSO-G8)
PLASTIC SMALL-OUTLINE PACKAGE
0,30
0,15
0,65
8
0,13 M
5
0,15 NOM
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
2,90
2,70
4,25
3,75
Gage Plane
PIN 1
INDEX AREA
1
0,25
4
0° – 8°
3,15
2,75
0,60
0,20
1,30 MAX
Seating Plane
0,10
0,10
0,00
NOTES: A.
B.
C.
D.
4188781/C 09/02
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion
Falls within JEDEC MO-187 variation DA.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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