ABC MB4532

SPECIFICATION FOR APPROVAL
REF : 20090527-A
PROD.
NAME
PAGE: 1
ABC'S DWG NO.
HIGH CURRENT MULTILAYER
CHIP BEAD
MB□□□□□□□□L□-□□□
ABC'S ITEM NO.
Ⅰ﹒CONFIGURATION & DIMENSIONS：
H
A
D
I
C
D
G
I
( PCB Pattern )
B
Series
MB4532
MB4516
MB3261
MB2029
MB1608
A
Unit : m/m
B
4.5±0.2
4.5±0.2
3.2±0.2
2.0±0.2
1.6±0.2
3.2±0.2
1.6±0.2
1.6±0.2
1.2±0.2
0.8±0.2
C
D
1.5±0.2
1.6±0.2
1.1±0.2
0.9±0.2
0.8±0.2
0.6±0.4
0.6±0.4
0.6±0.4
0.5±0.3
0.3±0.2
G
H
I
3.0
3.0
2.2
1.0
0.7
3.0
1.4
1.4
1.0
0.7
1.5
1.5
1.1
1.0
0.7
Ⅱ﹒SCHEMATIC DIAGRAM：
Ⅲ﹒MATERIALS：
a
b
c
a﹒Body：Ferrite
b﹒Internal conductor：Silver or Ag / Pd
c﹒Terminal：Ag/Ni/Sn
d﹒Remark：Products comply with RoHS'
requirements
Ⅳ﹒GENERAL SPECIFICATION：
a﹒Storage temp.：-40℃ ---- +105℃
b﹒Operating temp.：-55℃ ---- +125℃
c﹒Terminal strength：
Peak Temp：260℃ max.
Max time above 230℃ ：50sec max.
Max time above 200℃ ：70sec max.
F
MB4532
MB4516
MB3261
MB2029
MB1608
F ( kgf )
1.5
1.0
1.0
0.6
0.5
Time ( sec )
Preheat Area
Reflow Area
Forced Cooling Area
+4.0℃ / sec max.
150 ~ 200 ℃ / 60 ~ 120 sec
+2.0 ~ 4.0℃
/ sec max.
-(1.0 ~ 5.0)℃ / sec max.
Peak Temperature:
260℃
30±5
d﹒Solderability：
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
AR-001A
Temperature
Rising Area
250
50sec max.
Temperature ( ℃ )
Type
230℃
200
150
70sec max.
100
50
0
50
100
150
Time ( seconds )
200
250
SPECIFICATION FOR APPROVAL
REF : 20090527-A
PROD.
NAME
PAGE: 2-1
HIGH CURRENT MULTILAYER
CHIP BEAD
ABC'S DWG NO.
MB□□□□□□□□L□-□□□
ABC'S ITEM NO.
Ⅴ﹒ELECTRICAL CHARACTERISTICS：
MB4532700YL□ -□□□
Impedance
(Ω)
at 100MHz
70±25%
MB4532121YL□ -□□□
120±25%
50
3.0
MB4532131YL□ -□□□
125±25%
50
3.0
MB4516600YL□ -□□□
60±25%
10
6.0
MB4516750YL□ -□□□
75±25%
25
3.0
MB4516800YL□ -□□□
80±25%
50
3.0
DWG No.
1). □：Paclaging Information… A：Bulk
2)."":Reference code
□□□
AR-001A
RDC
(mΩ)
max.
30
IDC
(A)
max.
6.0
B：Taping Reel
MB4532700YL□
MB4532121YL□
MB4532131YL□
MB4516600YL□
MB4516750YL□
MB4516800YL□
SPECIFICATION FOR APPROVAL
REF : 20090527-A
PROD.
NAME
PAGE: 2-2
ABC'S DWG NO.
HIGH CURRENT MULTILAYER
CHIP BEAD
MB□□□□□□□□L□-□□□
ABC'S ITEM NO.
Ⅴ﹒ELECTRICAL CHARACTERISTICS：
MB3261190YL□ -□□□
Impedance
(Ω)
at 100MHz
19±25%
RDC
(mΩ)
max.
40
IDC
(A)
max.
3.0
MB3261260YL□ -□□□
26±25%
40
3.0
MB3261310YL□ -□□□
31±25%
40
3.0
MB3261500YL□ -□□□
50±25%
25
3.0
MB3261800YL□ -□□□
80±25%
30
3.0
MB2029070YL□ -□□□
7±25%
30
3.0
MB2029100YL□ -□□□
10±25%
30
3.0
MB2029300YL□ -□□□
30±25%
25
3.0
MB1608300YL□ -□□□
30±25%
60
1.0
DWG No.
1). □：Paclaging Information… A：Bulk B：Taping Reel
2)."-
AR-001A
□□□":Reference code
MB3261190YL□
MB3261260YL□
MB3261310YL□
MB3261500YL□
MB3261800YL□
MB2029070YL□
MB2029100YL□
MB2029300YL□
MB1608300YL□
SPECIFICATION FOR APPROVAL
REF : 20090527-A
PROD.
PAGE: 3
ABC'S DWG NO.
HIGH CURRENT MULTILAYER
CHIP BEAD
NAME
MB□□□□□□□□L□-□□□
ABC'S ITEM NO.
Ⅵ﹒PACKAGING INFORMATION：
( 1 ) Configuration
T
Cover Tape
N
B
A
2.0±0.5
∮C
∮C
D
G
Embossed Carrier
※Carrier tape width : D
P:4 m/m
4 m/m
End
Start
Leader
no component
200 m/m min.
Trailer
no component
400 m/m min.
Components
User direction of feed
Unit:m/m
( 2 ) Dimensions
Style
A
07 - 08
178
07 - 12
178
B
C
D
G
N
T
21±0.8
13
8
10 +0
50 -0
12.5
21±0.8
13
12
14 +0
50 -0
16.5
( 3 ) Q'TY & G.W. Per package
Inner : Reel
Series
MB4532
MB4516
MB3261
MB2029
MB1608
AR-001A
Outer : Cartion
Q'TY (pcs)
G.W. (gw)
Style
Q'TY(kpcs)
G.W. (Kg)
1,000
2,000
3,000
4,000
4,000
170
180
150
120
90
07 - 12
07 - 12
07 - 08
07 - 08
07 - 08
30
80
120
200
200
9.3
9.7
8.5
8.5
7.0
Size (cm)
41 x 39 x 22
41 x 39 x 22
41 x 39 x 22
41 x 39 x 22
41 x 39 x 22
SPECIFICATION FOR APPROVAL
REF : 20090527-A
PROD.
PAGE: 4
HIGH CURRENT MULTILAYER
CHIP BEAD
NAME
ABC'S DWG NO.
MB□□□□□□□□L□-□□□
ABC'S ITEM NO.
( 4 ) TYPE DIMENSIONS
4±0.1
(0.157 ±0.004)
φ1.55±0.05
2±0.05
(0.079 ±0.002) (0.061 ±0.002)
T max.
B ±0.1(0.004)
F±0.05
(0.002)
W±0.2
(0.008)
1.75 ±0.1
(0.069 ±0.004)
Fig 1.
P±0.1
(0.004)
A±0.1
(0.004)
4±0.1
(0.157 ±0.004)
φ1.55±0.05
2±0.05
(0.079 ±0.002) (0.061 ±0.002)
0.23 ±0.1(0.00 4)
B±0.1(0.004)
F±0.05
(0.002)
W±0.2
(0.008)
1.75 ±0.1
(0.069 ±0.004)
Fig 2.
P±0.1
(0.004)
T±0. 1(0.00 4)
A±0.1
(0.004)
Unit:m/m
AR-001A
Type
A
B
F
P
T
W
Fig
MB4532
3.66
4.95
5.50
8.0
1.85
12.0
2
MB4516
1.93
4.95
5.50
4.0
1.93
12.0
2
MB3261
1.88
3.50
3.50
4.0
1.27
8.0
2
MB2029
1.50
2.30
3.50
4.0
1.10
8.0
1
MB1608
1.05
1.85
3.50
4.0
1.10
8.0
1
SPECIFICATION FOR APPROVAL
REF :
20090527-A
PROD.
NAME
PAGE: 5
HIGH CURRENT MULTILAYER
CHIP BEAD
ABC'S DWG NO.
MB□□□□□□□□L□-□□□
ABC'S ITEM NO.
Ⅶ﹒DWGING NUMBER EXPRESSION：
M B
Reference code
Appendix code 2 : Package
Appendix code 1 : Classification
Tolerance code
Electrical code
Dimension code
Type code
Appendix code 1：Product Classification
L：Lead Free Standard products comply with RoHS' requirements
1 ~ 9：Lead Free Special products comply with RoHS' requirements
Appendix code 2：Package Information
Code
A
B
AR-001A
Inner package
T.B.D.
Inner package Q'TY
Remark
T.B.D.
T / R ( Reel package )
1000
pcs
MB4532
T / R ( Reel package )
2000
pcs
MB4516
T / R ( Reel package )
3000
pcs
MB3261
T / R ( Reel package )
4000
pcs
MB2029
T / R ( Reel package )
4000
pcs
MB1608