BEREX BD23B

BeRex
BD23B
Triple Band 2-Way SMT Power Divider
1900~2500MHz PCS, WCDMA & TD-SCDMA, WiBro
Device Features and Description
 25dB Typical Isolation
 0.4dB Typical Insertion Loss
 Small Size and Low Profile
 MSL 1 moisture rating
 Lead-free/Green/RoHS compliant package
Application: commercial, space, military wireless system
 Industry Standard SOIC-8 SMT Plastic Package with exposed back side ground pad
 Chip is fully passivated for enhanced performance and reliability
 Can be used without back side ground soldering
(This may degrade the performance at the high frequency edge. Refer to the following
typical test data)
Electrical specifications
Parameters
Unit
Min
Typ
Max
Frequency Range
MHz
1900
Insertion Loss
dB
Isolation
dB
IRL(S11)
dB
-23
-15
ORL(S22,S33)
dB
-25
-15
Amplitude Balance
dB
0.05
0.2
Phase Balance
deg
1.0
2.0
2500
0.4
15
0.8
25
All specifications apply with the following test conditions,
1. Device performance is measured on BeRex evaluation board at 25C, 50 ohm system
2. Insertion Loss: Above 3.0dB
3. Back side ground was soldered
Absolute Maximum Ratings
Parameters
Input Power
Storage Temperature
Operating Temperature
Rating
1W CW
-55 to +155C
-40C to +85C
Operation of this device above any of these parameters may result in permanent damage.
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BeRex
BD23B
Evaluation Board Drawing
Function Block Diagram
Pins 1,3,4,6 and 7 must be DC and RF grounded.
Typical Test Data
With Back Side Ground Soldering
Parameters
Unit
WCDMA & TD-SCDMA
WiBro
Frequency Range
MHz
1900
2075
2250
2200
2350
2500
Insertion Loss
dB
0.38
0.39
0.44
0.42
0.46
0.54
Isolation
dB
18.7
21.6
25.8
24.2
28.5
23.8
IRL(S11)
dB
-21.4
-26.7
-25.2
-27.0
-21.6
-17.4
ORL(S22,S33)
dB
-20.9
-24.5
-23.0
-23.7
-21.6
-20.8
Phase Diff.
deg
0.0
0.2
0.3
0.3
0.5
0.7
Amplitude Balance
dB
0.03
0.04
0.06
0.05
0.06
0.09
Without Back Side Ground Soldering
Parameters
Unit
WCDMA & TD-SCDMA
WiBro
Frequency Range
MHz
1900
2075
2250
2200
2350
2500
Insertion Loss
dB
0.36
0.38
0.45
0.42
0.49
0.6
Isolation
dB
19.2
22.2
25.7
24.7
25.8
20.5
IRL(S11)
dB
-24.2
-26.0
-20.4
-22.1
-17.6
-14.2
ORL(S22,S33)
dB
-22.3
-25.0
-21.9
-22.8
-20.4
-19.3
Phase Diff.
deg
1.7
1.6
1.7
1.7
1.7
1.8
Amplitude Balance
dB
0.07
0.06
0.07
0.07
0.06
0.06
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BD23B
Insertion Loss vs. Frequency
Isolation vs. Frequency
BG
BG
NBG
0
0
-1
-5
-2
-10
Isolation [dB]
Insertion Loss [dB]
BeRex
-3
-4
-5
-15
-20
-25
-6
1900
2100
2300
-30
1900
2500
Freq [MHz]
BG
NBG
BG
-5.00
-5.00
-10.00
-10.00
ORL [dB]
0.00
-15.00
2500
-20.00
-25.00
-25.00
2300
2500
NBG
-15.00
-20.00
2100
2300
ORL vs. Frequency
0.00
-30.00
1900
2100
Freq [MHz]
IRL vs. Frequency
IRL [dB]
NBG
-30.00
1900
Freq [MHz]
2100
2300
2500
Freq [MHz]
Notes)
- BG: Data taken with backside ground soldering
- NBG: Data taken without backside ground soldering
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BeRex
BD23B
Package Drawing
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BeRex
BD23B
Suggested PCB Land Pattern and PAD Layout
PCB Land Pattern
PCB Mounting
RF In
0.047"(1.20)
0.018"(0.45)
0.076"(1.92)
0.157"(3.98)
0.040"(1.01)
RF Out1
RF Out2
0.030"(0.76)
0.198"(5.02)
Visit http://www.berex.com for PCB layout
Tape & Reel
Packaging information:
SOIC8
SOIC8-Part orientation
Tape Width (mm): 12
Reel Size (inches): 7
Device Cavity Pitch (mm): 8
Devices Per Reel: 1000
Direction of feed
Lead plating finish
100% Tin Matte finish.
(All BeRex products undergoes a 1 hour, 150 degree C, Anneal bake to eliminate thin
whisker growth concerns)
MSL / ESD Rating
MSL Rating:
Standard:
Level 3 at +265C convection reflow
JEDEC Standard J-STD-020
NATO CAGE code:
2
N
9
6
F
NOTICE
BeRex Corporation reserves the right to make changes of product specification or to
discontinue product at any time without notice.
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