XBB170 DUAL POLE OptoMOS® Relay Load Voltage Load Current Max RON XBB170 350 100 50 Description XBB170 is a 350V, 100mA, 50Ω 2-Form-B relay. It provides an economical solution for applications requiring two independent Form-B relays where cost is critical. Units V mA Ω Features • Small 8 Pin DIP Package • Low Drive Power Requirements (TTL/CMOS Compatible) • No Moving Parts • High Reliability • Arc-Free With No Snubbing Circuits • 3750VRMS Input/Output Isolation • FCC Compatible • VDE Compatible • No EMI/RFI Generation • Machine Insertable, Wave Solderable • Surface Mount and Tape & Reel Versions Available Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hookswitch • Dial Pulsing • Ground Start • Ringer Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment—Patient/Equipment Isolation • Security • Aerospace • Industrial Controls Approvals • UL Recognized: File Number E76270 • CSA Certified: File Number LR 43639-10 • BSI Certified to: • BS EN 60950:1992 (BS7002:1992) Certificate #: 7344 • BS EN 41003:1993 Certificate #: 7344 Ordering Information Part # XBB170 XBB170P XBB170PTR XBB170S XBB170STR Description 8 Pin DIP (50/Tube) 8 Pin Flatpack (50/Tube) 8 Pin Flatpack (1000/Reel) 8 Pin Surface Mount (50/Tube) 8 Pin Surface Mount (1000/Reel) Pin Configuration XBB170 Pinout AC/DC Configuration + Control - Switch #1 Ð Control - Switch #1 + Control - Switch #2 Ð Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Closed (Form B) Devices 10ms CONTROL +90% + 90% +10% TOFF DS-XBB170-R2 www.clare.com TON 1 XBB170 Absolute Maximum Ratings (@ 25˚ C) Parameter Input Power Dissipation Input Control Current Peak (10ms) Reverse Input Voltage Total Power Dissipation Isolation Voltage Input to Output Operational Temperature Storage Temperature Soldering Temperature DIP Package Surface Mount Package (10 Seconds Max.) 1 Derate Linearly 1.33 mw/˚C 2 Derate Linearly 6.67 mw/˚C Min - Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this data sheet is not implied. Exposure of the device to the absolute maximum ratings for an extended period may degrade the device and effect its reliability. Typ Max Units - 1501 mW 50 mA 1 A 5 V - 8002 mW 3750 -40 -40 - VRMS +85 °C +125 °C - - +260 +220 °C °C Electrical Characteristics Parameter Output Characteristics @ 25°C Load Voltage (Peak) Load Current* (Continuous) AC/DC Configuration Peak Load Current On-Resistance AC/DC Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics @ 25°C Input Control Current Input Dropout Current Input Voltage Drop Reverse Input Voltage Reverse Input Current Common Characteristics @ 25°C Input to Output Capacitance Input to Output Isolation Conditions Symbol Min Typ Max Units - VL - - 350 V 10ms IL ILPK - - 100 350 mA mA IL=120mA VL=350V RON - - 33 - 50 1 Ω µA IF = 5mA,VL=10V IF = 5mA,VL=10V 50V; f = 1MHz TON TOFF COUT - 25 5 5 - ms ms pF IL= 120mA IF= 5mA VR= 5V IF IF VF VR IR 5 0.4 0.9 - 0.7 1.2 - 50 1.4 5 10 mA mA V V µA - VC/O VI/O 3750 3 - - pF VRMS *Note: If both poles operate simulataneously load current must be derated so as not to exceed the package power dissipation value. 2 www.clare.com Rev. 2 XBB170 PERFORMANCE DATA* Device Count (N) Device Count (N) 30 25 20 15 10 5 25 25 20 20 Device Count (N) 35 15 10 5 0 0 1.17 1.19 1.21 1.23 1.25 5 0 424.0 429.3 434.5 439.7 444.9 450.1 455.4 Blocking Voltage (V) XBB170 Typical Turn-On Time (N=50 Ambient Temperature = 25°C) (Load Current = 100mADC) XBB170 Typical IF for Switch Dropout (N=50 Ambient Temperature = 25°C) (Load Current = 100mADC) 25 25 20 20 20 15 10 5 Device Count (N) 25 Device Count (N) Device Count (N) 10 On-Resistance (Ω) XBB170 Typical IF for Switch Operation (N=50 Ambient Temperature = 25°C) (Load Current = 100mADC) 15 10 5 0.44 0.50 0.56 0.62 0.69 0.75 0.44 0.81 0.50 Load Current (mA) 20 15 10 5 0 0.11 0.14 0.17 0.19 0.22 0.25 0.28 440 435 430 425 420 20 40 0.75 0.67 0.81 0.75 60 Temperature (°C) 80 100 0.83 0.91 0.99 1.06 1.14 XBB170 Typical Load Current vs. Temperature XBB170 Typical Leakage vs. Temperature (Measured across Pins 4 & 6) 160 140 120 100 80 60 40 20 0 -40 -20 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0 20 40 60 0 80 100 120 -40 -20 0 20 40 60 80 100 Temperature (°C) XBB170 Typical Turn-Off vs. Temperature (Load Current = 100mADC) 1.80 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 5mA 1.60 1.40 Turn-Off (ms) Turn-On (ms) 445 0 0.69 XBB170 Typical Turn-On vs. Temperature (Load Current = 100mADC) 450 -20 0.62 Temperature (°C) XBB170 Typical Blocking Voltage vs. Temperature IF=5mADC -40 5 Turn-On (ms) Turn-Off (ms) 455 0.56 Leakage (µA) 25 10 LED Current (mA) LED Current (mA) XBB170 Typical Turn-Off Time (N=50 Ambient Temperature = 25°C) (Load Current = 100mADC) 15 0 0 0 Device Count (N) 15 30.59 31.36 32.13 32.90 33.66 34.43 35.20 LED Forward Voltage Drop (V) Blocking Voltage (VRMS) XBB170 Typical Blocking Voltage Distribution (N=50 Ambient Temperature = 25°C) IF=5mADC XBB170 Typical On-Resistance Distribution (N=50 Ambient Temperature = 25°C) (Load Current = 100mADC) XBB170 Typical LED Forward Voltage Drop (N=50 Ambient Temperature = 25°C) IF = 5mADC 1.20 1.00 10mA 0.80 20mA 0.60 0.40 0.20 0 -40 -20 0 20 40 60 80 100 Temperature (°C) 120 -40 -20 0 20 40 60 80 100 120 Temperature (°C) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. Rev. 2 www.clare.com 3 XBB170 PERFORMANCE DATA* XBB170 Typical LED Forward Voltage Drop vs. Temperature Turn-On (ms) 1.6 50mA 30mA 20mA 10mA 5mA 1.2 1.0 0.8 -40 -20 0 20 40 60 80 100 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 120 Turn-Off (ms) LED Forward Voltage Drop (V) 1.8 1.4 0 5 Temperature (°C) 40 60 6.0 5.0 5.0 3.0 2.0 80 100 120 -2 -1 0 1 Load Voltage (V) 3 4 20 25 30 35 40 45 50 4.0 3.0 2.0 0 -40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120 Temperature (°C) Temperature (°C) 2 15 1.0 0 XBB170 Energy Rating Curve Load Current (A) Load Current (mA) 6.0 4.0 XBB170 Typical Load Current vs. Load Voltage (Ambient Temperature = 25°C) -3 10 XBB170 Typical IF for Switch Dropout vs. Temperature (Load Current = 100mADC) LED Current (mA) On-Resistance (Ω) LED Current (mA) 20 5 LED Forward Current (mA) 1.0 0 0 50 XBB170 Typical IF for Switch Operation vs. Temperature (Load Current = 100mADC) Temperature (°C) 120 100 80 60 40 20 0 -20 -40 -60 -80 -100 -120 -4 10 15 20 25 30 35 40 45 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 LED Forward Current (mA) XBB170 Typical On-Resistance vs. Temperature (Load Current = 100mADC) 70 60 50 40 30 20 10 0 -40 -20 XBB170 Typical Turn-Off vs. LED Forward Current (Load Current = 100mADC) XBB170 Typical Turn-On vs. LED Forward Current (Load Current = 100mADC) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10µs 100µs 1ms 10ms 100ms 1s 10s 100s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.clare.com Rev. 2 XBB170 Mechanical Dimensions 9.652 ± .381 (.380 ± .015) 8 Pin DIP Through Hole (Standard) 2.540 ± .127 8-.800 DIA. (.100 ± .005) (8-.031 DIA.) 2.540 ± .127 (.100 ± .005) 7.620 ± .254 (.300 ± .010) 7.239 TYP. (.285) PC Board Pattern (Top View) 3.302 (.130) 9.144 ± .508 (.360 ± .020) 6.350 ± .127 (.250 ± .005) 9.144 TYP. (.360) .457 ± .076 (.018 ± .003) 7.620 ± .127 (.300 ± .005) 8.077 ± .127 (.318 ± .005 ) 9.652 ± .381 (.380 ± .015) 8 Pin DIP Surface Mount (“S” Suffix) 4.445 ± .127 (.175 ± .005) 3.302 (.130) .254 TYP. (.010) (.100 ± .005) 9.525 ± .254 (.375 ± .010) 6.350 ± .127 (.250 ± .005) .635 TYP. (.025) PC Board Pattern (Top View) 2.540 ± .127 2.540 ± .127 (.100 ± .005) 7.620 ± .254 (.300 ± .010) 8.305 ± .127 (.327 ± .005) 1.905 ± .127 (.075 ± .005) .457 ± .076 (.018 ± .003) 1.498 ± .127 (.059 ± .005) 8.077 ± .127 (.318 ± .005) 9.652 ± .381 (.380 ± .015) 2.540 ± .127 (.100 ± .005) 8 Pin Flatpack (“P” Suffix) 2.159 TYP. (.085) PC Board Pattern (Top View) 2.540 ± .127 (.100 ± .005) 7.620 ± .254 (.300 ± .010) 2.286 MAX. .635 ± .127 (.090) (.025) 7.620 ± .127 (.300 ± .005) 6.350 ± .127 (.250 ± .005) 6.350 ± .127 (.250 ± .005) 9.398 ± .127 (.370 ± .005) 8.763 ± .127 (.345 ± .005) .203 (.008) 1.193 (.047) .457 ± .076 (.018 ± .003) 8.077 ± .127 (.318 ± .005) .787 (.031) Dimensions mm (inches) Rev. 2 www.clare.com 5 XBB170 Mechanical Dimensions Tape and Reel Packaging for 8 Pin Surface Mount Package 330.2 DIA. (13.00) 6.731 MAX. 1.753 ± .102 (.265) (.069 ± .004) .406 MAX. (.016) Top Cover Tape Thickness .102 MAX. (.004) 2.007 ± .102 1.498 ± .102 3.987 ± .102 (.079 ± .004) (.059 ± .004) (.157 ± .004) 7.493 ± .102 (.295 ± .004) 1 8 12.090 (.476) 10.300 (.405) 4.877 (.192) Top Cover Tape Embossed Carrier 16.002 ± .305 (.630 ± .012) .050R TYP. 11.989 ± .102 (.472 ± .004) 10.300 ± .102 (.405 ± .004) 1.549 ± .102 (.061 ± .004) User Direction of Feed Embossment Tape and Reel Packaging for 8 Pin Flatpack Package 330.2 DIA. (13.00) Top Cover Tape Thickness .102 MAX. (.004) 6.731 MAX. 1.753 ± 0.102 (.265) (.069 ± .004) .406 MAX. (.016) 2.007 ± .102 1.498 ± .102 3.987 ± .102 (.079 ± .004) (.059 ± .004) (.157 ± .004) 7.493 ± .102 (.295 ± .004) 1 8 12.090 (.476) 10.287 (.405) 4.877 (.192) Top Cover Tape Embossed Carrier 16.002 ± .305 (.630 ± .012) .050R TYP. 11.988 ± .102 (.472 ± .004) Embossment 10.287 ± .102 (.405 ± .004) 1.549 ± .102 (.061 ± .004) User Direction of Feed Dimensions mm (inches) 6 www.clare.com Rev. 2 Worldwide Sales Offices CLARE LOCATIONS EUROPE ASIA/PACIFIC Clare Headquarters 78 Cherry Hill Drive Beverly, MA 01915 Tel: 1-978-524-6700 Fax: 1-978-524-4900 Toll Free: 1-800-27-CLARE European Headquarters CP Clare nv Bampslaan 17 B-3500 Hasselt (Belgium) Tel: 32-11-300868 Fax: 32-11-300890 Clare Micronix Division 145 Columbia Aliso Viejo, CA 92656-1490 Tel: 1-949-831-4622 Fax: 1-949-831-4628 France Clare France Sales Lead Rep 99 route de Versailles 91160 Champlan France Tel: 33 1 69 79 93 50 Fax: 33 1 69 79 93 59 Asian Headquarters Clare Room N1016, Chia-Hsin, Bldg II, 10F, No. 96, Sec. 2 Chung Shan North Road Taipei, Taiwan R.O.C. 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Colombo 10/A I-20066 Melzo (Milano) Tel: 39-02-95737160 Fax: 39-02-95738829 Sweden Clare Sales Comptronic AB Box 167 S-16329 Spånga Tel: 46-862-10370 Fax: 46-862-10371 United Kingdom Clare UK Sales Marco Polo House Cook Way Bindon Road Taunton UK-Somerset TA2 6BG Tel: 44-1-823 352541 Fax: 44-1-823 352797 http://www.clare.com Clare cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in this Clare product. No circuit patent licenses nor indemnity are expressed or implied. Clare reserves the right to change the specification and circuitry, without notice at any time. The products described in this document are not intended for use in medical implantation or other direct life support applications where malfunction may result in direct physical harm, injury or death to a person. Specification: DS-XBB170-R2 ©Copyright 2000, Clare, Inc. All rights reserved. Printed in USA. 1/30/01