XS170 Multifunction Telecom Switch Load Voltage Load Current Max RON XS170 350 100 50 Description XS170 is a 350V, 100mA, 50Ω 1-Form-A relay with an optocoupler in a single package. It provides an economical solution for cost sensitive applications. Units V mA Ω Features • Small 8 Pin DIP Package • Low Drive Power Requirements (TTL/CMOS Compatible) • No Moving Parts • High Reliability • Arc-Free With No Snubbing Circuits • 3750VRMS Input/Output Isolation • FCC Compatible • VDE Compatible • No EMI/RFI Generation • Machine Insertable, Wave Solderable • Surface Mount and Tape & Reel Versions Available Approvals • UL Recognized: File Number E76270 • CSA Certified: File Number LR 43639-10 • BSI Certified to: • BS EN 60950:1992 (BS7002:1992) Certificate #: 7344 • BS EN 41003:1993 Certificate #: 7344 Ordering Information Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hookswitch • Dial Pulsing • Ground Start • Ringer Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Aerospace • Industrial Controls DS-XS170-R1 Part # XS170 XS170S XS170STR Description 8 Pin DIP (50/Tube) 8 Pin Surface Mount (50/Tube) 8 Pin Surface Mount (1000/Reel) Pin Configuration XS170 Pinout + LED - Relay – LED - Relay Collector - Phototransistor Emitter - Phototransistor www.clare.com 1 8 2 7 3 6 4 5 Load - Relay (MOSFET Output) Load - Relay (MOSFET Output) LED - Phototransistor –/+ LED - Phototransistor +/– 1 XS170 Absolute Maximum Ratings (@ 25˚ C) Parameter Input Power Dissipation Input Control Current Peak (10ms) Reverse Input Voltage Total Power Dissipation Isolation Voltage Input to Output Operational Temperature Storage Temperature Soldering Temperature DIP Package Flatpack/Surface Mount Package (10 Seconds Max.) 1 Derate Linearly 1.33 mw/˚C 2 Derate Linearly 6.67 mw/˚C Min - Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this data sheet is not implied. Exposure of the device to the absolute maximum ratings for an extended period may degrade the device and effect its reliability. Typ Max Units - 1501 mW 50 mA 1 A 5 V - 8002 mW 3750 -40 -40 - VRMS +85 °C +125 °C - - +260 °C - - +220 °C Electrical Characteristics Parameter Relay Portion (Pins 7, 8) Output Characteristics @ 25°C Load Voltage (Peak) Load Current (Continuous) Peak Load Current On-Resistance Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Load Current Limit Relay Portion (Pins 1, 2) Input Characteristics @ 25°C Input Control Current Input Dropout Current Input Voltage Drop Reverse Input Voltage Reverse Input Current 2 Conditions Symbol Min Typ Max Units 10ms IL=120mA VL=350V VL IL ILPK RON ILEAK - 33 - 350 100 350 50 1 V mA mA Ω µA IF=5mA, VL=10V IF=5mA, VL=10V 50V; f=1MHz TON TOFF COUT ICL - 25 - 5 5 - ms ms pF mA IL=120mA IF=5mA VR=5V IF IF VF VR IR 2 0.4 0.9 - 0.7 1.2 - 50 1.4 5 10 mA mA V V µA www.clare.com Rev. 1 XS170 Electrical Characteristics (Continued) Parameter Detector Portion (Pins 3, 4) Output Characteristics @ 25°C Phototransistor Blocking Voltage Phototransistor Output Current Saturation Voltage Current Transfer Ratio Detector Portion (Pins 5, 6) Input Characteristics @ 25°C Input Control Current Input Voltage Drop Input Current (Detector must be off) Input to Output Capacitance (Relay Only) Capacitance Input to Output Input to Output Isolation Rev. 1 Conditions Symbol Min Typ Max Units IC=10µA VCE=5V, IF=0mA IC=2mA, IF=16mA IF=6mA, VCE=0.5V BVCEO ICEO VSAT CTR 20 33 50 50 0.3 100 500 0.5 - V nA V % IC=2mA, VCE=0.5V IF=5mA IC=1µA, VCE=5V IF VF IF 6 0.9 5 2 1.2 25 100 1.4 - mA V µA - CI/O VI/O 3750 3 3 - - pF pF VRMS www.clare.com 3 XS170 PERFORMANCE DATA* Device Count (N) Device Count (N) 30 25 20 15 10 XS170 Typical Blocking Voltage Distribution (N=50 Ambient Temperature = 25°C) 25 25 20 20 Device Count (N) 35 XS170 Typical On-Resistance Distribution (N=50 Ambient Temperature = 25°C) (Load Current = 100mADC) XS170 Typical LED Forward Voltage Drop (N=50 Ambient Temperature = 25°C) IF = 5mADC 15 10 5 15 10 5 5 0 0 0 1.17 1.19 1.21 1.23 25 25 20 20 20 15 10 5 Device Count (N) 25 Device Count (N) 15 10 5 0.50 0.56 0.62 0.69 0.75 0.81 0.44 0.50 LED Current (mA) 0.56 0.62 0.69 0.75 0.67 Load Current (mA) 20 15 10 5 160 0.016 140 0.014 120 0.012 100 80 10mA 5mA 2mA 60 40 0.22 0.25 0.28 -20 0 20 40 60 80 100 -40 120 5mA 1.40 Turn-On (ms) 435 430 1.20 1.00 10mA 0.80 20mA 0.60 0.40 425 0.20 420 0 0 20 40 -20 0 60 Temperature (°C) 80 100 -40 -20 0 20 40 60 20 40 60 80 100 XS170 Typical Turn-Off vs. Temperature (Load Current = 120mADC) 1.80 440 -20 0.006 Temperature (°C) 1.60 -40 0.008 XS170 Typical Turn-On vs. Temperature (Load Current = 100mADC) 445 1.14 0.010 Temperature (°C) 450 1.06 0 -40 455 0.99 0.002 Turn-Off (ms) XS170 Typical Blocking Voltage vs. Temperature 0.91 0.004 0 0 0.19 0.83 XS170 Typical Leakage vs. Temperature (Measured across Pins 4 & 6) 20 0.17 0.75 Turn-On (ms) XS170 Typical Load Current vs. Temperature 25 0.14 5 LED Current (mA) XS170 Typical Turn-Off Time (N=50 Ambient Temperature = 25°C) (Load Current = 100mADC) 0.11 10 0.81 Leakage (µA) 0.44 15 0 0 80 Temperature (°C) 100 120 Turn-Off (ms) Device Count (N) XS170 Typical Turn-On Time (N=50 Ambient Temperature = 25°C) (Load Current = 100mADC) XS170 Typical IF for Switch Dropout (N=50 Ambient Temperature = 25°C) (Load Current = 100mADC) 0 Device Count (N) Blocking Voltage (V) On-Resistance (Ω) XS170 Typical IF for Switch Operation (N=50 Ambient Temperature = 25°C) (Load Current = 100mADC) Blocking Voltage (VRMS) 424.0 429.3 434.5 439.7 444.9 450.1 455.4 29.09 29.86 30.63 31.40 32.16 32.93 33.70 1.25 LED Forward Voltage Drop (V) 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 -40 -20 0 20 40 60 80 100 120 Temperature (°C) The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.clare.com Rev. 1 XS170 PERFORMANCE DATA* XS170 Typical Turn-On vs. LED Forward Current (Load Current = 100mADC) 1.4 Turn-On (ms) 1.6 50mA 30mA 20mA 10mA 5mA 1.2 1.0 0.8 -40 -20 0 20 40 60 80 100 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 120 5 10 25 30 35 40 45 50 0 5.0 50 40 30 20 4.0 3.0 2.0 10 1.0 0 0 20 40 60 80 LED Current (mA) 6.0 5.0 LED Current (mA) 6.0 0 -3 -2 -1 0 1 2 3 4 30 35 40 45 50 3.0 2.0 -20 0 20 40 60 80 100 120 -40 -20 0 20 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10µs 100µs 1ms 10ms 100ms 40 60 80 100 120 Temperature (°C) XS170 Typical Normalized CTR vs. Forward Current (VCE = 0.5V) XS170 Energy Rating Curve Load Current (A) -4 25 4.0 Temperature (°C) XS170 Typical Load Current vs. Load Voltage (Ambient Temperature = 25°C) IF = 5mADC 20 0 -40 100 120 15 1.0 Temperature (°C) 120 100 80 60 40 20 0 -20 -40 -60 -80 -100 -120 10 XS170 Typical IF for Switch Dropout vs. Temperature (Load Current = 100mADC) 60 -20 5 LED Forward Current (mA) 70 -40 Load Current (mA) 20 XS170 Typical IF for Switch Operation vs. Temperature (Load Current = 100mADC) XS170 Typical On-Resistance vs. Temperature (Load Current = 100mADC; IF = 5mADC) On-Resistance (Ω) 15 LED Forward Current (mA) Temperature (°C) 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 10s 100s 1s Load Voltage (V) Time XS170 Typical Normalized CTR vs. Temperature (VCE = 0.5V) XS170 Typical Collector Current vs. Forward Current (VCE = 0.5V) 0 2 4 6 8 10 12 14 16 18 20 IF (mA) 12 8 7 10 6 8 5 IC (mA) Normalized CTR (%) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 Normalized CTR (%) LED Forward Voltage Drop (V) 1.8 XS170 Typical Turn-Off vs. LED Forward Current (Load Current = 120mADC) Turn-Off (ms) XS170 Typical LED Forward Voltage Drop vs. Temperature 4 3 2 1 0 -40 -20 0 20 40 60 Temperature (°C) 1mA 2mA 5mA 10mA 15mA 20mA 80 100 120 6 4 2 0 0 2 4 6 8 10 12 14 16 18 20 IF (mA) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. Rev. 1 www.clare.com 5 XS170 Mechanical Dimensions 9.652 ± .381 (.380 ± .015) 8 Pin DIP Through Hole (Standard) 2.540 ± .127 8-.800 DIA. (.100 ± .005) (8-.031 DIA.) 2.540 ± .127 (.100 ± .005) 7.620 ± .254 (.300 ± .010) 7.239 TYP. (.285) PC Board Pattern (Top View) 3.302 (.130) 9.144 ± .508 (.360 ± .020) 6.350 ± .127 (.250 ± .005) 9.144 TYP. (.360) .457 ± .076 (.018 ± .003) 7.620 ± .127 (.300 ± .005) 8.077 ± .127 (.318 ± .005 ) 9.652 ± .381 (.380 ± .015) 8 Pin DIP Surface Mount (“S” Suffix) 4.445 ± .127 (.175 ± .005) 3.302 (.130) .635 TYP. (.025) PC Board Pattern (Top View) 2.540 ± .127 2.540 ± .127 (.100 ± .005) 7.620 ± .254 (.300 ± .010) 7.620 ± .127 (.300 ± .005) 6.350 ± .127 (.250 ± .005) (.100 ± .005) 9.525 ± .254 (.375 ± .010) 6.350 ± .127 (.250 ± .005) 8.305 ± .127 (.327 ± .005) 1.905 ± .127 (.075 ± .005) .254 TYP. (.010) .457 ± .076 (.018 ± .003) 1.498 ± .127 (.059 ± .005) 8.077 ± .127 (.318 ± .005) Tape and Reel Packaging for 8 Pin Surface Mount Package 330.2 DIA. (13.00) Top Cover Tape Thickness .102 MAX. (.004) 6.731 MAX. 1.753 ± .102 (.265) (.069 ± .004) .406 MAX. (.016) 2.007 ± .102 1.498 ± .102 3.987 ± .102 (.079 ± .004) (.059 ± .004) (.157 ± .004) 7.493 ± .102 (.295 ± .004) 1 8 12.090 (.476) 10.300 (.405) 4.877 (.192) Top Cover Tape Embossed Carrier 16.002 ± .305 (.630 ± .012) .050R TYP. 11.989 ± .102 (.472 ± .004) 10.300 ± .102 (.405 ± .004) 1.549 ± .102 (.061 ± .004) User Direction of Feed Embossment Dimensions mm (inches) 6 www.clare.com Rev. 1 Worldwide Sales Offices CLARE LOCATIONS EUROPE ASIA/PACIFIC Clare Headquarters 78 Cherry Hill Drive Beverly, MA 01915 Tel: 1-978-524-6700 Fax: 1-978-524-4900 Toll Free: 1-800-27-CLARE European Headquarters CP Clare nv Bampslaan 17 B-3500 Hasselt (Belgium) Tel: 32-11-300868 Fax: 32-11-300890 Clare Micronix Division 145 Columbia Aliso Viejo, CA 92656-1490 Tel: 1-949-831-4622 Fax: 1-949-831-4628 France Clare France Sales Lead Rep 99 route de Versailles 91160 Champlan France Tel: 33 1 69 79 93 50 Fax: 33 1 69 79 93 59 Asian Headquarters Clare Room N1016, Chia-Hsin, Bldg II, 10F, No. 96, Sec. 2 Chung Shan North Road Taipei, Taiwan R.O.C. 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Colombo 10/A I-20066 Melzo (Milano) Tel: 39-02-95737160 Fax: 39-02-95738829 Sweden Clare Sales Comptronic AB Box 167 S-16329 Spånga Tel: 46-862-10370 Fax: 46-862-10371 United Kingdom Clare UK Sales Marco Polo House Cook Way Bindon Road Taunton UK-Somerset TA2 6BG Tel: 44-1-823 352541 Fax: 44-1-823 352797 http://www.clare.com Clare cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in this Clare product. No circuit patent licenses nor indemnity are expressed or implied. Clare reserves the right to change the specification and circuitry, without notice at any time. The products described in this document are not intended for use in medical implantation or other direct life support applications where malfunction may result in direct physical harm, injury or death to a person. Specification: DS-XS170-R1 ©Copyright 2000, Clare, Inc. All rights reserved. Printed in USA. 2/20/01