COMCHIP CDBB5200-HF

SMD Schottky Barrier Rectifiers
CDBB5150-HF Thru. CDBB5200-HF
Reverse Voltage: 150 to 200 Volts
Forward Current: 5.0 Amp
RoHS Device
Halogen Free
Features
DO-214AA (SMB)
-Low Profile surface mount applications
in order to optimize board space.
-Low power loss, high efficiency.
-High current capability, low forward voltage drop.
0.087 (2.20)
0.075 (1.90)
0.157 (4.00)
0.130 (3.30)
-High surge capability.
0.189 (4.80)
0.157 (4.00)
-Guardring for overvoltage protection.
-Ultra high-speed switching.
0.012 (0.31)
MAX.
-Silicon epitaxial planar chip,metal silicon junction.
0.098 (2.50)
0.083 (2.10)
Mechanical data
-Epoxy: UL94-V0 rate flame retardant.
0.008(0.21)
MAX.
0.063 (1.60)
0.028 (0.70)
-Case: Molded plastic, DO-214AA / SMB
-Terminals: solderable per MIL-STD-750,
method 2026.
-Polarity: Indicated by cathode band.
0.220 (5.60)
0.197 (5.00)
Dimensions in inches and (millimeter)
-Weight: 0.091 grams
Maximum Ratings and Electrical Characteristics
Ratings at Ta=25°C unless otherwise noted.
Single phase, half wave, 60Hz, resistive or inductive loaded.
For capacitive load, derate current by 20% .
Symbol
CDBB
5150-HF
CDBB
5200-HF
Units
Max. repetitive peak reverse voltage
VRRM
150
200
V
Max. DC blocking voltage
VDC
150
200
V
Max. RMS voltage
VRMS
105
140
V
Max. instantaneous forward voltage @ 5.0A, TA=25°C
VF
0.87
0.90
V
Operating Temperature
TJ
Parameter
-50 to +175
Symbol
°C
MAX.
Units
IO
5.0
A
IFSM
125
A
VR =VRRM TA=25°C
IR
0.5
mA
VR =VRRM TA=100°C
IR
20
mA
Junction to ambient
RθJA
24
°C/W
CJ
380
pF
Parameter
Conditions
Forward rectified current
see Fig.1
Forward surge current
8.3ms single half sine-wave superimposed
on rate load (JEDEC method)
MIN.
TYP.
Reverse Current
Thermal Resistance
Diode Junction capacitance f=1MHZ and applied 4V DC reverse Voltage
Storage temperature
TSTG
-50
+175
°C
REV:A
Page 1
QW-JB034
Comchip Technology CO., LTD.
SMD Schottky Barrier Rectifiers
RATING AND CHARACTERISTIC CURVES (CDBB5150-HF Thru. CDBB5200-HF)
Fig.1 - Typical Forward Current
Derating Curve
Fig.2 - Typical Forward Characteristics
100
Instantaneous Forward Current, (A)
Average Forward Current, (A)
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
1.0
0.1
TJ=25°C
Pulse Width 300us
1% Duty Cycle
0.01
0
0.1
20 40 60 80 100 120 140 160 180 200
0.3
0.5
0.7
0.9
1.1
1.3
1.5
Ambient Temperature, (°C)
Forward Voltage, (V)
Fig.3 - Maximum Non-repetitive
Forward Surge Current
Fig.4 - Typical Junction Capacitance
150
1400
TJ=25 OC
8.3ms single half sine
wave, JEDEC method
Junction Capacitance, (pF)
Peak Forward Surge Current, (A)
10
120
90
60
30
1200
1000
800
600
400
200
0
1
10
100
0
0.01
Number of Cycles at 60Hz
0.1
1
10
100
Reverse Voltage, (V)
Fig.5 - Typical Reverse Characteristics
Reverse Leakage Current, (mA)
100
10
1
TJ=125°C
0.1
TJ=25°C
0.01
0
40
80
120
160
200
Percent of Rated Peak Reverse Voltage, (%)
REV:A
Page 2
QW-JB034
Comchip Technology CO., LTD.
SMD Schottky Barrier Rectifiers
Reel Taping Specification
d
P0
P1
T
E
Index hole
F
W
B
C
P
A
12
o
0
D2
D1 D
W1
Trailer
Device
.......
.......
End
.......
.......
Leader
.......
.......
.......
.......
10 pitches (min)
Start
10 pitches (min)
Direction of Feed
DO-214AA
(SMB)
DO-214AA
(SMB)
SYMBOL
A
B
C
d
D
D1
D2
(mm)
4.00 ± 0.10
5.90 ± 0.10
3.00 ± 0.10
1.50 ± 0.10
330 ± 2.00
50.0 MIN.
13.50 ± 0.50
(inch)
0.157 ± 0.004
0.232 ± 0.004
0.118 ± 0.004
0.059 ± 0.004
12.99 ± 0.079
1.969 MIN.
0.531 ± 0.020
SYMBOL
E
F
P
P0
P1
T
W
W1
(mm)
1.75 ± 0.10
5.50 ± 0.10
8.00 ± 0.10
4.00 ± 0.10
2.00 ± 0.10
0.60 ± 0.10
12.0 ± 0.30
18.4 ± 1.00
(inch)
0.069 ± 0.004
0.217 ± 0.004
0.315± 0.004
0.157 ± 0.004
0.079 ± 0.004
0.236 ± 0.004
0.472 ±0.012
0.724 ± 0.040
REV:A
Page 3
QW-JB034
Comchip Technology CO., LTD.
SMD Schottky Barrier Rectifiers
Marking Code
Cathod Band
Part Number
Marking Code
CDBB5150-HF
SK515
CDBB5200-HF
SK520
XXXXX
XXXX / XXXXX = Product type marking code
Suggested PAD Layout
DO-214AA (SMB)
D
SIZE
(mm)
(inch)
A
4.30
0.169
B
2.50
0.098
C
2.30
0.091
D
6.80
0.268
E
1.80
0.071
A
E
C
B
Standard Packaging
REEL PACK
Case Type
DO-214AA
(SMB)
REEL
Reel Size
( pcs )
(inch)
3,000
13
REV:A
Page 4
QW-JB034
Comchip Technology CO., LTD.