EVERLIGHT 19-217-BHC-XK1L2B11X-3T

Technical Data Sheet
0603 Package Chip LED(0.4mm Height)
19-217/BHC- XK1L2B11X/3T
Features
․Package in 8mm tape on 7〞diameter reel.
․Compatible with automatic placement equipment.
․Compatible with infrared and vapor phase reflow
solder process.
․Mono-color type.
․Pb-free
․The product itself will remain within RoHS complaint Version.
Descriptions
․The 19-217 SMD LED is much smaller than lead
frame type components, thus enable smaller
board size, higher packing density, reduced
storage space and finally smaller equipment to be
obtained.
․Besides, lightweight makes them ideal for
miniature applications. etc.
Applications
․Backlighting in dashboard and switch.
․Telecommunication: indicator and backlighting in
telephone and fax.
․Flat backlight for LCD, switch and symbol.
․General use.
Device Selection Guide
Part No.
19-217/BHC-XK1L2B11X/3T
Everlight Electronics Co., Ltd.
Device No: DSE-0001230
Chip
Material
Emitted Color
Resin Color
Blue
Water Clear
InGaN
http://www.everlight.com
Prepared date: 9-Apr-2009
Rev
1
Page: 1 of 10
Prepared by:Cheng Dejiang
19-217/BHC- XK1L2B11X/3T
Package Outline Dimensions
Note: The tolerances unless mentioned is ±0.1mm, Unit = mm
Everlight Electronics Co., Ltd.
Device No: DSE-0001230
http://www.everlight.com
Prepared date: 9-Apr-2009
Rev
1
Page: 2 of 10
Prepared by:Cheng Dejiang
19-217/BHC- XK1L2B11X/3T
Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Rating
Unit
Reverse Voltage
VR
5
V
Forward Current
IF
25
mA
IFP
100
mA
Pd
95
mW
ESD
150
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +90
℃
Soldering Temperature
Tsol
Peak Forward Current
(Duty 1/10 @1KHz)
Power Dissipation
Electrostatic
Discharge(HBM)
Reflow Soldering : 260 ℃ for 10 sec.
Hand Soldering : 350 ℃ for 3 sec.
Electro-Optical Characteristics (Ta=25℃)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Luminous Intensity
Iv
7.2
-----
18.0
mcd
Viewing Angle
2θ1/2
-----
120
-----
deg
Peak Wavelength
λp
-----
468
-----
nm
Condition
IF=2mA
Dominant Wavelength
λd
465
-----
470
nm
Spectrum Radiation
Bandwidth
△λ
-----
25
-----
nm
Forward Voltage
VF
2.60
-----
2.90
Reverse Current
IR
-----
-----
50
V
μA
VR=5V
Notes:
1.Tolerance of Luminous Intensity ±11%
2.Tolerance of Dominant Wavelength ±1nm
3.Tolerance of Forward Voltage ±0.05V
Everlight Electronics Co., Ltd.
Device No: DSE-0001230
http://www.everlight.com
Prepared date: 9-Apr-2009
Rev
1
Page: 3 of 10
Prepared by:Cheng Dejiang
19-217/BHC- XK1L2B11X/3T
Bin Range Of Dom. Wavelength
Group
Bin
Min
Max
Unit
Condition
X
X
465
470
nm
IF=2mA
Unit
Condition
mcd
IF=2mA
Unit
Condition
V
IF=2mA
Bin Range Of Luminous Intensity
Bin
Min
Max
K1
7.2
9.0
K2
9.0
11.5
L1
11.5
14.5
L2
14.5
18.0
Bin Range Of Forward Voltage
Group
B11
Bin
Min
Max
28
2.60
2.70
29
2.70
2.80
30
2.80
2.90
Notes:
1.Tolerance of Luminous Intensity ±11%
2.Tolerance of Dominant Wavelength ±1nm
3.Tolerance of Forward Voltage ±0.05V
Everlight Electronics Co., Ltd.
Device No: DSE-0001230
http://www.everlight.com
Prepared date: 9-Apr-2009
Rev
1
Page: 4 of 10
Prepared by:Cheng Dejiang
19-217/BHC- XK1L2B11X/3T
Typical Electro-Optical Characteristics Curves
Ta=25°C
Forward Current
I (mA)
Relative luminous intensity ( % )
Ta=25°C
Wavelength λ(nm)
Forward Voltage VF (V)
Relative luminous intensity ( %)
Relative luminous intensity ( % )
Ta=25°C
1000
100
10
1
-60 -40 -20
0 20 40 60 80 100
Ambient Temperature Ta(°C )
Forward Current I (mA)
0°
10°
20°
Ta=25°C
I (mA)
30°
Forward Current
40°
1.0
0.9
50°
0.8
60°
70°
0.7
Ambient Temperature Ta (°C )
Everlight Electronics Co., Ltd.
Device No: DSE-0001230
http://www.everlight.com
Prepared date: 9-Apr-2009
80°
90°
0.5
0.3
Rev
0.1
1
0.2
0.4
0.6
Page: 5 of 10
Prepared by:Cheng Dejiang
19-217/BHC- XK1L2B11X/3T
Label explanation
CAT: Luminous Intensity Rank
HUE: Dom. Wavelength Rank
REF: Forward Voltage Rank
Reel Dimensions
Note: The tolerances unless mentioned is ±0.1mm, Unit = mm
Everlight Electronics Co., Ltd.
Device No: DSE-0001230
http://www.everlight.com
Prepared date: 9-Apr-2009
Rev
1
Page: 6 of 10
Prepared by:Cheng Dejiang
19-217/BHC- XK1L2B11X/3T
Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel
Note: The tolerances unless mentioned is ±0.1mm, Unit = mm
Moisture Resistant Packaging
Label
Aluminum moisture-proof bag
Everlight Electronics Co., Ltd.
Device No: DSE-0001230
http://www.everlight.com
Prepared date: 9-Apr-2009
Desiccant
Rev
Label
1
Page: 7 of 10
Prepared by:Cheng Dejiang
19-217/BHC- XK1L2B11X/3T
Reliability Test Items And Conditions
The reliability of products shall be satisfied with items listed below.
Confidence level:90%
LTPD:10%
Test
Sample
Hours/Cycles
Size
No.
Items
Test Condition
1
Reflow Soldering
Temp. : 260℃±5℃
Min. 5sec.
6 Min.
22 PCS.
0/1
Temperature Cycle
H : +100℃ 15min
∫ 5 min
L : -40℃ 15min
300 Cycles
22 PCS.
0/1
Thermal Shock
H : +100℃ 5min
∫ 10 sec
L : -10℃ 5min
300 Cycles
22 PCS.
0/1
Temp. : 100℃
1000 Hrs.
22 PCS.
0/1
Temp. : -40℃
1000 Hrs.
22 PCS.
0/1
2
3
4
5
High Temperature
Storage
Low Temperature
Storage
Ac/Re
6
DC Operating Life
IF = 20 mA
1000 Hrs.
22 PCS.
0/1
7
High Temperature /
High Humidity
85℃/ 85% RH
1000 Hrs.
22 PCS.
0/1
Everlight Electronics Co., Ltd.
Device No: DSE-0001230
http://www.everlight.com
Prepared date: 9-Apr-2009
Rev
1
Page: 8 of 10
Prepared by:Cheng Dejiang
19-217/BHC- XK1L2B11X/3T
Precautions For Use
1. Over-current-proof
Customer must apply resistors for protection, otherwise slight voltage shift will cause big
current change ( Burn out will happen ).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.
2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less.
If unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5℃ for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
Everlight Electronics Co., Ltd.
Device No: DSE-0001230
http://www.everlight.com
Prepared date: 9-Apr-2009
Rev
1
Page: 9 of 10
Prepared by:Cheng Dejiang
19-217/BHC- XK1L2B11X/3T
4.Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds
within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do
soldering of each terminal. Be careful because the damage of the product is often started at the time of
the hand solder.
5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a
double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether
the characteristics of the LEDs will or will not be damaged by repairing.
EVERLIGHT ELECTRONICS CO., LTD.
Office: No 25, Lane 76, Sec 3, Chung Yang Rd,
Tucheng, Taipei 236, Taiwan, R.O.C
Everlight Electronics Co., Ltd.
Device No: DSE-0001230
Tel: 886-2-2267-2000, 2267-9936
Fax: 886-2267-6244, 2267-6189, 2267-6306
http://www.everlight.com
http://www.everlight.com
Prepared date: 9-Apr-2009
Rev
1
Page: 10 of 10
Prepared by:Cheng Dejiang