Technical Data Sheet 0603 Package Chip LED(0.4mm Height) 19-217/BHC- XK1L2B11X/3T Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type. ․Pb-free ․The product itself will remain within RoHS complaint Version. Descriptions ․The 19-217 SMD LED is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ․Besides, lightweight makes them ideal for miniature applications. etc. Applications ․Backlighting in dashboard and switch. ․Telecommunication: indicator and backlighting in telephone and fax. ․Flat backlight for LCD, switch and symbol. ․General use. Device Selection Guide Part No. 19-217/BHC-XK1L2B11X/3T Everlight Electronics Co., Ltd. Device No: DSE-0001230 Chip Material Emitted Color Resin Color Blue Water Clear InGaN http://www.everlight.com Prepared date: 9-Apr-2009 Rev 1 Page: 1 of 10 Prepared by:Cheng Dejiang 19-217/BHC- XK1L2B11X/3T Package Outline Dimensions Note: The tolerances unless mentioned is ±0.1mm, Unit = mm Everlight Electronics Co., Ltd. Device No: DSE-0001230 http://www.everlight.com Prepared date: 9-Apr-2009 Rev 1 Page: 2 of 10 Prepared by:Cheng Dejiang 19-217/BHC- XK1L2B11X/3T Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Rating Unit Reverse Voltage VR 5 V Forward Current IF 25 mA IFP 100 mA Pd 95 mW ESD 150 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +90 ℃ Soldering Temperature Tsol Peak Forward Current (Duty 1/10 @1KHz) Power Dissipation Electrostatic Discharge(HBM) Reflow Soldering : 260 ℃ for 10 sec. Hand Soldering : 350 ℃ for 3 sec. Electro-Optical Characteristics (Ta=25℃) Parameter Symbol Min. Typ. Max. Unit Luminous Intensity Iv 7.2 ----- 18.0 mcd Viewing Angle 2θ1/2 ----- 120 ----- deg Peak Wavelength λp ----- 468 ----- nm Condition IF=2mA Dominant Wavelength λd 465 ----- 470 nm Spectrum Radiation Bandwidth △λ ----- 25 ----- nm Forward Voltage VF 2.60 ----- 2.90 Reverse Current IR ----- ----- 50 V μA VR=5V Notes: 1.Tolerance of Luminous Intensity ±11% 2.Tolerance of Dominant Wavelength ±1nm 3.Tolerance of Forward Voltage ±0.05V Everlight Electronics Co., Ltd. Device No: DSE-0001230 http://www.everlight.com Prepared date: 9-Apr-2009 Rev 1 Page: 3 of 10 Prepared by:Cheng Dejiang 19-217/BHC- XK1L2B11X/3T Bin Range Of Dom. Wavelength Group Bin Min Max Unit Condition X X 465 470 nm IF=2mA Unit Condition mcd IF=2mA Unit Condition V IF=2mA Bin Range Of Luminous Intensity Bin Min Max K1 7.2 9.0 K2 9.0 11.5 L1 11.5 14.5 L2 14.5 18.0 Bin Range Of Forward Voltage Group B11 Bin Min Max 28 2.60 2.70 29 2.70 2.80 30 2.80 2.90 Notes: 1.Tolerance of Luminous Intensity ±11% 2.Tolerance of Dominant Wavelength ±1nm 3.Tolerance of Forward Voltage ±0.05V Everlight Electronics Co., Ltd. Device No: DSE-0001230 http://www.everlight.com Prepared date: 9-Apr-2009 Rev 1 Page: 4 of 10 Prepared by:Cheng Dejiang 19-217/BHC- XK1L2B11X/3T Typical Electro-Optical Characteristics Curves Ta=25°C Forward Current I (mA) Relative luminous intensity ( % ) Ta=25°C Wavelength λ(nm) Forward Voltage VF (V) Relative luminous intensity ( %) Relative luminous intensity ( % ) Ta=25°C 1000 100 10 1 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta(°C ) Forward Current I (mA) 0° 10° 20° Ta=25°C I (mA) 30° Forward Current 40° 1.0 0.9 50° 0.8 60° 70° 0.7 Ambient Temperature Ta (°C ) Everlight Electronics Co., Ltd. Device No: DSE-0001230 http://www.everlight.com Prepared date: 9-Apr-2009 80° 90° 0.5 0.3 Rev 0.1 1 0.2 0.4 0.6 Page: 5 of 10 Prepared by:Cheng Dejiang 19-217/BHC- XK1L2B11X/3T Label explanation CAT: Luminous Intensity Rank HUE: Dom. Wavelength Rank REF: Forward Voltage Rank Reel Dimensions Note: The tolerances unless mentioned is ±0.1mm, Unit = mm Everlight Electronics Co., Ltd. Device No: DSE-0001230 http://www.everlight.com Prepared date: 9-Apr-2009 Rev 1 Page: 6 of 10 Prepared by:Cheng Dejiang 19-217/BHC- XK1L2B11X/3T Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel Note: The tolerances unless mentioned is ±0.1mm, Unit = mm Moisture Resistant Packaging Label Aluminum moisture-proof bag Everlight Electronics Co., Ltd. Device No: DSE-0001230 http://www.everlight.com Prepared date: 9-Apr-2009 Desiccant Rev Label 1 Page: 7 of 10 Prepared by:Cheng Dejiang 19-217/BHC- XK1L2B11X/3T Reliability Test Items And Conditions The reliability of products shall be satisfied with items listed below. Confidence level：90% LTPD：10% Test Sample Hours/Cycles Size No. Items Test Condition 1 Reflow Soldering Temp. : 260℃±5℃ Min. 5sec. 6 Min. 22 PCS. 0/1 Temperature Cycle H : +100℃ 15min ∫ 5 min L : -40℃ 15min 300 Cycles 22 PCS. 0/1 Thermal Shock H : +100℃ 5min ∫ 10 sec L : -10℃ 5min 300 Cycles 22 PCS. 0/1 Temp. : 100℃ 1000 Hrs. 22 PCS. 0/1 Temp. : -40℃ 1000 Hrs. 22 PCS. 0/1 2 3 4 5 High Temperature Storage Low Temperature Storage Ac/Re 6 DC Operating Life IF = 20 mA 1000 Hrs. 22 PCS. 0/1 7 High Temperature / High Humidity 85℃/ 85% RH 1000 Hrs. 22 PCS. 0/1 Everlight Electronics Co., Ltd. Device No: DSE-0001230 http://www.everlight.com Prepared date: 9-Apr-2009 Rev 1 Page: 8 of 10 Prepared by:Cheng Dejiang 19-217/BHC- XK1L2B11X/3T Precautions For Use 1. Over-current-proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less. 2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less. If unused LEDs remain, it should be stored in moisture proof packages. 2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 24 hours. 3. Soldering Condition 3.1 Pb-free solder temperature profile 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. Everlight Electronics Co., Ltd. Device No: DSE-0001230 http://www.everlight.com Prepared date: 9-Apr-2009 Rev 1 Page: 9 of 10 Prepared by:Cheng Dejiang 19-217/BHC- XK1L2B11X/3T 4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. EVERLIGHT ELECTRONICS CO., LTD. Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Tucheng, Taipei 236, Taiwan, R.O.C Everlight Electronics Co., Ltd. Device No: DSE-0001230 Tel: 886-2-2267-2000, 2267-9936 Fax: 886-2267-6244, 2267-6189, 2267-6306 http://www.everlight.com http://www.everlight.com Prepared date: 9-Apr-2009 Rev 1 Page: 10 of 10 Prepared by:Cheng Dejiang