SMD FYLS FYLS-1206UBC Radiation pattern. Features: Compatible with automatic placement equipment Compatible with reflow solder process. Applications: Automotive-Telecommumication Indicators Lcd Back-lights Illuminations Relative Lumionous Intensity(LOP @max=1) Descriptions: Dice material: InGaN. Emitting Color: Blue. Lens Color: Water clear. Absolute maximun ratings(Ta=25゜ ratings(Ta=25゜с) Parameter MAX. Unit 70 mW Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) Continuous Forward Current 100 mA 25 mA Derating Linear From 25℃ 0.4 mA/℃ Power Dissipation Operating Temperature Range -30℃ to +80℃ Storage Temperature Range -40℃ to +100℃ 260℃ for 5 Seconds Lead Soldering Temperature[4mm(.157”) From Body] Electrical and optical characteristics(Ta=25゜ characteristics(Ta=25゜с) Symbol Min. Typ. Max. Unit IV -- 120 -- mcd 2θ1/2 130 140 150 Deg Peak Emission Wavelength Dominant Wavelength λp 465 470 475 nm λd 460 465 470 nm Spectral Line Half-Width △λ 10 15 20 nm Forward Voltage VF 3.2 3.6 V Reverse Current IR 10 µA Parameter Luminous Intensity Viewing Angle Test Condition IF=20mA VR=5V SMD Typical Electrical Characteristics Curves (25゜ (25゜с Ambient Temperature Unless Otherwise Noted) Normalized Response Spectral Reduance Wave Length(nm) s u o n i m u l e v i t a l e R t n e r r u C d r a w r o f . s V y t i s n e t n I s u o n i m u L t n e r r u C d r a w r o f . s V y t i s n e t n I s u o n i m u L ) % ( y t i s n e t n i ) % ( y t i s n e t n i 50 40 1000 100 s u o n i m u l e v i t a l e R 30 20 10 0 2.8 3.2 3.6 0 4.4 4.0 s t l o v ) F V ( e g a t l o V d r a w r o F 2.4 10 1 100 10 1000 Forward Current(mA) . s V e r yu t t ia s r n e ep t m n e IT st un o e n i ib m m u LA Forward Current Derating Curve 0 4 0 3 0 2 0 0 1 Forward Current(mA) 0 5 0 9 0 8 0 7 0 6 0 5 0 4 0 3 0 2 0 1 0 Ambient Temperature TA( C) Relative Luminous Intensity 0 6 1000 100 0 -60 -35 -10 15 40 Ambient Temperature TA( C) 65 90 SMD Precautions For Use Over-current-proof Customer must apply resistors for protection,otherwise slight voltage shift will cause big current chang(Burn out will happen) Storage 1. The operation of temperature and R.H are:5゜с ---30゜с,R.H.60% Max. 2. Once the package is opened ,the products should be used within a week. Otherwise,they Should be kept in a dampproof box with desccating regent.Considering the tape life,we Suggest our customers to use our products within 1.5year (form production date). 3. It’s recommended to bake before soldering when the package is unsealed after 72hrs.The Condition is: 60゜с ±5゜с for 15 hrs. Soldering Iron: Temperature at tip of iron:300゜с Max.(25W Max) Soldering time:3±1sec. Reflow Temp./Time: Temperature Time SMD Package Package Dimensions of Device l a n i m r e T g n i r e d l o S 1.6 0.6 1.5 3.2 LED Die 2.0 2.0 Cathode Mark PCB 1.6 1.5 2.0 1.5 Resin 1.1 0.8 0.5 0.6 Unit:mm Tape Specification:3000pcs Per Reel. Packing Size Item W P1 E F D0 D1 P0 Unit Spec. 8.00 4.00 1.75 3.50 1.50 1.00 4.00 mm Tolerance ±0.20 ±0.10 ±0.10 ±0.05 +0.1/-0 ±0.05 ±0.05 mm Item 10P0 P2 A0 B0 K0 T Unit Spec. 40.00 2.00 1.85 3.45 1.27 0.22 mm Tolerance ±0.20 ±0.05 ±0.10 ±0.10 ±0.10 ±0.05 mm Cathode P2 P0 K0 E A' F D0 W D1 5° A0 P1 t A' SEC:A-A' Package Dimensions of Reel: Reel: sb ? ? 13.5± 0.2 ? 178± 1.0 0 / 5 . 0 + 0 6 9.0±0.1 12.0±0.15 Unit:mm SMD Packing and Shipping Spec. L1 sb W1 sb Zip-lock Desiccant Antistatic Bag Desiccant Spec. Spec. Spec. 203.0. 198.0 Unit:mm ) s c p ( Y T ' Q 5 . 1 1 * 9 1 * 0 3 : ) m c ( n o i s n e m i D x o B . O N T R A P 10 Reels per box CARTON Dimension(cm):39*32*38 ) s c p ( Y T ' Q R E B M U N T R A P S G K S G K M C 8 3 * 1 3 * 8 3 W W : S . G . N A E M C/NO 6 Boxes/Carton 0603B/0603/0805: 4000pcs*10reels*6boxs 0805B/1206B/1206/1210/1204/: 3000pcs*10Reels*6boxs* 1311:2000pcs*10Reels*6boxs