HMC156A v00.0111 FREQUency MULTIPLIERS - Passive - CHIP 2 Typical Applications Features The HMC156A is suitable for: Conversion Loss: 15 dB • Wireless Local Loop Fo, 3Fo, 4Fo Isolation: 38 dB • LMDS, VSAT, and Point-to-Point Radios Input Drive Level: 10 to 20 dBm • UNII & HiperLAN • Test Equipment Functional Diagram General Description The HMC156A is a miniature frequency doubler in a MMIC die. Suppression of undesired fundamental and higher order harmonics is 38 dB typical with respect to input signal levels. The doubler uses the same diode/balun technology used in Hittite MMIC mixers, features small size and requires no DC bias. Electrical Specifications, TA = +25° C, As a Function of Drive Level Input = +10 dBm Parameter Min. Typ. Input = +15 dBm Max. Min. Typ. Input = +20 dBm Max. Min. Typ. Max. Units Frequency Range, Input 1.1 - 2.1 0.8 - 2.4 0.7 - 2.3 GHz Frequency Range, Output 2.2 - 4.2 1.6 - 4.8 1.4 - 4.6 GHz Conversion Loss 2-1 GaAs MMIC PASSIVE FREQUENCY DOUBLER, 0.7 - 2.4 GHz INPUT 17 22 15 20 15 20 dB FO Isolation (with respect to input level) 42 47 43 47 27 35 dB 3FO Isolation (with respect to input level) 45 55 44 55 29 40 dB 4FO Isolation (with respect to input level) 28 38 31 38 25 35 dB For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] HMC156A v00.0111 GaAs MMIC PASSIVE FREQUENCY DOUBLER, 0.7 - 2.4 GHz INPUT Isolation @ +15 dBm Drive Level* Fo 3Fo 4Fo -20 -10 ISOLATION (dB) CONVERSION GAIN (dB) 2 0 0 -20 -30 Pin = 10 dBm Pin = 15 dBm Pin = 20 dBm -40 -60 -80 -100 -40 1 1.5 2 2.5 3 3.5 4 4.5 0 5 2 4 6 8 10 FREQUENCY (GHz) OUTPUT FREQUENCY (GHz) *With respect to input level Output Return Loss @ +15 Drive Level Input Return Loss vs. Drive Level 0 0 RETURN LOSS (dB) RETURN LOSS (dB) -5 -10 -15 Pin =10 dBm Pin =15 dBm Pin = 20 dBm -20 -25 -4 -8 -12 -16 0 0.5 1 1.5 2 2.5 3 3.5 4 INPUT FREQUENCY (GHz) 0 1 2 3 4 5 OUTPUT FREQUENCY (GHz) Absolute Maximum Ratings Input Drive +27 dBm Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C FREQUency MULTIPLIERS - Passive - CHIP Conversion Gain vs. Drive Level ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] 2-2 HMC156A v00.0111 GaAs MMIC PASSIVE FREQUENCY DOUBLER, 0.7 - 2.4 GHz INPUT Outline Drawing FREQUency MULTIPLIERS - Passive - CHIP 2 2-3 Die Packaging Information [1] Standard Alternate WP-13 (Waffle Pack) [2] NOTES: 1. ALL UNLABELED PADS MUST BE BONDED TO GROUND (8 TOTAL). 2. ALL DIMENSIONS IN INCHES [MILLIMETERS] 3. ALL TOLERANCES ARE ±0.001 [0.025] 4. DIE THICKNESS IS ±0.005 [0.127] 5. BOND PADS ARE ±0.004 [0.100] SQUARE 6. EQUALLY SPACED AT ±0.006 [0.150] CENTERS 7. BACKSIDE METALLIZATION: NONE 8. BOND PAD METALLIZATION: GOLD [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. Pad Description Pad Number Function Description 1 RFIN DC coupled and matched to 50 Ohm. 2 RFOUT DC coupled and matched to 50 Ohm. Die Bottom GND Die bottom must be connected to RF/DC ground. Interface Schematic For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] HMC156A v00.0111 GaAs MMIC PASSIVE FREQUENCY DOUBLER, 0.7 - 2.4 GHz INPUT Handling Precautions Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: Follow ESD precautions to protect against ESD strikes. Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip may have fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Wire Bonding Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package. RF bonds should be as short as possible. For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] 2 FREQUency MULTIPLIERS - Passive - CHIP Follow these precautions to avoid permanent damage. 2-4