LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED ARRAY Pb Lead-Free Parts LA208B/SRG-1-PF DATA SHEET DOC. NO : QW0905-L A208B/SRG-1-PF REV. : A DATE : 25 - Apr. - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA208B/SRG-1-PF Page 1/6 Package Dimensions 2.5±0.5 7.5 14.0 10.3 6.55 3.0 1.85 3.5± 0.5 2.54TYP 11.25± 0.5 2.54TYP 2 1 3 SR G 1 2 3 1.CATHODE GREEN 2.COMMON ANODE 3.CATHODE RED LSRG3392/R6-PF 5.0 5.9 7.6 8.6 10.5±0.5 1 1.5MAX □0.5 TYP 18.0MIN 2.0MIN 1 2 3 2 3 1.CATHODE GREEN 2.COMMON ANODE 3.CATHODE RED 2.0MIN 2.54TYP SR G 2.54TYP Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/6 PART NO. LA208B/SRG-1-PF Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT SR G Forward Current IF 30 15 mA Peak Forward Current Duty 1/10@10KHz IFP 100 80 mA Power Dissipation PD 100 50 mW Reverse Current @5V Ir 10 μA Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Soldering Temperature Tsol Max 260 ℃ for 5 sec Max (2mm from body) Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted Forward Peak Spectral voltage wave halfwidth length △λ nm @ 20mA(V) λPnm Red Diffused Red GaP Green Green Diffused @10mA(mcd) Min. Max. Min. Lens GaAlAs Luminous intensity Viewing angle 2θ 1/2 (deg) Typ. 660 20 1.5 2.4 20 45 70 565 20 1.7 2.1 12 30 70 LA208B/SRG-1-PF Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA208B/SRG-1-PF Page 3/6 Typical Electro-Optical Characteristics Current SR CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 1.0 2.0 3.0 4.0 5.0 1.0 10 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 600 650 700 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25 ℃ Forward Voltage@20mA Normalize @25 ℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 750 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/6 PART NO. LA208B/SRG-1-PF Typical Electro-Optical Characteristics Curve G CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 2.0 1.0 3.0 4.0 5.0 1.0 10 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 600 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature(℃) Ambient Temperature( ℃) Relative Intensity@20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25 ℃ Forward Voltage@20mA Normalize @25 ℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 650 Fig.6 Directive Radiation 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA208B/SRG-1-PF Page5/6 Recommended Soldering Conditions 1. Wave Solder Soldering Soldering Iron:30W Max Temperature 300°C Max Soldering Time:3 Seconds Max Distance:2mm Min(From solder joint to case) Temp(°C) 245°C 5sec Max 245° 120° Preheat 2°/sec max 2°/sec max 2°/sec max Time(sec) 120 Seconds Max Dip Soldering Preheat: 120° C Max Preheat time: 120 seconds Max Ramp-up:2°C/sec(max) Ramp-Down:2°C/sec(max) Solder Bath:245°C Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case) 2. PB-Free Wave Solder Soldering Soldering Iron:30W Max Temperature:350 °CMax Soldering Time:3seconds Max Distance:2mm Min(From solder joint to case) Temp(°C) 265°C 5sec Max 265° 120° Preheat 2°/sec max 2°/sec max 2°/sec max Time(sec) 120 Seconds Max Dip Soldering Preheat: 120° C Max Preheat time: 120seconds Max Ramp-up:2°C/sec(max) Ramp-Down:2°C/sec(max) Solder Bath:265°C Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/6 PART NO. LA208B/SRG-1 LA208B/SRG-1-PF Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. 1.Ta=105 ℃±5 ℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11