LIGITEK LG-150EGY-CT

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LED SMD
LG-150EGY-CT
DATA SHEET
DOC. NO :
QW0905-LG-150EGY-CT
REV.
:
A
DATE
:
12 - Jun - 2007
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/13
PART NO. LG-150EGY-CT
Features:
1. Package in 8.0mm carrier tape on 7" diameter reel.
2. Compatible with automatic placement equipment.
3. Compatible with reflow solder process.
Descriptions:
1. The LG-150RGB SMD Taping is much smaller than
lead frame type components, thus enable smaller
board size, higher packing density, reduced storage
space and finally smaller equipment to be obtained.
2. Besides, lightweight makes them ideal for miniature
applications. etc.
Applications:
1. Automotive : backlighting in dashboard and switch.
2. Telecommunication : indicator and backlighting in telephone and fax.
3. Flat backlight for LCD, switch and symbol
4. General use.
Device Selection Guide:
PART NO
LG-150EGY-CT
MATERIAL
COLOR
Emitted
AlGaInP
Red
lnGaN/GaN
Green
AlGaInP
Yellow
Lens
Water Clear
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PART NO. LG-150EGY-CT
Page 2/13
Package Dimensions
1.1
Cathode Mark
4
1
0.5
Cathode Mark
Resin
0.6
E
3.2
Soldering
Terminal
2.0
Y
G
2
3
0.6
PCB
0.4
1.6
0.6
4
1
E
2
G
3
Y
Note : 1.All dimension are in millimeter tolerance is ± 0.1mm unless otherwise noted.
2.Specifications are subject to change without notice.
Recommended Soldering Pad Dimensions
0.7
0.4
0.7
0.8
1.8
0.8
Note : The tolerances unless mentioned is ±0.1mm,Angle±0.5. Unit=mm.
0.6
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Page 3/13
PART NO. LG-150EGY-CT
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Parameter
Symbol
UNIT
HRF(S)
DGM
HY(R)
Power Dissipation
PD
78
80
78
mW
Peak Forward Current
Duty 1/10@10KHz
IFP
60
100
60
mA
Forward Current
IF
30
20
30
mA
Reverse Current @5V
Ir
10
50
10
μA
Electrostatic Discharge
ESD
2000
150
2000
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +90
℃
Soldering Temperature
Tsol
Max 260 ℃ for 5 sec Max
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150EGY-CT
Page 4/13
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Items
Min.
Typ. Max. UNIT
125
220
----
DGM 200
465
----
HY(R)
80
170
----
HRF(S)
----
625
----
DGM
----
525
----
HY(R) ----
590
----
HRF(S)
----
20
----
DGM
----
36
----
HY(R) ----
20
----
HRF(S)
1.7
----
2.6
DGM
----
3.5
4.0
HY(R) 1.7
----
2.6
HRF(S)
----
140
----
2θ 1/2 DGM
----
140
----
HY(R) ----
140
----
Symbol
HRF(S)
Luminous Intensity
Dominant Wavelength
Spectral Line Half-Width
Forward Voltage
Viewing Angle
Iv
λD
△λ
VF
CONDITION
mcd
IF=20mA
nm
IF=20mA
nm
IF=20mA
V
IF=20mA
deg
IF=20mA
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PART NO. LG-150EGY-CT
Page 5/13
Typical Electro-Optical Characteristics Curve
HRFS CHIP
Fig.2 Luminous Intensity vs. Forward Current
6.0
150
Luminous Intensity
Normalize @20mA
Forward Current(mA)
Fig.1 Forward current vs. Forward Voltage
100
50
0
0
0.5
1.0
1.5
2.0
2.5
5.0
4.0
3.0
2.0
1.0
0.0
0
3.0
50
1.06
1.04
1.02
1.00
0.98
0.96
0.94
0
20
40
60
80
100
Relative Intensity@20mA
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0
600
650
Wavelength (nm)
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40
-20
0
20
40
60
Ambient Temperature( ℃)
Ambient Temperature( ℃)
550
Fig.4 Luminous Intensity vs. Temperature
Luminous Intensity@20mA
Normalize @25 ℃
Forward Voltage@20mA
Normalize @25 ℃
Fig.3 Forward Voltage vs. Temperature
-20
150
Forward Current(mA)
Forward Voltage(V)
-40
100
700
Fig.6 Directive Radiation
80
100
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PART NO. LG-150EGY-CT
Page 6/13
Typical Electro-Optical Characteristics Curve
DGM CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
1.0
2.0
3.0
4.0
5.0
1.0
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
3.0
Relative Intensity@20mA
Normalize @25 ℃
Forward Voltage@20mA
Normalize @25 ℃
1000
Forward Current(mA)
Forward Voltage(V)
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
100
Fig.5 Relative Intensity vs. Wavelength
0.5
0.0
500
550
Wavelength (nm)
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
Fig.6 Directive Radiation
1.0
450
2.5
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Relative Intensity@20mA
100
600
100
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PART NO. LG-150EGY-CT
Page 7/13
Typical Electro-Optical Characteristics Curve
HYR CHIP
Fig.2 Luminous Intensity vs. Forward Current
5.0
150
Luminous Intensity
Normalize @20mA
Forward Current(mA)
Fig.1 Forward current vs. Forward Voltage
100
50
0
0
0.5
1.0
1.5
2.0
2.5
4.0
3.0
2.0
1.0
0.0
0
3.0
50
1.06
1.04
1.02
1.00
0.98
0.96
0.94
0
20
40
60
80
100
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1.0
0.5
0.0
550
600
Wavelength (nm)
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
Ambient Temperature(℃)
Ambient Temperature(℃)
500
Fig.4 Luminous Intensity vs. Temperature
Luminous Intensity@20mA
Normalize @25 ℃
Forward Voltage@20mA
Normalize @25 ℃
Fig.3 Forward Voltage vs. Temperature
-20
150
Forward Current(mA)
Forward Voltage(V)
-40
100
650
Fig.6 Directive Radiation
80
100
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Page 8/13
PART NO. LG-150EGY-CT
Carrier Type Dimensions
4.0±0.2
2.0
0.23
1.5
1.75
3.5±0.2
8.0±0.3
5.3
3.38
Polarity
4.0±0.2
1.36
1.76
Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm.
• Packing Specifications
Label
Aluminum Moist-Proof bag
Label
Part No.
Description
Quantity/Reel
LG-150EGY-CT
8.0mm tape,7"reel
3000 devices
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150EGY-CT
Page 9/13
Label Explanation
立碁電子工業股份有限公司
LIGITEK LED
LIGITEK ELECTRONICS CO., LTD.
PART NO. : LG-150EGY-CT
BIN : Luminous Intensity
LOT NO. : 93000453
Q'TY(PCS) : 3000 PCS
BIN/HUE : S/T/R
Reel Dimensions
0.2
0.4
0.8
0.8
0.6
0.2
0.4
0.6
2.0±0.5
178±1.5
6.0±1.0
9.0± 1.0
ψ13.5±1.0
12.0±1.0
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PART NO. LG-150EGY-CT
Page 10/13
Box Explanation
1. 5 BAG / INNER BOX
2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm
H
W
L
3. 10 INNER BOXES / CARTON
4. CARTON SIZE : L X W X H 49cm X 46cm x 29cm
L
W
H
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150EGY-CT
Page 11/13
Recommended Soldering Conditions
1. Hand Solder
Basic spec is ≦ 280℃ 3 sec one time only.
2. Wave Solder
Soldering heat Max. 260 ℃
245± 5℃ within 5 sec
Preheat
120 ~ 150℃
120 ~ 180 sec
3-1. LEAD Reflow Solder
Temp.
(℃)
240
Rising
+5℃/sec
Cooling
-5℃ /sec
Preheat
150
120
60 ~ 120 sec
Time
5sec
3-2 PB-Free Reflow Solder
1~5° C/sec
Preheat
180~200 ° C
1~5° C/sec
260° C MaX.
10sec.Max
Above 220 ° C
60 sec.Max.
120 sec.Max.
Reflow Soldering should not be done more than two times.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150EGY-CT
Page 12/13
Precautions For Use:
Storage time:
1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%.
2.Once the package is opened, the products should be used within a week.
Otherwise, they should be kept in a damp proof box with descanting agent.
Considering the tape life, we suggest our customers to use our products within
a year at <30℃ and <90% relative humidity(RH) (from production date).
3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH60%,
they should be treated at 60 ℃± 5 ℃fo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forward
current should not be allowed to change by more than 40 % of its desired value.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
LIGITEK ELECTRONICS CO.,LTD.
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Page 13/13
PART NO. LG-150EGY-CT
Reliability Test:
Classification
Test Item
Test Condition
Reference
Standard
Operating Life Test
1.Ta=Under Room Temperature As Per Data Sheet
Maximum Rating.
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-750D: 1026
MIL-STD-883D: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883D:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
High Temperature
High Humidity
Storage Test
1.Ta=65 ℃±5℃
2.RH=90 %~95 %
3.t=1000hrs ±2hrs
Endurance
Test
Thermal Shock Test
Solderability Test
Environmental
Test
Temperature
Cycling
IR Reflow
1.Ta=105 ℃±5 ℃&-40 ℃±5℃
(10min)
(10min)
2.total 10 cycles
1.T.Sol=235 ℃±5℃
2.Immersion time 2 ±0.5sec
3.Coverage ≧95% of the dipped surface
1.105 ℃ ~ 25 ℃ ~ -55 ℃ ~ 25 ℃
30mins 5mins 30mins 5mins
2.10 Cyeles
1.T=260 ° C Max. 10sec.Max.
2. 6 Min
MIL-STD-202F:103B
JIS C 7021: B-11
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1011
MIL-STD-202F: 208D
MIL-STD-750D: 2026
MIL-STD-883D: 2003
IEC 68 Part 2-20
JIS C 7021: A-2
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1010
JIS C 7021: A-4
MIL-STD-750D:2031.2
J-STD-020