LIGITEK LHYSGL2092

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
DUAL COLOR LED LAMPS
Pb
Lead-Free Parts
LHYSGL2092
DATA SHEET
DOC. NO :
QW0905- LHYSGL2092
REV.
:
A
DATE
:
29 - Aug.- 2007
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/6
PART NO. LHYSGL2092
Package Dimensions
3.0
4.2
4.0
5.2 6.7± 0.5
1.5
MAX
HY
SGL
□0.5
TYP
18.0MIN
1
2
1 2 3
3
2.0MIN
2.0MIN
1.ANODE GREEN
2.COMMON CATHODE
3.ANODE YELLOW
2.54TYP
2.54TYP
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0°
-30°
30°
-60 °
100% 75% 50%
60°
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHYSGL2092
Page 2/6
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
HY
SGL
Forward Current
IF
30
30
mA
Peak Forward Current
Duty 1/[email protected]
IFP
60
100
mA
Power Dissipation
PD
75
120
mW
Ir
10
50
μA
Electrostatic Discharge( * )
ESD
2000
500
V
Operating Temperature
Topr
-40 ~ +85
-20 ~ +80
℃
Storage Temperature
Tstg
-40 ~ +100
-30 ~ +100
℃
Reverse Current @5V
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
* glove
is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
Typical Electrical & Optical Characteristics (Ta=25 ℃)
COLOR
PART NO MATERIAL
Emitted
AIGaInP
Peak Dominant Spectral Forward
voltage
wave halfwidth
wave
length
length
@20mA(V)
△λ nm
λPnm λDnm
Luminous Viewing
intensity
angle
@20mA(mcd) 2θ 1/2
(deg)
Typ.
Typ.
Max. Min.
Min.
Lens
Yellow
---
595
15
1.7 ---
2.6
160
300
60
502
505
30
---
3.5 4.2
65
120
60
White Diffused
LHYSGL2092
InGaN/SiC Green
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHYSGL2092
Page3/6
Typical Electro-Optical Characteristics Curve
HY CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0.0
1.5
1.0
2.0
2.5
3.0
1.0
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
3.0
Relative [email protected]
Normalize @25℃
Forward [email protected]
Normalize @25℃
1000
Forward Current(mA)
Forward Voltage(V)
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
500
550
600
Wavelength (nm)
100
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Relative [email protected]
100
650
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO.LHYSGL2092
Page 4/6
Typical Electro-Optical Characteristics Curve
SGL CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
1.5
20
Relative Intensity
Normalize @20mA
Forward Current(mA)
25
10
15
5
0
1.0
0.5
0.0
1.5
2.0
3.0
2.5
3.5
4.0
0
Forward Current(mA)
40
30
20
10
0
60
40
80
100
Ambient Temperature Ta(℃)
Relative [email protected]
1.0
0.8
0.6
0.4
0.2
0.0
400
450
500
550
Wavelength (nm)
25
600
2.0
1.5
1.0
0.5
0.0
25
30
35
40
45
50
55
60
Ambient Temperature Ta(℃)
Fig.5 Relative Intensity vs. Wavelength
350
20
Fig.4 Relative Intensity vs. Ambient Temp
Relative Luminous Intensity(a.u.)
Fig.3 Forward Voltage vs. Ambient Temp
20
15
Forward Current(mA)
Forward Voltage(V)
0
10
5
650
65
70
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHYSGL2092
Page 5/6
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350 ° C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120° C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5° C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(° C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
60 Seconds Max
50
100
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
150
Time(sec)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHYSGL2092
Page 6/6
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5 ℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5 ℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5 ℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11