SN54LS257B, SN54LS258B, SN54S257, SN54S258 SN74LS257B, SN74LS258B, SN74S257, SN74S258 QUADRUPLE 2-LINE TO 1-LINE DATA SELECTORS/MULTIPLEXERS SDLS148 – OCTOBER 1976 – REVISED MARCH 1988 Copyright 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54LS257B, SN54LS258B, SN54S257, SN54S258 SN74LS257B, SN74LS258B, SN74S257, SN74S258 QUADRUPLE 2-LINE TO 1-LINE DATA SELECTORS/MULTIPLEXERS SDLS148 – OCTOBER 1976 – REVISED MARCH 1988 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54LS257B, SN54LS258B, SN54S257, SN54S258 SN74LS257B, SN74LS258B, SN74S257, SN74S258 QUADRUPLE 2-LINE TO 1-LINE DATA SELECTORS/MULTIPLEXERS SDLS148 – OCTOBER 1976 – REVISED MARCH 1988 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN54LS257B, SN54LS258B, SN54S257, SN54S258 SN74LS257B, SN74LS258B, SN74S257, SN74S258 QUADRUPLE 2-LINE TO 1-LINE DATA SELECTORS/MULTIPLEXERS SDLS148 – OCTOBER 1976 – REVISED MARCH 1988 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54LS257B, SN54LS258B, SN54S257, SN54S258 SN74LS257B, SN74LS258B, SN74S257, SN74S258 QUADRUPLE 2-LINE TO 1-LINE DATA SELECTORS/MULTIPLEXERS SDLS148 – OCTOBER 1976 – REVISED MARCH 1988 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) 5962-7603701VEA ACTIVE CDIP J 16 25 TBD A42 N / A for Pkg Type -55 to 125 5962-7603701VE A SNV54LS257BJ 5962-7603701VFA ACTIVE CFP W 16 25 TBD A42 N / A for Pkg Type -55 to 125 5962-7603701VF A SNV54LS257BW 5962-7603701VFA ACTIVE CFP W 16 25 TBD A42 N / A for Pkg Type -55 to 125 5962-7603701VF A SNV54LS257BW 7603701EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7603701EA SNJ54LS257BJ 7603701EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7603701EA SNJ54LS257BJ 7603701FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7603701FA SNJ54LS257BW 7603701FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7603701FA SNJ54LS257BW 76038012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76038012A SNJ54LS 258BFK 76038012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76038012A SNJ54LS 258BFK 7603801EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7603801EA SNJ54LS258BJ 7603801EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7603801EA SNJ54LS258BJ 7603801FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7603801FA SNJ54LS258BW 7603801FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7603801FA SNJ54LS258BW 8002301EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8002301EA SNJ54S258J 8002301EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8002301EA SNJ54S258J Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) 8002301FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 8002301FA SNJ54S258W 8002301FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 8002301FA SNJ54S258W JM38510/07906BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 07906BEA JM38510/07906BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 07906BEA JM38510/07906BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 07906BFA JM38510/07906BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 07906BFA JM38510/30906B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 30906B2A JM38510/30906B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 30906B2A JM38510/30906BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30906BEA JM38510/30906BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30906BEA JM38510/30906BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30906BFA JM38510/30906BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30906BFA M38510/07906BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 07906BEA M38510/07906BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 07906BEA M38510/07906BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 07906BFA M38510/07906BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 07906BFA M38510/30906B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 30906B2A M38510/30906B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 30906B2A Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) M38510/30906BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30906BEA M38510/30906BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30906BEA M38510/30906BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30906BFA M38510/30906BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30906BFA SN54LS257BJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS257BJ SN54LS257BJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS257BJ SN54LS258BJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS258BJ SN54LS258BJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS258BJ SN54S257J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54S257J SN54S257J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54S257J SN54S258J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54S258J SN54S258J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54S258J SN74LS257BD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS257B SN74LS257BD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS257B SN74LS257BDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS257B SN74LS257BDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS257B SN74LS257BDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS257B SN74LS257BDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS257B SN74LS257BDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS257B Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 25-Sep-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) SN74LS257BDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS257B SN74LS257BDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS257B SN74LS257BDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS257B SN74LS257BDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS257B SN74LS257BDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS257B SN74LS257BN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS257BN SN74LS257BN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS257BN SN74LS257BN3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74LS257BN3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74LS257BNE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS257BN SN74LS257BNE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS257BN SN74LS257BNSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS257B SN74LS257BNSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS257B SN74LS257BNSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS257B SN74LS257BNSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS257B SN74LS257BNSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS257B SN74LS257BNSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS257B SN74LS258BD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS258B SN74LS258BD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS258B Addendum-Page 4 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) SN74LS258BDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS258B SN74LS258BDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS258B SN74LS258BDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS258B SN74LS258BDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS258B SN74LS258BDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS258B SN74LS258BDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS258B SN74LS258BDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS258B SN74LS258BDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS258B SN74LS258BDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS258B SN74LS258BDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS258B SN74LS258BN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS258BN SN74LS258BN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS258BN SN74LS258BN3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74LS258BN3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74LS258BNE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS258BN SN74LS258BNE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS258BN SN74S257N NRND PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74S257N SN74S257N NRND PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74S257N SN74S257N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74S257N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 Addendum-Page 5 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) SN74S257NE4 NRND PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74S257N SN74S257NE4 NRND PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74S257N SN74S258DR OBSOLETE SOIC D 16 TBD Call TI Call TI 0 to 70 SN74S258DR OBSOLETE SOIC D 16 TBD Call TI Call TI 0 to 70 SN74S258N OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74S258N OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74S258N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74S258N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SNJ54LS257BFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS 257BFK SNJ54LS257BFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS 257BFK SNJ54LS257BJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7603701EA SNJ54LS257BJ SNJ54LS257BJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7603701EA SNJ54LS257BJ SNJ54LS257BW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7603701FA SNJ54LS257BW SNJ54LS257BW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7603701FA SNJ54LS257BW SNJ54LS258BFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76038012A SNJ54LS 258BFK SNJ54LS258BFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76038012A SNJ54LS 258BFK SNJ54LS258BJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7603801EA SNJ54LS258BJ SNJ54LS258BJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7603801EA SNJ54LS258BJ SNJ54LS258BW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7603801FA SNJ54LS258BW SNJ54LS258BW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7603801FA SNJ54LS258BW Addendum-Page 6 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) SNJ54S257FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54S 257FK SNJ54S257FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54S 257FK SNJ54S257J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54S257J SNJ54S257J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54S257J SNJ54S257W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54S257W SNJ54S257W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54S257W SNJ54S258FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54S 258FK SNJ54S258FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54S 258FK SNJ54S258J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8002301EA SNJ54S258J SNJ54S258J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8002301EA SNJ54S258J SNJ54S258W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 8002301FA SNJ54S258W SNJ54S258W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 8002301FA SNJ54S258W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Addendum-Page 7 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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OTHER QUALIFIED VERSIONS OF SN54LS257B, SN54LS257B-SP, SN54LS258B, SN54S257, SN54S258, SN74LS257B, SN74LS258B, SN74S257, SN74S258 : • Catalog: SN74LS257B, SN54LS257B, SN74LS258B, SN74S257, SN74S258 • Military: SN54LS257B, SN54LS258B, SN54S257, SN54S258 • Space: SN54LS257B-SP NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications • Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 8 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74LS257BDR Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN74LS257BNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74LS258BDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS257BDR SOIC D 16 2500 333.2 345.9 28.6 SN74LS257BNSR SO NS 16 2000 367.0 367.0 38.0 SN74LS258BDR SOIC D 16 2500 333.2 345.9 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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