TI SN74LVC2G17-EP

SN74LVC2G17-EP
DUAL SCHMITT-TRIGGER BUFFER
www.ti.com
SCES683 – JANUARY 2007
FEATURES
•
•
•
•
•
•
•
•
•
•
•
(1)
Controlled Baseline
– One Assembly/Test Site, One Fabrication
Site
Enhanced Diminishing Manufacturing Sources
(DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree (1)
Customer-Specific Configuration Control Can
Be Supported Along With Major-Change
Approval
Supports 5-V VCC Operation
Inputs Accept Voltages to 5.5 V
Max tpd of 5.4 ns at 3.3 V
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
•
•
•
•
Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 1000-V Charged-Device Model (C101)
DCK PACKAGE
(TOP VIEW)
1A
1
6
1Y
GND
2
5
VCC
2A
3
4
2Y
Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
DESCRIPTION/ORDERING INFORMATION
This dual Schmitt-trigger buffer is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC2G17 contains two buffers and performs the Boolean function Y = A. The device functions as two
independent buffers, but because of Schmitt action, it may have different input threshold levels for positive-going
(VT+) and negative-going (VT–) signals.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
–55°C to 125°C
(1)
(2)
PACKAGE (1)
ORDERABLE PART NUMBER
SOT (SC-70) – DCK
Reel of 3000
SN74LVC2G17MDCKREP
TOP-SIDE MARKING (2)
BZV
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DCK: The actual top-side marking has one additional character that designates the assembly/test site. Pin 1 identifier indicates
solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
(EACH INVERTER)
INPUT
A
OUTPUT
Y
H
H
L
L
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
SN74LVC2G17-EP
DUAL SCHMITT-TRIGGER BUFFER
www.ti.com
SCES683 – JANUARY 2007
LOGIC DIAGRAM (POSITIVE LOGIC)
1A
2A
1
6
3
4
1Y
2Y
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage range
–0.5
6.5
V
VI
Input voltage range (2)
–0.5
6.5
V
VO
Voltage range applied to any output in the high-impedance or power-off state (2)
–0.5
6.5
V
–0.5
VCC + 0.5
state (2) (3)
VO
Voltage range applied to any output in the high or low
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
Continuous current through VCC or GND
θJA
Package thermal impedance (4)
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
DBV package
165
DCK package
259
–65
V
°C/W
°C
150
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCC is provided in the recommended operating conditions table.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions (1) (2)
VCC
Supply voltage
VI
Input voltage
VO
Output voltage
IOH
Operating
High-level output current
MIN
MAX
1.65
5.5
V
0
5.5
V
0
VCC
V
VCC = 1.65 V
–4
VCC = 2.3 V
–8
–16
VCC = 3 V
–32
VCC = 1.65 V
4
VCC = 2.3 V
Low-level output current
8
16
VCC = 3 V
(1)
(2)
2
Operating free-air temperature
mA
24
VCC = 4.5 V
TA
mA
–24
VCC = 4.5 V
IOL
UNIT
32
–55
125
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of
overall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging.
Submit Documentation Feedback
SN74LVC2G17-EP
DUAL SCHMITT-TRIGGER BUFFER
www.ti.com
SCES683 – JANUARY 2007
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
VT+
Positive-going input
threshold voltage
VT–
Negative-going input
threshold voltage
∆VT
Hysteresis
(VT+ – VT–)
IOH = –100 µA
VOH
1
1.7
3V
1.3
2.2
4.5 V
1.9
3.1
5.5 V
2.2
3.7
1.65 V
0.19
0.7
2.3 V
0.25
1
3V
0.45
1.3
4.5 V
0.9
2
5.5 V
1.4
2.5
1.65 V
0.3
1.15
2.3 V
0.4
1.2
3V
0.4
1.5
4.5 V
0.6
1.90
5.5 V
0.7
2.0
1.2
1.9
3V
IOL = 100 µA
1.65 V to 5.5 V
0.1
IOL = 4 mA
1.65 V
0.45
IOL = 8 mA
2.3 V
0.3
0.4
VI = 5.5 V or GND,
IO = 0
∆ICC
One input at VCC – 0.6 V,
Other inputs at VCC or GND
Ci
VI = VCC or GND
V
0.55
4.5 V
VI or VO = 5.5 V
V
3.8
3V
ICC
V
2.3
4.5 V
Ioff
V
V
2.4
IOH = –32 mA
VI = 5.5 V or GND
UNIT
VCC – 0.1
2.3 V
IOL = 32 mA
(1)
2.3 V
IOH = –8 mA
IOL = 24 mA
A input
1.4
1.65 V
IOL = 16 mA
II
0.7
1.65 V to 5.5 V
IOH = –24 mA
MAX
1.65 V
IOH = –4 mA
IOH = –16 mA
VOL
MIN TYP (1)
0.55
0 to 5.5 V
±5
µA
0
±10
µA
1.65 V to 5.5 V
10
µA
3 V to 5.5 V
500
µA
3.3 V
4
pF
All typical values are at VCC = 3.3 V, TA = 25°C.
Submit Documentation Feedback
3
SN74LVC2G17-EP
DUAL SCHMITT-TRIGGER BUFFER
www.ti.com
SCES683 – JANUARY 2007
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
A
Y
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
3.9
13
1.9
8.7
2.2
7.4
1.5
6.3
UNIT
ns
Operating Characteristics
TA = 25°C
PARAMETER
Cpd
4
Power dissipation capacitance
TEST CONDITIONS
f = 10 MHz
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
VCC = 5 V
TYP
TYP
TYP
TYP
17
18
19
21
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UNIT
pF
SN74LVC2G17-EP
DUAL SCHMITT-TRIGGER BUFFER
www.ti.com
SCES683 – JANUARY 2007
PARAMETER MEASUREMENT INFORMATION
VLOAD
S1
RL
From Output
Under Test
Open
TEST
GND
CL
(see Note A)
S1
Open
VLOAD
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
RL
GND
LOAD CIRCUIT
INPUTS
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
VI
tr/tf
VCC
VCC
3V
VCC
£2 ns
£2 ns
£2.5 ns
£2.5 ns
VM
VLOAD
CL
RL
VD
VCC/2
VCC/2
1.5 V
VCC/2
2 × VCC
2 × VCC
6V
2 × VCC
30 pF
30 pF
50 pF
50 pF
1 kW
500 W
500 W
500 W
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tW
tsu
VI
Input
VM
VM
th
VI
Data Input
VM
VM
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VM
Input
VM
0V
tPLH
VM
VM
VOL
tPHL
VM
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
tPLZ
VLOAD/2
VM
tPZH
VOH
Output
VM
tPZL
tPHL
VOH
Output
VI
Output
Control
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Waveform 2
S1 at GND
(see Note B)
VOL + VD
VOL
tPHZ
VM
VOH – VD
VOH
»0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
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5
PACKAGE OPTION ADDENDUM
www.ti.com
11-Feb-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
CLVC2G17MDCKREPG4
ACTIVE
SC70
DCK
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G17MDCKREP
ACTIVE
SC70
DCK
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
V62/07617-01XE
ACTIVE
SC70
DCK
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(3)
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVC2G17-EP :
• Catalog: SN74LVC2G17
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Feb-2012
• Automotive: SN74LVC2G17-Q1
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Apr-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74LVC2G17MDCKREP
Package Package Pins
Type Drawing
SC70
DCK
6
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
3000
180.0
8.4
Pack Materials-Page 1
2.25
B0
(mm)
K0
(mm)
P1
(mm)
2.4
1.22
4.0
W
Pin1
(mm) Quadrant
8.0
Q3
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Apr-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LVC2G17MDCKREP
SC70
DCK
6
3000
202.0
201.0
28.0
Pack Materials-Page 2
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