SN74LVC2G17-EP DUAL SCHMITT-TRIGGER BUFFER www.ti.com SCES683 – JANUARY 2007 FEATURES • • • • • • • • • • • (1) Controlled Baseline – One Assembly/Test Site, One Fabrication Site Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree (1) Customer-Specific Configuration Control Can Be Supported Along With Major-Change Approval Supports 5-V VCC Operation Inputs Accept Voltages to 5.5 V Max tpd of 5.4 ns at 3.3 V Low Power Consumption, 10-µA Max ICC ±24-mA Output Drive at 3.3 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C • • • • Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 1000-V Charged-Device Model (C101) DCK PACKAGE (TOP VIEW) 1A 1 6 1Y GND 2 5 VCC 2A 3 4 2Y Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. DESCRIPTION/ORDERING INFORMATION This dual Schmitt-trigger buffer is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC2G17 contains two buffers and performs the Boolean function Y = A. The device functions as two independent buffers, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION TA –55°C to 125°C (1) (2) PACKAGE (1) ORDERABLE PART NUMBER SOT (SC-70) – DCK Reel of 3000 SN74LVC2G17MDCKREP TOP-SIDE MARKING (2) BZV Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DCK: The actual top-side marking has one additional character that designates the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). FUNCTION TABLE (EACH INVERTER) INPUT A OUTPUT Y H H L L Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007, Texas Instruments Incorporated SN74LVC2G17-EP DUAL SCHMITT-TRIGGER BUFFER www.ti.com SCES683 – JANUARY 2007 LOGIC DIAGRAM (POSITIVE LOGIC) 1A 2A 1 6 3 4 1Y 2Y Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage range –0.5 6.5 V VI Input voltage range (2) –0.5 6.5 V VO Voltage range applied to any output in the high-impedance or power-off state (2) –0.5 6.5 V –0.5 VCC + 0.5 state (2) (3) VO Voltage range applied to any output in the high or low IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through VCC or GND θJA Package thermal impedance (4) Tstg Storage temperature range (1) (2) (3) (4) DBV package 165 DCK package 259 –65 V °C/W °C 150 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) (2) VCC Supply voltage VI Input voltage VO Output voltage IOH Operating High-level output current MIN MAX 1.65 5.5 V 0 5.5 V 0 VCC V VCC = 1.65 V –4 VCC = 2.3 V –8 –16 VCC = 3 V –32 VCC = 1.65 V 4 VCC = 2.3 V Low-level output current 8 16 VCC = 3 V (1) (2) 2 Operating free-air temperature mA 24 VCC = 4.5 V TA mA –24 VCC = 4.5 V IOL UNIT 32 –55 125 °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of overall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging. Submit Documentation Feedback SN74LVC2G17-EP DUAL SCHMITT-TRIGGER BUFFER www.ti.com SCES683 – JANUARY 2007 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC VT+ Positive-going input threshold voltage VT– Negative-going input threshold voltage ∆VT Hysteresis (VT+ – VT–) IOH = –100 µA VOH 1 1.7 3V 1.3 2.2 4.5 V 1.9 3.1 5.5 V 2.2 3.7 1.65 V 0.19 0.7 2.3 V 0.25 1 3V 0.45 1.3 4.5 V 0.9 2 5.5 V 1.4 2.5 1.65 V 0.3 1.15 2.3 V 0.4 1.2 3V 0.4 1.5 4.5 V 0.6 1.90 5.5 V 0.7 2.0 1.2 1.9 3V IOL = 100 µA 1.65 V to 5.5 V 0.1 IOL = 4 mA 1.65 V 0.45 IOL = 8 mA 2.3 V 0.3 0.4 VI = 5.5 V or GND, IO = 0 ∆ICC One input at VCC – 0.6 V, Other inputs at VCC or GND Ci VI = VCC or GND V 0.55 4.5 V VI or VO = 5.5 V V 3.8 3V ICC V 2.3 4.5 V Ioff V V 2.4 IOH = –32 mA VI = 5.5 V or GND UNIT VCC – 0.1 2.3 V IOL = 32 mA (1) 2.3 V IOH = –8 mA IOL = 24 mA A input 1.4 1.65 V IOL = 16 mA II 0.7 1.65 V to 5.5 V IOH = –24 mA MAX 1.65 V IOH = –4 mA IOH = –16 mA VOL MIN TYP (1) 0.55 0 to 5.5 V ±5 µA 0 ±10 µA 1.65 V to 5.5 V 10 µA 3 V to 5.5 V 500 µA 3.3 V 4 pF All typical values are at VCC = 3.3 V, TA = 25°C. Submit Documentation Feedback 3 SN74LVC2G17-EP DUAL SCHMITT-TRIGGER BUFFER www.ti.com SCES683 – JANUARY 2007 Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A Y VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V MIN MAX MIN MAX MIN MAX MIN MAX 3.9 13 1.9 8.7 2.2 7.4 1.5 6.3 UNIT ns Operating Characteristics TA = 25°C PARAMETER Cpd 4 Power dissipation capacitance TEST CONDITIONS f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V TYP TYP TYP TYP 17 18 19 21 Submit Documentation Feedback UNIT pF SN74LVC2G17-EP DUAL SCHMITT-TRIGGER BUFFER www.ti.com SCES683 – JANUARY 2007 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test Open TEST GND CL (see Note A) S1 Open VLOAD tPLH/tPHL tPLZ/tPZL tPHZ/tPZH RL GND LOAD CIRCUIT INPUTS VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5 V ± 0.5 V VI tr/tf VCC VCC 3V VCC £2 ns £2 ns £2.5 ns £2.5 ns VM VLOAD CL RL VD VCC/2 VCC/2 1.5 V VCC/2 2 × VCC 2 × VCC 6V 2 × VCC 30 pF 30 pF 50 pF 50 pF 1 kW 500 W 500 W 500 W 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tW tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH VM VM VOL tPHL VM VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPLH tPLZ VLOAD/2 VM tPZH VOH Output VM tPZL tPHL VOH Output VI Output Control VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) VOL + VD VOL tPHZ VM VOH – VD VOH »0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms Submit Documentation Feedback 5 PACKAGE OPTION ADDENDUM www.ti.com 11-Feb-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp CLVC2G17MDCKREPG4 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC2G17MDCKREP ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM V62/07617-01XE ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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OTHER QUALIFIED VERSIONS OF SN74LVC2G17-EP : • Catalog: SN74LVC2G17 Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 11-Feb-2012 • Automotive: SN74LVC2G17-Q1 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 27-Apr-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74LVC2G17MDCKREP Package Package Pins Type Drawing SC70 DCK 6 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 3000 180.0 8.4 Pack Materials-Page 1 2.25 B0 (mm) K0 (mm) P1 (mm) 2.4 1.22 4.0 W Pin1 (mm) Quadrant 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 27-Apr-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LVC2G17MDCKREP SC70 DCK 6 3000 202.0 201.0 28.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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