TI AM26LS31MW883

DS26LS31MQML
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SNOSAM5B – AUGUST 2005 – REVISED APRIL 2013
DS26LS31MQML Quad High Speed Differential Line Driver
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FEATURES
DESCRIPTION
•
•
•
The DS26LS31MQML is a quad differential line driver
designed for digital data transmission over balanced
lines. The DS26LS31MQML meets all the
requirements of EIA Standard RS-422 and Federal
Standard 1020. It is designed to provide unipolar
differential drive to twisted-pair or parallel-wire
transmission lines.
1
2
•
•
•
•
•
Operation from Single 5V Supply
Outputs Won't Load Line When VCC = 0V
Four Line Drivers in One Package for
Maximum Package Density
Output Short-Circuit Protection
Complementary Outputs
Meets the Requirements of EIA Standard RS422
Pin Compatible with AM26LS31
Glitch Free Power Up/Down
The circuit provides an enable and disable function
common to all four drivers. The DS26LS31MQML
features TRI-STATE outputs and logically ANDed
complementary outputs. The inputs are all LS
compatible and are all one unit load.
The DS26LS31 features a power up/down protection
circuit which keeps the output in a high impedance
state (TRI-STATE) during power up or down
preventing erroneous glitches on the transmission
lines.
Logic and Connection Diagrams
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2013, Texas Instruments Incorporated
DS26LS31MQML
SNOSAM5B – AUGUST 2005 – REVISED APRIL 2013
www.ti.com
Top View
Figure 1. CDIP Package
See Package Numbers NAJ0020A, NFE0016A, NAD0016A
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1)
Supply Voltage
7V
Input Voltage
7V
Output Voltage
5.5V
−0.25 to 6V
Output Voltage (Power OFF)
Maximum Power Dissipation at 25°C (2)
NFE0016A Package
1400 mW
NAJ0020A Package
1600 mW
NAD0016A Package
850 mW
Junction Temperature (TJ)
+150°C
Thermal Resistance, Junction-to-Ambient
θJA
NFE0016A Package
94°C/W derate above +25°C at 10.6 mW/°C
NAJ0020A Package
83°C/W derate above +25°C at 12 mW/°C
NAD0016A Package
163°C/W derate above +25°C at 6.1 mW/°C
Thermal Resistance, Junction-to-Case
θJC
NFE0016A Package
16°C/W
NAJ0020A Package
19°C/W
NAD0016A Package
14°C/W
ESD Tolerance
(1)
(2)
2500V
“Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be specified. They are not meant to imply
that the devices should be operated at these limits. The tables of “Electrical Characteristics” provide conditions for actual device
operation.
Derate CDIP = 11.5 mW/°C, LCCC = 13mW/°C, CLGA = 7.4mW/°C above 25°C.
Recommended Operating Conditions
Supply Voltage, VCC
4.5 V to 5.5 V
−55°C to +125°C
Temperature, TA
2
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SNOSAM5B – AUGUST 2005 – REVISED APRIL 2013
Radiation Features
DS26LS31MEFQML
300 Krads (Si)
DS26LS31MJFQML
300 Krads (Si)
DS26LS31MJFQMLV
300 Krads (Si)
DS26LS31MWFQML
300 Krads (Si)
DS26LS31MWFQMLV
300 Krads (Si)
Quality Conformance Inspection
MIL-STD-883, Method 5005 - Group A
Subgroup
Description
Temp (°C)
1
Static tests at
+25
2
Static tests at
+125
3
Static tests at
-55
4
Dynamic tests at
+25
5
Dynamic tests at
+125
6
Dynamic tests at
-55
7
Functional tests at
+25
8A
Functional tests at
+125
8B
Functional tests at
-55
9
Switching tests at
+25
10
Switching tests at
+125
11
Switching tests at
-55
DS26LS31M - SMD, QMLV & RH Electrical Characteristics DC Parameters
The following conditions apply, unless otherwise specified. +V = 5V, VCM = 0V. (1)
Parameter
Test Conditions
VIH
Logical "1" Input Voltage
VCC = 4.5V
VIL
Logical "0" Input Voltage
VCC = 5.5V
Notes
Min
See and (2)
(3)
2
See (2) and
.8
(3)
(3)
VOH
Logical "1" Output Voltage
VCC = 4.5V, IOH = -20mA
See
VOL
Logical "0" Output Voltage
VCC = 4.5V, IOL = 20mA
See (3)
(3)
Max
2.5
Unit
Subgroups
V
1, 2, 3
V
1, 2, 3
V
1, 2, 3
.5
V
1, 2, 3
IIH
Logical "1" Input Current
VCC = 5.5V, VIN= 2.7V
See
-2.0
20
uA
1, 2, 3
IIL
Logical "0" Input Current
VCC = 5.5V, VIN = .4V
See (3)
100
-360
uA
1, 2, 3
II
Input Reverse Current
VCC = 5.5V, VIN = 7V
See (3)
-.01
.1
mA
1, 2, 3
VCC = 5.5V, VO = .5V
See
(3)
-20
uA
1, 2, 3
VCC = 5.5V, VO = 2.5V
See (3)
20
uA
1, 2, 3
-1.5
V
1, 2, 3
-150
mA
1, 2, 3
80
mA
1, 2, 3
IO
TRI-STATE Output Current
VIC
Input Clamp Voltage
VCC = 4.5V, IIN = -18mA
See (3)
IOS
Output Short Circuit Current
VCC = 5.5V
See (3)
ICC
Power Supply Current
VCC = 5.5V, All Outputs Disabled or
Active
See (3)
(1)
(2)
(3)
-30
Pre and post irradiation limits are identical to those listed under AC and DC electrical characteristics. These parts may be dose rate
sensitive in a space environment and demonstrate enhanced low dose rate effect. Radiation end point limits for the noted parameters
are ensured only for the conditions as specified in MIL-STD 883, Method 1019, Condition A.
Parameter tested go-no-go only.
Subgroups 1, 2 and 9, 10: Power dissipation must be externally controlled at elevated temperatures.
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SNOSAM5B – AUGUST 2005 – REVISED APRIL 2013
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DS26LS31M - SMD, QMLV and RH Electrical Characteristics AC Parameters - Propagation Delay
Time
The following conditions apply, unless otherwise specified. VCC = 5V, VIN = 1.3V to VO = 1.3V, V (pulse) = 0 to 3V. (1)
Parameter
Test Conditions
Notes
tPLH
Input to Output
CL = 30 pF
See (2)
tPHL
Input to Output
CL = 30 pF
See (2)
tSkew
Output to Output
CL = 30 pF
See (2)
S2 Open, Enable, CL = 10 pF
See (2)
tPLZ
tPHZ
tPZL
tPZH
(1)
(2)
Min
Enable to Output
S2 Open, Enable, CL = 10 pF
See (2)
S1 Open, Enable, CL = 10 pF
See (2)
S1 Open, Enable, CL = 10 pF
See (2)
S2 Open, Enable, CL = 30 pF
See (2)
S2 Open, Enable, CL = 30 pF
See (2)
Enable to Output
Enable to Output
S1 Open, Enable, CL = 30 pF
See (2)
S1 Open, Enable, CL = 30 pF
See (2)
Enable to Output
Subgroups
Max
Unit
20
ns
9
30
ns
10, 11
20
ns
9
30
ns
10, 11
6
ns
9
9
ns
10, 11
35
ns
9
53
ns
10, 11
35
ns
9
53
ns
10, 11
30
ns
9
45
ns
10, 11
30
ns
9
45
ns
10, 11
45
ns
9
68
ns
10, 11
45
ns
9
68
ns
10, 11
40
ns
9
60
ns
10, 11
40
ns
9
60
ns
10, 11
Pre and post irradiation limits are identical to those listed under AC and DC electrical characteristics. These parts may be dose rate
sensitive in a space environment and demonstrate enhanced low dose rate effect. Radiation end point limits for the noted parameters
are ensured only for the conditions as specified in MIL-STD 883, Method 1019, Condition A.
Subgroups 1, 2 and 9, 10: Power dissipation must be externally controlled at elevated temperatures.
DS26LS31M - SMD, QMLV and RH Electrical Characteristics DC Parameters - Drift Values
The following conditions apply, unless otherwise specified. Delta calculations performed on QMLV only devices after burn-in
and at Group B5.
Parameter
Test Conditions
Notes
Min
Max
Unit
Subgroups
VOL
Output Low Voltage
VCC = 4.5, IOL = 20 mA
See (1)
-50
50
mV
1
VOH
Output High Voltage
VCC = 4.5, IOH = -20 mA
See (1)
-250
250
mV
1
Power Supply Current
VCC = 5.5, All outputs disabled or
active
See (1)
-8
8
mA
1
Max
Unit
Subgroups
V
1, 2, 3
V
1, 2, 3
V
1, 2, 3
ICC
(1)
Subgroups 1, 2 and 9, 10: Power dissipation must be externally controlled at elevated temperatures.
DS26LS31M - 883 Electrical Characteristics DC Parameters
Parameter
VIH
Logical "1" Input Voltage
VIL
Logical "0" Input Voltage
VOH
Logical "1" Output Voltage
(1)
(2)
4
Test Conditions
Notes
See (1) and
(2)
Min
2
See (1) and
.8
(2)
VCC = 4.5V, IOH = -20mA
See (2)
2.5
Parameter tested go-no-go only.
Subgroups 1, 2 and 9, 10: Power dissipation must be externally controlled at elevated temperatures.
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DS26LS31MQML
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SNOSAM5B – AUGUST 2005 – REVISED APRIL 2013
DS26LS31M - 883 Electrical Characteristics DC Parameters (continued)
Parameter
Test Conditions
Notes
Min
Max
Unit
Subgroups
VOL
Logical "0" Output Voltage
VCC = 4.5V, IOL = 20mA
See (2)
.5
V
1, 2, 3
IIH
Logical "1" Input Current
VCC = 5.5V, VIN = 2.7V
See (2)
20
uA
1, 2, 3
(2)
IIL
Logical "0" Input Current
VCC = 5.5V, VIN = .4V
See
-200
uA
1, 2, 3
II
Input Reverse Current
VCC = 5.5V, VIN = 7V
See (2)
.1
mA
1, 2, 3
VCC = 5.5V, VO = .5V
See (2)
-20
uA
1, 2, 3
20
uA
1, 2, 3
-1.5
V
1, 2, 3
mA
1, 2, 3
IO
TRI-STATE Output Current
VCC = 5.5V, VO = 2.5V
See
VIC
Input Clamp Voltage
VCC = 4.5V, IIN = -18mA
See (2)
IOS (min)
Output Short Circuit Current
VCC = 5.5V
See (2)
Output Short Circuit Current
VCC = 5.5V
See
(2)
-150
mA
1, 2, 3
Power Supply Current
VCC = 5.5V, All Outputs Disabled or
Active
See
(2)
60
mA
1, 2, 3
IOS (max)
ICC
(2)
-30
DS26LS31M - 883 Electrical Characteristics AC Parameters - Propagation Delay Time
The following conditions apply, unless otherwise specified. VCC = 5V, CL = 50pF or equivalent impedance provided by diode
load.
Parameter
tPLH
Input to Output
tPHL
Input to Output
tSkew
Output to Output
Test Conditions
(2)
See (1) and
(2)
See (1) and
(2)
Enable to Output
S2 Open, /Enable
S1 Open, Enable
tPHZ
Enable to Output
S1 Open, /Enable
S2 Open, Enable
tPZL
Enable to Output
S2 Open, /Enable
S1 Open, Enable
tPZH
Enable to Output
S1 Open, /Enable
(1)
(2)
Min
See (1) and
S2 Open, Enable
tPLZ
Notes
See (1) and
(2)
See (1) and
(2)
See (1) and
(2)
See (1) and
(2)
See (1) and
(2)
See (1) and
(2)
See (1) and
(2)
See (1) and
(2)
Subgroups
Max
Unit
15
ns
9
30
ns
10, 11.
15
ns
9
30
ns
10, 11.
6
ns
9
9
ns
10, 11.
35
ns
9
53
ns
10, 11.
35
ns
9
53
ns
10, 11.
25
ns
9
45
ns
10, 11.
25
ns
9
45
ns
10, 11.
30
ns
9
68
ns
10, 11.
30
ns
9
68
ns
10, 11.
30
ns
9
60
ns
10, 11.
30
ns
9
60
ns
10, 11.
Subgroups 1, 2 and 9, 10: Power dissipation must be externally controlled at elevated temperatures.
Subgroup 10 and 11 specified but not tested.
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DS26LS31MQML
SNOSAM5B – AUGUST 2005 – REVISED APRIL 2013
www.ti.com
AC TEST CIRCUIT AND SWITCHING TIME WAVEFORMS
S1 and S2 of load circuit are closed except where shown.
Figure 2. AC Test Circuit
f = 1 MHz, tr ≤ 15 ns, tf ≤ 6 ns
Figure 3. Propagation Delays
f = 1 MHz, tr ≤ 15 ns, tf ≤ 6 ns
Figure 4. Enable and Disable Times
TYPICAL APPLICATIONS
Figure 5. Two-Wire Balanced System, RS-422
RT is optional although highly recommended to reduce reflection.
6
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SNOSAM5B – AUGUST 2005 – REVISED APRIL 2013
Typical Performance Characteristics
DS26LS31MQMLCN Unloaded IC
vs
Frequency
vs
TA
DS26LS31MQML ICC
vs
VCC vs TA
Figure 6.
Figure 7.
DS26LS31MQMLCN VOH
vs
IOH vs TA
DS26LS31MQMLCN VOL
vs
IOL vs TA
Figure 8.
Figure 9.
DS26LS31MQMLCN VOD
vs
IO vs TA
Figure 10.
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DS26LS31MQML
SNOSAM5B – AUGUST 2005 – REVISED APRIL 2013
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REVISION HISTORY
Date
Released
Revision
8/04/05
A
3/01/06
4/15/2013
8
Section
New Release, Corporate format
Ordering Info. Table, Absolute Ratings,
Maximum Operating Conditions, New
Radiation Section. Typos in QMLV &
RH, 883 AC Electrical Characteristics
Parameters Column
Originator
Changes
R. Malone
2 MDS data sheets converted into a Corp. data
sheet format. Following MDS data sheets will
be Archived MDDS26LS31M-X-RH, Rev.2A0,
MNDS26LS31M-X, Rev. 0A0
A1
R. Malone
Added: Juction temp., Thermal Resistance θJA
and θJC. Added a Radiation Section. Changed:
Maximum Operating Conditions to
Recommended Operating Conditions, Enable
and Disable Time to Enable to Output. Revision
A will be archived.
B
TIS
Changed layout of National Data Sheet to TI
format
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PACKAGE OPTION ADDENDUM
www.ti.com
15-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
(3)
Top-Side Markings
(4)
5962-7802301VEA
ACTIVE
CDIP
NFE
16
25
TBD
Call TI
Call TI
-55 to 125
DS26LS31MJ-QMLV
5962-7802301VEA Q
AM26LS31MW/883
ACTIVE
CFP
NAD
16
19
TBD
Call TI
Call TI
-55 to 125
DS26LS31MW
/883 Q ACO
/883 Q >T
DS26LS31ME-SMD
ACTIVE
LCCC
NAJ
20
50
TBD
Call TI
Call TI
-55 to 125
DS26LS31ME
-SMD Q
5962-78023
01Q2A ACO
01Q2A >T
DS26LS31MJ-QMLV
ACTIVE
CDIP
NFE
16
25
TBD
Call TI
Call TI
-55 to 125
DS26LS31MJ-QMLV
5962-7802301VEA Q
DS26LS31MJ-SMD
ACTIVE
CDIP
NFE
16
25
TBD
Call TI
Call TI
-55 to 125
DS26LS31MJ-SMD
5962-7802301MEA Q
DS26LS31MJ/883
ACTIVE
CDIP
NFE
16
25
TBD
Call TI
Call TI
-55 to 125
DS26LS31MJ/883 Q
DS26LS31MW/883
ACTIVE
CFP
NAD
16
19
TBD
Call TI
Call TI
-55 to 125
DS26LS31MW
/883 Q ACO
/883 Q >T
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
(3)
15-Apr-2013
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF DS26LS31MQML, DS26LS31MQML-SP :
• Military: DS26LS31MQML
• Space: DS26LS31MQML-SP
NOTE: Qualified Version Definitions:
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 2
MECHANICAL DATA
NFE0016A
J0016A
J16A (REV L)
www.ti.com
MECHANICAL DATA
NAJ0020A
E20A (Rev F)
www.ti.com
MECHANICAL DATA
NAD0016A
W16A (Rev T)
www.ti.com
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