11-MD218B Version Issue Date File Name Total Page : A.003 : 2009-02-10 : SP-MD218B-A.003.doc : 17 130mA, 10Bit Current Sinking VCM Driver with I2C Interface 新竹市展業一路 9 號 7 樓之 1 SILICON TOUCH TECHNOLOGY INC. 9-4F-3, Prosperity Rd I, Science-Based Industrial Park Hsinchu, Taiwan, R.O.C. Tel：886-3-5727171 Fax：886-3-5727390 點晶科技股份有限公司 SILICON TOUCH TECHNOLOGY INC. 11-MD218B 130mA, 10-Bit Current Sinking VCM Driver with I2C Interface General Specifications The 11-MD218B is a VCM driver IC with I2C interface control that is capable of programmable output current sinking. It has a built-in internal voltage reference and operates in a wide supply voltage range from 2.4V to 5.5V. The DAC is controlled by a 2-wire I2C serial interface which operates in I2C fast mode (400 kHz). The 11-MD218B is designed for applications like image stabilization, auto-focus, and optical zoom in camera phones, digital still cameras, and other portable module devices. Features and Benefits z Programmable output current sinking z I2C serial interface z 10-BIT DAC resolution z 2.4V – 5.5V power supply z Low voltage control for digital pin PD, SDA, and SCL(i.e., VIH = 1.54V @ VDD = 2.8V) z Power down operation z Power on reset z Constant current control z Ultra small package: DFN10 (3*3*0.8 mm), WLCSP(0.99*1.87*0.5 mm) Ordering Information Part Number Package Marking 11-MD218B WLCSP WLCSP, 8Pin GXX* or HXX* DFN, 10Pin XXXX**G 11-MD218B DFN *XX means lot number **XXXX means lot number SP-MD218B-A.003.doc Version：A.003 Page：1 點晶科技股份有限公司 SILICON TOUCH TECHNOLOGY INC. Pin Assignment Pin Assignment of DFN10 (3*3*0.8 mm) Pin Descriptions 1. Pin NO. Pin Name Description 1 VDD 2 PD 3 NC 4 VSS 5 NC 6 NC 7 SDA I2C Interface Data 8 SCL I2C Interface Data 9 AGND Analog GND 10 SINK Analog Output : Output Current Sink Power Supply Pin Digital Input: Power Down Mode(High power down, Low operation) Ground Pin The I2C slave 7-bit address of 11-MD218B is 0001-1xx. SP-MD218B-A.003.doc Version：A.003 Page：2 點晶科技股份有限公司 SILICON TOUCH TECHNOLOGY INC. Pin Assignment of WLCSP (0.99*1.87*0.5mm) TOP View WL1 WL8 WL2 WL7 WL3 WL6 WL4 WL5 Pin NO. Pin Name Description WL1 SINK Programmable Sink Current WL2 AGND Current Sinking GND WL3 SCL I2C Interface Data WL4 SDA I2C Interface Data WL5 VSS Ground Pin WL6 VSS Ground Pin Wl7 PD IC Power Down Pin(Logic ‘H’: power down) WL8 VDD IC Power Pin Absolute Maximum Ratings Unless otherwise noted, TA= 25℃ Characteristic Symbol Rating Unit Supply Voltage VDD 5.5 V Input Voltage VIN VDD+0.4 V Maximum Sink Current ISINK 150 mA Operating Temperature Range TOPR -40 ~ 125 °C Storage Temperature Range TSTG -65 ~ 150 °C SP-MD218B-A.003.doc Version：A.003 Page：3 點晶科技股份有限公司 SILICON TOUCH TECHNOLOGY INC. Electrical Characteristic Unless otherwise noted, TA= 25℃, VDD = 2.8 V and VCM = 28.5Ω, 460uH. Item Sym. Limit Condition Unit Min. Typ. Max. 2.4 2.8 5.5 V Power Supply Supply Voltage VDD Supply Current IPD PD = H (Power down mode) - - 0.5 uA ( IDD ) IDD PD = L, I2C= logic H - - 0.1 mA PD, SDA, SCL digital control pin Input Voltage H VIH - 0.55*VDD - VDD+0.4 V Input Voltage L VIL - -0.4 - 0.2*VDD V Parameters DAC Resolution 10 DNL +/-0.8 +/-1 LSB INL +/-1 +/-5 LSB 5 uA Output Offset Current IOS Current Slew Rate SR Output Constant Current Settling Time ts Voltage Drop ΔV PD = L, I2C= logic H Bits 3 VDD = 2.8V, ISINK = 100mA ΔV = VSINK − VAGND (@ - mA/us 40 80 us 0.32 0.35 V ISINK = 80 mA) SP-MD218B-A.003.doc Version：A.003 Page：4 點晶科技股份有限公司 SILICON TOUCH TECHNOLOGY INC. Block Diagram (DFN10) PD VDD 2 1 Power ON Reset SCL 8 I2C Interface SDA Voltage Reference 10-Bit DAC Output Driver 10 SINK 7 4 9 VSS AGND SP-MD218B-A.003.doc Version：A.003 Page：5 點晶科技股份有限公司 SILICON TOUCH TECHNOLOGY INC. Terminology Resolution The DAC resolution is defined by the number of distinct analog levels corresponding to the number of bits it uses. N-bit resolution -> 2N distinct analog levels Differential Nonlinearity (DNL) error The variation in analog step sizes away from 1 LSB by any two adjacent codes. Usually, gain and offset errors have been removed. Integral Nonlinearity (INL) It is the deviation of actual transfer response from a straight line. Usually, INL error is referred to as the maximum INL error. SP-MD218B-A.003.doc Version：A.003 Page：6 點晶科技股份有限公司 SILICON TOUCH TECHNOLOGY INC. Data Format 11-MD218B Write Mode When in the write mode, data is written to the 11-MD218B and shifted step-by-step into the 16-bit input register. When all data has been loaded in and master signal receives a STOP condition, the loaded data in the input register is transferred to the DAC. 11-MD218B Read Mode When 11-MD218B is in the write mode, data is read back from IC to master in the same bit order. SP-MD218B-A.003.doc Version：A.003 Page：7 點晶科技股份有限公司 SILICON TOUCH TECHNOLOGY INC. Table MSB LSB 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 Serial Data Bits 7 Input Register R15 R14 R13 R12 R11 R10 R09 R08 R07 R06 R05 R04 R03 R02 R01 R00 SPD X D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 X X X X Function z SPD (Soft Power Down, 2nd standby mode): IC power down controlled by software. Regarding to all kinds of IC operation situations please refers to following table. z PD SPD IC status H - Power down L L IC Active H Soft power down X denotes “Don’t care/Unused”. SP-MD218B-A.003.doc Version：A.003 Page：8 點晶科技股份有限公司 SILICON TOUCH TECHNOLOGY INC. Performance Characteristics 1. DNL Plot Typical DNL Plot @VDD=2.8V, 25degree 2 1.5 1 DNL (LSB) 0.5 0 -0.5 -1 -1.5 -2 100 200 300 400 500 600 700 800 900 1000 800 900 1000 DIGITAL Code 2. INL Plot Typical INL Plot @VDD=2.8V, 25degree 2 1.5 1 INL (LSB) 0.5 0 -0.5 -1 -1.5 -2 100 200 300 400 500 600 700 DIGITAL Code SP-MD218B-A.003.doc Version：A.003 Page：9 點晶科技股份有限公司 SILICON TOUCH TECHNOLOGY INC. 3. Settling Time (VDD = 2.8V, VCM = 27Ohm with 430uH@500Hz, 550uH@1kHz, respectively, CL = 0.1uF @Temp. = 25) 4. Sink Current vs. Codes vs. Temp. Isink vs. Codes vs. Temp. 140 120 Isink (mA) 100 80 60 40 Temp. = -40 20 Temp. = 25 Temp. = 85 100 200 300 400 500 600 700 800 900 1000 DIGITAL Code SP-MD218B-A.003.doc Version：A.003 Page：10 點晶科技股份有限公司 SILICON TOUCH TECHNOLOGY INC. 5. Full-Scale Programmable Current vs. Temp. vs. VDD Full-Scale Current vs. VDD vs. Temp. 160 Temp. = -40 Temp. = 25 Temp. = 85 Full Scale Programmable Current (mA) 150 140 130 120 110 100 -40 -20 0 20 40 60 80 Temp. SP-MD218B-A.003.doc Version：A.003 Page：11 點晶科技股份有限公司 SILICON TOUCH TECHNOLOGY INC. Application Circuit CL= 0.1 F VCM VDD 1 F Rp 0.1 F IL Rp 1 11-MD218B SDA SCL I2C MASTER DEVICE I2C SLAVE DEVICE 7 VDD 10 SINK Output Driver I2C Interface 10-BIT DAC 8 VSS PD 2 AGND 4 9 PD = H (power down mode) PD = L (IC operation) Application Notes z The 11-MD218B is a constant current control IC for application in Auto-Focus. The supply voltage range VDD of 11-MD218B is from 2.4V to 5.5V. The input range of digital control pin PD, and digital I/O pins SCL and SDA, are defined such that logic “H” is from 0.55*VDD to VDD+0.4V and logic “L” is from –0.4V to 0.2*VDD. Therefore, the three digital pins are suitable controlled by 1.8V ISP. z The PD pin is the power down pin of 11-MD218B. Logic low level (PD = L) is for IC operation. On the other hand, its logic high level (PD = H) puts the chip into power down mode for power saving. It is recommended to keep PD at high level (PD = H) before operation to reach the maximum efficiency of power saving, especially for applications in portable devices. SP-MD218B-A.003.doc Version：A.003 Page：12 點晶科技股份有限公司 SILICON TOUCH TECHNOLOGY INC. z The I2C bus would not be well controlled by master if VDD of Driver IC is shutdown(i.e., not applying voltage on VDD pin) because of ESD diode turning on via P-diode of SDA/or SCL. To avoid the application issue, NOT to turn off VDD of driver IC during whole module operation. It could be controlled by PD pin via GPIO of ISP. The power consumption of Driver IC should be 1.4uW in the standby mode (PD = H). z In order to ensure the stability of output current, a compensation capacitance CL is suggested placing across the two terminals of VCM. The suggested value of CL is about 0.1~0.22uF and could be fine tuned for different VCM. SP-MD218B-A.003.doc Version：A.003 Page：13 點晶科技股份有限公司 SILICON TOUCH TECHNOLOGY INC. Package Specification (DFN-10) SYMBOL A A1 A3 b D D1 E E1 L e e1 MIN. 0.70 0.00 0.18 2.90 2.10 2.90 1.10 0.45 SP-MD218B-A.003.doc DIMENSION (mm) NOM. 0.75 0.02 0.203 REF 0.25 3.00 2.20 3.00 1.20 0.55 0.50 BASIC 2.00 BASIC MAX. 0.80 0.05 MIN. 28 0 0.30 3.10 2.30 3.10 1.30 0.65 7 114 83 114 86 18 Version：A.003 DIMENSION (mil) NOM. 30 0.8 8 REF 10 118 87 118 87 22 20 BASIC 80 BASIC MAX. 32 2 12 122 91 122 91 26 Page：14 點晶科技股份有限公司 SILICON TOUCH TECHNOLOGY INC. Package Specifications (WLCSP) Bottom View E A1 A A2 L1 D e1 b L2 e2 DIMENSION (mm) SYMBOL A A1 A2 b D E e1 e2 L1 L2 SP-MD218B-A.003.doc MIN. 0.445 0.17 0.275 0.24 1.83 0.95 0.160 0.220 NOM. 0.5 0.20 0.30 0.26 1.87 0.99 0.50 0.50 0.185 0.245 Version：A.003 MAX. 0.555 0.23 0.325 0.28 1.91 1.03 0.210 0.270 Page：15 點晶科技股份有限公司 SILICON TOUCH TECHNOLOGY INC. The products listed herein are designed for ordinary electronic applications, such as electrical appliances, audio-visual equipment, communications devices and so on. Hence, it is advisable that the devices should not be used in medical instruments, surgical implants, aerospace machinery, nuclear power control systems, disaster/crime-prevention equipment and the like. Misusing those products may directly or indirectly endanger human life, or cause injury and property loss. Silicon Touch Technology, Inc. will not take any responsibilities regarding the misusage of the products mentioned above. Anyone who purchases any products described herein with the above-mentioned intention or with such misused applications should accept full responsibility and indemnify. Silicon Touch Technology, Inc. and its distributors and all their officers and employees shall defend jointly and severally against any and all claims and litigation and all damages, cost and expenses associated with such intention and manipulation. SP-MD218B-A.003.doc Version：A.003 Page：16