FERRITE CHIP INDUCTORS L2520101R0M(a) (c) (b) (d) (e) L252010 SERIES (a) Series code (d) Tolerance code : M = ±20%, Y = ±30% (b) Dimension code (e) Internal Controller Number (c) Inductance code : 1R0 = 1.0uH 2. CONFIGURATION & DIMENSIONS : A D C B Unit:m/m A B C D 2.5 ±0.2 2.0 ±0.2 1.0 Max. 0.50 ±0.3 3. SCHEMATIC : 4. MATERIALS : b a Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.) (a) Body : Ferrite (b) Termination : Ag/Ni/Sn 5. GENERAL SPECIFICATION : a) Temp. rise : 40°C Max. b) Rated current : Base on temp. rise c) Storage temp. : -40°C to +105°C d) Operating temp. : -40°C to +105°C e) Resistance to solder heat : 260°C.10secs NOTE : Specifications subject to change without notice. Please check our website for latest information. 13.10.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 FERRITE CHIP INDUCTORS L252010 SERIES 6. ELECTRICAL CHARACTERISTICS : Inductance (µH) Test Frequency (MHz) Rated Current (mA) Max DC Resistance (ȍ) SRF (MHz) Min L2520101R0M- 1.0 ±20% 1 1500 0.10 ±30% 90 L2520101R5M- 1.5 ±20% 1 1400 0.12 ±30% 60 L2520102R2M- 2.2 ±20% 1 1300 0.14 ±30% 50 L2520103R3M- 3.3 ±20% 1 1200 0.18 ±30% 40 L2520104R7M- 4.7 ±20% 1 1000 0.23 ±30% 35 L2520106R8M- 6.8 ±20% 1 900 0.25 ±30% 30 L252010100M- 10 ±20% 1 800 0.30 ±30% 20 Part Number 6-1. INDUCTANCE VS. FREQUENCY CURVE : 6-2 INDUCTANCE-CURRENT CURVE : NOTE : Specifications subject to change without notice. Please check our website for latest information. 13.10.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 FERRITE CHIP INDUCTORS L252010 SERIES 7. RELIABILITY & TEST CONDITION : ITEM PERFORMANCE TEST CONDITION Operating Temperature -40~+105°C (Including self-temperature rise) Storage Temperature -40~+105°C Inductance Long storage conditions, please see the aplication notice Refer to standard electrical characteristics list DC Resistance HP4291, HP E4991+HP4287 +HP16192 HP4338 DC Power Supply, over rated current ,there will be some risk Rated Current Temperature Rise Test 40°C max. (ǻt) 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Solder Heat Resistance No mechanical damage Remaining terminal electrode : 75% min. Appearance: No significant abnormality. Inductance change: Within ± 10%. Preheat : 150°C, 60sec. Solder : Sn-Cu0.5 Solder Temperature : 260±5°C Flux for lead free : ROL0 Dip Time : 10±0.5sec. Preheating Dipping 260°C 150°C Solderability 60 seconds Natural cooling 10±0.5 seconds Preheat : 150°C, 60sec. Solder : Sn-Cu0.5 Solder Temperature : 245±5°C Flux for lead free : ROL0 Dip Time : 4±1sec. More than 95% of the terminal electrode should be covered with solder. Preheating Dipping 245°C 150°C Terminal Strength 60 seconds Natural cooling 4¡À1.0 seconds The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. Size L252010 Force (Kfg) 1.0 Time (sec) > 30 W Flexture Strength The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. Solder a chip on a test substrate, bend the substrate by 2mm (0.079in) and return. The duration of the applied forces shall be 60(+5) Sec 20(.787) Bending 45(1.772) 45(1.772) 40(1.575) 100(3.937) NOTE : Specifications subject to change without notice. Please check our website for latest information. 13.10.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 FERRITE CHIP INDUCTORS L252010 SERIES 7. RELIABILITY & TEST CONDITION : ITEM Bending Strength PERFORMANCE TEST CONDITION The ferrite should not be damaged by forces applied on the right condition. 1.0(0.039) R0.5(0.02) Size mm (inches) P-Kgf L252010 1.40(0.055) 1.0 Chip A Random Vibration Test Drop Appearance : Cracking, Chipping & any other defects harmful to the characteristics should not be allowed. Inductance: within±30% No mechanical damage Inductance change : within±10% Frequency : 10-55-10Hz for 15 min. Amplitude : 1.52mm Directions & times : X, Y, Z directions for 15 mins This cycle shall be performed 12 times in each of three mutually perpendicular direction.(Total 9 hours) Drop 10 times on a concrete floor from a height of 75cm. Life testing at high temperature Appearance : No damage. Inductance : Within ±10% of initial value. Temperature Temperature : 105±2°C Applied Current : rated current Duration : 1008±12hrs Measured at room temperature after placing for 2 to 3hrs. Humidity Humidity : 90~95% RH. Temperature : 40±2°C Duration : 504±8hrs Measured at room temperature after placing for 2 to 3hrs. Appearance : No damage. Inductance : Within ±10% of initial value. Thermal Shock Phase Temperature (°C) Times (min.) 1 -40±2°C 30±5 2 room temp <0.5 3 +105±2°C 30±5 Condition for 1 cycle Step1 : -40±2°C 30±5 min. Step2 : +105±5°C 30±5 min. Number of cycles : 500 Measured at room temperature after placing for 2 to 3hrs. Measured : 500 times Low temperature storage test Appearance : No damage. Inductance : Within ±30% of initial value. Temperature : -40±2°C Duration : 500±8hrs Measured at room temperature after placing for 2 to 3hrs. NOTE : Specifications subject to change without notice. Please check our website for latest information. 13.10.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 FERRITE CHIP INDUCTORS L252010 SERIES 8. SOLDERING AND MOUNTING : 8-1. Recommended PC Board Pattern 3.9 PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. 1.5 1.5 8-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 8-2.1 Lead Free Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 8-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : d) 1.0mm tip diameter (max) a) Preheat circuit and products to 150°C. e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 350°C tip temperature (max) f) Limit soldering time to 4~5 secs. c) Never contact the ceramic with the iron tip TEMPERATURE °C Preheating Soldering 20 ~ 40s Natural cooling 260 217 200 150 60~150s 60~180s 480s max. 25 Time (sec) Reflow 3 times max. Figure 1. Re-flow Soldering (Pb Free) TEMPERATURE °C Preheating Soldering 4~5 sec (max.) 350 Natural cooling 330 150 Over 1min. Gradual Cooling Figure 2. Hand Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 13.10.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 FERRITE CHIP INDUCTORS L252010 SERIES 8-3. Solder Volume Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4. Upper limit t Recommendable Figure 4 9. PACKAGING INFORMATION : 9-1. Reel Dimension A 2±0.5 Type A(mm) B(mm) C(mm) 7" x 8mm 9±0.5 60.0±2.0 D(mm) 13.5±0.5 D B C R10.5 R1.9 13.5±0.5 178.0±2.0 R0.5 120° 7" x 8mm 9-2 Tape Dimension / 8mm Material : Plastic D:1.5+0.1 Po:4±0.1 t P A D1:1±0.1 Ao Size P(mm) L252010 4.0±0.1 Bo(mm) Ao(mm) 2.74±0.10 2.29±0.10 Ko(mm) t(mm) 1.45 max 0.3 max Bo W:8.0±0.1 A F:3.5±0.05 E:1.75±0.1 P2:2±0.05 Ko Section A-A 9-3. Packaging Quantity Chip Size L252010 Reel 3000 NOTE : Specifications subject to change without notice. Please check our website for latest information. 13.10.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 FERRITE CHIP INDUCTORS L252010 SERIES 9-4. Tearing Off Force The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. F 165° to 180° Top cover tape Room Temp. (°C) Room Humidity (%) Room atm (hPa) Tearing Speed (mm/min) 5~35 45~85 860~1060 300 Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : 40°C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 13.10.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7