A29L004A Series 512K X 8 Bit CMOS 3.0 Volt-only, Preliminary Boot Sector Flash Memory Document Title 512K X 8 Bit CMOS 3.0 Volt-only, Boot Sector Flash Memory Revision History Rev. 0.0 History Issue Date Initial issue March 9, 2005 PRELIMINARY (March, 2005, Version 0.0) Remark Preliminary AMIC Technology, Corp. A29L004A Series 512K X 8 Bit CMOS 3.0 Volt-only, Preliminary Boot Sector Flash Memory Features Single power supply operation - Full voltage range: 2.7 to 3.6 volt read and write operations for battery-powered applications - Regulated voltage range: 3.0 to 3.6 volt read and write operations for compatibility with high performance 3.3 volt microprocessors Access times: - 70/90 (max.) Current: - 4 mA typical active read current - 20 mA typical program/erase current - 200 nA typical CMOS standby - 200 nA Automatic Sleep Mode current Flexible sector architecture - 16 Kbyte/ 8 KbyteX2/ 32 Kbyte/ 64 KbyteX7 sectors - Any combination of sectors can be erased - Supports full chip erase - Sector protection: A hardware method of protecting sectors to prevent any inadvertent program or erase operations within that sector. Temporary Sector Unprotect feature allows code changes in previously locked sectors Unlock Bypass Program Command - Reduces overall programming time when issuing multiple program command sequence Top or bottom boot block configurations available Embedded Algorithms - Embedded Erase algorithm will automatically erase the entire chip or any combination of designated sectors and verify the erased sectors - Embedded Program algorithm automatically writes and verifies data at specified addresses Typical 100,000 program/erase cycles per sector 20-year data retention at 125°C - Reliable operation for the life of the system Compatible with JEDEC-standards - Pinout and software compatible with single-power-supply Flash memory standard - Superior inadvertent write protection Data Polling and toggle bits - Provides a software method of detecting completion of program or erase operations Ready / BUSY pin (RY / BY ) - Provides a hardware method of detecting completion of program or erase operations (not available on 32-pin PLCC & (s)TSOP packages) Erase Suspend/Erase Resume - Suspends a sector erase operation to read data from, or program data to, a non-erasing sector, then resumes the erase operation Hardware reset pin ( RESET ) - Hardware method to reset the device to reading array data (not available on 32 pin PLCC & (s)TSOP packages) Package options - 40-pin TSOP (forward type), 32-pin PLCC or (s)TSOP (forward type) General Description The A29L004A is a 4Mbit, 3.0 volt-only Flash memory organized as 524,288 bytes of 8 bits. The 8 bits of data appear on I/O0 - I/O7. The A29L004A is offered in 40-pin TSOP, 32-pin PLCC or (s)TSOP packages. This device is designed to be programmed in-system with the standard system 3.0 volt VCC supply. Additional 12.0 volt VPP is not required for in-system write or erase operations. However, the A29L004A can also be programmed in standard EPROM programmers. The A29L004A has the first toggle bit, I/O6, which indicates whether an Embedded Program or Erase is in progress, or it is in the Erase Suspend. Besides the I/O6 toggle bit, the A29L004A has a second toggle bit, I/O2, to indicate whether the addressed sector is being selected for erase. The A29L004A also offers the ability to program in the Erase Suspend mode. The standard A29L004A offers access times of 70 and 90ns, allowing high-speed microprocessors to operate without wait states. To eliminate bus contention the device has separate chip enable ( CE ), write enable ( WE ) and output enable ( OE ) controls. The device requires only a single 3.0 volt power supply for both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations. PRELIMINARY (March, 2005, Version 0.0) The A29L004A is entirely software command set compatible with the JEDEC single-power-supply Flash standard. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state-machine that controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from other Flash or EPROM devices. Device programming occurs by writing the proper program command sequence. This initiates the Embedded Program algorithm - an internal algorithm that automatically times the program pulse widths and verifies proper program margin. Device erasure occurs by executing the proper erase command sequence. This initiates the Embedded Erase algorithm - an internal algorithm that automatically preprograms the array (if it is not already programmed) before executing the erase operation. During erase, the device automatically times the erase pulse widths and verifies proper erase margin. The Unlock Bypass mode facilitates faster programming times by requiring only two write cycles to program data instead of four. The host system can detect whether a program or erase operation is complete by observing the RY / BY pin (not 1 AMIC Technology, Corp. A29L004A Series available on 32-pin PLCC & (s)TSOP), or by reading the I/O7 ( Data Polling) and I/O6 (toggle) status bits. After a program or erase cycle has been completed, the device is ready to read array data or accept another command. The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. The A29L004A is fully erased when shipped from the factory. The hardware sector protection feature disables operations for both program and erase in any combination of the sectors of memory. This can be achieved via programming equipment. The Erase Suspend/Erase Resume feature enables the user to put erase on hold for any period of time to read data from, or program data to, any other sector that is not selected for erasure. True background erase can thus be achieved. The hardware RESET pin terminates any operation in progress and resets the internal state machine to reading array data (not available on 32-pin PLCC & (s)TSOP). The RESET pin may be tied to the system reset circuitry. A system reset would thus also reset the device, enabling the system microprocessor to read the boot-up firmware from the Flash memory. The device offers two power-saving features. When addresses have been stable for a specified amount of time, the device enters the automatic sleep mode. The system can also place the device into the standby mode. Power consumption is greatly reduced in both these modes. Pin Configurations 40-pin TSOP A16 1 40 A17 A15 2 39 VSS A14 3 38 NC A13 4 37 NC A12 5 36 A10 A11 6 35 I/O7 A9 7 34 I/O6 A8 8 33 I/O5 WE 9 32 I/O4 31 VCC A29L004AW RESET 10 NC 11 30 VCC RY/BY 12 29 NC A18 13 28 I/O3 A7 14 27 I/O2 A6 15 26 I/O1 A5 16 25 I/O0 A4 17 24 OE A3 18 23 VSS A2 19 22 CE A1 20 21 A0 WE VCC A17 30 31 32 A16 A18 1 A15 32-pin TSOP (8mm X 20mm) 32-pin sTSOP (8mm X 13.4mm) 32-pin sTSOP (8mm X 14mm) 2 3 4 A12 PLCC A7 5 29 A14 A6 6 28 A13 A5 7 27 A8 A4 8 26 A9 A3 9 25 A11 A2 10 24 OE A1 11 23 A10 A0 12 22 CE I/O0 13 21 I/O7 PRELIMINARY 15 16 17 18 19 20 I/O2 GND I/O3 I/O4 I/O5 I/O6 I/O1 14 A29L004AL (March, 2005, Version 0.0) A11 A9 A8 A13 A14 A17 WE VCC A18 A16 A15 A12 A7 A6 A5 A4 2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A29L004AV (8mm X 20mm) A29L004AX (8mm X 13.4mm) A29L004AY (8mm X 14mm) 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CE I/O7 I/O6 I/O5 I/O4 I/O3 GND I/O2 I/O1 I/O0 A0 A1 A2 A3 AMIC Technology, Corp. A29L004A Series Block Diagram RY/BY (N/A 32-pin PLCC, (s)TSOP) VCC VSS I/O 0 - I/O 7 Sector Switches Input/Output Buffers Erase Voltage Generator RESET (N/A 32-pin PLCC, (s)TSOP) State Control WE PGM Voltage Generator Command Register Chip Enable Output Enable Logic CE OE VCC Detector Address Latch STB Timer A0-A18 STB Data Latch Y-Decoder Y-Gating X-decoder Cell Matrix Pin Descriptions Pin No. A0 - A18 Address Inputs I/O0 - I/O7 Data Inputs/Outputs CE Chip Enable WE Write Enable OE Output Enable RESET Hardware Reset (N/A 32-pin PLCC, (s)TSOP) RY/ BY Ready/ BUSY - Output (N/A 32-pin PLCC, (s)TSOP) VSS Ground VCC Power Supply NC PRELIMINARY Description (March, 2005, Version 0.0) Pin not connected internally 3 AMIC Technology, Corp. A29L004A Series Absolute Maximum Ratings* *Comments Storage Temperature Plastic Packages . …… .0°C to + 70°C Ambient Temperature with Power Applied…… 0°C to + 70°C Voltage with Respect to Ground VCC (Note 1) . . . . . . . . . . . . . . . . . . . …... . . . -0.5V to +4.0V A9, OE & RESET (Note 2) . . . . . . . . . . ….. . -0.5 to +12.5V All other pins (Note 1) . . . . . . . . . . . ….. -0.5V to VCC + 0.5V Output Short Circuit Current (Note 3) . . . . . . . ….. … 200mA Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to this device. These are stress ratings only. Functional operation of this device at these or any other conditions above those indicated in the operational sections of these specification is not implied or intended. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability. Notes: Operating Ranges 1. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions, input or I/O pins may undershoot VSS to -2.0V for periods of up to 20ns. Maximum DC voltage on input and I/O pins is VCC +0.5V. During voltage transitions, input or I/O pins may overshoot to VCC +2.0V for periods up to 20ns. 2. Minimum DC input voltage on A9, OE and RESET is - Commercial (C) Devices Ambient Temperature (TA) . . . . . . . ….. . . . . . . 0°C to +70°C VCC Supply Voltages VCC for all devices . . . . . . . . . . . . . . . ….. . . +2.7V to +3.6V Operating ranges define those limits between which the functionally of the device is guaranteed. 0.5V. During voltage transitions, A9, OE and RESET may overshoot VSS to -2.0V for periods of up to 20ns. Maximum DC input voltage on A9 is +12.5V which may overshoot to 14.0V for periods up to 20ns. ( RESET is N/A on 32-pin PLCC & (s)TSOP) 3. No more than one output is shorted at a time. Duration of the short circuit should not be greater than one second. Device Bus Operations This section describes the requirements and use of the device bus operations, which are initiated through the internal command register. The command register itself does not occupy any addressable memory location. The register is composed of latches that store the commands, along with the address and data information needed to execute the command. The contents of the register serve as inputs to the internal state machine. The state machine outputs dictate the function of the device. The appropriate device bus operations table lists the inputs and control levels required, and the resulting output. The following subsections describe each of these operations in further detail. Table 1. A29L004A Device Bus Operations Operation A0 – A18 I/O0 - I/O7 H AIN DOUT L H AIN DIN X X VCC ± 0.3 V X High-Z L H H H X High-Z X X X L X High-Z L H L VID Sector Address, A6=L, A1=H, A0=L DIN Sector Unprotect (See Note 2) L H L VID Sector Address, A6=H, A1=H, A0=L DIN Temporary Sector Unprotect X X X VID AIN DIN CE OE WE Read L L H Write L H VCC ± 0.3 V Output Disable Hardware Reset Sector Protect (See Note 2) RESET (N/A 32-pin PLCC, (s)TSOP) CMOS Standby Legend: L = Logic Low = VIL, H = Logic High = VIH, VID = 12.0 ± 0.5V, X = Don't Care, DIN = Data In, DOUT = Data Out, AIN = Address In Notes: 1. See the “Sector Protection/Unprotection” section and Temporary Sector Unprotect for more information. 2. This function is not available on 32-pin PLCC & (s)TSOP packages. PRELIMINARY (March, 2005, Version 0.0) 4 AMIC Technology, Corp. A29L004A Series Requirements for Reading Array Data The device enters the CMOS standby mode when the CE & RESET pins ( CE only on 32-pin PLCC & (s)TSOP packages) are both held at VCC ± 0.3V. (Note that this is a more restricted voltage range than VIH.) If CE and RESET (N/A on 32-pin PLCC & (s)TSOP packages) are held at VIH, but not within VCC ± 0.3V, the device will be in the standby mode, but the standby current will be greater. The device requires the standard access time (tCE) before it is ready to read data. If the device is deselected during erasure or programming, the device draws active current until the operation is completed. ICC3 and ICC4 in the DC Characteristics tables represent the standby current specification. To read array data from the outputs, the system must drive the CE and OE pins to VIL. CE is the power control and selects the device. OE is the output control and gates array data to the output pins. WE should remain at VIH all the time during read operation. The internal state machine is set for reading array data upon device power-up, or after a hardware reset. This ensures that no spurious alteration of the memory content occurs during the power transition. No command is necessary in this mode to obtain array data. Standard microprocessor read cycles that assert valid addresses on the device address inputs produce valid data on the device data outputs. The device remains enabled for read access until the command register contents are altered. See "Reading Array Data" for more information. Refer to the AC Read Operations table for timing specifications and to the Read Operations Timings diagram for the timing waveforms, lCC1 in the DC Characteristics table represents the active current specification for reading array data. Automatic Sleep Mode The automatic sleep mode minimizes Flash device energy consumption. The device automatically enables this mode when addresses remain stable for tACC +30ns. The automatic sleep mode is independent of the CE , WE and OE control signals. Standard address access timings provide new data when addresses are changed. While in sleep mode, output data is latched and always available to the system. ICC4 in the DC Characteristics table represents the automatic sleep mode current specification. Writing Commands/Command Sequences To write a command or command sequence (which includes programming data to the device and erasing sectors of memory), the system must drive WE and CE to VIL, and OE to VIH. The device features an Unlock Bypass mode to Output Disable Mode facilitate faster programming. Once the device enters the Unlock Bypass mode, only two write cycles are required to program a byte, instead of four. The “Byte Program Command Sequence” section has details on programming data to the device using both standard and Unlock Bypass command sequence. An erase operation can erase one sector, multiple sectors, or the entire device. The Sector Address Tables indicate the address range that each sector occupies. A "sector address" consists of the address inputs required to uniquely select a sector. See the "Command Definitions" section for details on erasing a sector or the entire chip, or suspending/resuming the erase operation. When the OE input is at VIH, output from the device is disabled. The output pins are placed in the high impedance state. RESET : Hardware Reset Pin (N/A on 32-pin PLCC & (s)TSOP packages) The RESET pin provides a hardware method of resetting the device to reading array data. When the system drives the RESET pin low for at least a period of tRP, the device immediately terminates any operation in progress, tristates all data output pins, and ignores all read/write attempts for the duration of the RESET pulse. The device also resets the internal state machine to reading array data. The operation that was interrupted should be reinitiated once the device is ready to accept another command sequence, to ensure data integrity. Current is reduced for the duration of the RESET pulse. When RESET is held at VSS ± 0.3V, the device draws CMOS standby current (ICC4 ). If RESET is held at VIL but not within VSS ± 0.3V, the standby current will be greater. The RESET pin may be tied to the system reset circuitry. A system reset would thus also reset the Flash memory, enabling the system to read the boot-up firmware from the Flash memory. If RESET is asserted during a program or erase operation, After the system writes the autoselect command sequence, the device enters the autoselect mode. The system can then read autoselect codes from the internal register (which is separate from the memory array) on I/O7 - I/O0. Standard read cycle timings apply in this mode. Refer to the "Autoselect Mode" and "Autoselect Command Sequence" sections for more information. ICC2 in the DC Characteristics table represents the active current specification for the write mode. The "AC Characteristics" section contains timing specification tables and timing diagrams for write operations. Program and Erase Operation Status During an erase or program operation, the system may check the status of the operation by reading the status bits on I/O7 I/O0. Standard read cycle timings and ICC read specifications apply. Refer to "Write Operation Status" for more information, and to each AC Characteristics section for timing diagrams. the RY/ BY pin remains a “0” (busy) until the internal reset operation is complete, which requires a time tREADY (during Embedded Algorithms). The system can thus monitor RY/ BY to determine whether the reset operation is complete. If RESET is asserted when a program or erase operation is not Standby Mode executing (RY/ BY pin is “1”), the reset operation is completed within a time of tREADY (not during Embedded Algorithms). The system can read data tRH after the RESET pin return to VIH. Refer to the AC Characteristics tables for RESET parameters and diagram. When the system is not reading or writing to the device, it can place the device in the standby mode. In this mode, current consumption is greatly reduced, and the outputs are placed in the high impedance state, independent of the OE input. PRELIMINARY (March, 2005, Version 0.0) 5 AMIC Technology, Corp. A29L004A Series Table 2. A29L004A Top Boot Block Sector Address Table Sector A18 A17 A16 A15 A14 A13 Sector Size (Kbytes) Address Range (in hexadecimal) SA0 0 0 0 X X X 64 00000h - 0FFFFh SA1 0 0 1 X X X 64 10000h - 1FFFFh SA2 0 1 0 X X X 64 20000h - 2FFFFh SA3 0 1 1 X X X 64 30000h - 3FFFFh SA4 1 0 0 X X X 64 40000h - 4FFFFh SA5 1 0 1 X X X 64 50000h - 5FFFFh SA6 1 1 0 X X X 64 60000h - 6FFFFh SA7 1 1 1 0 X X 32 70000h - 77FFFh SA8 1 1 1 1 0 0 8 78000h - 79FFFh SA9 1 1 1 1 0 1 8 7A000h - 7BFFFh SA10 1 1 1 1 1 X 16 7C000h - 7FFFFh A13 Sector Size (Kbytes) Address Range Table 3. A29L004A Bottom Boot Block Sector Address Table Sector A18 A17 SA0 0 0 SA1 0 0 SA2 0 0 SA3 0 SA4 A16 A14 (in hexadecimal) 0 0 X 16 00000h - 03FFFh 0 1 0 8 04000h - 05FFFh 0 0 1 1 8 06000h - 07FFFh 0 0 1 X X 32 08000h - 0FFFFh 0 0 1 X X X 64 10000h - 1FFFFh SA5 0 1 0 X X X 64 20000h - 2FFFFh SA6 0 1 1 X X X 64 30000h - 3FFFFh SA7 1 0 0 X X X 64 40000h - 4FFFFh SA8 1 0 1 X X X 64 50000h - 5FFFFh SA9 1 1 0 X X X 64 60000h - 6FFFFh SA10 1 1 1 X X X 64 70000h - 7FFFFh PRELIMINARY 0 A15 0 (March, 2005, Version 0.0) 6 AMIC Technology, Corp. A29L004A Series Autoselect Mode The autoselect mode provides manufacturer and device identification, and sector protection verification, through identifier codes output on I/O7 - I/O0. This mode is primarily intended for programming equipment to automatically match a device to be programmed with its corresponding programming algorithm. However, the autoselect codes can also be accessed in-system through the command register. When using programming equipment, the autoselect mode requires VID (11.5V to 12.5 V) on address pin A9. Address pins A6, A1, and A0 must be as shown in Autoselect Codes (High Voltage Method) table. In addition, when verifying sector protection, the sector address must appear on the appropriate highest order address bits. Refer to the corresponding Sector Address Tables. The Command Definitions table shows the remaining address bits that are don't care. When all necessary bits have been set as required, the programming equipment may then read the corresponding identifier code on I/O7 - I/O0.To access the autoselect codes in-system, the host system can issue the autoselect command via the command register, as shown in the Command Definitions table. This method does not require VID. See "Command Definitions" for details on using the autoselect mode. Table 4. A29L004A Autoselect Codes (High Voltage Method) Description Manufacturer ID: AMIC Device ID: A29L004A CE OE WE A18 to A13 A12 to A10 A9 A8 to A7 A6 A5 to A2 A1 A0 I/O7 to I/O0 L L H X X VID X L X L L 37h L L H X X VID X L X L H 34h L L H X X VID X L X L H B5h L L H X X VID X L X H H 7Fh (Top Boot Block) Device ID: A29L004A (Bottom Boot Block) Continuation ID Sector Protection Verification L L H SA X VID X L X H L 01h (protected) 00h (unprotected) L=Logic Low= VIL, H=Logic High=VIH, SA=Sector Address, X=Don’t Care. Note: The autoselect codes may also be accessed in-system via command sequences. PRELIMINARY (March, 2005, Version 0.0) 7 AMIC Technology, Corp. A29L004A Series Sector Protection/Unprotection Temporary Sector Unprotect (N/A on 32-pin PLCC & (s)TSOP packages) The hardware sector protection feature disables both program and erase operations in any sector. The hardware sector unprotection feature re-enables both program and erase operations in previously protected sectors. It is possible to determine whether a sector is protected or unprotected. See “Autoselect Mode” for details. Sector protection / unprotection can be implemented via two methods. The primary method requires VID on the RESET pin only (N/A on 32-pin PLCC & (s)TSOP packages), and can be implemented either in-system or via programming equipment. Figure 2 shows the algorithm and the Sector Protect / Unprotect Timing Diagram illustrates the timing waveforms for this feature. This method uses standard microprocessor bus cycle timing. For sector unprotect, all unprotected sectors must first be protected prior to the first sector unprotect write cycle. The alternate method must be implemented using programming equipment. The procedure requires a high voltage (VID) on address pin A9 and the control pins. The device is shipped with all sectors unprotected. It is possible to determine whether a sector is protected or unprotected. See "Autoselect Mode" for details. This feature allows temporary unprotection of previous protected sectors to change data in-system. The Sector Unprotect mode is activated by setting the RESET pin to VID. During this mode, formerly protected sectors can be programmed or erased by selecting the sector addresses. Once VID is removed from the RESET pin, all the previously protected sectors are protected again. Figure 1 shows the algorithm, and the Temporary Sector Unprotect diagram shows the timing waveforms, for this feature. START RESET = VID (Note 1) Hardware Data Protection Perform Erase or Program Operations The requirement of command unlocking sequence for programming or erasing provides data protection against inadvertent writes (refer to the Command Definitions table). In addition, the following hardware data protection measures prevent accidental erasure or programming, which might otherwise be caused by spurious system level signals during VCC power-up transitions, or from system noise. The device is powered up to read array data to avoid accidentally writing data to the array. RESET = VIH Write Pulse "Glitch" Protection Temporary Sector Unprotect Completed (Note 2) Noise pulses of less than 5ns (typical) on OE , CE or WE do not initiate a write cycle. Logical Inhibit Write cycles are inhibited by holding any one of OE =VIL, CE = VIH or WE = VIH. To initiate a write cycle, CE and Notes: 1. All protected sectors unprotected. 2. All previously protected sectors are protected once again. WE must be a logical zero while OE is a logical one. Figure 1. Temporary Sector Unprotect Operation Power-Up Write Inhibit If WE = CE = VIL and OE = VIH during power up, the device does not accept commands on the rising edge of WE . The internal state machine is automatically reset to reading array data on the initial power-up. PRELIMINARY (March, 2005, Version 0.0) 8 AMIC Technology, Corp. A29L004A Series START START Protect all sectors: The indicated portion of the sector protect algorithm must be performed for all unprotected sectors prior to issuing the first sector unprotect address PLSCNT=1 RESET=V ID Wait 1 us No Temporary Sector Unprotect Mode PLSCNT=1 RESET=V ID Wait 1 us No First Write Cycle=60h? First Write Cycle=60h? Temporary Sector Unprotect Mode Yes Yes Set up sector address All sectors protected? Sector Protect Write 60h to sector address with A6=0, A1=1, A0=0 Yes Set up first sector address Sector Unprotect: Write 60h to sector address with A6=1, A1=1, A0=0 Wait 150 us Verify Sector Protect: Write 40h to sector address with A6=0, A1=1, A0=0 Increment PLSCNT No Reset PLSCNT=1 Wait 15 ms Read from sector address with A6=0, A1=1, A0=0 Verify Sector Unprotect : Write 40h to sector address with A6=1, A1=1, A0=0 Increment PLSCNT No PLSCNT =25? No Read from sector address with A6=1, A1=1, A0=0 Data=01h? No Set up next sector address Yes Yes Protect another sector? Device failed PLSCNT= 1000? Yes No Remove V ID from RESET Device failed Write reset command Sector Protect complete Yes Yes No Sector Protect Algorithm Data=00h? Last sector verified? No Yes Remove V ID from RESET Sector Unprotect Algorithm Write reset Command Sector Unprotect complete Figure 2. In-System Sector Protect/Unprotect Algorithms PRELIMINARY (March, 2005, Version 0.0) 9 AMIC Technology, Corp. A29L004A Series Command Definitions Autoselect Command Sequence Writing specific address and data commands or sequences into the command register initiates device operations. The Command Definitions table defines the valid register command sequences. Writing incorrect address and data values or writing them in the improper sequence resets the device to reading array data. All addresses are latched on the falling edge of WE or CE , whichever happens later. All data is latched on the rising edge of WE or CE , whichever happens first. Refer to the appropriate timing diagrams in the "AC Characteristics" section. The autoselect command sequence allows the host system to access the manufacturer and devices codes, and determine whether or not a sector is protected. The Command Definitions table shows the address and data requirements. This method is an alternative to that shown in the Autoselect Codes (High Voltage Method) table, which is intended for PROM programmers and requires VID on address bit A9. The autoselect command sequence is initiated by writing two unlock cycles, followed by the autoselect command. The device then enters the autoselect mode, and the system may read at any address any number of times, without initiating another command sequence. A read cycle at address XX00h retrieves the manufacturer code and another read cycle at XX03h retrieves the continuation code. A read cycle at address XX01h returns the device code. A read cycle containing a sector address (SA) and the address 02h in returns 01h if that sector is protected, or 00h if it is unprotected. Refer to the Sector Address tables for valid sector addresses. The system must write the reset command to exit the autoselect mode and return to reading array data. Reading Array Data The device is automatically set to reading array data after device power-up. No commands are required to retrieve data. The device is also ready to read array data after completing an Embedded Program or Embedded Erase algorithm. After the device accepts an Erase Suspend command, the device enters the Erase Suspend mode. The system can read array data using the standard read timings, except that if it reads at an address within erase-suspended sectors, the device outputs status data. After completing a programming operation in the Erase Suspend mode, the system may once again read array data with the same exception. See "Erase Suspend/Erase Resume Commands" for more information on this mode. The system must issue the reset command to re-enable the device for reading array data if I/O5 goes high, or while in the autoselect mode. See the "Reset Command" section, next. See also "Requirements for Reading Array Data" in the "Device Bus Operations" section for more information. The Read Operations table provides the read parameters, and Read Operation Timings diagram shows the timing diagram. Byte Program Command Sequence Programming is a four-bus-cycle operation. The program command sequence is initiated by writing two unlock write cycles, followed by the program set-up command. The program address and data are written next, which in turn initiate the Embedded Program algorithm. The system is not required to provide further controls or timings. The device automatically provides internally generated program pulses and verify the programmed cell margin. Table 5 shows the address and data requirements for the byte program command sequence. When the Embedded Program algorithm is complete, the device then returns to reading array data and addresses are longer latched. The system can determine the status of the program operation by using I/O7, I/O6, or RY/ BY (N/A on 32pin PLCC & (s)TSOP packages). See “Write Operation Status” for information on these status bits. Any commands written to the device during the Embedded Program Algorithm are ignored. Note that a hardware reset immediately terminates the programming operation. The Byte Program command sequence should be reinitiated once the device has reset to reading array data, to ensure data integrity. Programming is allowed in any sequence and across sector boundaries. A bit cannot be programmed from a “0” back to a “1”. Attempting to do so may halt the operation and set I/O5 to “1”, or cause the Data Polling algorithm to indicate the operation was successful. However, a succeeding read will show that the data is still “0”. Only erase operations can convert a “0” to a “1”. Reset Command Writing the reset command to the device resets the device to reading array data. Address bits are don't care for this command. The reset command may be written between the sequence cycles in an erase command sequence before erasing begins. This resets the device to reading array data. Once erasure begins, however, the device ignores reset commands until the operation is complete. The reset command may be written between the sequence cycles in a program command sequence before programming begins. This resets the device to reading array data (also applies to programming in Erase Suspend mode). Once programming begins, however, the device ignores reset commands until the operation is complete. The reset command may be written between the sequence cycles in an autoselect command sequence. Once in the autoselect mode, the reset command must be written to return to reading array data (also applies to autoselect during Erase Suspend). If I/O5 goes high during a program or erase operation, writing the reset command returns the device to reading array data (also applies during Erase Suspend). PRELIMINARY (March, 2005, Version 0.0) 10 AMIC Technology, Corp. A29L004A Series 00h. Addresses are don’t care for both cycle. The device returns to reading array data. Figure 3 illustrates the algorithm for the program operation. See the Erase/Program Operations in “AC Characteristics” for parameters, and to Program Operation Timings for timing diagrams. START Write Program Command Sequence Embedded Program algorithm in progress Chip Erase Command Sequence Chip erase is a six-bus-cycle operation. The chip erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. Two additional unlock write cycles are then followed by the chip erase command, which in turn invokes the Embedded Erase algorithm. The device does not require the system to preprogram prior to erase. The Embedded Erase algorithm automatically preprograms and verifies the entire memory for an all zero data pattern prior to electrical erase. The system is not required to provide any controls or timings during these operations. The Command Definitions table shows the address and data requirements for the chip erase command sequence. Any commands written to the chip during the Embedded Erase algorithm are ignored. The system can determine the status of the erase operation by using I/O7, I/O6, or I/O2. See "Write Operation Status" for information on these status bits. When the Embedded Erase algorithm is complete, the device returns to reading array data and addresses are no longer latched. Figure 4 illustrates the algorithm for the erase operation. See the Erase/Program Operations tables in "AC Characteristics" for parameters, and to the Chip/Sector Erase Operation Timings for timing waveforms. Data Poll from System Verify Data ? No Yes Increment Address Last Address ? Yes Programming Completed Sector Erase Command Sequence Sector erase is a six-bus-cycle operation. The sector erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. Two additional unlock write cycles are then followed by the address of the sector to be erased, and the sector erase command. The Command Definitions table shows the address and data requirements for the sector erase command sequence. The device does not require the system to preprogram the memory prior to erase. The Embedded Erase algorithm automatically programs and verifies the sector for an all zero data pattern prior to electrical erase. The system is not required to provide any controls or timings during these operations. After the command sequence is written, a sector erase timeout of 50µs begins. During the time-out period, additional sector addresses and sector erase commands may be written. Loading the sector erase buffer may be done in any sequence, and the number of sectors may be from one sector to all sectors. The time between these additional cycles must be less than 50µs, otherwise the last address and command might not be accepted, and erasure may begin. It is recommended that processor interrupts be disabled during this time to ensure all commands are accepted. The interrupts can be re-enabled after the last Sector Erase command is written. If the time between additional sector erase commands can be assumed to be less than 50µs, the system need not monitor I/O3. Any command other than Sector Erase or Erase Suspend during the time-out period resets the device to reading array data. The system must rewrite the command sequence and any additional sector addresses and commands. Note : See the appropriate Command Definitions table for program command sequence. Figure 3. Program Operation Unlock Bypass Command Sequence The unlock bypass feature allows the system to program bytes or words to the device faster than using the standard program command sequence. The unlock bypass command sequence is initiated by first writing two unlock cycles. This is followed by a third write cycle containing the unlock bypass command, 20h. The device then enters the unlock bypass mode. A two-cycle unlock bypass program command sequence is all that is required to program in this mode. The first cycle in this sequence contains the unlock bypass program command, A0h; the second cycle contains the program address and data. Additional data is programmed in the same manner. This mode dispenses with the initial two unlock cycles required in the standard program command sequence, resulting in faster total programming time. Table 5 shows the requirements for the command sequence. During the unlock bypass mode, only the Unlock Bypass Program and Unlock Bypass Reset commands are valid. To exit the unlock bypass mode, the system must issue the twocycle unlock bypass reset command sequence. The first cycle must contain the data 90h; the second cycle the data PRELIMINARY (March, 2005, Version 0.0) 11 AMIC Technology, Corp. A29L004A Series The system can monitor I/O3 to determine if the sector erase timer has timed out. (See the " I/O3: Sector Erase Timer" section.) The time-out begins from the rising edge of the final WE pulse in the command sequence. Once the sector erase operation has begun, only the Erase Suspend command is valid. All other commands are ignored. When the Embedded Erase algorithm is complete, the device returns to reading array data and addresses are no longer latched. The system can determine the status of the erase operation by using I/O7, I/O6, or I/O2. Refer to "Write Operation Status" for information on these status bits. 4 illustrates the algorithm for the erase operation. Refer to the Erase/Program Operations tables in the "AC Characteristics" section for parameters, and to the Sector Erase Operations Timing diagram for timing waveforms. The system may also write the autoselect command sequence when the device is in the Erase Suspend mode. The device allows reading autoselect codes even at addresses within erasing sectors, since the codes are not stored in the memory array. When the device exits the autoselect mode, the device reverts to the Erase Suspend mode, and is ready for another valid operation. See "Autoselect Command Sequence" for more information. The system must write the Erase Resume command (address bits are "don't care") to exit the erase suspend mode and continue the sector erase operation. Further writes of the Resume command are ignored. Another Erase Suspend command can be written after the device has resumed erasing. Erase Suspend/Erase Resume Commands START The Erase Suspend command allows the system to interrupt a sector erase operation and then read data from, or program data to, any sector not selected for erasure. This command is valid only during the sector erase operation, including the 50µs time-out period during the sector erase command sequence. The Erase Suspend command is ignored if written during the chip erase operation or Embedded Program algorithm. Writing the Erase Suspend command during the Sector Erase time-out immediately terminates the time-out period and suspends the erase operation. Addresses are "don't cares" when writing the Erase Suspend command. When the Erase Suspend command is written during a sector erase operation, the device requires a maximum of 20µs to suspend the erase operation. However, when the Erase Suspend command is written during the sector erase time-out, the device immediately terminates the time-out period and suspends the erase operation. After the erase operation has been suspended, the system can read array data from or program data to any sector not selected for erasure. (The device "erase suspends" all sectors selected for erasure.) Normal read and write timings and command definitions apply. Reading at any address within erase-suspended sectors produces status data on I/O7 - I/O0. The system can use I/O7, or I/O6 and I/O2 together, to determine if a sector is actively erasing or is erasesuspended. See "Write Operation Status" for information on these status bits. After an erase-suspended program operation is complete, the system can once again read array data within nonsuspended sectors. The system can determine the status of the program operation using the I/O7 or I/O6 status bits, just as in the standard program operation. See "Write Operation Status" for more information. PRELIMINARY (March, 2005, Version 0.0) Write Erase Command Sequence Data Poll from System Embedded Erase algorithm in progress No Data = FFh ? Yes Erasure Completed Note : 1. See the appropriate Command Definitions table for erase command sequences. 2. See "I/O3 : Sector Erase Timer" for more information. Figure 4. Erase Operation 12 AMIC Technology, Corp. A29L004A Series Command Sequence (Note 1) Cycles Table 5. A29L004A Command Definitions Bus Cycles (Notes 2 - 5) First Second Addr Data Addr Data Third Fourth 1 RA RD Reset (Note 7) 1 XXX F0 4 555 AA 2AA 55 555 90 X00 37 4 555 AA 2AA 55 555 90 X01 34 Bottom Boot Block 4 555 AA 2AA 55 555 90 X01 B5 Continuation ID 4 555 AA 2AA 55 555 90 4 555 AA 2AA 55 555 90 X02 XX01 Program 4 555 AA 2AA 55 555 A0 PA PD Unlock Bypass 3 555 AA 2AA 55 555 20 Autoselect (Note 8) Sixth Addr Data Addr Data Addr Data Addr Data Read (Note 6) Manufacturer ID Fifth Device ID, Top Boot Block Device ID, 7F (SA) XX00 Sector Protect Verify (Note 9) X03 Unlock Bypass Program (Note 10) 2 XXX A0 PA PD Unlock Bypass Reset (Note 11) 2 XXX 90 XXX 00 Chip Erase 6 555 AA 2AA 55 555 80 555 AA 2AA 55 555 10 Sector Erase 6 555 AA 2AA 55 555 80 555 AA 2AA 55 SA 30 Erase Suspend (Note 12) 1 XXX B0 Erase Resume (Note 13) 1 XXX 30 Legend: X = Don't care RA = Address of the memory location to be read. RD = Data read from location RA during read operation. PA = Address of the memory location to be programmed. Addresses latch on the falling edge of the WE or CE pulse, whichever happens later. PD = Data to be programmed at location PA. Data latches on the rising edge of WE or CE pulse, whichever happens first. SA = Address of the sector to be verified (in autoselect mode) or erased. Address bits A18 - A13 select a unique sector. Note: 1. See Table 1 for description of bus operations. 2. All values are in hexadecimal. 3. Except when reading array or autoselect data, all bus cycles are write operation. 4. Address bits A18 - A11 are don't cares for unlock and command cycles, unless SA or PA required. 5. No unlock or command cycles required when reading array data. 6. The Reset command is required to return to reading array data when device is in the autoselect mode, or if I/O5 goes high (while the device is providing status data). 7. The fourth cycle of the autoselect command sequence is a read cycle. 8. The data is 00h for an unprotected sector and 01h for a protected sector. See “Autoselect Command Sequence” for more information. 9. The Unlock Bypass command is required prior to the Unlock Bypass Program command. 10. The Unlock Bypass Reset command is required to return to reading array data when the device is in the unlock bypass mode. 11. The system may read and program in non-erasing sectors, or enter the autoselect mode, when in the Erase Suspend mode. 12. The Erase Resume command is valid only during the Erase Suspend mode. PRELIMINARY (March, 2005, Version 0.0) 13 AMIC Technology, Corp. A29L004A Series Write Operation Status START Several bits, I/O2, I/O3, I/O5, I/O6, I/O7, RY/ BY are provided in the A29L004A to determine the status of a write operation (RY/ BY pin is not available on 32-pin PLCC & (s)TSOP packages). Table 6 and the following subsections describe the functions of these status bits. I/O7, I/O6 and RY/ BY each offer a method for determining whether a program or erase operation is complete or in progress. These three bits are discussed first. Read I/O7-I/O0 Address = VA I/O7: Data Polling Yes The Data Polling bit, I/O7, indicates to the host system whether an Embedded Algorithm is in progress or completed, or whether the device is in Erase Suspend. Data Polling is I/O7 = Data ? valid after the rising edge of the final WE pulse in the program or erase command sequence. During the Embedded Program algorithm, the device outputs on I/O7 the complement of the datum programmed to I/O7. This I/O7 status also applies to programming during Erase Suspend. When the Embedded Program algorithm is complete, the device outputs the datum programmed to I/O7. The system must provide the program address to read valid status information on I/O7. If a program address falls within a protected sector, Data Polling on I/O7 is active for approximately 2µs, then the device returns to reading array data. During the Embedded Erase algorithm, Data Polling produces a "0" on I/O7. When the Embedded Erase algorithm is complete, or if the device enters the Erase Suspend mode, Data Polling produces a "1" on I/O7.This is analogous to the complement/true datum output described for the Embedded Program algorithm: the erase function changes all the bits in a sector to "1"; prior to this, the device outputs the "complement," or "0." The system must provide an address within any of the sectors selected for erasure to read valid status information on I/O7. After an erase command sequence is written, if all sectors selected for erasing are protected, Data Polling on I/O7 is active for approximately 100µs, then the device returns to reading array data. If not all selected sectors are protected, the Embedded Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. When the system detects I/O7 has changed from the complement to true data, it can read valid data at I/O7 - I/O0 on the following read cycles. This is because I/O7 may change asynchronously with I/O0 - I/O6 while Output Enable ( OE ) is asserted low. The Data Polling Timings (During Embedded Algorithms) in the "AC Characteristics" section illustrates this. Table 6 shows the outputs for Data Polling No No I/O5 = 1? Yes Read I/O7 - I/O0 Address = VA Yes I/O7 = Data ? No FAIL PASS Note : 1. VA = Valid address for programming. During a sector erase operation, a valid address is an address within any sector selected for erasure. During chip erase, a valid address is any non-protected sector address. 2. I/O7 should be rechecked even if I/O5 = "1" because I/O7 may change simultaneously with I/O5. Figure 5. Data Polling Algorithm on I/O7. Figure 5 shows the Data Polling algorithm. PRELIMINARY (March, 2005, Version 0.0) 14 AMIC Technology, Corp. A29L004A Series sector is erase-suspended. Toggle Bit II is valid after the rising edge of the final WE pulse in the command sequence. I/O2 toggles when the system reads at addresses within those sectors that have been selected for erasure. (The system may use either OE or CE to control the read cycles.) But I/O2 cannot distinguish whether the sector is actively erasing or is erase-suspended. I/O6, by comparison, indicates whether the device is actively erasing, or is in Erase Suspend, but cannot distinguish which sectors are selected for erasure. Thus, both status bits are required for sector and mode information. Refer to Table 6 to compare outputs for I/O2 and I/O6. Figure 6 shows the toggle bit algorithm in flowchart form, and the section " I/O2: Toggle Bit II" explains the algorithm. See also the " I/O6: Toggle Bit I" subsection. Refer to the Toggle Bit Timings figure for the toggle bit timing diagram. The I/O2 vs. I/O6 figure shows the differences between I/O2 and I/O6 in graphical form. RY/ BY : Read/ Busy (N/A on 32-pin PLCC & (s)TSOP packages) The RY/ BY is a dedicated, open-drain output pin that indicates whether an Embedded algorithm is in progress or complete. The RY/ BY status is valid after the rising edge of the final WE pulse in the command sequence. Since RY/ BY is an open-drain output, several RY/ BY pins can be tied together in parallel with a pull-up resistor to VCC. If the output is low (Busy), the device is actively erasing or programming. (This includes programming in the Erase Suspend mode.) If the output is high (Ready), the device is ready to read array data (including during the Erase Suspend mode), or is in the standby mode. Table 6 shows the outputs for RY/ BY . Refer to “ RESET Timings”, “Timing Waveforms for Program Operation” and “Timing Waveforms for Chip/Sector Erase Operation” for more information. Reading Toggle Bits I/O6, I/O2 I/O6: Toggle Bit I Refer to Figure 6 for the following discussion. Whenever the system initially begins reading toggle bit status, it must read I/O7 - I/O0 at least twice in a row to determine whether a toggle bit is toggling. Typically, a system would note and store the value of the toggle bit after the first read. After the second read, the system would compare the new value of the toggle bit with the first. If the toggle bit is not toggling, the device has completed the program or erase operation. The system can read array data on I/O7 - I/O0 on the following read cycle. However, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the system also should note whether the value of I/O5 is high (see the section on I/O5). If it is, the system should then determine again whether the toggle bit is toggling, since the toggle bit may have stopped toggling just as I/O5 went high. If the toggle bit is no longer toggling, the device has successfully completed the program or erase operation. If it is still toggling, the device did not complete the operation successfully, and the system must write the reset command to return to reading array data. The remaining scenario is that the system initially determines that the toggle bit is toggling and I/O5 has not gone high. The system may continue to monitor the toggle bit and I/O5 through successive read cycles, determining the status as described in the previous paragraph. Alternatively, it may choose to perform other system tasks. In this case, the system must start at the beginning of the algorithm when it returns to determine the status of the operation (top of Figure 6). Toggle Bit I on I/O6 indicates whether an Embedded Program or Erase algorithm is in progress or complete, or whether the device has entered the Erase Suspend mode. Toggle Bit I may be read at any address, and is valid after the rising edge of the final WE pulse in the command sequence (prior to the program or erase operation), and during the sector erase time-out. During an Embedded Program or Erase algorithm operation, successive read cycles to any address cause I/O6 to toggle. (The system may use either OE or CE to control the read cycles.) When the operation is complete, I/O6 stops toggling. After an erase command sequence is written, if all sectors selected for erasing are protected, I/O6 toggles for approximately 100µs, then returns to reading array data. If not all selected sectors are protected, the Embedded Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. The system can use I/O6 and I/O2 together to determine whether a sector is actively erasing or is erase-suspended. When the device is actively erasing (that is, the Embedded Erase algorithm is in progress), I/O6 toggles. When the device enters the Erase Suspend mode, I/O6 stops toggling. However, the system must also use I/O2 to determine which sectors are erasing or erase-suspended. Alternatively, the system can use I/O7 (see the subsection on " I/O7 : Data Polling"). If a program address falls within a protected sector, I/O6 toggles for approximately 2µs after the program command sequence is written, then returns to reading array data. I/O6 also toggles during the erase-suspend-program mode, and stops toggling once the Embedded Program algorithm is complete. The Write Operation Status table shows the outputs for Toggle Bit I on I/O6. Refer to Figure 6 for the toggle bit algorithm, and to the Toggle Bit Timings figure in the "AC Characteristics" section for the timing diagram. The I/O2 vs. I/O6 figure shows the differences between I/O2 and I/O6 in graphical form. See also the subsection on " I/O2: Toggle Bit II". I/O5: Exceeded Timing Limits I/O5 indicates whether the program or erase time has exceeded a specified internal pulse count limit. Under these conditions I/O5 produces a "1." This is a failure condition that indicates the program or erase cycle was not successfully completed. The I/O5 failure condition may appear if the system tries to program a "1 "to a location that is previously programmed to "0." Only an erase operation can change a "0" back to a "1." Under this condition, the device halts the operation, and when the operation has exceeded the timing limits, I/O5 produces a "1." Under both these conditions, the system must issue the reset command to return the device to reading array data. I/O2: Toggle Bit II The "Toggle Bit II" on I/O2, when used with I/O6, indicates whether a particular sector is actively erasing (that is, the Embedded Erase algorithm is in progress), or whether that PRELIMINARY (March, 2005, Version 0.0) 15 AMIC Technology, Corp. A29L004A Series I/O3: Sector Erase Timer After writing a sector erase command sequence, the system may read I/O3 to determine whether or not an erase operation has begun. (The sector erase timer does not apply to the chip erase command.) If additional sectors are selected for erasure, the entire time-out also applies after each additional sector erase command. When the time-out is complete, I/O3 switches from "0" to "1." The system may ignore I/O3 if the system can guarantee that the time between additional sector erase commands will always be less than 50µs. See also the "Sector Erase Command Sequence" section. After the sector erase command sequence is written, the system should read the status on I/O7 ( Data Polling) or I/O6 (Toggle Bit I) to ensure the device has accepted the command sequence, and then read I/O3. If I/O3 is "1", the internally controlled erase cycle has begun; all further commands (other than Erase Suspend) are ignored until the erase operation is complete. If I/O3 is "0", the device will accept additional sector erase commands. To ensure the command has been accepted, the system software should check the status of I/O3 prior to and following each subsequent sector erase command. If I/O3 is high on the second status check, the last command might not have been accepted. Table 6 shows the outputs for I/O3. START Read I/O7-I/O0 Read I/O7-I/O0 Toggle Bit = Toggle ? (Note 1) No Yes No I/O5 = 1? Yes Read I/O7 - I/O0 Twice Toggle Bit = Toggle ? (Notes 1,2) No Yes Program/Erase Operation Not Commplete, Write Reset Command Program/Erase Operation Complete Notes : 1. Read toggle bit twice to determine whether or not it is toggling. See text. 2. Recheck toggle bit because it may stop toggling as I/O5 changes to "1". See text. Figure 6. Toggle Bit Algorithm PRELIMINARY (March, 2005, Version 0.0) 16 AMIC Technology, Corp. A29L004A Series Table 6. Write Operation Status I/O7 Operation I/O6 (Note 1) Standard Mode Embedded Program Algorithm Erase Suspend Mode Embedded Erase Algorithm Reading within Erase Suspended Sector Reading within Non-Erase Suspended Sector Erase-Suspend-Program I/O5 I/O3 (Note 2) I/O2 (Note 1) I/O7 Toggle 0 N/A 0 0 1 Toggle No toggle Data I/O7 RY/ BY (N/A on 32-pin PLCC & (s)TSOP packages) 1 No toggle Toggle 0 0 0 N/A Toggle 1 Data Data Data Data 1 Toggle 0 N/A N/A 0 Notes: 1. I/O7 and I/O2 require a valid address when reading status information. Refer to the appropriate subsection for further details. 2. I/O5 switches to “1” when an Embedded Program or Embedded Erase operation has exceeded the maximum timing limits. See “I/O5: Exceeded Timing Limits” for more information. Maximum Negative Input Overshoot 20ns 20ns +0.8V -0.5V -2.0V 20ns Maximum Positive Input Overshoot 20ns VCC+2.0V VCC+0.5V 2.0V 20ns PRELIMINARY (March, 2005, Version 0.0) 20ns 17 AMIC Technology, Corp. A29L004A Series DC Characteristics CMOS Compatible Parameter Parameter Description Symbol ILI Input Load Current Test Description Min. VIN = VSS to VCC. VCC = VCC Max ILIT A9 Input Load Current VCC = VCC Max, A9 =12.5V ILO Output Leakage Current VOUT = VSS to VCC. VCC = VCC Max ICC1 VCC Active Read Current (Notes 1, 2) ICC2 ICC3 ICC4 ICC5 VIL VCC Active Write (Program/Erase) Current (Notes 2, 3, 4) VCC Standby Current (Note 2) VCC Standby Current During Reset (Note 2) (N/A on 32-pin PLCC & (s)TSOP packages) Automatic Sleep Mode (Note 2, 4, 5) Input Low Level VIH Input High Level VID Voltage for Autoselect and VOL VOH2 Unit ±1.0 µA 35 µA ±1.0 µA 4 10 1 MHz 2 4 CE = VIL, OE =VIH 20 30 mA CE = VIH, RESET = VCC ± 0.3V 1 5 µA RESET = VSS ± 0.3V 1 5 µA VIH = VCC ± 0.3V; VIL = VSS ± 0.3V 1 5 µA -0.5 0.8 V 0.7 x VCC VCC + 0.3 V 11.5 12.5 V 0.45 V VCC = 3.3 V Output Low Voltage IOL = 4.0mA, VCC = VCC Min Output High Voltage Max. 5 MHz CE = VIL, OE = VIH Temporary Unprotect Sector VOH1 Typ. mA IOH = -2.0 mA, VCC = VCC Min 0.85 x VCC V IOH = -100 µA, VCC = VCC Min VCC - 0.4 V Notes: 1. The ICC current listed is typically less than 2 mA/MHz, with OE at VIH. Typical VCC is 3.0V. 2. Maximum ICC specifications are tested with VCC = VCC max. 3. ICC active while Embedded Algorithm (program or erase) is in progress. 4. Automatic sleep mode enables the low power mode when addresses remain stable for tACC + 30ns. Typical sleep mode current is 1µA. 5. Not 100% tested. PRELIMINARY (March, 2005, Version 0.0) 18 AMIC Technology, Corp. A29L004A Series DC Characteristics (continued) Zero Power Flash Supply Current in mA 25 20 15 10 5 0 0 500 1000 1500 2000 2500 3000 3500 4000 Time in ns Note: Addresses are switching at 1MHz ICC1 Current vs. Time (Showing Active and Automatic Sleep Currents) 10 3.6V 8 Supply Current in mA 2.7V 6 4 2 0 1 2 3 4 5 Frequency in MHz Note : T = 25 ° C Typical ICC1 vs. Frequency PRELIMINARY (March, 2005, Version 0.0) 19 AMIC Technology, Corp. A29L004A Series AC Characteristics Read Only Operations Parameter Symbols Description Speed Test Setup JEDEC Std tAVAV tRC Read Cycle Time (Note 1) tAVQV tACC Address to Output Delay tELQV tCE Chip Enable to Output Delay tGLQV tOE Output Enable to Output Delay tOEH Output Enable Hold Time (Note 1) Unit -70 -90 Min. 70 90 ns CE = VIL OE = VIL Max. 70 90 ns OE = VIL Max. 70 90 ns Max. 30 35 ns Min. 0 0 ns Min. 10 10 Max. 25 30 ns 25 30 ns 0 0 ns Read Toggle and Data Polling tEHQZ tDF Chip Enable to Output High Z (Notes 1) tGHQZ tDF Output Enable to Output High Z (Notes 1) tAXQX tOH Output Hold Time from Addresses, CE or OE , Whichever Occurs First (Note 1) Min. ns Notes: 1. Not 100% tested. 2. See Test Conditions and Test Setup for test specifications. Timing Waveforms for Read Only Operation tRC Addresses Addresses Stable tACC CE tDF tOE OE tOEH WE tCE tOH High-Z Output Output Valid High-Z RESET 0V RY/BY PRELIMINARY (March, 2005, Version 0.0) 20 AMIC Technology, Corp. A29L004A Series AC Characteristics Hardware Reset ( RESET , N/A on 32-pin PLCC & (s)TSOP packages) Parameter JEDEC Std Description Test Setup All Speed Options Unit tREADY RESET Pin Low (During Embedded Algorithms) to Read or Write (See Note) Max 20 µs tREADY RESET Pin Low (Not During Embedded Algorithms) to Read or Write (See Note) Max 500 ns RESET Pulse Width RESET High Time Before Read (See Note) RY/ BY Recovery Time RESET Low to Standby Mode Min 500 ns Min 50 ns tRP tRH tRB tRPD Min 0 ns Min 20 µs Note: Not 100% tested. RESET Timings RY/BY CE, OE tRH RESET tRP tReady Reset Timings NOT during Embedded Algorithms Reset Timings during Embedded Algorithms ~ ~ ~ ~ tReady RY/BY tRB CE, OE ~ ~ RESET tRP PRELIMINARY (March, 2005, Version 0.0) 21 AMIC Technology, Corp. A29L004A Series Temporary Sector Unprotect (N/A on 32-pin PLCC & (s)TSOP packages) Parameter JEDEC Std tVIDR tRSP Description All Speed Options Unit VID Rise and Fall Time (See Note) Min 500 ns RESET Setup Time for Temporary Sector Unprotect Min 4 µs Note: Not 100% tested. Temporary Sector Unprotect Timing Diagram ~ ~ 12V 0 or 3V 0 or 3V RESET tVIDR Program or Erase Command Sequence tVIDR CE ~ ~ WE ~ ~ ~ ~ tRSP RY/BY PRELIMINARY (March, 2005, Version 0.0) 22 AMIC Technology, Corp. A29L004A Series AC Characteristics Erase and Program Operations Parameter Speed Description Unit JEDEC Std tAVAV tWC Write Cycle Time (Note 1) Min. tAVWL tAS Address Setup Time Min. tWLAX tAH Address Hold Time Min. 45 45 ns tDVWH tDS Data Setup Time Min. 35 45 ns tWHDX tDH Data Hold Time Min. 0 ns tOES Output Enable Setup Time Min. 0 ns Read Recover Time Before Write Min. 0 ns tGHWL tGHWL -70 -90 70 90 0 ns ns ( OE high to WE low) tELWL tCS CE Setup Time Min. 0 ns tWHEH tCH CE Hold Time Min. 0 ns tWLWH tWP Write Pulse Width Min. tWHWL tWPH Write Pulse Width High Min. 30 ns tWHWH1 tWHWH1 Byte Programming Operation (Note 2) Typ. 17 µs tWHWH2 tWHWH2 Sector Erase Operation (Note 2) Typ. 1 sec tvcs VCC Set Up Time (Note 1) Min. 50 µs tRB Recovery Time from RY/ BY (N/A on 32-pin PLCC & (s)TSOP packages) Min 0 ns Program/Erase Valid to RY/ BY Delay (N/A on 32-pin PLCC & (s)TSOP packages) Min 90 ns tBUSY 35 35 ns Notes: 1. Not 100% tested. 2. See the "Erase and Programming Performance" section for more information. PRELIMINARY (March, 2005, Version 0.0) 23 AMIC Technology, Corp. A29L004A Series Timing Waveforms for Program Operation Program Command Sequence (last two cycles) PA 555h PA tAH PA ~ ~ ~ ~ Addresses tAS ~ ~ tWC Read Status Data (last two cycles) CE ~ ~ tCH OE tWP ~ ~ tWHWH1 WE tCS tWPH A0h Data tDH PD ~ ~ tDS tBUSY Status DOUT tRB ~ ~ ~ ~ RY/BY tVCS VCC Note : 1. PA = program addrss, PD = program data, Dout is the true data at the program address. 2. Illustration shows device in word mode. PRELIMINARY (March, 2005, Version 0.0) 24 AMIC Technology, Corp. A29L004A Series Timing Waveforms for Chip/Sector Erase Operation Read Status Data Erase Command Sequence (last two cycles) tAS SA 2AAh VA 555h for chip erase tAH VA ~ ~ ~ ~ Addresses ~ ~ tWC ~ ~ CE OE tCH ~ ~ tWP WE tWPH tWHWH2 tCS Data tDH 55h 30h ~ ~ tDS 10h for chip erase tBUSY In Progress Complete tRB ~ ~ RY/BY ~ ~ tVCS VCC Note : 1. SA = Sector Address (for Sector Erase), VA = Valid Address for reading status data (see "Write Operaion Ststus"). 2. Illustratin shows device in word mode. PRELIMINARY (March, 2005, Version 0.0) 25 AMIC Technology, Corp. A29L004A Series Timing Waveforms for Data Polling (During Embedded Algorithms) Addresses ~ ~ tRC VA tAC C CE VA ~ ~ ~ ~ VA tCE tCH ~ ~ tOE OE tDF ~ ~ tOEH WE tOH High-Z Status Data High-Z ~ ~ I/O0 - I/O6 Complement Complement True Valid Data ~ ~ I/O7 Status Data True Valid Data High-Z tBUSY ~ ~ RY/BY Note : VA = Valid Address. Illustation shows first status cycle after command sequence, last status read cycle, and array data read cycle. Timing Waveforms for Toggle Bit (During Embedded Algorithms) Addresses ~ ~ tRC VA tAC C CE VA VA ~ ~ ~ ~ VA tCE tCH tOE ~ ~ ~ ~ OE tDF tOEH WE I/O6 , I/O2 High-Z tBUSY Valid Status Valid Status (first read) (second read) ~ ~ tOH Valid Status Valid Data (stop togging) ~ ~ RY/BY Note: VA = Valid Address; not required for I/O6. Illustration shows first two status cycle after command sequence, last status read cycle, and array data read cycle. PRELIMINARY (March, 2005, Version 0.0) 26 AMIC Technology, Corp. A29L004A Series Timing Waveforms for Sector Protect/Unprotect VID VIH ~ ~ RESET SA, A6, A1, A0 Valid* ~ ~ ~ ~ Valid* Sector Protect/Unprotect 60h 60h Verify 40h Status ~ ~ Data Valid* Sector Protect:150us Sector Unprotect:15ms 1us CE WE OE Note : For sector protect, A6=0, A1=1, A0=0. For sector unprotect, A6=1, A1=1, A0=0 Timing Waveforms for I/O2 vs. I/O6 ~ ~ ~ ~ Erase Complete ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ Erase ~ ~ Erase Suspend Read ~ ~ ~ ~ ~ ~ I/O2 ~ ~ I/O6 Erase Resume Erase Suspend Program Erase Suspend Read ~ ~ Erase Enter Erase Suspend Program ~ ~ WE Erase Suspend ~ ~ Enter Embedded Erasing I/O2 and I/O6 toggle with OE and CE Note : Both I/O6 and I/O2 toggle with OE or CE. See the text on I/O6 and I/O2 in the section "Write Operation Status" for more information. PRELIMINARY (March, 2005, Version 0.0) 27 AMIC Technology, Corp. A29L004A Series AC Characteristics Erase and Program Operations Alternate CE Controlled Writes Parameter Speed Description Unit JEDEC Std tAVAV tWC Write Cycle Time (Note 1) Min. tAVEL tAS Address Setup Time Min. tELAX tAH Address Hold Time Min. 45 45 ns tDVEH tDS Data Setup Time Min. 35 45 ns tEHDX tDH Data Hold Time Min. 0 ns tOES Output Enable Setup Time Min. 0 ns tGHEL Read Recover Time Before Write Min. 0 ns tGHEL -70 -90 70 90 0 ns ns ( OE High to WE Low) tWLEL tWS WE Setup Time Min. 0 ns tEHWH tWH WE Hold Time Min. 0 ns tELEH tCP CE Pulse Width Min. tEHEL tCPH CE Pulse Width High Min. 30 ns tWHWH1 tWHWH1 Byte Programming Operation (Note 2) Typ. 17 µs tWHWH2 tWHWH2 Sector Erase Operation (Note 2) Typ. 1 sec 35 35 ns Notes: 1. Not 100% tested. 2. See the "Erase and Programming Performance" section for more information. PRELIMINARY (March, 2005, Version 0.0) 28 AMIC Technology, Corp. A29L004A Series Timing Waveforms for Alternate CE Controlled Write Operation PA for program SA for sector erase 555 for chip erase Data Polling ~ ~ 555 for program 2AA for erase PA tAS tAH tWH ~ ~ tWC ~ ~ Addresses ~ ~ WE OE tWHWH1 or 2 ~ ~ tCP tBUSY tCPH CE tWS tDS ~ ~ tDH tRH A0 for program 55 for erase PD for program 30 for sector erase 10 for chip erase I/O7 DOUT ~ ~ Data RESET ~ ~ RY/BY Note : 1. PA = Program Address, PD = Program Data, SA = Sector Address, I/O 7 = Complement of Data Input, DOUT = Array Data. 2. Figure indicates the last two bus cycles of the command sequence. Erase and Programming Performance Parameter Sector Erase Time Chip Erase Time Byte Programming Time Chip Programming Time (Note 3) Typ. (Note 1) 1 11 17 Max. (Note 2) 8 64 200 Unit sec sec 6 13.5 sec µs Comments Excludes 00h programming prior to erasure Excludes system-level overhead (Note 5) Notes: 1. Typical program and erase times assume the following conditions: 25°C, 3.0V VCC, 10,000 cycles. Additionally, programming typically assumes checkerboard pattern. 2. Under worst case conditions of 90°C, VCC = 2.7V, 100,000 cycles. 3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes program faster than the maximum byte program time listed. If the maximum byte program time given is exceeded, only then does the device set I/O5 = 1. See the section on I/O5 for further information. 4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure. 5. System-level overhead is the time required to execute the four-bus-cycle command sequence for programming. See Table 5 for further information on command definitions. 6. The device has a guaranteed minimum erase and program cycle endurance of 10,000 cycles. PRELIMINARY (March, 2005, Version 0.0) 29 AMIC Technology, Corp. A29L004A Series Latch-up Characteristics Description Input Voltage with respect to VSS on all I/O pins VCC Current Input voltage with respect to VSS on all pins except I/O pins Min. Max. -1.0V VCC+1.0V -100 mA +100 mA -1.0V 12.5V (including A9, OE and RESET ) Includes all pins except VCC. Test conditions: VCC = 3.0V, one pin at time. TSOP Pin Capacitance Parameter Symbol CIN Parameter Description Input Capacitance COUT Output Capacitance CIN2 Control Pin Capacitance Test Setup Typ. Max. Unit VIN=0 6 7.5 pF VOUT=0 8.5 12 pF VIN=0 7.5 9 pF Test Setup Typ. Max. Unit VIN=0 4 6 pF Notes: 1. Sampled, not 100% tested. 2. Test conditions TA = 25°C, f = 1.0MHz PLCC Pin Capacitance Parameter Symbol CIN Parameter Description Input Capacitance COUT Output Capacitance VOUT=0 8 12 pF CIN2 Control Pin Capacitance VPP=0 8 12 pF Notes: 1. Sampled, not 100% tested. 2. Test conditions TA = 25°C, f = 1.0MHz Data Retention Parameter Test Conditions Min Unit 150°C 10 Years 125°C 20 Years Minimum Pattern Data Retention Time PRELIMINARY (March, 2005, Version 0.0) 30 AMIC Technology, Corp. A29L004A Series Test Conditions Test Specifications Test Condition -70 -90 Output Load Unit 1 TTL gate Output Load Capacitance, CL(including jig capacitance) 30 100 pF Input Rise and Fall Times 5 5 ns Input Pulse Levels 0.0 - 3.0 0.0 - 3.0 V Input timing measurement reference levels 1.5 1.5 V Output timing measurement reference levels 1.5 1.5 V Test Setup 3.3 V 2.7 KΩ Device Under Test CL PRELIMINARY (March, 2005, Version 0.0) Diodes = IN3064 or Equivalent 6.2 KΩ 31 AMIC Technology, Corp. A29L004A Series Ordering Information Top Boot Sector Flash Part No. Access Time (ns) Active Read Current Typ. (mA) Program/Erase Current Typ. (mA) Standby Current Typ. (µA) A29L004ATL-70 Package 32-pin PLCC A29L004ATL-70F 32-Pin Pb-Free PLCC A29L004ATX-70 32-pin sTSOP (8mm X 13.4mm) 32-Pin Pb-Free sTSOP (8mm X 13.4mm) A29L004ATX-70F 32-pin TSOP (8mm X 20mm) A29L004ATV-70 70 4 20 0.2 A29L004ATV-70F 32-pin Pb-Free TSOP (8mm X 20mm) A29L004ATW-70 40-pin TSOP A29L004ATW-70F 40-pin Pb-Free TSOP 32-pin sTSOP (8mm X 14mm) A29L004ATY-70 32-Pin Pb-Free sTSOP (8mm X 14mm) A29L004ATY-70F A29L004ATL-90 32-pin PLCC A29L004ATL-90F 32-pin Pb-Free PLCC A29L004ATX-90 32-pin sTSOP (8mm X 13.4mm) 32-pin Pb-Free sTSOP (8mm X 13.4mm) A29L004ATX-90F 32-pin TSOP (8mm X 20mm) A29L004ATV-90 90 4 20 0.2 A29L004ATV-90F 32-pin Pb-Free TSOP (8mm X 20mm) A29L004ATW-90 40-pin TSOP A29L004ATW-90F 40-pin Pb-Free TSOP 32-pin sTSOP (8mm X 14mm) A29L004ATY-90 32-Pin Pb-Free sTSOP (8mm X 14mm) A29L004ATY-90F PRELIMINARY (March, 2005, Version 0.0) 32 AMIC Technology, Corp. A29L004A Series Bottom Boot Sector Flash Part No. Access Time (ns) Active Read Current Typ. (mA) Program/Erase Current Typ. (mA) Standby Current Typ. (µA) Package 32-pin PLCC A29L004AUL-70 A29L004AUL-70F 32-pin Pb-Free PLCC A29L004AUX-70 32-pin sTSOP (8mm X 13.4mm) 32-pin Pb-Free sTSOP (8mm X 13.4mm) A29L004AUX-70F 32-pin TSOP (8mm X 20mm) A29L004AUV-70 70 4 20 0.2 A29L004AUV-70F 32-pin Pb-Free TSOP (8mm X 20mm) A29L004AUW-70 40-pin TSOP 40-pin Pb-Free TSOP A29L004AUW-70F 32-pin sTSOP (8mm X 14mm) A29L004AUY-70 32-Pin Pb-Free sTSOP (8mm X 14mm) A29L004AUY-70F 32-pin PLCC A29L004AUL-90 A29L004AUL-90F 32-pin Pb-Free PLCC A29L004AUX-90 32-pin sTSOP (8mm X 13.4mm) 32-pin Pb-Free sTSOP (8mm X 13.4mm) A29L004AUX-90F 32-pin TSOP (8mm X 13.4mm) A29L004AUV-90 90 4 20 0.2 A29L004AUV-90F 32-pin Pb-Free TSOP (8mm X 13.4mm) A29L004AUW-90 40-pin TSOP 40-pin Pb-Free TSOP A29L004AUW-90F 32-pin sTSOP (8mm X 14mm) A29L004AUY-90 32-Pin Pb-Free sTSOP (8mm X 14mm) A29L004AUY-90F PRELIMINARY (March, 2005, Version 0.0) 33 AMIC Technology, Corp. A29L004A Series Package Information TSOP 40L TYPE I (10 X 20mm) Outline Dimensions unit: inches/mm A A1 D A2 0.076 C e E b Pin1 D1 D 0.25 Detail "A" Gage Plane θ c Dimensions in inches Symbol Min Nom Max Seating Plane L Dimensions in mm Min Nom Max A - - 0.047 - - 1.20 A1 0.002 - 0.006 0.05 - 0.15 A2 0.037 0.039 0.041 0.95 1.00 1.05 b 0.0067 0.0087 0.0106 0.17 0.22 0.27 c 0.004 - 0.0083 0.10 - 0.21 E 0.394 BSC 10.00 BSC e 0.020 BSC 0.50 BSC D 0.787 BSC 20.00 BSC D1 0.724 BSC 18.40 BSC L 0.020 0.024 0.028 0.50 0.60 0.70 θ 0° 3° 5° 0° 3° 5° Notes: 1. Dimension D1 and E do not include mold flash. 2. The lead width dimension does not include dambar protrusion. Total in excess of the lead width dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. PRELIMINARY (March, 2005, Version 0.0) 34 AMIC Technology, Corp. A29L004A Series Package Information PLCC 32L Outline Dimension unit: inches/mm HD D 13 5 E 1 HE 4 14 32 20 30 29 c A1 b e L A A2 21 b1 D GE GD y Symbol θ Dimensions in inches Dimensions in mm Min Nom Max Min Nom Max A - - 0.134 - - 3.40 A1 0.0185 - - 0.47 - - A2 0.105 0.110 0.115 2.67 2.80 2.93 b1 0.026 0.028 0.032 0.66 0.71 0.81 b 0.016 0.018 0.021 0.41 0.46 0.54 C 0.008 0.010 0.014 0.20 0.254 0.35 D 0.547 0.550 0.553 13.89 13.97 14.05 E 0.447 0.450 0.453 11.35 11.43 11.51 e 0.044 0.050 0.056 1.12 1.27 1.42 GD 0.490 0.510 0.530 12.45 12.95 13.46 GE 0.390 0.410 0.430 9.91 10.41 10.92 HD 0.585 0.590 0.595 14.86 14.99 15.11 12.57 HE 0.485 0.490 0.495 12.32 12.45 L 0.075 0.090 0.095 1.91 2.29 2.41 y - - 0.003 - - 0.075 θ 0° - 10° 0° - 10° Notes: 1. Dimensions D and E do not include resin fins. 2. Dimensions GD & GE are for PC Board surface mount pad pitch design reference only. PRELIMINARY (March, 2005, Version 0.0) 35 AMIC Technology, Corp. A29L004A Series Package Information TSOP 32L TYPE I (8 X 20mm) Outline Dimensions unit: inches/mm A A1 c E A2 e D θ L LE HD Detail "A" D Detail "A" y S Dimensions in inches Symbol Min Nom Max b Dimensions in mm Min Nom Max A - - 0.047 - - 1.20 A1 0.002 - 0.006 0.05 - 0.15 A2 0.037 0.039 0.041 0.95 1.00 1.05 b 0.007 0.009 0.011 0.18 0.22 0.27 c 0.004 - 0.008 0.11 - 0.20 D 0.720 0.724 0.728 18.30 18.40 18.50 E - 0.315 0.319 - 8.00 8.10 e 0.020 BSC 0.50 BSC HD 0.779 0.787 0.795 19.80 20.00 20.20 L 0.016 0.020 0.024 0.40 0.50 0.60 LE - 0.032 - - 0.80 - S - - 0.020 - - 0.50 y - - 0.003 - - 0.08 θ 0° - 5° 0° - 5° Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension S includes end flash. PRELIMINARY (March, 2005, Version 0.0) 36 AMIC Technology, Corp. A29L004A Series Package Information unit: inches/mm A A1 c E A2 e sTSOP 32L TYPE I (8 X 13.4mm) Outline Dimensions θ L LE D1 D Detail "A" D Detail "A" 0.076MM S b SEATING PLANE Dimensions in inches Symbol Dimensions in mm Min Nom Max Min Nom Max A - - 0.049 - - 1.25 A1 0.002 - - 0.05 - - A2 0.037 0.039 0.041 0.95 1.00 1.05 b 0.007 0.008 0.009 0.17 0.20 0.23 c 0.0056 0.0059 0.0062 0.142 0.150 0.158 E 0.311 0.315 0.319 7.90 8.00 8.10 e 0.020 TYP 0.50 TYP D 0.520 0.528 0.535 13.20 13.40 13.60 D1 0.461 0.465 0.469 11.70 11.80 11.90 L 0.012 0.020 0.028 0.30 0.50 0.70 LE 0.0275 0.0315 0.0355 0.700 0.800 0.900 S θ 0.0109 TYP 0° 3° 0.278 TYP 5° 0° 3° 5° Notes: 1. The maximum value of dimension D1 includes end flash. 2. Dimension E does not include resin fins. 3. Dimension S includes end flash. PRELIMINARY (March, 2005, Version 0.0) 37 AMIC Technology, Corp. A29L004A Series Package Information sTSOP 32L TYPE I (8 X 14mm) Outline Dimensions unit: inches/mm c E A A2 0.254 Pin1 Gage Plane A1 θ L D1 Detail "A" D Detail "A" b D e Dimensions in inches Symbol Min Nom Max y Dimensions in mm Min Nom Max A - - 0.047 - - 1.20 A1 0.002 - 0.006 0.05 - 0.15 A2 0.037 0.039 0.041 0.95 1.00 1.05 b 0.0067 0.0087 0.0106 0.17 0.22 0.27 c 0.004 - 0.0083 0.10 - 0.21 E 0.311 0.315 0.319 7.90 8.00 8.10 e - 0.0197 - - 0.50 - D 0.543 0.551 0.559 13.80 14.00 14.20 D1 0.484 0.488 0.492 12.30 12.40 12.50 L 0.020 0.024 0.028 0.50 0.60 0.70 y 0.000 - 0.003 0.00 - 0.076 θ 0° 3° 5° 0° 3° 5° Notes: 1. Dimension E does not include mold flash. 3. Dimension D1 does not include interlead flash. 4. Dimension b does not include dambar protrusion. PRELIMINARY (March, 2005, Version 0.0) 38 AMIC Technology, Corp.