P/N 96-208M50 QFP-to-PGA EIAJ 208-Position, 0.0197 [0.50] Pitch Adapter FEATURES •Convert surface-mount QFP packages to a 17x17 PGA footprint. •Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. •Pins are mechanically fastened and soldered to board using Aries’ patented process, creating a reliable electrical connection and rugged contact. •Consult factory for Panelized Form or for mounting of consigned chips. GENERAL SPECIFICATIONS •ADAPTER BODY: FR-4 with 1-oz. Cu traces •PADS: bare Cu protected with Entek® by Enthone or immersion white Sn to eliminate coplanarity concerns and solder bridges associated with hot air solder leveling •PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M •MALE PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-29 •OPERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS •SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia. •Standard: will plug into PGA sockets ALL DIMENSIONS: INCHES [MILLIMETERS] CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice. ORDERING INFORMATION P/N 96-208M50 P/N 96-208M50-P for Panelized Form P/N 208-PGM17039-30 for Wire Wrap PGA Socket ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED ROW-TO-ROW ±0.003 [±0.08] PIN-TO-PIN ±0.003 [±0.08] NON-CUMULATIVE CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS Bristol, PA 19007-6810 USA TEL (215) 781-9956 • FAX (215) 781-9845 WWW.ARIESELEC.COM • [email protected] PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED 18031 Rev. AA