plerowTM ALN2501AT Internally Matched LNA Module Features Description · S21 = 12.95 dB @ 2300 MHz = 11.45 dB @ 2700 MHz · NF = 0.65 dB @ 2300 MHz = 0.85 dB @ 2700 MHz · Unconditionally Stable · Single 5V Supply · High OIP3 @ Low Current The plerowTM ALN-series is the compactly designed surface-mount module for the use of the LNA with or without the following gain blocks in the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS, PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communication terminals, CATV and so on. It has an exceptional performance of low noise figure, high gain, high OIP3, and low bias current. The stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. The surface-mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. Specifications (in Production) Typ. @ T = 25°C, Vs = 5 V, Freq. = 2500 MHz, Zo.sys = 50 ohm Parameter Unit Frequency Range Min Typ MHz 2300 Gain dB 11.2 Gain Flatness dB ± 0.75 Noise Figure dB 0.65 @2.3G 0.85 @2.7G Output IP3 S11 / S22 (1) dBm (2) Max 2700 12.2 33 More Information ± 0.95 Website: www.asb.co.kr E-mail: [email protected] 34 dB Tel: (82) 42-528-7223 Fax: (82) 42-528-7222 -19 / -9 Output P1dB dBm Switching Time µsec 1.0 Supply Current mA 80 Supply Voltage V 5 18 19 ASB Inc., 4th Fl. Venture Town Bldg., 367-17 Goijeong-Dong, Seo-Gu, Daejon 302-716, Korea 100 Ω 50 Max. RF Input Power dBm C.W 29 ~ 31 (before fail) Package Type & Size mm Surface Mount Type, 10Wx10Lx3.8H Impedance 1-stage Single Type Specifications Operating temperature is -40°C to +85°C. 1) OIP3 is measured with two tones at an output power of 7 dBm / tone separated by 1 MHz. 2) S11/S22 (max) is the worst value within the frequency band. 3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS. Outline Drawing (Unit: mm) Pin Number plerow ALN2501AT ASB Inc. (Top View) (Bottom View) Solder Stencil Area Function 2 RF In 5 RF Out 6 +Vcc Others Ground Note: 1. The number and size of ground via holes in a circuit board is critical for thermal RF grounding considerations. 2. We recommend that the ground via holes be placed on the bottom of all ground pins for better RF and thermal performance, as shown in the drawing at the left side. (Side View) Ø0.4 plated thru holes to ground plane (Recommended Footprint) 1/4 www.asb.co.kr November 2008 plerowTM ALN2501AT Internally Matched LNA Module S-parameters Typical Performance (Measured) 2300~2700 +5 V Noise Figure 30 10 20 9 10 S21 8 0 S22 7 -10 6 S12 -20 5 -30 4 -40 3 S11 -50 2 -60 1 -70 0 500 1000 1500 2000 2500 3000 3500 4000 4500 Stability Factor K S-parameter [dB] S-parameters & K Factor 0 5000 Frequency [MHz] OIP3 2/4 P1dB www.asb.co.kr November 2008 plerowTM ALN2501AT Internally Matched LNA Module S-parameters Typical Performance (Measured) 2500~3000 +5 V Noise Figure 30 10 20 9 10 S21 8 0 S22 7 -10 6 S12 -20 5 -30 4 -40 3 S11 -50 2 -60 1 -70 0 500 1000 1500 2000 2500 3000 3500 4000 4500 Stability Factor K S-parameter [dB] Stability Factor (K) 0 5000 Frequency [MHz] OIP3 3/4 P1dB www.asb.co.kr November 2008 plerowTM ALN2501AT Internally Matched LNA Module Application Circuit V DC + - Tantal Capacitor IN OUT ALN C1 C2 1) The tantal capacitor is optional and for bypassing the AC noise introduced from the DC supply. The capacitance value may be determined by customer’s DC supply status. 2) So-called DC blocking capacitors are always necessarily placed at the input and output port for allowing only the RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are included inside the LNA module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just in case that the customer wants. The value of C1 & C2 is determined by considering the application frequency. Recommended Soldering Reflow Process Evaluation Board Layout +Vcc 20~40 sec 260°C Ramp-up (3˚C/sec) Ramp-down (6°C/sec) IN 200°C OUT 150°C 60~180 sec Size 25 x 25mm (for ALN-AT, BT, T Series – 10x10mm) 4/4 www.asb.co.kr November 2008