ASB ALN2501AT

plerowTM ALN2501AT
Internally Matched LNA Module
Features
Description
· S21 = 12.95 dB @ 2300 MHz
= 11.45 dB @ 2700 MHz
· NF = 0.65 dB @ 2300 MHz
= 0.85 dB @ 2700 MHz
· Unconditionally Stable
· Single 5V Supply
· High OIP3 @ Low Current
The plerowTM ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communication terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
Specifications (in Production)
Typ. @ T = 25°C, Vs = 5 V, Freq. = 2500 MHz, Zo.sys = 50 ohm
Parameter
Unit
Frequency Range
Min
Typ
MHz
2300
Gain
dB
11.2
Gain Flatness
dB
± 0.75
Noise Figure
dB
0.65 @2.3G
0.85 @2.7G
Output IP3
S11 / S22
(1)
dBm
(2)
Max
2700
12.2
33
More Information
± 0.95
Website: www.asb.co.kr
E-mail: [email protected]
34
dB
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
-19 / -9
Output P1dB
dBm
Switching Time
µsec
1.0
Supply Current
mA
80
Supply Voltage
V
5
18
19
ASB Inc., 4th Fl. Venture Town
Bldg., 367-17 Goijeong-Dong,
Seo-Gu, Daejon 302-716, Korea
100
Ω
50
Max. RF Input Power
dBm
C.W 29 ~ 31 (before fail)
Package Type & Size
mm
Surface Mount Type, 10Wx10Lx3.8H
Impedance
1-stage Single Type
Specifications
Operating temperature is -40°C to +85°C.
1) OIP3 is measured with two tones at an output power of 7 dBm / tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Outline Drawing (Unit: mm)
Pin Number
plerow
ALN2501AT
ASB Inc.
(Top View)
(Bottom View)
Solder Stencil Area
Function
2
RF In
5
RF Out
6
+Vcc
Others
Ground
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
(Side View)
Ø0.4 plated thru holes to ground plane
(Recommended Footprint)
1/4
www.asb.co.kr
November 2008
plerowTM ALN2501AT
Internally Matched LNA Module
S-parameters
Typical Performance
(Measured)
2300~2700
+5 V
Noise Figure
30
10
20
9
10
S21
8
0
S22
7
-10
6
S12
-20
5
-30
4
-40
3
S11
-50
2
-60
1
-70
0
500
1000
1500
2000
2500
3000
3500
4000
4500
Stability Factor K
S-parameter [dB]
S-parameters & K Factor
0
5000
Frequency [MHz]
OIP3
2/4
P1dB
www.asb.co.kr
November 2008
plerowTM ALN2501AT
Internally Matched LNA Module
S-parameters
Typical Performance
(Measured)
2500~3000
+5 V
Noise Figure
30
10
20
9
10
S21
8
0
S22
7
-10
6
S12
-20
5
-30
4
-40
3
S11
-50
2
-60
1
-70
0
500
1000
1500
2000
2500
3000
3500
4000
4500
Stability Factor K
S-parameter [dB]
Stability Factor (K)
0
5000
Frequency [MHz]
OIP3
3/4
P1dB
www.asb.co.kr
November 2008
plerowTM ALN2501AT
Internally Matched LNA Module
Application Circuit
V DC
+
-
Tantal
Capacitor
IN
OUT
ALN
C1
C2
1) The tantal capacitor is optional and for bypassing the AC noise introduced from the DC supply.
The capacitance value may be determined by customer’s DC supply status.
2) So-called DC blocking capacitors are always necessarily placed at the input and output port
for allowing only the RF signal to pass and blocking the DC component in the signal. The DC
blocking capacitors are included inside the LNA module. Therefore, C1 & C2 capacitors may
not be necessary, but can be added just in case that the customer wants. The value of C1 &
C2 is determined by considering the application frequency.
Recommended Soldering Reflow Process
Evaluation Board Layout
+Vcc
20~40 sec
260°C
Ramp-up
(3˚C/sec)
Ramp-down
(6°C/sec)
IN
200°C
OUT
150°C
60~180 sec
Size 25 x 25mm
(for ALN-AT, BT, T Series – 10x10mm)
4/4
www.asb.co.kr
November 2008