High Performance ASIC Cooling Solutions w/Thermal Tape Attachment ATS PART # ATS-56011-C3-R0 Features & Benefits » D maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling » Designed specifically for ASIC package and their unique cooling requirements » Comes preassembled with high performance thermal interface material C B Thermal Performance A *Image above is for illustration purposes only. Air Velocity Thermal Resistance FT/MIN M/S °C/W (UNDUCTED FLOW) °C/W (DUCTED FLOW) 200 1.0 2.3 1.1 300 1.5 1.8 400 2.0 1.3 500 2.5 1.2 600 3.0 1 700 3.5 0.8 800 4.0 0.7 Product Details DIMENSION A DIMENSION B DIMENSION C DIMENSION D INTERFACE MATERIAL FINISH 57.5 mm 57.5 mm 12.5 mm 70 mm Saint-gobain C675 BLACK-ANODIZED Notes: 1) 2) 3) 4) Dimension C = heat sink height from bottom of the base to the top of the fin field. Thermal performance data are provided for reference only. Actual performance may vary by application. ATS reserves the right to update or change its products without notice to improve the design or performance. Contact ATS to learn about custom options available. For more information, to find a distributor or to place an order, visit www.qats.com or call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe). REV1_0908