BeRex BD0926 Dedicated Band 2-Way SMT Power Divider 700~1000MHz Cellular & GSM900 Device Features and Description 23.0dB Typical Isolation 0.6dB Typical Insertion Loss Small Size and Low Profile MSL 1 moisture rating Lead-free/Green/RoHS compliant package BD09XX(XX=Wafer number) Application: commercial, space, military wireless system Industry Standard SOT-26 SMT Plastic Package Chip is fully passivated for enhanced performance and reliability Electrical specifications Parameters Unit Min Typ Max Frequency Range MHz 700 Insertion Loss dB Isolation dB IRL(S11) dB -17.0 -14.5 ORL(S22,S33) dB -20.0 -15.0 Amplitude Balance dB 0.1 0.2 Phase Balance deg 0.4 0.5 1000 0.6 16.5 0.8 23.0 All specifications apply with the following test conditions, 1. Device performance is measured on BeRex evaluation board at 25C, 50 ohm system 2. Insertion Loss: Above 3.0dB Absolute Maximum Ratings Parameters Input Power Storage Temperature Operating Temperature Rating 1W CW -55 to +155C -40C to +85C Operation of this device above any of these parameters may result in permanent damage. http: //www.berex.com BeRex BD0926 Evaluation Board Drawing Function Block Diagram Pins 2,4 and 6 must be DC and RF grounded. Typical Test Data Parameters Unit Cellular & GSM900 Frequency Range MHz 700 750 800 850 900 950 1000 Insertion Loss dB 0.54 0.55 0.55 0.57 0.59 0.63 0.70 Isolation dB 17.39 22.03 30.99 31.43 23.06 18.99 16.37 IRL(S11) dB -16.30 -17.18 -17.68 -17.87 -17.30 -16.15 -14.75 ORL(S22,S33) dB -27.8 -25.66 -22.59 -20.03 -18.20 -16.69 -15.50 Phase Diff. deg 0.13 0.22 0.23 0.23 0.24 0.41 0.42 Amplitude Balance dB 0.01 0.01 0.01 0.01 0.02 0.02 0.02 Insertion Loss vs. Frequency Isolation vs. Frequency 0 0 S21 Isolation -5 -10 -2 Isolation[dB]] Insertion Loss [dB] -1 -15 -20 -3 -25 -4 -30 -5 -35 -40 -6 700 800 900 Freq [MHz] 1000 700 800 900 Freq [MHz] 1000 http: //www.berex.com BeRex BD0926 IRL vs. Frequency ORL vs. Frequency 0 0 S11 -5 -10 ORL[dB] IRL[dB] S22 -5 -10 -15 -20 -25 -15 -30 -20 -35 700 800 900 Freq [MHz] 1000 700 800 900 Freq [MHz] 1000 Package Drawing http: //www.berex.com BeRex BD0926 Suggested PCB Land Pattern and PAD Layout PCB Land Pattern PCB Mounting Ø0.8 2.3 0.4 0.9 0.65 2.2 Ø0.8 Note : All dimension are in millimeters Visit http://www.berex.com for PCB layout Lead plating finish 100% Tin Matte finish. (All BeRex products undergoes a 1 hour, 150 degree C, Anneal bake to eliminate thin whisker growth concerns) MSL / ESD Rating MSL Rating: Standard: Level 3 at +265C convection reflow JEDEC Standard J-STD-020 NATO CAGE code: 2 N 9 6 F NOTICE BeRex Corporation reserves the right to make changes of product specification or to discontinue product at any time without notice. http: //www.berex.com