SN74AHCU04-EP HEX INVERTERS www.ti.com SCLS706 – MARCH 2007 FEATURES • • • • • • (1) Controlled Baseline – One Assembly Site – One Test Site – One Fabrication Site Extended Temperature Performance of –55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree (1) Operating Range 2-V to 5.5-V VCC • • • Unbuffered Outputs Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) D OR PW PACKAGE (TOP VIEW) 1A 1Y 2A 2Y 3A 3Y GND Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. 1 14 VCC 2 13 3 12 6A 6Y 5A 5Y 4A 4Y 4 11 5 10 6 9 7 8 DESCRIPTION/ORDERING INFORMATION The ’HC04 devices contain six independent inverters. They perform the Boolean function Y = A in positive logic. ORDERING INFORMATION (1) PACKAGE (2) TA –55°C to 125°C (1) (2) TSSOP - PW ODERABLE PART NUMBER Tape and Reel SN74AHCU04MPWREP TOP-SIDE MARKING AHCU04M For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (EACH INVERTER) INPUT A OUTPUT Y H L L H LOGIC DIAGRAM (POSITIVE LOGIC) A Y Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007, Texas Instruments Incorporated SN74AHCU04-EP HEX INVERTERS www.ti.com SCLS706 – MARCH 2007 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 7 V VI Input voltage range (2) –0.5 7 V –0.5 VCC + 0.5 range (2) UNIT VO Output voltage IIK Input clamp current VI < 0 –20 mA IOK Output clamp current VO < 0 or VO = 0 to VCC ±20 mA IO Continuous output current VO = 0 to VCC ±25 mA Continuous current through VCCor GND VCC or GND ±50 mA θJA Tstg (1) (2) (3) D package Package thermal impedance (3) 86 PW package 113 Storage temperature range –60 150 V °C/W °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) MIN VCC VIH Supply voltage High-level input voltage MAX 2 VCC = 2 V 1.7 VCC = 3 V 2.4 VCC = 5.5 V 4.4 V V VCC = 2 V 0.3 VCC = 3 V 0.6 VIL Low-level input voltage VI Input voltage 0 VCC V VO Output voltage 0 VCC V –50 µA IOH High-Level output current VCC = 5.5 V IOL TA (1) Low-Level output current VCC = 3.3 V ± 0.3 –4 VCC = 5 V ± 0.5 –8 VCC = 2 V 50 VCC = 3.3 V ± 0.3 4 VCC = 5 V ± 0.5 8 Operating free-air temperature V 1.1 VCC = 2 V 2 UNIT 5.5 –55 125 mA µA mA °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback SN74AHCU04-EP HEX INVERTERS www.ti.com SCLS706 – MARCH 2007 Electrical Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS TA = 25°C VCC IOH = –50 µA VOH MIN 1.8 1.8 3V 2.7 2.7 4 4 2.3 IOH = –4 mA 3V 2.58 IOH = –8 mA 4.5 V 3.94 V 3.5 0.1 0.2 3V 0.1 0.3 4.5 V 0.1 0.5 3V 0.26 0.5 IOL = 4 mA UNIT MAX 2V IOL = 50 µA IOL = 8 mA MIN 2V 4.5 V VOL TA = –55°C TO 125°C MAX V 4.5 V 0.26 0.5 II VI = VCC or GND 0 V to 5.5 V ±0.1 ±1 µA ICC VI = VCC or GND, O= 0 5.5 V 2 20 µA Ci VI = VCC or GND, 5V 10 10 pF Switching Characteristics over operating free-air temperature range, VCC = 3.3 ± 0.3 V (unless otherwise noted) (see Figure 1) PARAMETE R tPLH FROM (INPUT) TO (OUTPUT) VCC A Y CL = 50 pF tPHL TA = 25°C TA = –55°C TO 125°C UNIT MIN MAX MIN MAX 1 10.6 1 14 ns 1 10.6 1 14 ns Switching Characteristics over operating free-air temperature range, VCC = 5 ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER tPLH FROM (INPUT) TO (OUTPUT) VCC A Y CL = 50 pF tPHL TA = 25°C TA = –55°C TO 125°C UNIT MIN MAX MIN MAX 1 7 1 11 ns 1 7 1 11 ns Noise Characteristics (1) VCC = 5 V, CL = 50 pF, TA = 25°C PARAMETER MIN TYP MAX UNIT VOL(P) Quiet output, maximum dynamic VOL 0.5 V VOL(V) Quiet output, minimun dynamic VOL(V) –0.5 V 4.3 V VOH(V) Quiet output, minimun dynamic VOH VIH(D) HIgh-level dynamic input voltage VIH(D) VIL(D) Low-level dynamic input voltage VIH(D) (1) 4 V 1 V Characterists are for surface-mount packages only. Operating Characteristics TA = 25°C PARAMETER Cpd Power dissipation capacitance TEST CONDITIONS TYP UNIT No load, f = 1 MHz 7.3 pF Submit Documentation Feedback 3 SN74AHCU04-EP HEX INVERTERS www.ti.com SCLS706 – MARCH 2007 PARAMETER MEASURMENT INFORMATION VCC From Output Under Test R L = 1 kW From Output Under Test Test Point S1 Open GND CL (see Note A) CL (see Note A) TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VCC GND VCC Open Drain LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS VCC 50% VCC Timing Input tw VCC Input 50% VCC 50% VCC 0V th tsu VCC 50% VCC Data Input 50% VCC 0V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION VCC Input 50% VCC 50% VCC 0V 50% VCC In-Phase Output Out-of-Phase Output VOH 50% VCC VOL 50% VCC tPLZ »VCC 50% VCC 50% VCC VOL Output W aveform 2 S1 at GND (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL+ 0.3 V VOL tPHZ tPZH VOH 50% VCC 0V Output W aveform 1 S1 at VCC (see Note B) tPLH tPHL 50% VCC tPZL tPHL tPLH VCC Output Control 50% VCC VOH - 0.3 V VOH »0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR £ MHz, ZO = 50 W, tr £ 3 ns, tf £ 3 ns. D. The outputs are measured one at a time, with one transition per measurement. E. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 4 Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74AHCU04MPWREP ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM V62/07619-01XE ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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OTHER QUALIFIED VERSIONS OF SN74AHCU04-EP : SN74AHCU04 • Catalog: SN74AHCU04-Q1 • Automotive: • Military: SN54AHCU04 NOTE: Qualified Version Definitions: - TI's standard catalog product • Catalog - Q100 devices qualified for high-reliability automotive applications targeting zero defects • Automotive • Military - QML certified for Military and Defense Applications Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74AHCU04MPWREP Package Package Pins Type Drawing TSSOP PW 14 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 12.4 Pack Materials-Page 1 6.9 B0 (mm) K0 (mm) P1 (mm) 5.6 1.6 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AHCU04MPWREP TSSOP PW 14 2000 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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