PA75 PA75 P r o d u c t IInnnnoovvaa t i o n FFr roomm Dual Power Operational Amplifiers FEATURES • RoHS COMPLIANT • LOW COST • WIDE BANDWIDTH - 1.1 Mhz • HIGH OUTPUT CURRENT - 2.5A (Combined) • WIDE COMMON MODE RANGE Includes negative supply • WIDE SUPPLY VOLTAGE RANGE Single supply: 5V to 40V Split supplies: ± 2.5V to ± 20V • LOW QUIESCIENT CURRENT • VERY LOW DISTORTION APPLICATIONS • HALF AND FULL BRIDGE MOTOR DRIVERS • AUDIO POWER AMPLIFIER • IDEAL FOR SINGLE SUPPLY SYSTEMS 5V Peripherals, 12V Automotive, 28V Avionic 7 pin DDPAK PACKAGE STYLE CC 7 pin TO220 Staggered Leads PACKAGE STYLE CX TYPICAL APPLICATION Ref: APPLICATION NOTES 8, 20, 26 PACKAGING OPTIONS RI +VS • 7 TO-220 Plastic Package (PA75CD) • 7 TO-220 with Staggered Lead Form (PA75CX) • 7 DDPAK Surface Mount Package (PA75CC) 1/2 PA75 The amplifier design consists of dual power op amp on a single monolithic die. Side B of the dual monolithic is configured as a unity gain buffer to increase the current capability of the master side A. The use of two PA75 amplifiers provides a cost-effective solution to applications where multiple amplifiers are required or a bridge configuration is needed. Very low harmonic distortion of .02% THD and low IQ makes the PA75 a good solution for power audio applications. The PA75 is available in three standard package designs. The surface mount version of the PA75, the PA75CC, is an industry standard non-hermetic plastic 7-pin DDPAK. The through hole version of the PA75, the PA75CD and PA75CX, are industry standard non-hermetic plastic 7-pin TO-220 packages. The PA75CX is staggered lead formed and offers standard 100 mil spacing. This allows for easier PC board layout. (Please refer to the CX lead form package drawing for dimension of the PA75CX). The monolithic amplifier is directly attached to the metal tabs of the PA75CC, PA75CD, and PA75CX. The metal tabs of the packages are directly tied to -Vs. RS VO 2I I 1/2 PA75 LOAD RS B I –VS Combining the power op amp (master channel A) and the unity gain buffer (slave channel B) in a parallel connection yields a single 2.5A amplifier. RI and RF can set up channel A for the required gain for the overall circuit. Small values of RS (sense resistors) are used on the outputs to improve current sharing characteristics.The master amplifier can be configured in inverting or non-inverting gain configurations. EXTERNAL CONNECTIONS PA75CD PA75CX PA75CC SUB SUB A EQUIVALENT SCHEMATIC ONE CHANNEL PARALLEL CONNECTION yields a single 2.5A amplifier RF A VIN DESCRIPTION 7 pin TO220 PACKAGE STYLE CD B A SUB B A B +Vs CHANNEL A CHANNEL B -Vs PA75U http://www.cirrus.com Copyright © Cirrus Logic, Inc. 2009 (All Rights Reserved) OUT AMP A -IN AMP A +IN AMP A -VS +IN AMP B +VS OUT AMP B OUT THERMAL PROTECT OUT AMP A -IN AMP A +IN AMP A -VS +IN AMP B +VS OUT AMP B +IN -IN OUT AMP A -IN AMP A +IN AMP A -VS +IN AMP B +VS OUT AMP B I BIAS MONITOR MAY 20091 APEX − PA75UREVF PA75 ABSOLUTE MAXIMUM RATINGS P r o d u c t I n n o v a t i o nF r o m SUPPLY VOLTAGE, total OUTPUT CURRENT POWER DISSIPATION, internal, (per amplifier) POWER DISSIPATION, internal (both amplifiers) INPUT VOLTAGE, differential INPUT VOLTAGE, common mode JUNCTION TEMPERATURE, max1 TEMPERATURE, pin solder—10 sec max TEMPERATURE RANGE, storage OPERATING TEMPERATURE RANGE, case 5V to 40V SOA 19.5W 28.6W ±VS +VS, -VS–0.5V 150°C 220°C –55°C to 150°C –40°C to 125°C SPECIFICATIONS PARAMETER TEST CONDITIONS 2 MIN TYP MAX UNITS 1 20 100 90 90 68 22 15 500 +VS–1.3 mV µV/°C nA V dB dB dB nV/√Hz INPUT OFFSET VOLTAGE, initial OFFSET VOLTAGE, vs. temperature BIAS CURRENT, initial COMMON MODE RANGE COMMON MODE REJECTION, DC POWER SUPPLY REJECTION CHANNEL SEPARATION INPUT NOISE VOLTAGE Full temperature range Full temperature range Full temperature range IOUT = 500mA, ƒ = 1kHz RS = 100Ω, ƒ = 1 to 100kHz –VS 60 60 50 GAIN OPEN LOOP GAIN GAIN BANDWIDTH PRODUCT PHASE MARGIN POWER BANDWIDTH Full temperature range AV = 40dB Full temperature range, RL = 2KΩ, CL = 100pF VO(P-P) = 28V 89 0.9 100 1.4 65 13.6 dB MHz ° kHz 1 |VS| - 1.1 |VS| - 1.8 1.4 |VS| - .8 |VS| - 1.4 .02 1.5 A V/µs V V % 5 30 8 40 10 V mA 5.84 4.38 3.97 2.98 60 27 6.42 4.81 4.36 3.27 85 °C/W °C/W °C/W °C/W °C/W °C/W °C OUTPUT CURRENT, peak SLEW RATE VOLTAGE SWING VOLTAGE SWING HARMONIC DISTORTION Full temperature range Full Temperature Range, IO = 100mA Full Temperature Range, IO = 1A AV = 1, R2 = 50Ω, VO = .5VRMS, ƒ = 1kHz POWER SUPPLY VOLTAGE, VSS3 CURRENT, quiescent, total THERMAL RESISTANCE,DC junction to case (single) RESISTANCE,AC junction to case (single) RESISTANCE,DC junction to case (both) RESISTANCE,AC junction to case (both) RESISTANCE,junction to air (CD,CX) RESISTANCE,junction to air (CC)4 TEMPERATURE RANGE,case Meets full range specifications –25 NOTES: 1. Long term operation at the maximum junction temperature will result in reduced product life. Derate internal power dissipation to achieve high MTTF. 2. Unless otherwise noted, the following conditions apply: ±VS = ±15V, TC = 25°C. 3. +VS and –VS denote the positive and negative supply rail respectively. VSS denotes the total rail-to-rail supply voltage. 4. Heat tab attached to 3/32" FR-4 board with 2oz. copper. Topside copper area (heat tab directly attached) = 1000 sq. mm, backside copper area = 2500 sq. mm, board area = 2500 sq. mm. 2 PA75U PA75 P r o d u c t I n n o v a t i o nF r o m 80 12 40 8 0 4 -40 0 -80 1.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 NORMALIZED QUIESCENT CURRENT, IQ (mA) PHASE MARGIN vs. OUTPUT LOAD CAPACITANCE 45 PULSE RESPONSE 10 -0.5 -100 -50 0 50 -100 CASE TEMPERATURE, TC (°C) 150 90 40 100 20 110 +VS = +15V -VS = -15V RL = 2K 1 120 100 1K 10 FREQUENCY, f (KHz) 130 10K OFFSET VOLTAGE 3 2.5 2 1.5 1 0.5 0 -100 2 -50 0 50 100 TEMPERATURE, TC (°C) 150 OUTPUT VOLTAGE SWING 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0.1 0.5 0.9 0.7 0.3 OUTPUT CURRENT, IO (A) PULSE RESPONSE 10 8 8 OUTPUT VOLTAGE, VO (V) OUTPUT VOLTAGE, VO (V) 0 -20 25 2.0 0.4 0.8 1.2 1.6 0.0 OUTPUT LOAD CAPACITANCE, CL (nF) +VS = +15V AV = +1 VIN = 10Vp 6 4 2 0 -2 -VS = -15V RL = 20 fIN = 20kHz -4 -6 -8 PA75U 0.5 0 35 -10 1 60 GAIN, A (dB) PHASE MARGIN, Ф (°) 55 1.5 VOLTAGE GAIN & PHASE vs. FREQUENCY +VS = +15V -VS = -15V RL = 2K AV = -100 65 NORMALIZED OFFSET VOLTAGE, VOS (mV) 16 2 VOLTAGE DROP FROM SUPPLY, (V) 120 2.5 PHASE, Ф (°) 20 NORMALIZED BIAS CURRENT, IB (mA) TOTAL SUPPLY VOLTAGE, VS (V) BIAS CURRENT 160 CASE TEMPERATURE, TC (°C) QUIESCENT CURRENT 24 0 10 20 30 40 TIME, t (s) 50 60 70 +VS = +15V AV = +1 VIN = 10Vp 6 4 2 0 -2 -4 -6 -VS = -15V fIN = 1kHz -8 -10 0 200 400 600 800 1000 1200 1400 TIME, t (s) 3 PA75 P r o d u c t I n n o v a t i o nF r o m GENERAL THERMAL CONSIDERATIONS Please read Application Note 1 “General Operating Considerations” which covers stability, supplies, heatsinking, mounting, SOA interpretation, and specification interpretation. Visit www. Cirrus.com for design tools that help automate tasks such as calculations for stability, internal power dissipation, heatsink selection; Apex Precision Power’s complete Application Notes library; Technical Seminar Workbook; and Evaluation Kits. The PA75CD and CX have a large exposed copper heat tab to which the monolithic is directly attached. The PA75CD and CX may require a thermal washer, which is electrically insulating since the tab is directly tied to -VS. This can result in a thermal impedance RCS of up to 1˚C/W or greater. The PA75CC has a large exposed integrated copper heatslug to which the monolithic is directly attached. The solder connection of the heatslug to a minimum of 1 square inch foil area of the printed circuit board will result in thermal performance of 25°C/W junction to air rating of the PA75CC. Solder connection to an area of 1 to 2 square inches of foil is required for minimal power applications Where the PA75CC is used in higher power applications, it is necessary to use surface mount techniques of heatsinking. Surface mount techniques include the use of a surface mount fan in combination with a surface mount heatsink on the backside of the FR4/ PC board with through hole thermal vias. Other highly thermal conductive substrate board materials are available for maximum heat sinking. POWER DERATING All monolithic power + op amps use output stage topologies that present special stabil– C SN ity problems. This is 0.01µF primarily due to noncomplementary (both R SN d ev i c e s a re N P N ) 10Ω output stages with a mismatch in gain and phase response for different polarities of output current. It is difficult for the op amp manufacturer to optimize compensation for all operating conditions. For applications with load current exceeding 300ma, oscillation may appear. The oscillation may occur only with the output voltage swing at the negative or positive half cycle. Under most operating and load conditions acceptable stability can be achieved by providing a series RC snubber network connected from the output to ground. The recommended component values of the of the network are,RSN = 10Ω and CSN = 0.01µF. Please refer to Application Note 1 for further details. SAFE OPERATING AREA (SOA) OUTPUT CURRENT FROM +VS or -VS (A) The SOA curves combine the effect of all limits for this power op amp. For a given application, the direction and magnitude of the output current should be calculated or measured and checked against the SOA curves. This is simple for resistive loads but more complex for reactive and EMF generating loads. SOA 10.0 TWO AMPLIFIERS LOADED DC, TC = 25°C 35 INTERNAL POWER DISSIPATION, P (W) STABILITY CONSIDERATIONS TWO AMPLIFIERS LOADED 30 25 ONE AMPLIFIER LOADED 20 15 10 5 0 0 25 50 75 100 CASE TEMPERATURE, TC (°C) 125 MOUNTING PRECAUTIONS 1. Always use a heat sink. Even unloaded the PA75 can dissipate up to .4 watts. 2. Avoid bending the leads. Such action can lead to internal damage. 3. Always fasten the tab of the CD and CX package to the heat sink before the leads are soldered to fixed terminals. 4. Strain relief must be provided if there is any probability of axial stress to the leads. 1.0 ONE AMPLIFIER LOADED DC, TC = 85°C 0.1 1.0 10.0 100.0 SUPPLY TO OUTPUT DIFFERENTIAL VOLTAGE, VS - VO (V) 4 PA75U