Spec. No. : C400N3 Issued Date : 2006.10.17 Revised Date : Page No. : 1/5 CYStech Electronics Corp. P-CHANNEL ENHANCEMENT MODE POWER MOSFET MTP3001N3 Description The MTP3001N3 is a P-channel enhancement-mode MOSFET, providing the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost effectiveness. Features • RDS(ON)=50mΩ@VGS=-10V, ID=-5.3A RDS(ON)=75mΩ@VGS=-4.5V, ID=-4.2A • Simple drive requirement • Low on-resistance • Fast switching speed • Pb-free package Applications • Power management in notebook computer, portable equipment and battery powered systems. Equivalent Circuit MTP3001N3 Outline SOT-23 D G：Gate S：Source D：Drain MTP3001N3 G S CYStek Product Specification Spec. No. : C400N3 Issued Date : 2006.10.17 Revised Date : Page No. : 2/5 CYStech Electronics Corp. Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limits Unit Drain-Source Breakdown Voltage BVDSS -30 V Gate-Source Voltage VGS ±20 V Continuous Drain Current @TA=25 °C (Note 1) ID -5.3 A Continuous Drain Current @TA=70 °C (Note 1) ID -4 A IDM -20 A Pd 1.25 W Tj -55~+150 °C Tstg -55~+150 °C Rth,ja 50 °C/W Pulsed Drain Current (Note 2) Total Power Dissipation @ TA=25 °C (Note 1) Operating Junction Temperature Storage Temperature Thermal Resistance, Junction-to-Ambient Note : 1.Surface mounted on 1 in² copper pad of FR-4 board, t≤10s. 2.Pulse width limited by maximum junction temperature. Electrical Characteristics (Ta=25°C) Symbol Min. Typ. Max. BVDSS -30 VGS(th) -1 -1.5 -3 IGSS ±100 IDSS -1 60 70 *RDS(ON) 75 90 *GFS 4 7 Ciss 551 Coss 91 Crss 61 td(ON) 10.8 tr 2.3 td(OFF) 23 tf 4 Qg 9.5 Qgs 3.4 Qgd 1.7 ISD -1.7 *VSD -1.3 Unit V V nA μA S Test Conditions VGS=0, ID=-250μA VDS=VGS, ID=-250μA VGS=±20V, VDS=0 VDS=-24V, VGS=0 ID=-5.3A, VGS=-10V ID=-4.2A, VGS=-4.5V VDS=-15V, ID=-5.3A pF VDS=-15V, VGS=0, f=1MHz mΩ ns ns ns ns nC nC nC A V VDD=-15V, ID=-1A, VGS=-10V, RGEN=6Ω, RD=15Ω VDS=-15V, ID=-5.3A, VGS=-10V, VGS=0V, ISD=-1.7A *Pulse Test : Pulse Width ≤380μs, Duty Cycle≤2% Ordering Information Device MTP3001N3 MTP3001N3 Package SOT-23 (Pb-free) Shipping Marking 3000 pcs / Tape & Reel 01 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C400N3 Issued Date : 2006.10.17 Revised Date : Page No. : 3/5 Characteristic Curves On-Resistance vs Gate Voltage On Resistance vs Drain Current 250 140 RDSON, On - Resistance (mΩ) RDSON, On-Resistance(mΩ) -ID=5.3A 200 150 100 50 120 100 VGS=-4.5V 80 60 VGS=-10V 40 0 20 1 2 3 4 5 6 7 8 9 10 -VGS , Gate-to-Source Voltage(V) 0 3 6 9 ID , Drain Current (A) 12 15 Power Dearting Curve 1.5 PD, Power Dissipation(W) 1.25 1 0.75 0.5 0.25 0 0 25 50 75 100 125 150 TA , Ambient Temperature(℃) MTP3001N3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C400N3 Issued Date : 2006.10.17 Revised Date : Page No. : 4/5 Reel Dimension Carrier Tape Dimension MTP3001N3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C400N3 Issued Date : 2006.10.17 Revised Date : Page No. : 5/5 SOT-23 Dimension Marking: A L 3 B TE 01 S 2 1 3-Lead SOT-23 Plastic Surface Mounted Package CYStek Package Code: N3 G V Style: Pin 1.Gate 2.Source 3.Drain C D H K J *: Typical DIM A B C D G H Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTP3001N3 CYStek Product Specification