EHP-A21/LM31H-PU5/TR High Power LED – 0.5W Data Sheet Features Applications Feature of the device: Small package with high efficiency Typical color temperature: 3050 K. Typical view angle: 115° Typical light flux output: 22 lm @ 150mA. ESD protection. Soldering methods: SMT Grouping parameter: Brightness, Forward Voltage and Chromaticity. Optical efficiency: 42 lm/W. Moisture Sensitivity Level: 2A Color rendering Index: 80(typ.) Thermal resistance (Junction to Heat sink): 40 °C /W The product itself will remain within RoHS compliant version. Design and effect illumination Interior automotive lighting (e.g. dashboard backlighting) Room lighting (e.g. luminaries, spotlights) Reading light (aircraft, car, bus) Signal and symbol luminaries Marker lights (e.g. steps, exit ways, etc.) Architectural illumination Materials Items Description Encapsulating Resin Silicone resin Electrodes Ag plating copper alloy Die attach Silver paste Chip InGaN 1 of 15 EHP-A21/LM31H-PU5/TR High Power LED – 0.5W Dimensions Notes. 1. Dimensions are in millimeters. 2. Tolerances for fixed dimensions are ± 0.25mm. 2 of 15 EHP-A21/LM31H-PU5/TR High Power LED – 0.5W Maximum Ratings (T Soldering=25ºC) Parameter Symbol Rating Unit DC Operating Current IF 180 mA Pulsed Forward Current(1) IPF 200 mA ESD 2000 V Tj 125 °C Operating Temperature Top. -40 ~ +85 °C Storage Temperature Tstge. -40 ~ +100 °C Power Dissipation Pd 0.5 W Junction To Heat-Sink Thermal Resistance Rth 40 °C /W ESD Sensitivity Junction Temperature Electro-Optical Characteristics (T Soldering=25ºC) Parameter Symbol Min Typ. Max Unit Brightness(2) Фv ---- 22 ---- lm Forward Voltage(3) VF ---- 3.55 ---- V Color Temperature(4) CCT ---- 3050 ---- K Condition IF=150mA Note. 1. tp ≦100μs, Duty cycle = 0.25 2. Luminous Flux measurement tolerance: ±10%. 3. Forward Voltage measurement tolerance: ± 0.1V. 4. X, Y coordination for white light bin areas refer to EHP-A08-AX08 series White and Warm White Binning (DSE-A08-001). 3 of 15 EHP-A21/LM31H-PU5/TR High Power LED – 0.5W Brightness Bin Table Group E F J K Bin Min Typ. Max 3 11 130 ---- 140 ---- 4 12 140 ---- 150 4 ---- 5 13 150 ---- 160 4 5 ---- 6 21 160 ---- 180 5 6 ---- 8 22 180 ---- 200 1 8 ---- 10 31 200 ---- 225 2 10 ---- 13 32 225 ---- 250 3 13 ---- 17 41 250 ---- 275 4 17 ---- 20 42 275 ---- 300 5 20 ---- 23 51 300 ---- 350 1 23 ---- 27 52 350 ---- 400 2 27 ---- 33 1 400 ---- 500 3 33 ---- 39 2 500 ---- 600 4 39 ---- 45 3 600 ---- 750 5 45 ---- 52 4 750 ---- 1000 1 52 ---- 60 5 1000 ---- 1300 2 60 ---- 70 31 70 ---- 75 32 75 ---- 80 33 80 ---- 85 41 85 ---- 90 42 90 ---- 95 43 95 ---- 100 51 100 ---- 110 52 110 ---- 120 53 120 ---- 130 Bin Min Typ. Max 1 1.5 ---- 2 3 3 Group N R 4 of 15 EHP-A21/LM31H-PU5/TR High Power LED – 0.5W Forward Voltage Bin Table Group U1 U2 U3 U4 Bin Min Typ. Max 1 2.95 ---- 3.05 2 3.05 ---- 3.15 2.05 3 3.15 ---- 3.25 ---- 2.15 1 3.25 ---- 3.35 2.15 ---- 2.25 2 3.35 ---- 3.45 3 2.25 ---- 2.35 3 3.45 ---- 3.55 1 2.35 ---- 2.45 1 3.55 ---- 3.65 2 2.45 ---- 2.55 2 3.65 ---- 3.75 3 2.55 ---- 2.65 3 3.75 ---- 3.85 1 2.65 ---- 2.75 1 3.85 ---- 3.95 2 2.75 ---- 2.85 2 3.95 ---- 4.05 3 2.85 ---- 2.95 3 4.05 ---- 4.15 1 4.15 ---- 4.25 2 4.25 ---- 4.35 3 4.35 ---- 4.45 Bin Min Typ. Max 1 1.75 ---- 1.85 2 1.85 ---- 1.95 3 1.95 ---- 1 2.05 2 Group V1 V2 V3 V4 V5 Group O R Bin Min Typ. Max 1 4.5 ---- 5.0 2 5.0 ---- 5.5 3 5.5 ---- 6.0 4 6.0 ---- 6.5 5 6.5 ---- 7.0 6 7.0 ---- 7.5 7 7.5 ---- 8.0 1 8.0 ---- 9.0 2 9.0 ---- 10.0 3 10.0 ---- 11.0 4 11.0 ---- 12.0 5 of 15 EHP-A21/LM31H-PU5/TR High Power LED – 0.5W White Binning Structure Warm White 0.48 3250K 3500K 0.44 3800K 4500K 0.40 S4 T4 T5 S5 S6 Q5 R5 R6 Q7 P7 M6 N6 P6 Q6 N7 M4 M5 N5 P5 R4 2850K 2670K N4 P4 Q4 4100K CIE-Y 3050K M7 R7 T6 S7 0.36 T7 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 CIE-X Note. This datasheet is a product series datasheet with a list of all possible rankings for the entire Everlight high power portfolio. It does not specify exact bins available for any particular package. Please contact a member of your regional Everlight branch to receive specific binning, exact order codes and individual datasheets for a particular high power LED. 6 of 15 EHP-A21/LM31H-PU5/TR High Power LED – 0.5W Typical Electro-Optical Characteristics Curves Forward Voltage vs Forward Current, Tsoldering=25ºC 1.0 3.8 0.8 3.6 Forward Voltage(V) Relative Luminous Intenstiy Relative Spectral Distribution, IF=150mA, Tsoldering=25ºC 0.6 0.4 0.2 0.0 400 500 600 700 3.4 3.2 3.0 2.8 2.6 800 0 50 Wavelength(nm) 1.2 150 Forward Current (mA) Relative Luminous Intensity 180 1.0 0.8 0.6 0.4 0.2 120 90 60 30 0 50 100 200 Forward Current Derating Curve, Derating based on TjMAX=125°C 1.4 0 150 Forward Current(mA) Relative Luminous Intensity vs Forward Current, Tsoldering=25ºC 0.0 100 150 Forward Current(mA) 200 0 20 40 60 80 100 ο Soldering Temperature ( C) 7 of 15 EHP-A21/LM31H-PU5/TR High Power LED – 0.5W Typical Representative Spatial Radiation Pattern 1.0 Relative Luminous Intensity 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -80 -60 -40 -20 0 20 40 60 80 Degree (2θ) Note. 1. 2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 2. View angle tolerance is ± 5∘. 8 of 15 EHP-A21/LM31H-PU5/TR High Power LED – 0.5W Label explanation CPN: Customer’s Production Number P/N : Production Number QTY: Packing Quantity CAT: Rank of Luminous Flux HUE: Color Rank REF: Rank of Forward Voltage LOT No: Lot Number MADE IN TAIWAN: Production Place Reel Dimensions Note. 1. Dimensions are in millimeters. 2. Tolerances for fixed dimensions are ±0.1mm. 9 of 15 EHP-A21/LM31H-PU5/TR High Power LED – 0.5W Carrier Tape Dimensions: Loaded quantity 2000 PCS per reel Note. 1. Dimensions are in millimeters. 2. Tolerances for fixed dimensions are ±0.1mm. Moisture Resistant Packaging Label Aluminum moisture-proof bag Desiccant Label 10 of 15 EHP-A21/LM31H-PU5/TR High Power LED – 0.5W Reliability Data Stress Test Stress Condition Stress Duration Solderability Tsol=260℃, 10sec 1 times Reflow Tsol=260℃, 5sec, 6min 3 times H：＋100℃ 20min. '∫ 20sec. 'L：－ 10℃ 20min. 200 Cycles Temperature Cycle H：＋100℃ 15min. '∫ 5min. 'L：－ 40℃ 15min. 200 Cycles High Temperature/Humidity Reverse Bias Ta=85℃ , RH=85% 1000hours High Temperature/Humidity Operation Ta=85℃ , RH=85%, IF=120mA 1000hours High Temperature Storage Ta=85℃ 1000hours Low Temperature Storage Ta=-40℃ 1000hours Ta=25℃, IF=150mA 1000hours Ta=55℃, IF=150mA 1000hours Ta=85℃, IF=120mA 1000hours Low Temperature Operation Life Ta=-40℃, IF=150mA 1000hours Power Temperature Cycle H：＋100℃ 15min. '∫ 5min. 'L：－ 40℃ 15min. IF=120mA,2min on/off 200cycles Thermal Shock High Temperature Operation Life #1 High Temperature Operation Life #2 High Temperature Operation Life #3 *lm: BRIGHTNESS ATTENUATE DIFFERENCE(1000hrs)＜50% *VF: FORWARD VOLTAGE DIFFERENCE＜20% 11 of 15 EHP-A21/LM31H-PU5/TR High Power LED – 0.5W Precautions For Use Over-current-proof Although the EHP-A21 series has a conductive ESD protection mechanism, customer must not use the device in reverse and should apply resistors for extra protection. Otherwise, slight voltage shifts may cause significant current change resulting in burn out failure. 1. Storage i. Do not open the moisture proof bag before the devices are ready to use. ii. Before the package is opened, LEDs should be stored at temperatures less than 30℃ and humidity less than 90%. iii. LEDs should be used within a year. iv. After the package is opened, LEDs should be stored at temperatures less than 30℃and humidity less than 60%. v. LEDs should be used within 168 hours (7 days) after the package is opened. vi. If the moisture absorbent material (silicone gel) has faded away or LEDs have exceeded the storage time, baking treatment should be implemented based on the following conditions: pre-curing at 60±5℃ for 24 hours. 2. Thermal Management i. For maintaining the high flux output and achieving reliability, EHP-A21 series LEDs should be mounted on a metal core printed circuit board (MCPCB) or other kinds of heat sink with proper thermal connection to dissipate approximately 0.5W of thermal energy at 150mA operation. ii. Heat dissipation or thermal conduction design is strongly recommended on PCB or MCPCB for reflow soldering purposes. Please refer to soldering patterns on Page 2. iii. Sufficient thermal management must be implemented. Otherwise, the junction temperature of die may exceed over the limit at high current driving conditions and the LEDs’ lifetime may be decrease dramatically. iv. For further thermal management suggestions, please consult the Everlight Design Guide or local representatives for assistance. v. Special thermal designs are also recommended to take in outer heat sink design, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc. vi. Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and LED lifetime will decrease critically. 12 of 15 EHP-A21/LM31H-PU5/TR High Power LED – 0.5W 3. Proper Handling To avoid contamination of materials, damage of internal components, and shortening of LED lifetime, do not subject LEDs to conditions as those listed below. Bare Hand When handling the product, do not apply direct pressure on the resin. Pick and Place Nozzle for Surface Mount Assembly. Avoid directly contacting with nozzle. Tweezers Do not touch the resin to avoid scratching or other damage. During Module Assembly Do not stack the modules together, it could damage the resin or scratch the lens. 13 of 15 EHP-A21/LM31H-PU5/TR High Power LED – 0.5W 4. Soldering Iron i. For Reflow Process a. EHP-A21 series are suitable for SMT process. b. Curing of glue in oven according to standard operation flow processes. c. Reflow soldering should not be done more than twice. d. In soldering process, stress on the LEDs during heating should be avoided. e. After soldering, do not warp the circuit board. ii. For Manual Soldering Process a. For prototype builds or small series production runs it is possible to place and solder the LED by hand. b. Dispense thermal conductive glue or grease on the substrates and follow its curing specifications. Gently press LED housing to closely connect LED and substrate. c. It is recommended to hand solder the leads with a solder tip temperature of 280°C for less than 3 second, at a time with a soldering iron of less than 25W. Solder at intervals of two seconds or more. d. Take caution and be aware that damaged products are often a result of improper hand soldering technique. 14 of 15 EHP-A21/LM31H-PU5/TR High Power LED – 0.5W Revision History Page Subjects(major change in previous version) Date of change 1. Revise DC Operating Current and add Increases the specification 3,4,7 2. Change binning information 20-Jul-2009 3. Revise T Ambient to T Soldering 3 Update brightness value 27-Jul-2009 Prepared date: 20-Jul-2009 Device No.: DHE-0000326 Created by: Jessie Chueh Rev.: 3 For product information and a complete list of distributors, please go to our web site： www.everlight.com Everlight Electronics Co., Ltd. and the logo are trademarks of Everlight Electronics Co., Ltd. in the Taiwan and other countries. Data subject to change. Copyright © 2005-2009 Everlight Electronics Co., Ltd.. All rights reserved. 15 of 15