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411
BIN ranking for LEDs
BRIGHTNESS BIN
Bin Code
IV(mcd)
Bin Code
IV(mcd) Bin Code
IV(mcd)
Bin Code
IV(mcd)
A
0-5.0
H
37.2-52.0
Q
390-550
X
4180--5860
B
C
D
E
F
5.0-7.0
7.0-9.8
9.8-13.7
13.7-19.0
19.0-26.6
J
K
L
M
N
52.0-72.8
72.8-102
102-145
145-200
200-280
R
S
T
U
V
550-770
770-1100
1100-1520
1520-2130
2130-3000
Y
Z1
Z2
Z3
Z4
5860-8200
8-10cd
10-12cd
12-14cd
14-16cd
G
26.6-37.2
P
280-390
W
3000-4180
Z5
16-18cd
WAVELENGTH BIN
Ligth Col. Bin Code Wavel. (nm) Ligth Col. Bin Code Wavel. (nm)
BLUE
BLUE
GREEN
PURE
GREEN
B1
450-455
YG1
555-558
B2
B3
B4
B5
455-460
460-465
465-470
470-475
YG2
YG3
YG4
YG5
558-561
561-564
564-567
567-570
B6
475-480
YG6
570-573
G1
491-494
YG7
573-576
G2
494-497
Y1
582-585
G3
G4
G5
497-500
500-503
503-506
Y2
Y3
Y4
585-588
588-591
591-594
G6
506-509
Y5
594-597
G7
509-512
YO1
597-600
G8
512-515
YO2
600-603
G9
515-518
YO3
603-606
G10
518-521
YO4
606-609
G11
521-524
O1
609-612
G12
524-527
O2
612-615
G13
527-530
O3
615-618
G14
530-533
R1
618-621
G15
533-536
R2
621-624
G16
536-539
R3
624-627
G17
539-542
R4
627-630
G18
542-545
R5
630-633
G19
545-548
R6
633-636
YELLOW
GREEN
YELLOW
YELLOW
ORANGE
PURE
ORANGE
RED
FORWARD VOLTAGE (VF) BIN
Bin Code
VF (V)
Bin Code
VF (V)
Bin Code
VF (V)
Bin Code
VF (V)
V1
1.6-1.8
V5
V2
V3
1.8-2.0
2.0-2.2
V6
V7
2.4-2.6
V9
3.2-3.4
V13
4.0-4.2
2.6-2.8
2.8-3.0
V10
V11
3.4-3.6
3.6-3.8
V14
V15
4.2-4.4
4.4-4.6
V4
2.2-2.4
V8
3.0-3.2
V12
3.8-4.0
V16
4.6-4.8
Page:4
LED
LAMP APPLICATION
ySOLDERING
METHOD
DIP
SOLDERING
SOLDERING CONDITIONS
REMARK
Bath temperature: 260±5ć
Immersion time: with 5 sec
y Solder no closer than 3mm from the
base of the package
y Using soldering flux,” RESIN FLUX”
is recommended.
y During soldering, take care not to
press the tip of iron against the
Soldering iron: 30W or smaller
lead.
SOLDERING
Temperature at tip of iron: 260ć or lower (To prevent heat from being
IRON
Soldering time: within 5 sec.
transferred directly to the lead, hold
the lead with a pair of tweezers
while soldering
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
be careful not to stress the leads with iron tip.
٣
/HDGZULHV
3DQHO
)LJ
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
٣
/HDGZULHV
/HDYHDVOLJKW
FOHDUDQFH
)LJ
Page : 5
LED
LAMP APPLICATION
3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to
avoid steering the leads (See Fig.3).
٣
3&ERDUG
˄)LJ
˅
MLJ
4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to
preserve the soldering conditions with irons stated above: select a best-suited method that
assures the least stress to the LED.
5) Lead cutting after soldering should be performed only after the LED temperature has returned to
normal temperature.
yLED MOUNTING METHOD
1) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on
the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective
components including the LED should be taken into account especially when designing the
case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the
diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the
shape of the holes should be made oval. (See Fig.4)
case
pc board
Fig.4
Page : 6
LED
LAMP APPLICATION
2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs.
Tube
Stand-off
Fig.5
Fig.6
yFORMED LEAD
PP
1) The lead should be bent at a point located at least 2mm away from the package. Bending
should be performed with base fixed means of a jig or pliers (Fig.7)
)LJ
2) Forming lead should be carried our prior to soldering and never during or after soldering.
3) Form the lead to ensure alignment between the leads and the hole on board, so that stress
against the LED is prevented. (Fig.8)
Page : 7
LED
LAMP APPLICATION
yLEAD STRENGTH
1) Bend strength
Do not bend the lead more than twice. (Fig.9)
Fig.9
2) Tensile strength (@Room Temperature)
If the force is 1kg or less, there will be no problem. (Fig.10)
2.ʽ
.J
Fig.10
yHANDLING PRECAUTIONS
Although rigid against vibration, the LEDs may damaged or scratched if dropped. So take care
when handling.
yCHEMICAL RESISTANCE
1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration.
2) When washing is required, refer to the following table for the proper chemical to be sued.
(Immersion time: within 3 minutes at room temperature.)
SOLVENT
ADAPTABILITY
Freon TE
Ĵ
Chlorothene
͖
Isopropyl Alcohol
Ĵ
Thinner
͖
Acetone
͖
Trichloroethylene
͖
Ĵ--Usable
͖--Do not use.
NOTE: Influences of ultrasonic cleaning of the LED
resin body differ depending on such factors
as the oscillator output, size of the PC board
and the way in which the LED is mounted.
Therefore, ultrasonic cleaning should only be
performed after confirming there is no problem by
conducting a test under practical.
Page : 8
LED
LAMP PASSED TESTS
Experiment Item:
Item
OPERATION LIFE
HIGH
TEMPERATURE
HIGH HUMIDITY
STORAGE
TEMPERATURE
CYCLING
THERMAL SHOCK
SOLDER
RESISTANCE
SOLDERABILITY
Test Condition
Lamp & IR
TaΚ 25̈́5к
IF= 20mA RHΚІ=60%RH
ķʳ DYNAMIC:100mA 1ms 1/10 duty
ĸʳ STATIC STATE: IFЈ20mA
TEST TIME:
168HRSΰ-24HRSΔ+24HRSα
500HRSΰ-24HRSΔ+24HRSα
1000HRSΰ-24HRSΔ+72HRSα
Reference Standard
MIL-STD-750Κ1026
MIL-STD-883Κ1005
JIS C 7021ΚB-1
TaΚ 65к̈́5к
RHΚ 90Д95%RH
TEST TIMEΚ240HRS̈́2HRS
MIL-STD-202Κ103B
JIS C 7021 ΚB-1
105кД25кД-55кД25к
30min 5min
30min 5min
10CYCLES
MIL-STD-202Κ107D
MIL-STD-750Κ1051
MIL-STD-883Κ1010
JIS C 7021 ΚA-4
105к̈́5кД-55к̈́5к
10min
10min
10CYCLES
TΔsolΚ260к̈́5к
DWELL TIMEΚ10̈́lsec
TΔsolΚ230к̈́5к
DWELL TIMEΚ5̈́lsec
MIL-STD-202Κ107D
MIL-STD-750Κ1051
MIL-SYD-883Κ1011
MIL-STD-202Κ210A
MIL-STD-750-2031
JIS C 7021ΚA-1
MIL-STD-202Κ208D
MIL-STD-750Κ2026
MIL-STD-883Κ2003
JIS C 7021 ΚA-2
Drive Method
Circuit model A
Circuit model B
Page : 9
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.