ETC G766

G766
Global Mixed-mode Technology Inc.
Remote Temperature Sensor with SMBus Serial
Interface
Features
General Description
„Single Channel: Measures Remote CPU Tem-
The G766 is a precise digital thermometer that reports
the temperature of a remote sensor. The remote sensor is a diode-connected transistor typically a low-cost,
easily mounted 2N3904 NPN type-that replace conventional thermistors or thermocouples. Remote accuracy is ±3°C for multiple transistor manufacturers,
with no calibration needed. The G766 can also measure the die temperature of other ICs, such as microprocessors, that contain an on-chip, diode-connected
transistor.
perature
„No Calibration Required
„SMBus 2-Wire Serial Interface
„Programmable Under/Overtemperature Alarms
„Supports SMBus Alert Response
„Accuracy:
±3°C (+60°C to +100°C, remote)
„3µA (typ) Standby Supply Current
„300µA (max) Supply Current in Auto- Convert
Mode
„+3V to +5.5V Supply Range
„Small, 10-Pin MSOP Package
The 2-wire serial interface accepts standard System
Management Bus (SMBusTM) Write Byte, Read Byte,
Send Byte, and Receive Byte commands to program
the alarm thresholds and to read temperature data.
The data format is 7 bits plus sign, with each bit corresponding to 1°C, in twos-complement format. Measurements can be done automatically and autonomously, with the conversion rate programmed by the
user or programmed to operate in a single-shot mode.
The adjustable rate allows the user to control the supply-current drain.
The G766 is available in a small, 10-pin MSOP surface-mount package.
Applications
Desktop and Notebook
Computers
Smart Battery Packs
LAN Servers
Industrial Controls
Central Office
Telecom Equipment
Test and Measurement
Multi-Chip Modules
Ordering Information
Pin Configuration
PART*
TEMP. RANGE
PIN PACKAGE
G766
-55°C to +125°C
10-MSOP
Typical Operating Circuit
3V TO 5.5V
G766
0.1 µF
ADD0
1
10
ADD1
2
9
SMBDATA
GND
3
8
SMBCLK
200Ω
ALERT
Vcc
DXP
STBY
SMBCLK
SMBDATA
DXN
4
7
STBY
DXN
2N3904
DXP
6
5
Vcc
ALERT
2200pF
10k EACH
CLOCK
DATA
INTERRUPT
TO µC
ADD0 ADD1 GND
10 Pin MSOP
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G766
Global Mixed-mode Technology Inc.
Absolute Maximum Ratings
ESD Protection (all pins, human body model)…..2000V
Continuous Power Dissipation(TA = +70°C)
MSOP (derate 5.6mW/°C above +70°C)….......444mW
Operating Temperature Range………-55°C to +125°C
Junction Temperature…………………….……..+150°C
Storage temperature Range………….-65°C to +165°C
Lead Temperature (soldering, 10sec)…….……....+300°C
Vcc to GND………….…….……..……….-0.3V to +6V
DXP, ADD to GND……..…….…-0.3V to (Vcc + 0.3V)
DXN to GND……………..……………..-0.3V to +0.8V
SMBCLK, SMBDATA, ALERT , STBY to GND
……………………………………………..…-0.3V to +6V
SMBDATA, ALERT Current………….-1mA to +50mA
DXN Current……………………..………………….±1mA
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Electrical Characteristics
(Vcc = + 3.3V, TA = 0°C to +85°C, unless otherwise noted.)
PARAMETER
CONDITIONS
MIN TYP MAX UNITS
ADC and power supply
Temperature Resolution (Note 1) Monotonicity guaranteed
Initial Temperature Error,
TA = +60°C to +100°C
Local Diode (Note 2)
TA = 0°C to +85°C
Temperature Error, Remote Di- TR = +60°C to +100°C
ode (Notes 2 and 3)
TR = -55°C to +125°C
Temperature Error, Local Diode
(Notes 1 and 2)
TA = +60°C to +100°C
TA = 0°C to +85°C
Including long-term drift
Supply-Voltage Range
Undervoltage Lockout Threshold Vcc input, disables A/D conversion, rising edge
Undervoltage Lockout Hysteresis
Power-On Reset Threshold
Vcc , falling edge
POR Threshold Hysteresis
Standby Supply Current
8
-2
-3
-3
2
3
3
-5
-2.5
-3.5
3.0
5
2.5
3.5
5.5
2.6
1.0
SMBus static
Hardware or software
standby, SMBCLK at 10kHz
Logic inputs forced
to Vcc or GND
Conversion Time
94
Conversion Rate Timing Error
Auto-convert mode
-25
Remote-Diode Source Current
Address Pin Bias Current
2.8
50
1.7
50
2.95
3
10
2.5
210
125
°C
V
V
mV
V
mV
156
ms
25
%
High level
80
100
120
8
10
160
12
Ver 1.0
Dec 11, 2001
°C
µA
Low level
ADD0, ADD1; momentary upon power-on reset
DXP forced to 1.5V
°C
µA
4
Auto-convert mode, average measured over 4sec. Logic inputs forced 16 conv/sec
to VCC or GND
From stop bit to conversion complete (both channels)
Average Operating Supply
Bits
µA
µA
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G766
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Electrical Characteristics (continued)
(Vcc = + 3.3V, TA = 0 to +85°C, unless otherwise noted.)
PARAMETER
CONDITIONS
MIN TYP MAX UNITS
SMBus Interface
Logic Input High Voltage
STBY , SMBCLK, SMBDATA; Vcc = 3V to 5.5V
Logic Input Low Voltage
STBY , SMBCLK, SMBDATA; Vcc = 3V to 5.5V
2.2
0.8
Logic Output Low Sink Current
ALERT , SMBDATA forced to 0.4V
6
ALERT Output High Leakage Current
Logic Input Current
ALERT forced to 5.5V
Logic inputs forced to Vcc or GND
-1
SMBus Input Capacitance
SMBus Clock Frequency
SMBCLK Clock Low Time
SMBCLK Clock High Time
SMBCLK, SMBDATA
(Note 4)
tLOW , 10% to 10% points
tHIGH , 90% to 90% points
SMBus Start-Condition Setup Time
SMBus Repeated Start-Condition Setup Time tSU : STA , 90% to 90% points
SMBus Start-Condition Hold Time
tHD: STA , 10% of SMBDATA to 90% of SMBCLK
SMBus Start-Condition Setup Time
tSD: STO , 90% of SMBDATA to 10% of SMBDATA
SMBus Data Valid to SMBCLK Rising-Edge
Time
SMBus Data-Hold Time
SMBCLK Falling Edge to SMBus Data-Valid
Time
tSU: DAT , 10% or 90% of SMBDATA to 10% of
SMBCLK
tHD : DAT (Note 5)
V
V
mA
1
µA
1
µA
5
DC
4.7
4
100
pF
kHz
µs
µs
4.7
500
4
4
µs
ns
µs
µs
800
ns
0
µs
Master clocking in data
1
µs
Electrical Characteristics
(Vcc = + 3.3V, TA = -5.5 to + 125°C, unless otherwise noted.) (Note 6)
PARAMETER
CONDITIONS
ADC and power supply
Temperature Resolution(Note 1)
Initial Temperature Error, Local
Diode ( Note 2)
Temperature Error, Remote Diode
(Notds2 and 3)
Supply-Voltage Range
Conversion Time
Conversion Rate Timing Error
SMBus Interface
Monotonicity guaranteed
8
TA = +60°C to +100°C
TA = -55°C to +125°C
TR = +60°C to +100°C
TR = -55°C to +125°C
-2
-3
-3
-5
2
3
3
5
3.0
5.5
From stop bit to conversion complete
Auto-convert mode
Logic Input Low Voltage
Logic Output Low Sink Current
Vcc = 3V
Vcc = 5.5V
STBY, SMBCLK, SMBDATA; Vcc = 3V to 5.5V
ALERT, SMBDATA forced to 0.4V
ALERT Output High Leakage Current
Logic Input Current
Logic inputs forced to Vcc or GND
Logic Input High Voltage
MIN TYP MAX UNITS
STBY, SMBCLK, SMBDATA
Bits
62
-25
25
2.2
2.4
0.8
-2
°C
V
ms
%
V
6
ALERT forced to 5.5V
°C
V
mA
1
µA
2
µA
Note1 : Guaranteed but not 100% tested.
Note2 : Quantization error is not included in specifications for temperature accuracy. For example, if the G766 device temperature is exactly +66.7°C, or +68°C (due to the quantization error plus the +1/2°C offset used for
rounding up) and still be within the guaranteed ±1°C error limits for the +60°C to 100°C temperature range.
See Table2.
Note3 : A remote diode is any diode-connected transistor from Table1. TR is the junction temperature of the remote
of the remote diode. See Remote Diode Selection for remote diode forward voltage requirements.
Note4 : The SMBus logic block is a static design that works with clock frequencies down to DC. While slow operation is
possible, it violates the 10kHz minimum clock frequency and SMBus specifications, and may monopolize the bus.
Note5 : Note that a transition must internally provide at least a hold time in order to bridge the undefined region
(300ns max) of SMBCLK’s falling edge.
Note6 : Specifications from -55°C to +125°C are guaranteed by design, not production tested.
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G766
Pin Description
PIN
NAME
FUNCTION
1
ADD0
2
ADD1
SMBus Slave Address Select pin
SMBus Address Select pin (Table 8). ADD0 and ADD1 are sampled upon power-up. Excess capacitance (>50pF) at the address pins when floating may cause address-recognition problems.
3
4
GND
DXN
5
DXP
6
Vcc
7
8
9
10
Ground
Combined Current Sink and A/D Negative Input.
Combined Current Source and A/D Positive Input for remote-diode channel. Do not leave DXP floating; tie DXP to DXN if no remote diode is used. Place a 2200pF capacitor between DXP and DXN for
noise filtering.
Supply Voltage Input , 3V to 5.5V. Bypass to GND with a 0.1µF capacitor. A 200Ω series resistor is
recommended but not required additional noise filtering.
Hardware Standby Input. Temperature and comparison threshold data are retained in standby mode.
Low = standby mode, high = operate mode.
SMBCLK SMBus Serial-Clock Input
SMBDATA SMBus Serial-Data Input / Output, open drain
STBY
ALERT
SMBus Alert (interrupt) Output, open drain
Detailed Description
ADC and Multiplexer
The ADC is an averaging type that integrates over a
60ms period (typical), with excellent noise rejection.
The multiplexer automatically steers bias currents
through the remote and local diodes, measures their
forward voltages, and computes their temperatures.
Both channels are automatically converted once the
conversion process has started, either in free-running
or single-shot mode. If one of the two channels is not
used, the device still performs both measurements,
and the user can simply ignore the results of the unused channel.
The G766 (patents pending) is a temperature sensor
designed to work in conjunction with an external microcontroller (µC) or other intelligence in thermostatic,
process-control, or monitoring applications. The µC is
typically a power-management or keyboard controller,
generating SMBus serial commands by “bit-banging”
general-purpose input-output (GPIO) pins or via a
dedicated SMBus interface block.
Essentially an 8-bit serial analog-to digital converter
(ADC) with a sophisticated front end, the G766 contains a switched current source, a multiplexer, an ADC,
an SMBus interface, and associated control logic (Figure 1). Temperature data from the ADC is loaded into
two data registers, where it is automatically compared
with data previously stored in four over/under-temperature alarm registers.
The worst-case DXP-DXN differential input voltage
range is 0.25V to 0.95V.
Excess resistance in series with the remote diode
causes about +1/2°C error per ohm. Likewise, 200µV
of offset voltage forced on DXP-DXN causes about
1°C error.
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G766
Global Mixed-mode Technology Inc.
STBY ADD0 ADD1
VCC
ADDRESS
DECODER
MUX
DXP
2
+
DXN
+
REMOTE
+
ADC
7
SMBUS
SMBDATA
CONTROL
LOGIC
LOCAL
SMBCLK
READ WRITE
DIODE
FAULT
8
8
REMOTE TEMPERATURE
DATA REGISTER
COMMAND BYTE
(INDEX) REGISTER
8
HIGH-TEMPETATURE
THRESHOLD (REMOTE HIGH)
STATUS BYTE
REGISTER
LOW-TEMPETATURE
THRESHOLD (REMOTE
CONFIGURATION
BYTE REGISTER
)
LOW
CONVERSION RATE
REGISTER
DIGITAL COMPARATOR
(REMOTE)
ALERT
S
Q
R
8
SELECTED VIA
SLAVE ADD = 0001 100
ALERT RESPONSE
ADDRESS REGISTER
Figure 1. Functional Diagram
A/D Conversion Sequence
If a Start command is written (or generated automatically in the free-running auto-convert mode), both
channels are converted, and the results of both measurements are available after the end of conversion. A
BUSY status bit in the status byte shows that the device is actually performing a new conversion; however,
even if the ADC is busy, the results of the previous
conversion are always available.
grated circuits having on-board temperature-sensing
diodes.
The transistor must be a small-signal type with a relatively high forward voltage; otherwise, the A/D input
voltage range can be violated. The forward voltage
must be greater than 0.25V at 10µA; check to ensure
this is true at the highest expected temperature. The
forward voltage must be less than 0.95V at 100µA;
check to ensure this is true at the lowest expected
temperature. Large power transistors don’t work at all.
Also, ensure that the base resistance is less than
100Ω. Tight specifications for forward-current gain
(+50 to +150, for example) indicate that the manufacturer has good process controls and that the devices
have consistent VBE characteristics.
Remote-Diode Selection
Temperature accuracy depends on having a
good-quality, diode-connected small-signal transistor.
Accuracy has been experimentally verified for all of the
devices listed in Table 1. The G766 can also directly
measure the die temperature of CPUs and other inte-
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Table 1. Remote-Sensor Transistor Manufacturers
MANUFACTURER
traces such as +12VDC. Leakage currents from PC
board contamination must be dealt with carefully,
since a 20MΩ leakage path from DXP to ground
causes about +1°C error.
MODEL NUMBER
Philips
PMBS3904
Motorola(USA)
National Semiconductor(USA)
MMBT3904
MMBT3904
G766
Connect guard traces to GND on either side of the
DXP-DXN traces (Figure 2). With guard traces in place,
routing near high-voltage traces is no longer an issue.
Note:Transistors must be diode-connected (base
shorted to collector).
Route through as few vias and crossunders as
possible to minimize copper/solder thermocouple effects.
ADC Noise Filtering
The ADC is an integrating type with inherently good
noise rejection, especially of low-frequency signals
such as 60Hz/120Hz power-supply hum. Micropower
operation places constraints on high-frequency noise
rejection; therefore, careful PC board layout and proper external noise filtering are required for highaccuracy remote measurements in electrically noisy
environments.
When introducing a thermocouple, make sure that
both the DXP and the DXN paths have matching
thermocouples. In general, PC board-induced thermocouples are not a serious problem, A copper-solder
thermocouple exhibits 3µV/°C, and it takes about
200µV of voltage error at DXP-DXN to cause a +1°C
measurement error. So, most parasitic thermocouple
errors are swamped out.
High-frequency EMI is best filtered at DXP and DXN
with an external 2200pF capacitor. This value can be
increased to about 3300pF(max), including cable capacitance. Higher capacitance than 3300pF introduces
errors due to the rise time of the switched current
source.
Use wide traces. Narrow ones are more inductive and
tend to pick up radiated noise. The 10 mil widths and
spacing recommended on Figure 2 aren’t absolutely
necessary (as they offer only a minor improvement in
leakage and noise), but try to use them where practical.
Nearly all noise sources tested cause the ADC measurements to be higher than the actual temperature,
typically by +1°C to 10°C, depending on the frequency
and amplitude(see Typical Operating Characteristics).
Keep in mind that copper can’t be used as an EMI
shield, and only ferrous materials such as steel work
will. Placing a copper ground plane between the
DXP-DXN traces and traces carrying high-frequency
noise signals does not help reduce EMI.
PC Board Layout
Place the G766 as close as practical to the remote
diode. In a noisy environment, such as a computer
motherboard, this distance can be 4 in. to 8 in. (typical)
or more as long as the worst noise sources (such as
CRTs, clock generators, memory buses, and ISA/PCI
buses) are avoided.
PC Board Layout Checklist
„Place the G766 close to a remote diode.
„Keep traces away from high voltages (+12V bus).
„Keep traces away from fast data buses and CRTs.
„Use recommended trace widths and spacing.
„Place a ground plane under the traces
„Use guard traces flanking DXP and DXN and con-
Do not route the DXP-DXN lines next to the deflection
coils of a CRT. Also, do not route the traces across a
fast memory bus, which can easily introduce +30°C
error, even with good filtering, Otherwise, most noise
sources are fairly benign.
necting to GND.
„Place the noise filter and the 0.1µF Vcc bypass
capacitors close to the G766.
„Add a 200Ω resistor in series with Vcc for best
Route the DXP and DXN traces in parallel and in close
proximity to each other, away from any high-voltage
noise filtering (see Typical Operating Circuit).
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Activate hardware standby mode by forcing the
STBY pin low. In a notebook computer, this line may
be connected to the system SUSTAT# suspend-state
signal.
The STBY pin low state overrides any software conversion command. If a hardware or software standby
command is received while a conversion is in progress,
the conversion cycle is truncated, and the data from
that conversion is not latched into either temperature
reading register. The previous data is not changed and
remains available.
GND
10 MILS
10 MILS
DXP
MINIMUM
10 MILS
G766
DXN
10 MILS
GND
Supply-current drain during the 125ms conversion
period is always about 450µA. Slowing down the conversion rate reduces the average supply current (see
Typical Operating Characteristics). In between conversions, the instantaneous supply current is about
25µA due to the current consumed by the conversion
rate timer. In standby mode, supply current drops to
about 3µA. At very low supply voltages (under the
power-on-reset threshold), the supply current is higher
due to the address pin bias currents. It can be as high
as 100µA, depending on ADD0 and ADD1 settings.
Figure 2. Recommended DXP/DXN PC Traces
Twisted Pair and Shielded Cables
For remote-sensor distances longer than 8 in., or in
particularly noisy environments, a twisted pair is recommended. Its practical length is 6 feet to 12feet (typical) before noise becomes a problem, as tested in a
noisy electronics laboratory. For longer distances, the
best solution is a shielded twisted pair like that used
for audio microphones. Connect the twisted pair to
DXP and DXN and the shield to GND, and leave the
shield’s remote end unterminated.
SMBus Digital Interface
From a software perspective, the G766 appears as a
set of byte-wide registers that contain temperature
data, alarm threshold values, or control bits, A standard SMBus 2-wire serial interface is used to read
temperature data and write control bits and alarm
threshold data.
Each A/D channel within the device responds to the
same SMBus slave address for normal reads and
writes.
Excess capacitance at DX_limits practical remote
sensor distances (see Typical Operating Characteristics), For very long cable runs, the cable’s parasitic
capacitance often provides noise filtering, so the
2200pF capacitor can often be removed or reduced in
value. Cable resistance also affects remote-sensor
accuracy; 1Ω series resistance introduces about + 1°C
error.
Low-Power Standby Mode
Standby mode disables the ADC and reduces the
supply-current drain to less than 10µA. Enter standby
mode by forcing the STBY pin low or via the
RUN/STOP bit in the configuration byte register.
Hardware and software standby modes behave almost
identically: all data is retained in memory, and the
SMB interface is alive and listening for reads and
writes. The only difference is that in hardware standby
mode, the one-shot command does not initiate a conversion.
The G766 employs four standard SMBus protocols:
Write Byte, Read Byte, Send Byte, and Receive Byte
(Figure 3). The shorter Receive Byte protocol allows
quicker transfers, provided that the correct data register was previously selected by a Read Byte instruction.
Use caution with the shorter protocols in multi-master
systems, since a second master could overwrite the
command byte without informing the first master.
The temperature data format is 7bits plus sign in
twos-complement form for each channel, with each
data bit representing 1°C (Table 2), transmitted MSB
first. Measurements are offset by +1/2°C to minimize
internal rounding errors; for example, +99.6°C is reported as +100°C.
Standby mode is not a shutdown mode. With activity
on the SMBus, extra supply current is drawn (see
Typical Operating Characteristics). In software
standby mode, the G766 can be forced to perform A/D
conversions via the one-shot command, despite the
RUN/STOP bit being high.
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Write Byte Format
S
ADDRESS
ACK
WR
COMMAND
7 bits
ACK
DATA
8 bits
ACK
P
8 bits
1
Slave Address: equivalent to chip- select line of a 3-wire interface
Command Byte: selects which register you are writing to
Data byte: data goes into the register set by the command byte (to set thresholds, configuration masks, and sam
pling rate)
Read Byte Format
S
ADDRESS WR
ACK
COMMAND
7 bits
ACK
S
8bits
ADDRESS
RD
ACK
DATA
7bits
///
P
8 bits
Slave Address: equivalent to chip- select line
Command Byte: selects which register you are reading from
Slave Address: repeated due to change in data-flow direction
Data byte: reads from the register set by the command byte
Send Byte Format
S
ADDRESS
ACK
WR
COMMAND
7 bits
ACK
P
///
P
8 bits
Command Byte: sends command with no data , usually used for one-shot command
Receive Byte Format
S
ADDRESS
ACK
RD
DATA
7 bits
8 bits
Data Byte: reads data from the register commanded by the last Read Byte or Write Byte transmission; also used
for SMBus Alert Response return address
S = Start condition
Shaded = Slave transmission
P = Stop condition
/// = Not acknowledged
Figure 3. SMBus Protocols
Table 2. Data Format (Twos-Complement)
TEMP.
(°C)
ROUND
TEMP.
(°C)
+130.00
+127
0
111
1111
+127.00
+126.50
+126.00
+25.25
+127
+127
+126
+25
0
0
0
0
111
111
111
001
1111
1111
1110
1001
+0.50
+0.25
+0.00
-0.25
+1
+0
+0
+0
0
0
0
0
000
000
000
000
0001
0000
0000
0000
-0.50
-0.75
-1.00
-25.00
+0
-1
-1
-25
0
1
1
1
000
111
111
110
0000
1111
1111
0111
-25.50
-54.75
-55.00
-65.00
-25
-55
-55
-65
1
1
1
1
110
100
100
011
0110
1001
1001
1111
-70.00
-65
1
011
1111
registers for each A/D channel. If either measured
temperature equals or exceeds the corresponding alarm
threshold value, an ALERT interrupt is asserted.
DIGITAL OUTPUT
DATA BITS
SIGN
MSB
LSB
The power-on-reset (POR) state of both THIGH registers
is full scale (0111 1111, or +127°C). The POR state of
both TLOW registers is 1100 1001 or -55°C.
Thermostat Mode
Thermostat mode changes the function of the ALERT
output from a latched interrupt-type output to a selfclearing thermostat for fan control. This output simply
responds to the current temperature. If the current temperature is above THIGH, ALERT activates and does not
go inactive until the temperature drops below TLOW.
Enable thermostat mode through the configuration
register, with one bit to enable the feature and another
bit to set the output polarity (active high or active low).
The ALERT thermostat comparison is made after
each conversion, or at the end of any SMBus transaction. For example, if the limit is changed while the device is in standby mode, the ALERT output responds
correctly according to the last valid A/D result. Upon
entering thermostat mode, the ALERT output is reset so that if the temperature is in the hysteresis band
ALERT initially goes inactive. The power-on reset
(POR) state disables thermostat mode.
Alarm Threshold Registers
Four registers store alarm threshold data, with
high-temperature (THIGH) and low-temperature (TLOW )
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Diode Fault Alarm
ALERT Interrupts
There is a continuity fault detector at DXP that detects
whether the remote diode has an open-circuit condition. At the beginning of each conversion, the diode
fault is checked, and the status byte is updated. This
fault detector is a simple voltage detector; if DXP rises
above VCC – 1V (typical) due to the diode current
source, a fault is detected. Note that the diode fault
isn’t checked until a conversion is initiated, so immediately after power-on reset the status byte indicates no
fault is present, even if the diode path is broken.
The ALERT interrupt output signal is latched and
can only be cleared by reading the Alert Response
address. Interrupts are generated in response to THIGH
and TLOW comparisons and when the remote diode is
disconnected (for continuity fault detection). The interrupt does not halt automatic conversions; new temperature data continues to be available over the
SMBus interface after ALERT is asserted. The interrupt output pin is open-drain so that devices can
share a common interrupt line. The interrupt rate can
never exceed the conversion rate.
If the remote channel is shorted (DXP to DXN or DXP
to GND), the ADC reads 0000 0000 so as not to trip
either the THIGH or TLOW alarms at their POR settings.
In applications that are never subjected to 0°C in normal operation, a 0000 0000 result can be checked to
indicate a fault condition in which DXP is accidentally
short circuited. Similarly, if DXP is short circuited to
VCC, the ADC reads +127°C for both remote and local
channels, and the device alarms.
The interface responds to the SMBus Alert Response
address, an interrupt pointer return-address feature
(see Alert Response Address section). Prior to taking
corrective action, always check to ensure that an interrupt is valid by reading the current temperature.
Alert Response Address
The SMBus Alert Response interrupt pointer provides
quick fault identification for simple slave devices that
lack the complex, expensive logic needed to be a bus
master. Upon receiving an ALERT interrupt signal,
the host master can broadcast a Receive Byte transmission to the Alert Response slave address (0001
100). Then any slave device that generated an interrupt attempts to identify itself by putting its own address on the bus (Table 3).
Table 3. Read Format for Alert Response Address
(0001 100)
BIT
NAME
7(MSB)
ADD7
6
ADD6
5
ADD5
4
ADD4
3
ADD3
2
ADD2
1
ADD1
0(LSB)
1
FUNCTION
Provide the current G766
slave address that was
latched at POR (Table 8)
Logic 1
Table 4. Command-Byte Bit Assignments
REGISTER
COMMAND
POR STATE
FUNCTINON
RLTS
00h
0000 0000*
Read local temperature: returns latest temperature
RRTE
RSL
RCL
RCRA
01h
02h
03h
04h
0000 0000*
N/A
0000 0000
0000 0111
Read remote temperature: returns latest temperature
Read status byte (flags, busy signal)
Read configuration byte
Read conversion rate byte
RFU
RFU
RRHI
RRLS
05h
06h
07h
08h
N/A
N/A
0111 1111
1100 1001
Reserved for future use
Reserved for future use
Read remote THIGH limit
Read remote TLOW limit
WCA
WCRW
WLHO
WLLM
09h
0Ah
0Bh
0Ch
N/A
N/A
N/A
N/A
Write configuration byte
Write conversion rate byte
Write local THIGH limit
Write local TLOW limit
WRHA
WRLN
OSHT
0Dh
0Eh
0Fh
N/A
N/A
N/A
Write remote THIGH limit
Write remote TLOW limit
One-shot command (use send-byte format)
*If the device is in hardware standby mode at POR, both temperature registers read 0°C.
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Configuration Byte Functions
The configuration byte register (Table 5) is used to
mask (disable) interrupts and to put the device in
software standby mode. This register’s contents can
be read back over the serial interface.
The Alert Response can activate several different
slave devices simultaneously, similar to the SMBus
General Call. If more than one slave attempts to respond, bus arbitration rules apply, and the device with
the lower address code wins. The losing device does
not generate an acknowledge and continues to hold
the ALERT line low until serviced (implies that the
host interrupt input is level-sensitive). Successful
reading of the alert response address clears the interrupt latch.
Status Byte Functions
The status byte register (Table 6) indicates which (if
any) temperature thresholds have been exceeded.
This byte also indicates whether or not the ADC is
converting and whether there is an open circuit in the
remote diode DXP-DXN path. After POR, the normal
state of all the flag bits is zero, assuming none of the
alarm conditions are present. The status byte is
cleared by any successful read of the status, unless
the fault persists. Note that the ALERT interrupt
latch is not automatically cleared when the status flag
bit is cleared.
When reading the status byte, you must check for internal bus collisions caused by asynchronous ADC
timing, or else disable the ADC prior to reading the
status byte (via the RUN/STOP bit in the configuration
byte). In one-shot mode, read the status byte only after the conversion is complete, which is 150ms max
after the one-shot conversion is commanded.
Command Byte Functions
The 8-bit command byte register (Table 4) is the master index that points to the various other registers
within the G766. The register’s POR state is 0000
0000, so that a Receive Byte transmission (a protocol
that lacks the command byte) that occurs immediately
after POR returns the current local temperature data.
The one-shot command immediately forces a new
conversion cycle to begin. In software standby mode
(RUN/STOP bit = high), a new conversion is begun,
after which the device returns to standby mode. If a
conversion is in progress when a one-shot command
is received in auto-convert mode (RUN/STOP bit = low)
between conversions, a new conversion begins, the
conversion rate timer is reset, and the next automatic
conversion takes place after a full delay elapses.
Table 5. Configuration-Byte Bit Assignments
BIT
NAME
POR STATE
FUNCTION
7 (MSB)
MASK
0
Masks all ALERT interrupts when high.
6
RUN /
STOP
0
Standby mode control bit. If high, the device immediately stops converting and enters standby mode. If low, the device converts in either one-shot or timer mode.
5
POL
0
4
3 to 0
THERM
RFU
0
0
ALERT pin polarity control in thermostat mode.
0 = active low
1 = active high
Enables thermostat mode when high.
Reserved for future use
Table 6. Status-Byte Bit Assignments
BIT
NAME
7 (MSB)
BUSY
6
5
4
3
RFU
RFU
RHIGH*
RLOW*
2
1
0 (LSB)
DIODE FAULT
RFU
RFU
FUNCTION
A high indicates that the ADC is busy converting.
Reserved for future use
Reserved for future use
A high indicates that the remote high-temperature alarm has activated.
A high indicates that the remote low-temperature alarm has activated.
A high indicates a remote-diode fault (open-circuit, shorted diode, or DXP short to GND).
Reserved for future use (returns 0)
Reserved for future use (returns 0)
*These flags stay high until cleared by POR, or until the status byte register is read.
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Table 7. Conversion-Rate Control Byte
DATA
CONVERSION RATE (Hz)
00h
0.0125
01h
02h
03h
04h
0.25
0.5
1
2
05h
06h
07h
08h to FFh
4
8
16
RFU
sponse slave address (see the Alert Response Address section).
To check for internal bus collisions, read the status byte. If
the least significant seven bits are ones, discard the data
and read the status byte again. The status bits RHIGH,
and RLOW are refreshed on the SMBus clock edge immediately following the stop condition, so there is no danger of losing temperature-related status data as a result of
an internal bus collision. The OPEN status bit (diode continuity fault) is only refreshed at the beginning of a conversion, so OPEN data is lost. The ALERT interrupt latch is
independent of the status byte register, so no false alerts
are generated by an internal bus collision.
POR and UVLO
The G766 has a volatile memory. To prevent ambiguous power-supply conditions from corrupting the data
in memory and causing erratic behavior, a POR voltage detector monitors Vcc and clears the memory if
Vcc falls below 1.7V (typical, see Electrical Characteristics table). When power is first applied and Vcc
rises above 1.75V (typical), the logic blocks begin operating, although reads and writes at VCC levels below
3V are not recommended. A second Vcc comparator,
the ADC UVLO comparator, prevents the ADC from
converting until there is sufficient headroom (Vcc =
2.8V typical).
When auto-converting, if the THIGH and TLOW limits are
close together, it’s possible for both high-temp and
low-temp status bits to be set, depending on the amount
of time between status read operations (especially when
converting at the fastest rate). In these circumstances, it’s
best not to rely on the status bits to indicate reversals in
long-term temperature changes and instead use a current temperature reading to establish the trend direction.
Table 8. Slave Address Decoding
(ADD0 and ADD1)
Conversion Rate Byte
The conversion rate register (Table 7) programs the
time interval between conversions in free-running
auto-convert mode. This variable rate control reduces
the supply current in portable-equipment applications.
The conversion rate byte’s POR state is 07h (16Hz).
Slave Addresses
The G766 appears to the SMBus as one device having a common address for both ADC channels. The
device address can be set to one of nine different values by pin-strapping ADD0 and ADD1 so that more
than one G766 can reside on the same bus without
address conflicts (Table 8).
ADD0
ADD1
ADDRESS
GND
GND
GND
High-Z
GND
High-Z
Vcc
GND
0011 000
0011 001
0011 010
0101 001
High-Z
High-Z
Vcc
Vcc
High-Z
Vcc
GND
High-Z
0101 010
0101 011
1001 100
1001 101
Vcc
Vcc
1001 110
Note: High-Z means that the pin is left unconnected
and floating.
Power-Up Defaults:
„Interrupt latch is cleared.
„Address select pins are sampled.
„THIGH and TLOW registers are set to max and min
limits, respectively.
„Device is in normal mode. ( ALERT acts as a
latched interrupt output.)
The address pin states are checked at POR only, and
the address data stays latched to reduce quiescent
supply current due to the bias current needed for
high-Z state detection.
The G766 also responds to the SMBus Alert Re-
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A
B
tLOW tHIGH
C
D
G
E F
H
I
J
K
M
L
SMBCLK
SMBDATA
tSU:STA tHD:STA
tHD:DAT
tSU:DAT
tSU:STO
tBUF
Figure 4. SMBus Write Timing Diagram
A = start condition
B = MSB of address clocked into slave
C = LSB of address clocked into slave
D = R/W bit clocked into slave
E = slave pulls SMBData line low
F = acknowledge bit clocked into master
G = MSB of data clocked into slave
A
B
tLOW tHIGH
H = LSB of data clocked into slave
I = slave pulls SMBDATA line low
J = acknowledge clocked into master
K = acknowledge clocked pulse
L = stop condition data executed by slave
M = new start condition
C
D
E F
G
H
J
I
K
SMBCLK
SMBDATA
tSU:STA tHD:STA
tSU:STO
tSU:DAT
tBUF
Figure 5. SMBus Read Timing Diagram
A = start condition
B = MSB of address clocked into slave
C = LSB of address clocked into slave
D = R/ W bit clocked into slave
E = slave pulls SMBDATA line low
F =acknowledge bit clocked into master
G = MSB of data clocked into master
H = LSB of data clocked into master
I = acknowledge clocked pulse
J = stop condition
K= new start condition
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G766
Global Mixed-mode Technology Inc.
Package Information
A
10
A
e
C
L
E
E1
b
1
DETAIL “A”
e
0.076
A2
C
SEATING PLANE
θ2
A
A1
R1
0.25
b
D
R
GAUGE PLANE
b
b1
θ1
WITH PLATING
c1
L
θ3
c
BASE METAL
SYMBOL
A
A1
A2
b
b1
c
c1
D
E1
e
E
L
θ1
θ2
θ3
R
R1
MIN.
DIMENSION IN MM
NOM.
----0.05
0.81
0.15
0.15
0.13
0.13
2.90
2.90
0.445
0°
0.09
0.09
--------0.86
----0.20
----0.15
3.00
3.00
0.50 BSC
4.90 BSC
0.55
----12 REF
12 REF
---------
MAX.
MIN.
1.10
0.15
0.91
0.30
0.25
0.23
0.18
3.10
3.10
----0.002
0.032
0.006
0.006
0.005
0.005
0.114
0.114
0.648
6°
0.0175
0°°
---------
0.004
0.004
JEDEC
DIMENSION IN INCH
NOM.
--------0.034
----0.008
0.006
0.118
0.118
0.020 BSC
0.193 BSC
0.0217
----12 REF
12 REF
---------
MAX.
0.043
0.006
0.036
0.012
0.010
0.009
0.007
0.122
0.122
0.0255
6°
---------
MO-187BA
Taping Specification
Feed D irection
T ypical M S O P P ackage O rientation
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