TAIPEI : TEL : FAX : H.K. : TEL : FAX : 一華半導體股份有限公司 MOSDESIGN SEMICONDUCTOR CORP. 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 EN/DECODER 使用同一電阻 SAME Rosc in EN/DE S.O.DIP EN/DE 編/解碼 M1EA/DA FEATURES 功能敘述 BIT FORMAT • Momentary DATA ─ suffix-M. PROTOCOL TE "0" • S.O.Package 18P ─ suffix-S. T T T DO • Direct Data Transmit ─ suffix-H : switch to VDD. "1" VT DATA D0~3 APPLICATION 產品應用 • Security alarm, Remote control. 防盜系統, 任何遙控裝置. ELECTRICAL CHARACTERISTICS 電氣規格 Characteristics 工作電壓 Operating Voltage 工作電流 Operating Current Sym. VDD Min. 2.4 Typ. ─ Max. 13 Unit V IOP ─ 0.1 1 mA 靜態電流 Quiescent Current ISB ─ 1 uA 推動電流 Driving Current IOL ─ 2 10 ─ 振盪頻率 Oscillator Frequency FOSC ─ 76 ─ 工作溫度 Operating Temperature Temp. -20 25 60 mA KHz ℃ REMARKS No load @ VDS=1.2V External±30% APPLICATION DIAGRAM 參考電路圖 M1EA M1DA VDD A0 1 IR / RF 18 DO 1 VDD 18 IR / RF A1 A1 X VT X A2 A2 Y A0 Rosc Rosc A3 A3 Y A4 DIN A4 TE A5 A11/D3 A5 A11/D3 A6 A10/D2 A6 A10/D2 A7 A9/D1 A7 A9/D1 A8/D0 VSS VSS 9 10 9 10 * Rosc~M1EA : 270 KΩ, M1DA : 270 KΩ * All specs and applications shown above subject to change without prior notice. ( 以上電路及規格僅供參考,本公司得逕行修正 ) 1/3 2004-07-15 A8/D0 TAIPEI : TEL : FAX : H.K. : TEL : FAX : 一華半導體股份有限公司 MOSDESIGN SEMICONDUCTOR CORP. 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 EN/DECODER 使用同一電阻 SAME Rosc in EN/DE S.O.DIP M1EA/DA APPLICATION DIAGRAM 參考電路圖 CHIP FORM VDD A0 A1 IR / RF DO X A2 A3 Rosc M1EA A4 1.80 X1.81 mm 2 底=VDD A5 Y TE A6 D3 A7 VSS D0 A1 A0 VDD D1 D2 VT Rosc X A2 Y A3 M1DA A4 IR / RF DIN 2 2.60 X 2.60 mm 底=VDD A5 D3 A6 VSS A7 D0 D1 D2 * Rosc~M1EA : 270 KΩ, M1DA : 270 KΩ * All specs and applications shown above subject to change without prior notice. ( 以上電路及規格僅供參考,本公司得逕行修正 ) 2/3 2004-07-15 EN/DE 編/解碼 TAIPEI : TEL : FAX : H.K. : TEL : FAX : 一華半導體股份有限公司 MOSDESIGN SEMICONDUCTOR CORP. 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 EN/DECODER 使用同一電阻 SAME Rosc in EN/DE S.O.DIP M1EA/DA PAD ASSIGNMENT & POSITION M1EA： 5 4 3 2 1 No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 18 6 Y 17 7 X 16 ( 0,0 ) 8 9 10 11 12 13 14 15 NAME A10 / D2 A11 / D3 TEB Y X DOUT VDD A0 A1 A2 A3 A4 A5 A6 A7 VSS A8 / D0 A9 / D1 X 728 528 211 -31.5 -728.5 -728.5 -728.5 -728.5 -728.5 -728.5 -480.5 -101 184 480 728 728 728 728 UNIT : um Y 732.5 732.5 732.5 732.5 732.5 376.5 36 -164 -533 -733 -733 -733 -733 -733 -733 -66 183 431.5 M1DA： 5 4 3 2 1 6 18 7 17 8 Y 9 X ( 0,0 ) 16 10 11 12 13 14 No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 NAME X VT VDD A0 A1 A2 A3 A4 A5 A6 A7 VSS A8 / D0 A9 / D1 A10 / D2 A11 / D3 DIN Y X 259.5 -9.5 -347 -547 -950 -1150 -1150 -1150 -1150 -1043 -799.5 -599.5 -251 169 696 1145.5 1086 1086 15 * M1EA CHIP SIZE ~ 1.80 X 1.81 mm2 * M1DA CHIP SIZE ~ 2.60 X 2.60 mm2 * IC substrate should be connected to VDD in PCB (PCB 上 IC 必須接 VDD) 3/3 2004-07-15 UNIT : um Y 1096.5 1096.5 1096.5 1096.5 1096.5 1025 702 502 179 -1100 -1100 -1100 -1100 -1100 -1100 -946 590 790 EN/DE 編/解碼