TECHNICAL DATA 8-Bit Bidirectional Universal Shift Register with Parallel I/O IN74AC299 High-Speed Silicon-Gate CMOS The IN74AC299 is identical in pinout to the LS/ALS299, HC/HCT299. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LS/ALS outputs. The IN74AC299 features a multiplexed parallel input/output data port to achieve full 8-bit handling in a 20 pin package. Due to the large output drive capability and the 3-state feature, this device is ideally suited for interface with bus lines in a bus-oriented system. Two Mode-Select inputs and two Output Enable inputs are used to choose the mode of operation as listed in the Function Table. Synchronous parallel loading is accomplished by taking both Mode-Select lines, S1 and S2, high. This places the outputs in the high-impedance state, which permits data applied to the data port to be clocked into the register. Reading out of the register can be accomplished when the outputs are enabled. The active-low asynchronous Reset overrides all other inputs. • • • • • Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2.0 to 6.0 V Low Input Current: 1.0 µA; 0.1 µA @ 25°C High Noise Immunity Characteristic of CMOS Devices Outputs Source/Sink 24 mA ORDERING INFORMATION IN74AC299N Plastic IN74AC299DW SOIC TA = -40° to 85° C for all packages PIN ASSIGNMENT LOGIC DIAGRAM PIN 20=VCC PIN 10 = GND Rev. 00 IN74AC299 MAXIMUM RATINGS* Symbol Parameter Value Unit -0.5 to +7.0 V VCC DC Supply Voltage (Referenced to GND) VIN DC Input Voltage (Referenced to GND) -0.5 to VCC +0.5 V DC Output Voltage (Referenced to GND) -0.5 to VCC +0.5 V DC Input Current, per Pin ±20 mA IOUT DC Output Sink/Source Current, per Pin ±50 mA ICC DC Supply Current, VCC and GND Pins ±50 mA PD Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ 750 500 mW -65 to +150 °C 260 °C VOUT IIN Tstg TL Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) TJ Junction Temperature (PDIP) TA Operating Temperature, All Package Types IOH Output Current - High IOL Output Current - Low tr, tf * Parameter Input Rise and Fall Time (except Schmitt Inputs) * Min Max Unit 2.0 6.0 V 0 VCC V 140 °C +85 °C -24 mA 24 mA 150 40 25 ns/V -40 VCC =3.0 V VCC =4.5 V VCC =5.5 V 0 0 0 VIN from 30% to 70% VCC This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. Rev. 00 IN74AC299 DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol Parameter VIH Minimum High-Level Input Voltage VIL VOH Test Conditions Guaranteed Limits V 25 °C -40°C to 85°C Unit VOUT=0.1 V or VCC-0.1 V 3.0 4.5 5.5 2.1 3.15 3.85 2.1 3.15 3.85 V Maximum Low Level Input Voltage VOUT=0.1 V or VCC-0.1 V 3.0 4.5 5.5 0.9 1.35 1.65 0.9 1.35 1.65 V Minimum High-Level Output Voltage IOUT ≤ -50 µA 3.0 4.5 5.5 2.9 4.4 5.4 2.9 4.4 5.4 V 3.0 4.5 5.5 2.56 3.86 4.86 2.46 3.76 4.76 3.0 4.5 5.5 0.1 0.1 0.1 0.1 0.1 0.1 VIN= VIH or VIL IOL=12 mA IOL=24 mA IOL=24 mA 3.0 4.5 5.5 0.36 0.36 0.36 0.44 0.44 0.44 * VIN=VIH or VIL IOH=-12 mA IOH=-24 mA IOH=-24 mA VOL Maximum Low-Level Output Voltage IOUT ≤ 50 µA V * IIN Maximum Input Leakage Current VIN=VCC or GND 5.5 ±0.1 ±1.0 µA IOZ Maximum ThreeState Leakage Current VIN (OE)= VIH or VIL VIN =VCC or GND VOUT =VCC or GND 5.5 ±0.6 ±6.0 µA IOLD +Minimum Dynamic Output Current VOLD=1.65 V Max 5.5 75 mA IOHD +Minimum Dynamic Output Current VOHD=3.85 V Min 5.5 -75 mA ICC Maximum Quiescent Supply Current (per Package) VIN=VCC or GND 5.5 80 µA 8.0 * All outputs loaded; thresholds on input associated with output under test. +Maximum test duration 2.0 ms, one output loaded at a time. Note: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC Rev. 00 IN74AC299 AC ELECTRICAL CHARACTERISTICS (CL=50pF,Input tr=tf=3.0 ns) VCC* Symbol Parameter Guaranteed Limits V 25 °C Min Max Unit -40°C to 85°C Min Max fmax Maximum Clock Frequency (Figure 1) 3.3 5.0 90 130 80 105 tPLH Propagation Delay, Clock to QA’ or QH’ (Figure 1) 3.3 5.0 8.5 5.5 20.5 14.0 7.0 4.5 22.0 15.0 ns tPHL Propagation Delay, Clock to QA’ or QH’ (Figure 1) 3.3 5.0 8.5 5.5 21.5 14.5 7.0 5.0 23.0 16.0 ns tPLH Propagation Delay, Clock to QA thru QH (Figure 1) 3.3 5.0 9.0 6.0 20.5 14.5 7.5 5.0 22.5 16.0 ns tPHL Propagation Delay, Clock to QA thru QH (Figure 1) 3.3 5.0 10.0 6.5 23.0 16.0 8.5 6.0 24.5 17.5 ns tPHL Propagation Delay, Reset to QA’ or QH’ (Figure 2) 3.3 5.0 9.0 5.5 22.5 15.5 7.5 5.0 25.0 17.0 ns tPHL Propagation Delay, Reset to QA thru QH (Figure 2) 3.3 5.0 9.0 5.5 21.5 15.0 7.5 5.0 24.0 16.5 ns tPZH Propagation Delay , OE1, OE2 to QA thru QH (Figure 3) 3.3 5.0 7.0 4.5 18.0 12.5 6.0 4.0 19.5 13.5 ns tPZL Propagation Delay , OE1, OE2 to QA thru QH (Figure 3) 3.3 5.0 7.0 5.0 18.0 12.5 6.0 4.0 20.5 14.0 ns tPHZ Propagation Delay , OE1, OE2 to QA thru QH (Figure 3) 3.3 5.0 6.5 3.5 18.5 14.0 5.5 3.0 19.5 15.0 ns tPLZ Propagation Delay , OE1, OE2 to QA thru QH (Figure 3) 3.3 5.0 5.5 3.5 17.0 12.5 4.5 2.0 19.0 13.5 ns CIN Maximum Input Capacitance 5.0 4.5 MHz 4.5 pF Typical @25°C,VCC=5.0 V CPD Power Dissipation Capacitance 170 pF * Voltage Range 3.3 V is 3.3 V ±0.3 V Voltage Range 5.0 V is 5.0 V ±0.5 V Rev. 00 IN74AC299 TIMING REQUIREMENTS (CL=50pF,Input tr=tf=3.0 ns) VCC* Symbol Parameter Guaranteed Limits V 25 °C -40°C to 85°C Unit tsu Minimum Setup Time, Mode Select S1 or S2 to Clock (Figure 4) 3.3 5.0 8.0 5.0 8.5 5.5 ns tsu Minimum Setup Time, Data Inputs PA thru PH to Clock (Figure 4) 3.3 5.0 5.5 3.5 6.0 4.0 ns tsu Minimum Setup Time, Data Inputs SA, SH to Clock (Figure 4) 3.3 5.0 6.5 4.0 7.0 4.5 ns th Minimum Hold Time, Clock to Mode Select S1 or S2 (Figure 4) 3.3 5.0 0.5 1.0 0.5 1.0 ns th Minimum Hold Time, Clock to Data Inputs PA thru PH (Figure 4) 3.3 5.0 0 1.0 0 1.0 ns th Minimum Hold Time, Clock to Data Inputs SA, SH (Figure 4) 3.3 5.0 0 1.0 0.5 1.0 ns trec Minimum Recovery Time, Reset Inactive to Clock (Figure 2) 3.3 5.0 1.5 1.5 1.5 1.5 ns tw Minimum Pulse Width, Clock (Figure 1) 3.3 5.0 4.5 3.5 5.0 3.5 ns tw Minimum Pulse Width, Reset (Figure 2) 3.3 5.0 4.5 3.5 5.0 3.5 ns * Voltage Range 3.3 V is 3.3 V ±0.3 V Voltage Range 5.0 V is 5.0 V ±0.5 V Rev. 00 IN74AC299 FUNCTION TABLE Inputs Mode Reset Mode Select Response Output Enables Clock Serial Inputs PA/ PB/ PC/ PD/ PE/ PF/ PG/ PH/ QA’ QH’ QA QB QC QD QE QF QG QH S2 S1 OE1 OE2 L X L L L X X X L L L L L L L L L L L L X L L X X X L L L L L L L L L L L H H X X X X X QA through QH=Z L L H L H H X D X Shift Right: QA through QH=Z; DA FA; FA FB; etc D QG H L H X H D X Shift Right: QA through QH=Z; DA FA; FA FB; etc D QG H L H L L D X Shift Right: DA FA =QA; FA FB =QB; etc D QG H H L H X X D Shift Left: QA through QH=Z; DH FH; FH FG; etc QB D H H L X H X D Shift Left: QA through QH=Z; FH; FH FG; etc DH QB D H H L L L X D Shift Left: DH FH =QH; FH FG =QG; etc QB D Parallel Load H H H X X X X PA PH Hold H L L H X X X X Hold: QA through QH=Z; FN=FN PA PH H L L X H X X X Hold: QA through QH=Z; FN=FN PA PH H L L L L X X X Hold: QN =QH PA PH Reset Shift Right Shift Left DA DH Parallel Load:PN FN Z = high impedance D = data on serial input F = flip-flop (see Logic Diagram) When one or both output controls are high the eight input/output terminals are disabled to the highimpedance state; however, sequential operation or clearing of the register is not affected. Rev. 00 IN74AC299 Figure 1. Switching Waveform Figure 2. Switching Waveform Figure 3. Switching Waveform Figure 4. Switching Waveform Rev. 00 IN74AC299 EXPANDED LOGIC DIAGRAM Rev. 00 IN74AC299 N SUFFIX PLASTIC DIP (MS - 001AD) A Dimension, mm 11 20 B 1 10 Symbol MIN MAX A 24.89 26.92 B 6.1 7.11 5.33 C F L C -T- SEATING PLANE D 0.36 0.56 F 1.14 1.78 G 2.54 H 7.62 N K G M J H D 0.25 (0.010) M T NOTES: 1. Dimensions “A”, “B” do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.010) per side. J 0° 10° K 2.92 3.81 L 7.62 8.26 M 0.2 0.36 N 0.38 D SUFFIX SOIC (MS - 013AC) A 20 11 H Dimension, mm B 1 P 10 G R x 45 C -TK D SEATING PLANE J 0.25 (0.010) M T C M NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B ‑ 0.25 mm (0.010) per side. F M Symbol MIN MAX A 12.6 13 B 7.4 7.6 C 2.35 2.65 D 0.33 0.51 F 0.4 1.27 G 1.27 H 9.53 J 0° 8° K 0.1 0.3 M 0.23 0.32 P 10 10.65 R 0.25 0.75 Rev. 00