LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED ARRAY Pb Lead-Free Parts LA112B/2SGM-PF DATA SHEET DOC. NO : QW0905-LA112B/2SGM-PF REV. : A DATE : 15 - Apr. - 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA112B/2SGM-PF Page 1/5 Package Dimensions 4.3 2.5±0.5 8.2 Ø3.2*2 SGM 5.0 2.9 9.6 Ø2.9*2 SGM 2.65 3.2±0.3 □0.5 TYP 4.45±0.5 2.54TYP + - 6.99±0.5 LSGM2640-1 2.9 3.3 3.1 4.3 1.5 MAX 25.0MIN □0.5 TYP 1.0MIN 2.54TYP + - Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/5 PART NO. LA112B/2SGM-PF Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT SGM Forward Current IF 30 mA Peak Forward Current Duty 1/10@10KHz IFP 100 mA Power Dissipation PD 100 mW Ir 50 μA Electrostatic Discharge( * ) ESD 1000 V Operating Temperature Topr -20 ~ +80 ℃ Storage Temperature Tstg -30 ~ +100 ℃ Reverse Current @5V Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic * glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Typical Electrical & Optical Characteristics (Ta=25 ℃) COLOR PART NO MATERIAL Emitted LA112B/2SGM-PF InGaN/SiC Green Luminous Peak Dominant Spectral Forward wave intensity wave halfwidth voltage length length △λ nm @20mA(V) @20mA(mcd) λ P nm λD nm Lens Green Diffused Viewing angle 2θ 1/2 (deg) Typ. Max. Min. Typ. 518 525 35 3.5 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. 4.2 550 900 50 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/5 PART NO. LA112B/2SGM-PF Typical Electro-Optical Characteristics Curve SGM CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Forward Current vs. Relative Intensity 2.5 Forward Current(mA) Forward Current(mA) 30 20 10 2.0 1.5 1.0 0.5 0.0 0 1.0 1.5 2.0 2.5 3.0 3.5 0 4.0 10 Relative Intensity@20mA Normalize @25℃ Forward Current@20mA 60 50 40 30 20 10 0 40 60 80 100 Relative Intensity@20mA Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 500 550 Wavelength (nm) 50 2.0 1.5 1.0 0.5 0.0 20 30 40 50 Ambient Temperature( ℃) Ambient Temperature( ℃) 0.0 450 40 Fig.4 Relative Intensity vs. Temperature Fig.3 Forward Current vs. Temperature 20 30 Relative Intensity Normalize @20mA Forward Voltage(V) 0 20 600 60 70 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/5 PART NO. LA112B/2SGM-PF Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 2° /sec max 0 Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA112B/2SGM-PF Page 5/5 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105℃± 5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40℃± 5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260℃±5℃ 2.Dwell time= 10±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230℃±5℃ 2.Dwell time=5±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11