LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DUAL DIGIT LED DISPLAY (0.40 lnch) Pb Lead-Free Parts LDD495/61-XX/F1-PF DATA SHEET DOC. NO : QW0905-LDD495/61-XX/F1-PF REV. : DATE : 07 - JUL. - 2006 B LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/8 PART NO. LDD495/61-XX/F1-PF Package Dimensions 15.4 (0.606") DIG.1 10.16 (0.40") 2.5±0.3 1.5±0.3 DIG.2 10.0 ±0.5 15.0 (0.591") 1.15 (0.045") LDD495/61-XX/F1-PF LIGITEK A 7.2(0.283") F B E G C D DP 12.0±0.5 Ø0.51 TYP. 2.54*4=10.16(0.4") PIN NO.1 Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/8 PART NO. LDD495/61-XX/F1-PF Internal Circuit Diagram LDD4951-XX/F1-PF 10 5 DIG.1 DIG.2 A B C D E F G A B C D E F G 3 9 8 6 7 4 1 LDD4961-XX/F1-PF 10 5 DIG.1 DIG.2 A B C D E F G A B C D E F G 3 9 8 6 7 4 1 PIN 2:No Pin LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD495/61-XX/F1-PF Page 3/8 Electrical Connection PIN NO. LDD4951-XX/F1-PF PIN NO. LDD4961-XX/F1-PF 1 Anode G 1 Cathode G 2 No Pin 2 No Pin 3 Anode A 3 Cathode A 4 Anode F 4 Cathode F 5 Common Cathode Dig.2 5 Common Anode Dig.2 6 Anode D 6 Cathode D 7 Anode E 7 Cathode E 8 Anode C 8 Cathode C 9 Anode B 9 Cathode B 10 Common Cathode Dig.1 10 Common Anode Dig.1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/8 PART NO. LDD495/61-XX/F1-PF Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT H Forward Current Per Chip IF 15 mA Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) IFP 60 mA Power Dissipation Per Chip PD 40 mW Ir 10 μA Operating Temperature Topr -25 ~ +85 ℃ Storage Temperature Tstg -25 ~ +85 ℃ Reverse Current Per Any Chip Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Part Selection And Application Information(Ratings at 25℃) common cathode or anode Material Emitted CHIP PART NO λP (nm) △λ Vf(v) (nm) Min. Iv(mcd) Typ. Max. Min. IV-M Typ. Common Cathode LDD4951-XX/F1-PF GaP LDD4961-XX/F1-PF Electrical 697 Red 90 1.7 2.1 Common Anode Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. 2.6 0.2 0.35 2:1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD495/61-XX/F1-PF Page 5/8 Test Condition For Each Parameter Symbol Unit Test Condition Forward Voltage Per Chip Vf volt If=20mA Luminous Intensity Per Chip Iv mcd If=10mA Peak Wavelength λP nm If=20mA △λ nm If=20mA Ir μA Vr=5V Parameter Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/8 PART NO. LDD495/61-XX/F1-PF Typical Electro-Optical Characteristics Curve H CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0.0 2.0 1.0 3.0 4.0 5.0 1.0 10 Fig.4 Relative Intensity vs. Temperature 1.2 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 100 Relative Intensity@20mA Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 700 800 900 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) 600 1000 Forward Current(mA) Forward Voltage(V) -40 100 1000 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD495/61-XX/F1-PF Page 7/8 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One Time) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ° C 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD495/61-XX/F1-PF Page 8/8 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11