LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only FOUR DIGIT LED DISPLAY (0.39 Inch) Pb Lead-Free Parts LFD4K5/6SBKS-XX/S3-PF DATA SHEET DOC. NO : QW0905- LFD4K5/6SBKS-XX/S3-PF REV. : B DATE : 31 - Jul. - 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/8 PART NO. LFD4K5/6SBKS-XX/S3-PF Package Dimensions LFD4K5/6SBKS-XX/S3-PF BIN GRADING ORDER DATE CUSTOMER P/N LAPLING 7.0(0.276") 40.18(1.582") DIG.1 10.0 (0.39") DIG.2 L1 DIG.3 L3 L2 DIG.4 12.8 (0.504") 10.5±0.5 1.2 90° ±5° 17.5MIN Ø 0.51TYP 2.54*13=33.02 A F G E D B C DP PIN NO.1 Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/8 PART NO. LFD4K5/6SBKS-XX/S3-PF Internal Circuit Diagram LFD4K5SBKS-XX/S3-PF LFD4K6SBKS-XX/S3-PF 14 13 12 11 10 9 8 A DIG.1 B C D 5 E F G 14 13 12 11 10 9 8 A DIG.1 B C D 5 E F G A DIG.2 B C D 4 E F G A DIG.2 B C D 4 E F G A DIG.3 B C D 2 E F G A DIG.3 B C D 2 E F G A DIG.4 B C D 1 E F G A DIG.4 B C D 1 E F G L1 L2 3 L1 L2 3 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD4K5/6SBKS-XX/S3-PF Page 3/8 Electrical Connection PIN NO.1 LFD4K5SBKS-XX/S3-PF PIN NO.1 LFD4K6SBKS-XX/S3-PF 1 Common Cathode Dig.4 1 Common Anode Dig.4 2 Common Cathode Dig.3 2 Common Anode Dig.3 3 Cathode L1,L2 3 Anode L1,L2 4 Common Cathode Dig.2 4 Common Anode Dig.2 5 Common Cathode Dig.1 5 Common Anode Dig.1 6 NO CONNECT 6 NO CONNECT 7 NO CONNECT 7 NO CONNECT 8 Anode G 8 Cathode G 9 Anode F 9 Cathode F 10 Anode E 10 Cathode E 11 Anode D 11 Cathode D 12 Anode C 12 Cathode C 13 Anode B,L2 13 Cathode B,L2 14 Anode A,L1 14 Cathode A,L1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD4K5/6SBKS-XX/S3-PF Page 4/8 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT SBKS Forward Current Per Chip IF 30 mA Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) IFP 100 mA Power Dissipation Per Chip PD 120 mW Ir 50 μA ESD 500 V Reverse Current Per Any Chip Electrostatic Discharge( * ) Operating Temperature Topr -25 ~ +85 ℃ Storage Temperature Tstg -25 ~ +85 ℃ Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic * glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Part Selection And Application Information(Ratings at 25℃) common cathode Emitted or anode CHIP PART NO Material △λ Vf(v) (nm) Iv(mcd) IV-M Typ. Max. Min. Typ. Common Cathode LFD4K5SBKS-XX/S3-PF 475 InGaN/SiC Blue LFD4K6SBKS-XX/S3-PF Electrical λD (nm) 26 3.5 Common Anode Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. 4.2 5.0 8.5 2:1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD4K5/6SBKS-XX/S3-PF Page 5/8 Test Condition For Each Parameter Symbol Unit Test Condition Forward Voltage Per Chip Vf volt If=20mA Luminous Intensity Per Chip Iv mcd If=10mA Dominant Wavelength λD nm If=20mA △λ nm If=20mA Ir μA Vr=5V Parameter Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD4K5/6SBKS-XX/S3-PF Page 6/8 Typical Electro-Optical Characteristics Curve SBK-S CHIP Fig.2 Relative Intensity vs. Forward Current 30 1.5 Relative Intensity Normalize @20mA Forward Current(mA) Fig.1 Forward current vs. Forward Voltage 25 20 15 10 5 0 1 2 3 4 1.25 1.0 0.75 0.5 0.25 0 5 0 5 Relative Intensity@20mA Forward Current@20mA 40 30 20 10 0 50 75 Ambient Temperature( ℃) 20 25 30 Fig.4 Relative Intensity vs. Wavelength Fig.3 Forward Current vs. Temperature 25 15 Forward Current(mA) Forward Voltage(V) 0 10 100 1.0 0.5 0 380 430 480 530 580 Wavelength (nm) 630 680 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD4K5/6SBKS-XX/S3-PF Page 7/8 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One Time) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260° C 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C Temp(°C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD4K5/6SBKS-XX/S3-PF Page 8/8 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11