LIGITEK LG-110VIR-CT

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LED SMD
Pb
Lead-Free Parts
LG-110VIR-CT
DATA SHEET
DOC. NO :
QW0905-LG-110VIR-CT
REV.
:
A
DATE
:
21 - Aug - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/10
PART NO. LG-110VIR-CT
Features:
1. Package in 8.0mm carrier tape on 7" diameter reel.
2. Low forward voltage
3. Good spectral matehing to Si photo detecor
Descriptions:
1. The LG-110VIR is an infrared emitting diode in miniature
SMD package which is molded in a water cleatr plastic
with flat top view lens.
2. The device is spectrally matched with silicon photodiode
and phototransistor.
Applications:
1. PCB mounted infrared sensor
2. Infrared emitting for miniature light barrier
3. Floppy disk drive
4. Optoelectronic switch
5. Smoke detector
Device Selection Guide:
PART NO
MATERIAL
Lens Color
LG-110VIR-CT
GaAlAs
Water Clear
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PART NO. LG-110VIR-CT
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Package Dimensions
1.5
0.5
1.0
Cathode
Mark
0.65
Resin
LED DICE
3.2
Soldering
Terminal
0.8
0.65
PCB
R1.0
Note : 1.All dimension are in millimeter tolerance is ±0.1mm unless otherwise noted.
2.Specifications are subject to change without notice.
Recommended Soldering Pad Dimensions
5.0
1.0
0.9
1.0
1.5
1.5
Note : The tolerances unless mentioned is ±0.1mm,Angle± 0.5. Unit=mm.
1.0
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PART NO. LG-110VIR-CT
Page 3/10
Absolute Maximum Ratings at Ta=25 ℃
Symbol
Ratings
UNIT
Power Dissipation
PD
100
mW
Peak Forward Current
(300pps,10 μs Pulse)
IFP
1
A
Forward Current
IF
50
mA
Reverse Voltage
Vr
5
V
Operating Temperature
Topr
-25 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +85
℃
Soldering Temperature
Tsol
Parameter
Max 260 ℃ for 5 sec Max
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PARAMETER
SYMBOL
Min.
Typ.
Le
0.85
Max.
UNIT
TEST CONDITION
1.4
mW/sr
IF=20mA
λpeak
940
nm
IF=20mA
△λ
50
nm
IF=20mA
Forward Voltage
VF
1.2
1.6
V
IF=20mA
Reverse Current
IR
100
μA
VR=5V
Radiant Intensity
Peak Emission Wavelength
Spectral Line Half Width
Viewing Angle
2θ1/2
178
deg
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PART NO. LG-110VIR-CT
Typical Electro-Optical Characteristics Curve
Relative Radiant Intensity
Normalize @20mA
VIR CHIP
Forward Current [mA]
1000
100
10
1.0
0.1
0.5
1.0
1.5
2.0
2.5
3.0
3.5
1.0
0.5
0.0
4.0
800
850
1100
Fig.4 Relative Radiant Power
vs. Forward Peak Current
10.0
10.0
Relative Radiant Power
Normalized @ 100 mA
Fig 3. Relative Radiant Power
vs. Forward Peak Current
1.0
0.1
1.0
10
1.0
0.1
100
10
100
Fig.5 Forward DC Voltage vs. Temperature
1.1
1.0
0.9
0.8
-20
0
20
40
60
80
Ambient Temperature [ ℃]
100
Fig.6 Relative Radiant Power vs. Temperature
Relative Radiant Power
@ 20mA, Normalize @ 25 ℃
1.2
-40
1000
IFPK [mA]
IFDC [mA]
Forw ard DC Voltage @ 20 mA
Normalize @ 25 ℃
1000 1050
Wavelength[nm]
Forward Voltage[V]
Relative Radiant Power
Normalized @ 20mA
900 950
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
-20
0
20
40
60
80
Ambient Temperature [ ℃]
100
LIGITEK ELECTRONICS CO.,LTD.
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PART NO. LG-110VIR-CT
Carrier Type Dimensions
4.0±0.2
2.0
0.25
1.5
1.75
3.5±0.2
8.0±0.3
5.3
3.4
Polarity
1.25
4.0±0.2
1.87
Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm.
• Packing Specifications
Label
Aluminum Moist-Proof bag
Label
Part No.
Description
Quantity/Reel
LG-110VIR-CT
8.0mm tape,7"reel
3000 devices
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Property of Ligitek Only
PART NO. LG-110VIR-CT
Page 6/10
Label Explanation
立碁電子工業股份有限公司
LIGITEK LED
LIGITEK ELECTRONICS CO., LTD.
Pb
PART NO. : LG-110VIR-CT
BIN : Luminous Intensity
LOT NO. : GSI-680024
1.1 - 1.3 : Forward Voltage
Q'TY(PCS) : 3000 PCS
BIN/HUE : K
1.1 - 1.3
Reel Dimensions
0.2
0.4
0.8
0.8
0.6
0.2
0.4
0.6
2.0±0.5
178±1.5
6.0±1.0
9.0± 1.0
ψ13.5±1.0
12.0±1.0
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-110VIR-CT
Page 7/10
Box Explanation
1. 5 BAG / INNER BOX
2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm
H
W
L
3. 10 INNER BOXES / CARTON
4. CARTON SIZE : L X W X H 49cm X 46cm x 29cm
L
W
H
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-110VIR-CT
Page 8/10
Recommended Soldering Conditions
1. Hand Solder
Basic spec is ≦ 280℃ 3 sec one time only.
2. Wave Solder
Soldering heat Max. 260 ℃
245±5℃ within 5 sec
Preheat
120 ~ 150℃
120 ~ 180 sec
3-1. LEAD Reflow Solder
Temp.
(℃)
240
Rising
+5℃/sec
Cooling
-5 ℃/sec
Preheat
150
120
60 ~ 120 sec
Time
5sec
3-2 PB-Free Reflow Solder
1~5° C/sec
Preheat
180~200 ° C
1~5° C/sec
260° C MaX.
10sec.Max
Above 220 ° C
60 sec.Max.
120 sec.Max.
Reflow Soldering should not be done more than two times.
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PART NO. LG-110VIR-CT
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Precautions For Use:
Storage time:
1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%.
2.Once the package is opened, the products should be used within a week.
Otherwise, they should be kept in a damp proof box with descanting agent.
Considering the tape life, we suggest our customers to use our products within
a year(from production date).
3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH60%,
they should be treated at 60 ℃± 5 ℃fo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forward
current should not be allowed to change by more than 40 % of its desired value.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
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Page 10/10
PART NO. LG-110VIR-CT
Reliability Test:
Classification
Test Item
Test Condition
Reference
Standard
Operating Life Test
1.Ta=Under Room Temperature As Per Data Sheet
Maximum Rating.
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-750D: 1026
MIL-STD-883D: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883D:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
High Temperature
High Humidity
Storage Test
1.Ta=65 ℃±5℃
2.RH=90 %~95 %
3.t=1000hrs ±2hrs
Endurance
Test
Thermal Shock Test
Solderability Test
Environmental
Test
Temperature
Cycling
IR Reflow
1.Ta=105 ℃±5 ℃&-40 ℃±5℃
(10min)
(10min)
2.total 10 cycles
1.T.Sol=235 ℃±5℃
2.Immersion time 2 ±0.5sec
3.Coverage ≧95% of the dipped surface
1.105 ℃ ~ 25 ℃ ~ -55 ℃ ~ 25 ℃
30mins 5mins 30mins 5mins
2.10 Cyeles
1.T=260 ° C Max. 10sec.Max.
2. 6 Min
MIL-STD-202F:103B
JIS C 7021: B-11
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1011
MIL-STD-202F: 208D
MIL-STD-750D: 2026
MIL-STD-883D: 2003
IEC 68 Part 2-20
JIS C 7021: A-2
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1010
JIS C 7021: A-4
MIL-STD-750D:2031.2
J-STD-020