LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TAPE AND BOX TYPE LED LAMPS Pb Lead-Free Parts LHRF22840/S8-PF/TBS-X DATA SHEET DOC. NO : QW0905-LHRF22840/S8-PF/TBS-X REV. : A DATE : 05 - May.- 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHRF22840/S8-PF/TBS-X Page 1/6 Package Dimensions P2 ΔH H2 W2 H1 L W0 W1 D P1 - F + P T LHRF22840/S8-PF 4.0 3.8 6.3 9.6±0.5 1.5MAX 25.0MIN □0.5 TYP 2.54TYP + 1.0MIN - Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. W3 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/6 PART NO. LHRF22840/S8-PF/TBS-X Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT HRF Forward Current IF 30 mA Peak Forward Current Duty 1/10@10KHz IFP 90 mA Power Dissipation PD 75 mW Ir 10 μA Electrostatic Discharge( * ) ESD 2000 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Reverse Current @5V Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic * glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted LHRF22840/S8-PF/TBS-X AlGaInP Red Forward Dominant Spectral voltage wave halfwidth length △λ nm @20mA(V) λDnm @20mA(mcd) Viewing angle 2θ 1/2 (deg) Min. Max. Min. Typ. Lens Red Diffused Luminous intensity 630 20 1.5 2.4 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 120 250 Horizontal Axis 80° Vertical Axis 120° LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHRF22840/S8-PF/TBS-X Page 3/6 •Dimension Symbol Information SPECIFICATIONS OPTION SYMBOL CODE SYMBOL ITEMS Minimum Maximum mm inch mm inch Tape Feed Hole Diameter ------- D 3.8 0.15 4.2 0.17 Component Lead Pitch ------- F 2.3 0.09 3.0 0.12 Front-To-Rear Deflection ------- △H ------- ------- 2.0 0.08 TBS-1 17.5 0.69 18.5 0.73 TBS-2 21.5 0.85 22.5 0.89 TBS-3 25.5 1.0 26.5 1.04 TBS-5 22.5 0.89 23.5 0.93 TBS-6 19.9 0.78 20.9 0.82 24.0 0.94 25.0 0.98 24.5 0.96 25.5 1.0 TBS-9 19.0 0.75 20.0 0.79 TBS-10 18.4 0.72 19.4 0.76 TBS-11 21.0 0.83 22.0 0.87 TBS-12 20.5 0.81 21.5 0.85 TBS-13 18.0 0.71 19.0 0.75 ------- 36 1.42 11 0.43 TBS-7 Feed Hole To Bottom Of Component H1 TBS-8 Feed Hole To Overall Component Height ------- H2 Lead Length After Component Height ------- L Feed Hole Pitch ------- P 12.4 0.49 13 0.51 Lead Location ------- P1 4.4 0.17 5.8 0.23 Center Of Component Location ------- P2 5.1 0.2 7.7 0.3 Overall Taped Package Thickness ------- T ------- ------- 1.42 0.06 Feed Hole Location ------- W0 8.5 0.33 9.75 0.38 Adhesive Tape Width ------- W1 14.5 0.57 15.5 0.61 Adhesive Tape Position ------- W2 0 0 4.0 0.16 Tape Width ------- W3 17.5 0.69 19 0.75 ------- W0 REMARK:TBS=Tape And Box Straight Leads • Dimensions Symbol Information • Package Dimensions Specification Description Symbol minimum maxmum mm inch mm inch Overall Length L 330 13.0 340 13.4 Overall Width W 265 10.4 275 10.8 Overall Thickness H 50 1.97 60 2.4 Quantity/Box 2500PCS LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHRF22840/S8-PF/TBS-X Page4/6 Typical Electro-Optical Characteristics Curve HRF CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 3.0 2.5 2.0 1.5 1.0 0.5 0 0.1 1.0 2.0 1.5 2.5 3.0 1.0 10 Fig.4 Relative Intensity vs. Temperature Fig.3 Forward Voltage vs. Temperature 3.0 Relative Intensity@20mA Normalize@25 ℃ 1.2 1.1 1.0 0.9 0.8 -40 -20 -0 20 40 60 80 2.5 2.0 1.5 1.0 0.5 0 100 -40 -20 20 -0 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.6 Directivity Radiation Fig.5 Relative Intensity vs. Wavelength Vertical Axis 120 ° Relative Intensity@20mA 1000 Forward Current(mA) Forward Voltage(V) Forward Voltage@20mA Normalize @25℃ 100 Horizontal Axis 80 ° 1.0 0° -30° 30° -60° 0.5 60° 100% 75% 50% 0 550 600 650 Wavelength (nm) 700 25% 0 25% 50% 75% 100% Radiation Angle(0.5):H 80 Degree/V 120 Degree 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHRF22840/S8-PF/TBS-X Page 5/6 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/6 PART NO. LHRF22840/S8-PF/TBS-X Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11