LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TAPE AND BOX TYPE LED LAMPS Pb Lead-Free Parts LSRF42941-PF/TBF-X DATA SHEET DOC. NO : QW0905-LSRF42941-PF/TBF-X REV. : A DATE : 03 - Aug. - 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSRF42941-PF/TBF-X Page 1/6 Package Dimensions P2 ΔH H2 H1 H W2 L W0 W1 W3 D + - P1 F P T Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LSRF42941-PF 3.8 3.1 3.0 4.5 1.5 MAX 25.0MIN □0.5 TYP 1.0MIN 2.54TYP + - LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/6 PART NO. LSRF42941-PF/TBF-X Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT SRF Forward Current IF 30 mA Peak Forward Current Duty 1/10@10KHz IFP 90 mA Power Dissipation PD 75 mW Ir 10 μA Electrostatic Discharge( * ) ESD 2000 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Reverse Current @5V Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic *glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Typical Electrical & Optical Characteristics (Ta=25 ℃) COLOR PART NO MATERIAL Emitted LSRF42941-PF/TBF-X AlGaInP Red Dominant wave length λDnm Spectral halfwidth △λnm Lens Red Transparent 630 20 Forward voltage @20mA(V) Luminous intensity @20mA(mcd) Min. Max. Min. Typ. 1.5 2.4 120 220 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Viewing angle 2θ1/2 (deg) 56 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/6 PART NO. LSRF42941-PF/TBF-X •Dimension Symbol Information SPECIFICATIONS OPTION SYMBOL CODE SYMBOL ITEMS Minimum mm inch Maximum mm inch Tape Feed Hole Diameter ------- Component Lead Pitch ------- F Front-To-Rear Deflection ------- △H Height Of Seating Plane ------- H 15.5 0.61 16.5 0.65 17.5 19.0 22.5 25.5 21.5 20.2 17.125 20.0 26 18.8 24.0 21.0 19.0 21.7 22.5 17.5 0.69 0.75 0.89 1.0 0.85 0.8 0.67 0.79 1.02 0.74 0.94 0.83 0.75 0.85 0.89 0.69 19.5 21.0 24.5 26.5 22.5 21.2 21.125 22.5 28 19.8 26.0 23.0 20.0 23.7 23.5 18.0 0.77 0.83 0.96 1.04 0.89 0.83 0.83 0.89 1.10 0.78 1.02 0.91 0.79 0.93 0.93 0.71 18.5 20.5 0.73 0.81 19.5 21.5 36 11 0.77 0.85 1.42 0.43 D TBF-1 TBF-2 TBF-3 TBF-4 TBF-5 TBF-6 TBF-7 TBF-8 TBF-9 TBF-10 TBF-11 TBF-12 TBF-13 TBF-14 TBF-15 TBF-16 Feed Hole To Bottom Of Component H1 TBF-17 TBF-18 Feed Hole To Overall Component Height 3.8 0.15 4.2 0.17 4.8 0.19 ------- ------- 5.8 2.0 0.23 0.08 Lead Length After Component Height ------------- H2 L Feed Hole Pitch ------- P 12.4 0.49 13 0.51 Lead Location ------- P1 3.15 0.12 4.55 0.18 Center Of Component Location ------- P2 5.1 0.2 7.7 0.3 Overall Taped Package Thickness ------- T ------- ------- 1.42 0.06 Feed Hole Location ------- W0 8.5 0.33 9.75 0.38 Adhesive Tape Width ------- W1 14.5 0.57 15.5 0.61 Adhesive Tape Position ------- W2 0 0 4.0 0.16 Tape Width ------- W3 17.5 0.69 19 0.75 ------- ------- W0 REMARK:TBF = Tape And Box Forming Leads • Package Dimensions • Dimensions Symbol Information Specification Description Symbol minimum maxmum mm inch mm inch Overall Length L 330 13.0 340 13.4 Overall Width W 265 10.4 275 10.8 Overall Thickness H 50 1.97 60 2.4 Part No. Quantity/Box LSRF42941-PF/TBF-X 2500PCS W L H LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/6 PART NO. LSRF42941-PF/TBF-X Typical Electro-Optical Characteristics Curve SRF CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0.0 1.0 2.0 3.0 4.0 5.0 10 1.0 Forward Current(mA) Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 3.0 Relative Intensity@20mA Normalize @25 ℃ Forward Voltage@20mA Normalize @25 ℃ 1.2 1.1 1.0 0.9 0.8 -40 -20 0 20 60 40 80 100 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.6 Directivity Radiation Fig.5 Relative Intensity vs. Wavelength 0° 1.0 Relative Intensity@20mA 1000 100 -30° 30° -60° 0.5 60° 0.0 550 600 650 Wavelength (nm) 700 100% 75% 50% 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/6 PART NO. LSRF42941-PF/TBF-X Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/6 PART NO. LSRF42941-PF/TBF-X Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5 ℃&-40 ℃±5 ℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11