LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Features * Meet ROHS, Green Product. * Extra Thin (0.40Hmm) Full Color SMD Chip LED. * Package in 8mm tape on 7" diameter reels. * EIA STD package. * I.C. compatible. * Compatible with automatic placement equipment. * Compatible with infrared and vapor phase reflow solder process. Package Dimensions Devices Part No. LTST-C19GD2WT-G Lens White Diffused Source Color Pin Assignment InGaN Blue 1 AlInGaP Red 2 InGaN Green 3 Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ± 0.10 mm (.004") unless otherwise noted. Part No. : LTST-C19GD2WT-G BNS-OD-C131/A4 Page : 1 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Absolute Maximum Ratings At Ta=25°°C LTST-C19GD2WT-G Parameter Unit Blue Red Green Power Dissipation 80 75 80 mW Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) 100 80 100 mA Note 1 20 30 20 mA Note 2 10 10 10 mA 0.25 0.4 0.25 mA/°C 5 5 5 V DC Forward Current * DC Forward Current * Derating Linear From 25°C Reverse Voltage Operating Temperature Range -20°C to + 80°C Storage Temperature Range -30°C to + 100°C Infrared Soldering Condition 260°C For 5 Seconds Note: 1. The maximum condition is for driving by each color. 2. The maximum condition is for driving by all color. (Red, Green, Blue) Part No. : LTST-C19GD2WT-G BNS-OD-C131/A4 Page : 2 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Suggestion Profile: (1) Suggestion IR Reflow Profile For Normal Process (2) Suggestion IR Reflow Profile For Pb Free Process R e c o m m e n d e d P r o file B e t w e e n A s s e m b le A n d H e a t-R e s is t a n c e L in e T h e P r o file is a v a ila b le th a t m u s t to u s e S n A g Part No. : LTST-C19GD2WT-G BNS-OD-C131/A4 Cu Page : s o ld e r p a s t e 3 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Electrical / Optical Characteristics At Ta=25°°C LTST-C19GD2WT-G Parameter Symbol MIN. Luminous Intensity IV Blue Red Green 45.0 71.0 112.0 TYP. MAX. 180.0 180.0 130 2θ1/2 TYP. Peak Emission Wavelength λP TYP. 468 632 520 Dominant Wavelength λd MIN. 465 618 520 Spectral Line Half-Width ∆λ Forward Voltage VF IR Test Condition mcd IF = 20mA Note 1 deg Note 2 (Fig.6) nm Measurement @Peak (Fig.1) nm IF = 20mA Note 3 450.0 Viewing Angle Reverse Current Unit MAX. 475 630 535 TYP. 26 17 35 TYP. 3.5 2.0 3.5 MAX. 3.8 2.4 3.8 MAX. 10 10 10 nm V IF = 20mA µA VR = 5V Notes: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve. 2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 4. Caution in ESD: Static Electricity and surge damages the LED. It is recommend to use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded. Part No. : LTST-C19GD2WT-G BNS-OD-C131/A4 Page : 4 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Bin Code List Forward Voltage Color : Blue , Unit: V @20mA Bin Code Min. Max. D7 2.80 3.00 D8 3.00 3.20 D9 3.20 3.40 D10 3.40 3.60 D11 3.60 3.80 Tolerance on each Forward Voltage bin is +/-0.1 volt Luminous Intensity Color : Blue , Unit : mcd @20mA Bin Code Min. Max. P 45.0 71.0 Q 71.0 112.0 R 112.0 180.0 Tolerance on each Intensity bin is +/-15% Dominant Wavelength Color : Blue ,Unit : nm @20mA Bin Code Min. Max. AC 465.0 470.0 AD 470.0 475.0 Tolerance for each Dominate Wavelength bin is +/- 1nm Luminous Intensity Color : Red , Unit : mcd @20mA Bin Code Min. Max. Q 71.0 112.0 R 112.0 180.0 Tolerance on each Intensity bin is +/-15% Luminous Intensity Color : Green , Unit : mcd @20mA Bin Code Min. Max. R 112.0 180.0 S 180.0 280.0 T 280.0 450.0 Tolerance on each Intensity bin is +/-15% Dominant Wavelength Bin Code Color : Green ,Unit : nm @20mA Min. Max. AP 520.0 525.0 AQ 525.0 530.0 AR 530.0 535.0 Tolerance for each Dominate Wavelength bin is +/- 1nm Part No. : LTST-C19GD2WT-G BNS-OD-C131/A4 Page : 5 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Typical Electrical / Optical Characteristics Curves (25°C Ambient Temperature Unless Otherwise Noted) Part No. : LTST-C19GD2WT-G BNS-OD-C131/A4 Page : 6 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Cleaning Do not use unspecified chemical liquid to clean LED they could harm the package. If clean is necessary, immerse the LED in ethyl alcohol or in isopropyl alcohol at normal temperature for less one minute. Suggest Soldering Pad Dimensions Notes: 1. Suggest stencil thickness is maximum 0.10mm. Package Dimensions Of Tape And Reel Notes: 1. All dimensions are in millimeters (inches). Part No. : LTST-C19GD2WT-G BNS-OD-C131/A4 Page : 7 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Notes: 1. Empty component pockets sealed with top cover tape. 2. 7 inch reel-3000 pieces per reel. 3. Minimum packing quantity is 500 pcs for remainders. 4. The maximum number of consecutive missing lamps is two. 5. In accordance with ANSI/EIA 481-1-A-1994 specifications. Part No. : LTST-C19GD2WT-G BNS-OD-C131/A4 Page : 8 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only CAUTIONS 1. Application The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).Consult Liteon’s Sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 2. Storage The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity. It is recommended that LEDs out of their original packaging are IR-reflowed within one week. For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient. LEDs stored out of their original packaging for more than a week should be baked at about 60 deg C for at least 24 hours before solder assembly. 3. Cleaning Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary. 4. Soldering Recommended soldering conditions: Reflow soldering Pre-heat Pre-heat time Peak temperature Soldering time 120~150°C 120 sec. Max. 260°C Max. 5 sec. Max. Wave Soldering Pre-heat Pre-heat time Solder wave Soldering time Soldering iron 100°C Max. 60 sec. Max. 260°C Max. 10 sec. Max. Temperature Soldering time 300°C Max. 3 sec. Max. (one time only) 5. Drive Method An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as shown in Circuit A below. Circuit model A LED Circuit model B LED (A) Recommended circuit. (B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs. 6. ESD (Electrostatic Discharge) Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage: Part Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs. All devices, equipment, and machinery must be properly grounded. Work tables, storage racks, etc. should be properly grounded. Use ion blower to neutralize the static charge which might have built up on surface of the LED’s plastic lens as a result of friction between LEDs during storage and handling. No. : LTST-C19GD2WT-G BNS-OD-C131/A4 Page : 9 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage, or “ no lightup ” at low currents. To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents. The Vf of “ good ” LEDs should be >[email protected] for InGaN product and >[email protected] for AlInGaP product. 7. Reliability Test Test Item Classification MIL-STD-750D:1026 MIL-STD-883D:1005 JIS C 7021:B-1 High Temperature High Humidity Storage IR-Reflow In-Board, 2 Times Ta= 65±5℃,RH= 90～95% *Test Time= 240HRS±2HRS MIL-STD-202F:103B JIS C 7021:B-11 High Temperature Storage Ta= 105±5℃ *Test Time= 1000HRS (-24HRS,+72HRS) MIL-STD-883D:1008 JIS C 7021:B-10 Low Temperature Storage Ta= -55±5℃ *Test Time=1000HRS (-24HRS,+72H RS) JIS C 7021:B-12 105℃ ～ 25℃ ～ -55℃ ～ 25℃ 30mins 5mins 30mins 5mins 10 Cycles MIL-STD-202F:107D MIL-STD-750D:1051 MIL-STD-883D:1010 JIS C 7021:A-4 IR-Reflow In-Board, 2 Times 85 ± 5℃ ～ -40℃ ± 5℃ 10mins 10mins 10 Cycles MIL-STD-202F:107D MIL-STD-750D:1051 MIL-STD-883D:1011 T.sol= 260 ± 5℃ Dwell Time= 10 ± 1secs MIL-STD-202F:210A MIL-STD-750D:2031 JIS C 7021:A-1 Temperature Cycling Thermal Shock Solder Resistance Environmental Test Reference Standard Ta= Under Room Temperature As Per Data Sheet Maximum Rating *Test Time= 1000HRS (-24HRS,+72HRS)*@20mA. Operation Life Endurance Test Test Condition MIL-STD-750D:2031.2 J-STD-020C IR-Reflow Normal Process Ramp-up rate(183℃ to Peak) +3℃/ second max Temp. maintain at 125(±25)℃ 120 seconds max Temp. maintain above 183℃ 60-150 seconds Peak temperature range 235℃+5/-0℃ Time within 5°C of actual Peak Temperature (tp) 10-30 seconds Ramp-down rate +6℃/second max MIL-STD-750D:2031.2 J-STD-020C IR-Reflow Pb Free Process Ramp-up rate(217℃ to Peak) +3℃/ second max Temp. maintain at 175(±25)℃ 180 seconds max Temp. maintain above 217℃ 60-150 seconds Peak temperature range 260℃+0/-5℃ Time within 5°C of actual Peak Temperature (tp) 20-40 seconds Ramp-down rate +6℃/second max T.sol= 235 ± 5℃ Immersion time 2±0.5 sec Immersion rate 25±2.5 mm/sec Coverage ≧95% of the dipped surface MIL-STD-202F:208D MIL-STD-750D:2026 MIL-STD-883D:2003 IEC 68 Part 2-20 JIS C 7021:A-2 Solderability 8. Others The appearance and specifications of the product may be modified for improvement without prior notice. Part No. : LTST-C19GD2WT-G BNS-OD-C131/A4 Page : 10 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only 9. Suggested Checking List Training and Certification 1. Everyone working in a static-safe area is ESD-certified? 2. Training records kept and re-certification dates monitored? Static-Safe Workstation & Work Areas 1. Static-safe workstation or work-areas have ESD signs? 2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V? 3. All ionizer activated, positioned towards the units? 4. Each work surface mats grounding is good? Personnel Grounding 1. Every person (including visitors) handling ESD sensitive (ESDS) items wears wrist strap, heel strap or conductive shoes with conductive flooring? 2. If conductive footwear used, conductive flooring also present where operator stand or walk? 3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*? 4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs? 5. All wrist strap or heel strap checkers calibration up to date? Note: *50V for Blue LED. Device Handling 1. Every ESDS items identified by EIA-471 labels on item or packaging? 2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation? 3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items? 4. All flexible conductive and dissipative package materials inspected before reuse or recycles? Others 1. Audit result reported to entity ESD control coordinator? 2. Corrective action from previous audits completed? 3. Are audit records complete and on file? Part No. : LTST-C19GD2WT-G BNS-OD-C131/A4 Page : 11 of 11