® LY61L2568 256K X 8 BIT HIGH SPEED CMOS SRAM Rev. 0.4 REVISION HISTORY Revision Rev. 0.1 Rev. 0.2 Rev. 0.3 Rev. 0.4 Description Preliminary Deleted ISB Spec. Deleted -10/-12/-15 Spec. Revised Test Condition of ICC/ISB1/IDR Revised VTERM to VT1 and VT2 Revised FEATURES & ORDERING INFORMATION Lead free and green package available to Green package available Deleted TSOLDER in ABSOLUTE MAXIMUN RATINGS Added packing type in ORDERING INFORMATION Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 0 Issue Date Apr.19.2006 May.24.2006 Mar.13.2007 Apr.17.2009 ® LY61L2568 256K X 8 BIT HIGH SPEED CMOS SRAM Rev. 0.4 FEATURES GENERAL DESCRIPTION Fast access time : 20/25ns Very low power consumption: Operating current(Normal version): 110/90mA(TYP.) Operating current(20/25ns LL version): 40/35mA(TYP.) Standby current(Normal version): 0.5mA(TYP.) Standby current(20/25ns LL version): 10µA(TYP.) Single 3.3V power supply All inputs and outputs TTL compatible Fully static operation Tri-state output Data retention voltage : 2.0V (MIN.) Green package available Package : 44-pin 400 mil TSOP-II The LY61L2568 is a 2,097,152-bit low power CMOS static random access memory organized as 262,144 words by 8 bits. It is fabricated using very high performance, high reliability CMOS technology. Its standby current is stable within the range of operating temperature. The LY61L2568 is well designed for very low power system applications, and particularly well suited for battery back-up nonvolatile memory application. The LY61L2568 operates from a single power supply of 3.3V and all inputs and outputs are fully TTL compatible PRODUCT FAMILY Product Family LY61L2568 LY61L2568(LL) Operating Temperature 0 ~ 70℃ 0 ~ 70℃ Vcc Range Speed 3.0 ~ 3.6V 3.0 ~ 3.6V 20/25ns 20/25ns Power Dissipation Standby(ISB1,TYP.) Operating(Icc,TYP.) 0.5mA 110/90mA 10µA(LL) 40/35mA(LL) Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 1 ® LY61L2568 256K X 8 BIT HIGH SPEED CMOS SRAM Rev. 0.4 FUNCTIONAL BLOCK DIAGRAM PIN DESCRIPTION Vcc Vss A0-A17 DECODER DQ0-DQ7 I/O DATA CIRCUIT CE# WE# OE# CONTROL CIRCUIT 256Kx8 MEMORY ARRAY SYMBOL DESCRIPTION A0 - A17 Address Inputs DQ0 – DQ7 Data Inputs/Outputs CE# Chip Enable Inputs WE# Write Enable Input OE# Output Enable Input VCC Power Supply VSS Ground NC No Connection COLUMN I/O PIN CONFIGURATION NC 1 44 NC NC 2 43 NC A4 3 42 NC A3 4 41 A5 A2 5 40 A6 A1 6 39 A7 7 38 A8 8 37 OE# DQ0 9 36 DQ7 DQ1 10 35 DQ6 Vcc 11 34 Vss Vss 12 33 Vcc DQ2 13 32 DQ5 DQ3 14 31 DQ4 WE# 15 30 A9 A17 16 29 A10 A16 17 28 A11 A15 18 27 A12 A14 19 26 NC A13 20 25 NC NC 21 24 NC NC 22 23 NC LY61L2568 A0 CE# TSOP-II Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 2 ® LY61L2568 256K X 8 BIT HIGH SPEED CMOS SRAM Rev. 0.4 ABSOLUTE MAXIMUN RATINGS* PARAMETER Voltage on VCC relative to VSS Voltage on any other pin relative to VSS Operating Temperature Storage Temperature Power Dissipation DC Output Current SYMBOL VT1 VT2 TA TSTG PD IOUT RATING -0.5 to 4.6 -0.5 to VCC+0.5 0 to 70(C grade) -65 to 150 1 50 UNIT V V ℃ ℃ W mA *Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to the absolute maximum rating conditions for extended period may affect device reliability. TRUTH TABLE MODE Standby Output Disable Read Write Note: CE# H L L L OE# X H L X WE# X H H L SUPPLY CURRENT ISB1 ICC ICC ICC I/O OPERATION High-Z High-Z DOUT DIN H = VIH, L = VIL, X = Don't care. DC ELECTRICAL CHARACTERISTICS SYMBOL TEST CONDITION PARAMETER Supply Voltage VCC *1 Input High Voltage VIH *2 Input Low Voltage VIL Input Leakage Current ILI VCC ≧ VIN ≧ VSS Output Leakage VCC ≧ VOUT ≧ VSS, ILO Current Output Disabled Output High Voltage VOH IOH = -1mA Output Low Voltage VOL IOL = 2mA 20 Cycle time = Min. Average Operating 25 ICC CE# = VIL , II/O = 0mA Power supply Current 20LL Others at VIL or VIH 25LL Normal Standby Power CE# ≧VCC - 0.2V ISB1 Supply Current Others at 0.2V or VCC - 0.2V 20/25LL MIN. 3.0 2.2 - 0.3 -1 *4 MAX. 3.6 VCC+0.3 0.6 1 UNIT V V V µA -1 - 1 µA 2.4 - 110 90 40 35 0.5 10 0.4 150 115 50 45 *5 5 *6 50 V V mA mA mA mA mA µA Notes: 1. VIH(max) = VCC + 3.0V for pulse width less than 10ns. 2. VIL(min) = VSS - 3.0V for pulse width less than 10ns. 3. Over/Undershoot specifications are characterized, not 100% tested. 4. Typical values are included for reference only and are not guaranteed or tested. Typical valued are measured at VCC = VCC(TYP.) and TA = 25℃ 5. 1mA for special request 6. 20µA for special request Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 3 TYP. 3.3 - ® LY61L2568 256K X 8 BIT HIGH SPEED CMOS SRAM Rev. 0.4 CAPACITANCE (TA = 25℃, f = 1.0MHz) PARAMETER Input Capacitance Input/Output Capacitance SYMBOL CIN CI/O MIN. MAX 8 10 - UNIT pF pF Note : These parameters are guaranteed by device characterization, but not production tested. AC TEST CONDITIONS Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Levels Output Load 0.2V to VCC - 0.2V 3ns 1.5V CL = 30pF + 1TTL, IOH/IOL = -8mA/16mA AC ELECTRICAL CHARACTERISTICS (1) READ CYCLE PARAMETER Read Cycle Time Address Access Time Chip Enable Access Time Output Enable Access Time Chip Enable to Output in Low-Z Output Enable to Output in Low-Z Chip Disable to Output in High-Z Output Disable to Output in High-Z Output Hold from Address Change SYM. tRC tAA tACE tOE tCLZ* tOLZ* tCHZ* tOHZ* tOH LY61L2568-20 MIN. MAX. 20 20 20 8 4 0 8 8 3 - LY61L2568-25 MIN. MAX. 25 25 25 9 4 0 9 9 3 - UNIT LY61L2568-20 MIN. MAX. 20 16 16 0 11 0 9 0 5 9 LY61L2568-25 MIN. MAX. 25 20 20 0 12 0 10 0 6 10 UNIT ns ns ns ns N`s ns ns ns ns (2) WRITE CYCLE PARAMETER Write Cycle Time Address Valid to End of Write Chip Enable to End of Write Address Set-up Time Write Pulse Width Write Recovery Time Data to Write Time Overlap Data Hold from End of Write Time Output Active from End of Write Write to Output in High-Z SYM. tWC tAW tCW tAS tWP tWR tDW tDH tOW* tWHZ* *These parameters are guaranteed by device characterization, but not production tested. Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 4 ns ns ns ns ns ns ns ns ns ns ® LY61L2568 256K X 8 BIT HIGH SPEED CMOS SRAM Rev. 0.4 TIMING WAVEFORMS READ CYCLE 1 (Address Controlled) (1,2) tRC Address tAA Dout tOH Previous Data Valid Data Valid READ CYCLE 2 (CE# and OE# Controlled) (1,3,4,5) tRC Address tAA CE# tACE OE# tOE tOH tOHZ tCHZ tOLZ tCLZ Dout High-Z Data Valid Notes : 1.WE# is high for read cycle. 2.Device is continuously selected OE# = low, CE# = low. 3.Address must be valid prior to or coincident with CE# = low,; otherwise tAA is the limiting parameter. 4.tCLZ, tOLZ, tCHZ and tOHZ are specified with CL = 5pF. Transition is measured ±500mV from steady state. 5.At any given temperature and voltage condition, tCHZ is less than tCLZ , tOHZ is less than tOLZ. Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 5 High-Z ® LY61L2568 256K X 8 BIT HIGH SPEED CMOS SRAM Rev. 0.4 WRITE CYCLE 1 (WE# Controlled) (1,2,3,5,6) tWC Address tAW CE# tCW tAS tWP tWR WE# tWHZ Dout TOW High-Z (4) tDW (4) tDH Data Valid Din WRITE CYCLE 2 (CE# Controlled) (1,2,5,6) tWC Address tAW CE# tAS tWR tCW tWP WE# tWHZ Dout High-Z (4) tDW tDH Data Valid Din Notes : 1.WE#, CE# must be high during all address transitions. 2.A write occurs during the overlap of a low CE#, low WE#. 3.During a WE# controlled write cycle with OE# low, tWP must be greater than tWHZ + tDW to allow the drivers to turn off and data to be placed on the bus. 4.During this period, I/O pins are in the output state, and input signals must not be applied. 5.If the CE# low transition occurs simultaneously with or after WE# low transition, the outputs remain in a high impedance state. 6.tOW and tWHZ are specified with CL = 5pF. Transition is measured ±500mV from steady state. Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 6 ® LY61L2568 256K X 8 BIT HIGH SPEED CMOS SRAM Rev. 0.4 DATA RETENTION CHARACTERISTICS PARAMETER SYMBOL TEST CONDITION VCC for Data Retention VDR CE# ≧ VCC - 0.2V VCC = 2.0V Normal Data Retention Current IDR CE# ≧ VCC - 0.2V Others at 0.2V or VCC - 0.2V 20/25LL See Data Retention Chip Disable to Data tCDR Waveforms (below) Retention Time Recovery Time tR tRC* = Read Cycle Time MIN. 2.0 - TYP. 0.5 MAX. 3.6 1 UNIT V mA - 5 40 µA 0 - - ns tRC* - - ns DATA RETENTION WAVEFORM VDR ≧ 2.0V Vcc Vcc(min.) Vcc(min.) tCDR CE# VIH tR CE# ≧ Vcc-0.2V VIH Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 7 ® LY61L2568 256K X 8 BIT HIGH SPEED CMOS SRAM Rev. 0.4 PACKAGE OUTLINE DIMENSION θ 44-pin 400mil TSOP-Ⅱ Package Outline Dimension SYMBOLS A A1 A2 b c D E E1 e L ZD y Θ DIMENSIONS IN MILLMETERS MIN. NOM. MAX. 1.20 0.05 0.10 0.15 0.95 1.00 1.05 0.30 0.45 0.12 0.21 18.212 18.415 18.618 11.506 11.760 12.014 9.957 10.160 10.363 0.800 0.40 0.50 0.60 0.805 0.076 o o o 3 6 0 DIMENSIONS IN MILS MIN. NOM. MAX. 47.2 2.0 3.9 5.9 37.4 39.4 41.3 11.8 17.7 4.7 8.3 717 725 733 453 463 473 392 400 408 31.5 15.7 19.7 23.6 31.7 3 o o o 0 3 6 Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 8 ® LY61L2568 256K X 8 BIT HIGH SPEED CMOS SRAM Rev. 0.4 ORDERING INFORMATION LY61L2568 U V - WW XX Y Z Z : Packing Type Blank : Tube or Tray T : Tape Reel Y : Temperature Range Blank : (Commercial) 0°C ~ 70°C XX : Power Type LL : Ultra Low Power WW : Access Time(Speed) V : Lead Information L : Green Package U : Package Type M : 44-pin 400 mil TSOP-II Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 9 ® LY61L2568 Rev. 0.4 256K X 8 BIT HIGH SPEED CMOS SRAM THIS PAGE IS LEFT BLANK INTENTIONALLY. Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 10