MARKTECH MT5470-UYS

3Northway Lane North Latham,New York 12110.
Tollfree:1.800.984.5337
Phone:1.518.956.2980
Fax:1.518.785.4725
Http://www.marktechopto.com
SPECIFICATION
PART NO. : MT5470-UYS
5.2×4.6mm OVAL LED LAMP
ATTENTION
OBSERVE PRECAUTION
FOR HANDLING
ELECTRO STATIC
SENSITIVE
DEVICES
5.2×4.6mm OVAL LED
LAMP
MT5470-UYS
Description
This yellow lamp is made with AlGaInP/Si chip and yellow diffused epoxy
resin.
24.0 MIN.
1.5 TYP.
3.6 0.5
0.5 MAX.
1.0
1.2
7.8
5.2
4.6
2.54 0.1
A
K
Notes:
1. All dimensions are in mm.
2. Tolerance is ± 0.25mm unless otherwise noted.
Description
LED Chip
Part No.
MT5470-UYS
Material
Emitting Color
AlGaInP/Si
Yellow
Lens Color
Yellow diffused
VER.: 01 Date: 2007/03/22 Page: 1/5
5.2×4.6mm OVAL LED
LAMP
MT5470-UYS
Absolute Maximum Ratings at Ta=25℃
Parameter
Symbol
Rating
Unit
Power Dissipation
PD
130
mW
Reverse Voltage
VR
5
V
D.C. Forward Current
If
50
mA
Reverse (Leakage) Current
Ir
100
μA
If(Peak)
200
mA
Operating Temperature Range
Topr
-40 to +95
℃
Storage Temperature Range
Tstg
-40 to +100
℃
Soldering Temperature(1.6mm from body)
Tsol
Electrostatic discharge
ESD
Peak Current(1/10Duty Cycle,0.1ms Pulse Width.)
Dip Soldering : 260℃ for 5 sec.
Hand Soldering : 350℃ for 3 sec.
6000
V
Electrical and Optical Characteristics:
Parameter
Symbol
Condition
Min.
Typ.
Luminous Intensity
IV
If=20mA
770
1300
Forward Voltage
Vf
If=20mA
2.1
Peak Wavelength
λp
If=20mA
591
Dominant Wavelength
λd
If=20mA
Reverse (Leakage) Current
Ir
Vr=5V
VERTICAL
2θ1/2
If=20mA
HORIZONTAL
2θ1/2
If=20mA
70
∆λ
If=20mA
15
584
589
Max.
Unit
mcd
2.6
V
nm
596
nm
100
µA
40
ViewingAngle
deg
Spectrum Line Halfwidth
nm
Notes:1. The datas tested by IS tester.
2. Customer’s special requirements are also welcome.
VER.: 01 Date: 2007/03/22 Page: 2/5
5.2×4.6mm OVAL LED
LAMP
MT5470-UYS
Typical Electrical / Optical Characteristics Curves :
Relative Luminous Intensity(mcd)
Forward Current IF(mA)
50
40
30
20
10
1.2
1.6
2.0
2.4
2.8
2000
1600
1200
800
400
3.2
0.0
Applied Voltage (V)
FORWARD CURRENT VS.APPLIED VOLTAGE
30.0
FORWARD CURRENT VS. LUMINOUS INTENSITY
0°
100
Forward Current IF(mA)
20.0
10.0
Forward Current (mA)
20°
10°
30°
80
VERTICAL
HORIZONTAL
R j-pin=240℃/W
40°
60
1.0
40
50°
0.9
60°
0.8
20
70°
80°
90°
R j-a=500 ℃/W
0
20
40
60
Temperature (℃)
80
100
FORWARD CURRENT VS. AMBIENT TEMPERATURE
0.7
0.5
0.3
0.1
0.2
0.4
0.6
RADIATION DIAGRAM
VER.: 01 Date: 2007/03/22 Page: 3/5
MT5470-UYS
5.2×4.6mm OVAL LED
LAMP
Specifications for Bin Grading:
Iv(mcd)
BIN
MIN.
MAX.
S
770
1100
T
1100
1520
U
1520
2130
Specifications for Vf Group:
Vf(V)
Group
MIN.
MAX.
V1
1.6
1.8
V2
1.8
2.0
V3
2.0
2.2
V4
2.2
2.4
V5
2.4
2.6
*Majority VF bins are highlighted in Yellow.
Specifications for Wavelength Group:
λD(nm) @20mA
Group
MIN.
MAX.
X2
584
587
X3
587
590
X4
590
593
X5
593
596
VER.: 01 Date: 2007/03/22 Page: 4/5
MT5470-UYS
5.2×4.6mm OVAL LED
LAMP
Precautions:
TAKE NOTE OF THE FOLLOWING IN USE OF LED
1.
Temperature in use
Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with
high light transparency is used; therefore, additives to improve the heat resistance or moisture
resistance (silica gel , etc) which are used for semiconductor products such as transistors
cannot be added to the resin.
Consequently, the heat resistant ability of the resin used for LED is usually low; therefore,
please be careful on the following during use.
Avoid applying external force, stress, and excessive vibration to the resins and terminals at
high temperature. The glass transition temperature of epoxy resin used for the LED is
approximately 120-130℃.
At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or
more compared to that at normal temperature and the resin is softened.
If external force or stress is applied at that time, it may cause a wire rupture.
2.
Soldering
Please be careful on the following at soldering.
After soldering, avoided applying external force, stress, and excessive vibration until the
products go to cooling process (normal temperature), <Same for products with terminal leads>
(1)
Soldering measurements:
Distance between melted solder side to bottom of resin shall be 1.6mm or longer.
(2)
Dip soldering :
Pre-heat: 90℃ max. (Backside of PCB), Within 60 seconds.
Solder bath: 260±5℃ (Solder temperature), Within 5 seconds.
(3)
3.
Hand soldering: 350℃ max. (Temperature of soldering iron tip), Within 3 seconds.
Insertion
Pitch of the LED leads and pitch of mounting holes need to be same.
4.
Others
Since the heat resistant ability of the LED resin is low, SMD components are used on the same
PCB, please mount the LED after adhesive baking process for SMD components. In case
adhesive baking is done after LED lamp insertion due to a production process reason, make
sure not to apply external force, stress, and excessive vibration to the LED and follow the
conditions below.
Baking temperature: 120℃ max.
Baking time: Within 60 seconds.
If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down
the LED to normal temperature.
VER.: 01 Date: 2007/03/22 Page: 5/5