RECTRON GDSGA0-B00E

GDSGA0-500E
GDSGA0-700E
GDSGA0-900E
GDSGA0-B00E
RECTRON
SEMICONDUCTOR
TECHNICAL SPECIFICATION
STANDARD GPP CHIP - 100MIL
PRODUCT SPECIFICATIONS
CHIPS FOR STD GPP/SOLDERING TYPE
TYPE: GDSGA0 SERIES
CHIP APPEARANCE
75mil
CHIP DIMENSIONS
GDSGA0-700E
GDSGA0-900E GDSGA0-B00E
CHIP SIZE
100 x 100 mils
Contact area
75 x 75 mils
Total CHIP THICKNESS
11 mils
SOLDERABLE
METALLIZATION
Ni / Au
100mil
11mil
10.2mil
GDSGA0-500E
FEATURES
* Silicon chip with Boron / Phosphorus dopants
* Solderable metallization Ni / Au
* Glass passivated junction
SYMBOL
RATINGS
Maximum Recurrent Peak Reverse Voltage
VR
GDSGA0-500E
400
GDSGA0-700E
GDSGA0-900E
GDSGA0-B00E
UNITS
600
800
1000
Volts
Maximum Average Forward Rectified Current
at Derating Case Temperature
IO
3
Amps
Maximum Instantaneous Forward Voltage at 3A DC
VF
1.1
Volts
Maximum Average Reverse Current
at Rated DC Blocing Voltage
Operating Temperature Range
Storage Temperature Range
@ TA=25OC
@ TA=100OC
IR
5
300
uAmps
TJ
150
0
C
T STG
-55 to + 150
0
C
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