RMT Ltd Thermoelectric Module Datasheet Performance Parameters ΔTmax K Type Qmax W 1MD10-037-XX Imax A Umax V AC R Ohm H mm h mm 0.60 1.65 0.8 1MD10-037-xx (N=37) 1MD10-037-08 72 15.2 5.8 4.5 Performance data are given at 300K, vacuum Technical Drawing Options available A. TEC Assembly: Solder SnSb (Tmelt=230°C) C. Ceramics Surface Options D. Thermistor (optional) 1. Blank ceramics Can be mounted to cold side 2. Metallized: ceramics edge. Calibration 2.1 Ni / Sn(Bi) B. Ceramics: is available. 2.2 Gold plating 1.Pure Al2O3(100%) 3. Metallized and pre-tinned: 2.Alumina (Al2O3- 96%) E. Terminal wires 3.1 Solder 94 (PbSnBi, Tmelt=94°C) 1. Pre-tinned Copper 3.2 Solder 117 (In-Sn, Tmelt=117°C) 2. Insulated Wires 3.3 Solder 138 (Sn-Bi, Tmelt=138°C) 100% Al2O3 used as standard 3. Insulated Color Coded 3.4 Solder 183 (Pb-Sn, Tmelt=183°C) 4. Wire Bonding Pads 53 Leninskij prosp. Moscow 119991 Russia, ph: +7-499-132-6817, fax: +7-499-783-3664, web: www.rmtltd.ru Copyright 2010. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice. Page 1 of 2 Performance Plots 1MD10-037-08 C.O.P Voltage, V Temperature difference, K RMT Ltd Temperature difference, K Thermoelectric Module Datasheet Color Legend: Imax, 0.8 Imax, 0.6 Imax, 0.4 Imax Application Tips 1. Never heat TE module more than 200˚C (TEC assembled at 230˚C). 2. Never use TE module without attached heat sink at hot (bottom) side. 3. Connect TE module to DC power supply according to polarity. 4. Do not apply DC current higher than Imax. Installation 1. Mechanical Mounting. TEC is placed between two heat exchangers . This construction is fixed by screws or in another mechanical way. It is suitable for large modules (with dimensions 30x30mm and larger). Miniature types require other assembling methods in most cases. 2. Soldering. This method is suitable for a TE module with metallized outside surfaces. RMT provides this option and also makes pre-tinning for TE modules. 3. Glueing. It is an up-to-date method that is used by many customers due to availability of glues with good thermoconductive properties. A glue is usually based on some epoxy compound filled with some thermoconductive material such as graphite or diamond powders, silver, SiN and others. The application of a specific type depends on application features and the type of a TE module. Object being cooled Object being cooled TEC TEC 1 3 2 Screw mounting Heatsink Soldering Heatsink Gluing 53 Leninskij prosp. Moscow 119991 Russia, ph: +7-499-132-6817, fax: +7-499-783-3664, web: www.rmtltd.ru Copyright 2010. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice. Page 2 of 2