CX9VSM CRYSTAL 32 kHz to 160 kHz Ultra-Miniature, Low Profile Surface Mount Quartz Crystal ™ DESCRIPTION Designed and manufactured in the USA, the CX9V quartz crystal is available in frequencies from 32 kHz to 160 kHz. Using micro-machining processes, this surface-mountable crystal is hermetically sealed within a ultra-miniature ceramic package to ensure high stability and low aging. Tight calibration and high frequency/temperature stability make the CX9V ideally suited for all low frequency applications. actual size side view Glass Lid Shown PACKAGE DIMENSIONS FEATURES Ultra-miniature, surface mount design (4.1mm x 1.5mm) Low profile (typically 0.80mm) A Available with glass or ceramic lid TOP BOTTOM Hermetically sealed ceramic package D High shock and vibration survival Excellent aging characteristics B Designed for low power applications C Full military testing available TYP. Designed and manufactured in the USA APPLICATIONS Medical Pacemaker, defibrillator, and other implantables Medical instruments inches mm inches mm A 0.160 4.10 0.170 4.32 B 0.060 1.50 0.068 1.73 C - - D 0.031 0.79 DIM “C” Industrial, Computer, & Communications MAX. DIM GLASS LID see below 0.038 0.97 CERAMIC LID MAX inches mm inches mm Smart card SM1 0.035 0.89 0.038 0.97 Down hole instrumentation SM2 0.036 0.91 0.039 0.99 Transponder / Animal migration SM3 0.037 0.94 0.040 1.02 Process instrumentation SUGGESTED LAND PATTERN Military & Aerospace Airborne hybrid GRID COURTYARD Navigational computer 0.180[4.70] Real time clock 0.132[3.40] INCHES[mm] EQUIVALENT CIRCUIT C0 0.080 [2.10] 1 L1 C1 R1 0.048[1.30] 0.084[2.10] 10157 - Rev A IS O RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de YS 90 01 ERT T E M C IFIC T A N IO S R1 Motional Resistance L1 Motional Inductance C1 Motional Capacitance C0 Shunt Capacitance 2 SPECIFICATIONS TERMINATIONS Specifications are typical at 25OC unless otherwise noted. Specifications are subject to change without notice. 32.768 kHz 100 kHz Designation SM1 SM2 SM3 Motional Resistance R1(kΩ) 70 19 Motional Capacitance C1 (fF) 2.2 1.0 Quality Factor Q (k) 27 80 Shunt Capacitance C0 (pF) 1.1 0.84 9 5 20 16 Load Capacitance (pF)* Turning Point (oC)** PACKAGING OPTIONS CX9VSM -Tray Pack -16mm tape, 7” or 13” reels Per EIA 481 (see data sheet 10109) Standard Calibration Tolerance*** + _ 30 ppm, + _ 100 ppm, + _ 1000 ppm Glass Lid: + + _ _ Ceramic Lid: 100 ppm, 1000 ppm, +_ 10000 ppm 0.5 µW MAX Drive Level Termination Gold Plated Nickel, Solder Plated Nickel, Solder Dipped CONVENTIONAL CMOS PIERCE OSCILLATOR CIRCUIT Temperature Coefficient (k) -0.035 ppm/OC2 Aging, first year 5 ppm Shock, survival 5,000 G peak, 0.3 ms, 1/2 sine Vibration, survival 20 G RMS, 10-2,000 Hz random Operating Temp. Range -10OC to +70OC (Commercial) -40OC to +85OC (Industrial) -55OC to +125OC (Military) Rf Storage Temp. Range -55OC to +125OC Max Process Temperature 260OC for 20 sec. BUFFER AMPLIFIER CG Note: Deviation in frequency (f) @ temperature (T) from frequency (fO) @ turning point temperature (TO); CX9 RA OSC Freq (fO ) CD f-fO = k(T-T )2 o fO * Other load capacitance values available ** Other temperatures available *** Tighter tolerances available HOW TO ORDER CX9VSM CRYSTALS CX9V S “S” if special or custom design. Blank if Std. C C = Ceramic Lid Blank = Glass Lid SM1 100.0K, 100 Frequency K = kHz Calibration Tolerance @ 25OC (in ppm) SM1 = Gold Plated SM2 = Nickel, Solder Plated SM3 = Nickel, Solder Dipped / M Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified IS O RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de YS 90 01 ERT T E M C IFIC T A N IO S 10157 - Rev A