SY BZT52C3V3

Surface mount zener diode
FEATURES
Pb
z
Planar die construction.
500mW power dissipation on ceramic
PCB.
General purpose, medium current.
z
Ideally suited for automated assembly processes.
z
z
BZT52C2V4-BZT52C51
Lead-free
APPLICATIONS
z
Zener diode.
z
Ultra-small surface mount package.
SOD-123
ORDERING INFORMATION
Type No.
Marking
Package Code
BZT52C2V4-BZT52C51
See table 2
SOD-123
MAXIMUM RATING @ Ta=25℃ unless otherwise specified
Characteristic
Symbol
Value
Unit
VF
0.9
V
Power Dissipation
Pd
500
mW
Thermal resistance,junction to ambient air
RθjA
305
℃/W
Junction temperature
Tj
150
℃
Storage temperature range
Tstg
-65-150
℃
Forward Voltage
@ IF=10mA
Notes: 1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm2
2. Short duration test pulse used to minimize self-heating effect.
3. When provided, otherwise, parts are provided with date code only, and type number
identifications appears on reel only.
4. f = 1KHz
www.shunyegroup.com
Surface mount zener diode
BZT52C2V4-BZT52C51
ELECTRICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified
Type
Marking
Number
Code
Maximum Zener
Zener Voltage Range
VZ@IZT
Impedance
IZT
Nom(V)
Min(V)
Max(V)
mA
ZZT@IZT
ZZK@IZK
Ω
Maximum
Typical
Reverse
Temperature
Current
Coefficient@
IZTC mV/℃
Test
Current
IZTC
IZK
IR
@VR
mA
μA
V
Min
Max
mA
BZT52C2V4
WX
2.4
2.2
2.6
5
100
600
1.0
50
1.0
-3.5
0
5
BZT52C2V7
W1
2.7
2.5
2.9
5
100
600
1.0
20
1.0
-3.5
0
5
BZT52C3V0
W2
3.0
2.8
3.2
5
95
600
1.0
10
1.0
-3.5
0
5
BZT52C3V3
W3
3.3
3.1
3.5
5
95
600
1.0
5.0
1.0
-3.5
0
5
BZT52C3V6
W4
3.6
3.4
3.8
5
90
600
1.0
5.0
1.0
-3.5
0
5
BZT52C3V9
W5
3.9
3.7
4.1
5
90
600
1.0
3.0
1.0
-3.5
0
5
BZT52C4V3
W6
4.3
4.0
4.6
5
90
600
1.0
3.0
1.0
-3.5
0
5
BZT52C4V7
W7
4.7
4.4
5.0
5
80
500
1.0
3.0
2.0
-3.5
0
5
BZT52C5V1
W8
5.1
4.8
5.4
5
60
480
1.0
2.0
2.0
-2.7
1.2
5
BZT52C5V6
W9
5.6
5.2
6.0
5
40
400
1.0
1.0
2.0
-2
2.5
5
BZT52C6V2
WA
6.2
5.8
6.6
5
10
150
1.0
3.0
4.0
0.4
3.7
5
BZT52C6V8
WB
6.8
6.4
7.2
5
15
80
1.0
2.0
4.0
1.2
4.5
5
BZT52C7V5
WC
7.5
7.0
7.9
5
15
80
1.0
1.0
5.0
2.5
5.3
5
BZT52C8V2
WD
8.2
7.7
8.7
5
15
80
1.0
0.7
5.0
3.2
6.2
5
BZT52C9V1
WE
9.1
8.5
9.6
5
15
100
1.0
0.5
6.0
3.8
7.0
5
BZT52C10
WF
10
9.4
10.6
5
20
150
1.0
0.2
7.0
4.5
8.0
5
BZT52C11
WG
11
10.4
11.6
5
20
150
1.0
0.1
8.0
5.4
9.0
5
BZT52C12
WH
12
11.4
12.7
5
25
150
1.0
0.1
8.0
6.0
10.0
5
BZT52C13
WI
13
12.4
14.1
5
30
170
1.0
0.1
8.0
7.0
11.0
5
BZT52C15
WJ
15
13.8
15.6
5
30
200
1.0
0.1
10.5
9.2
13.0
5
BZT52C16
WK
16
15.3
17.1
5
40
200
1.0
0.1
11.2
10.4
14.0
5
BZT52C18
WL
18
16.8
19.1
5
45
225
1.0
0.1
12.6
12.4
16.0
5
BZT52C20
WM
20
18.8
21.2
5
55
225
1.0
0.1
14.0
14.4
18.0
5
BZT52C22
WN
22
20.8
23.3
5
55
250
1.0
0.1
15.4
16.4
20.0
5
BZT52C24
WO
24
22.8
25.6
5
70
250
1.0
0.1
16.8
18.4
22.0
5
BZT52C27
WP
27
25.1
28.9
2
80
300
0.5
0.1
18.9
21.4
25.3
2
BZT52C30
WQ
30
28.0
32.0
2
80
300
0.5
0.1
21.0
24.4
29.4
2
BZT52C33
WR
33
31.0
35.0
2
80
325
0.5
0.1
23.1
27.4
33.4
2
BZT52C36
WS
36
34.0
38.0
2
90
350
0.5
0.1
25.2
30.4
37.4
2
BZT52C39
WT
39
37.0
41.0
2
130
350
0.5
0.1
27.3
33.4
41.2
2
BZT52C43
WU
43
40.0
46.0
5
100
700
1.0
0.1
32
10.0
12.0
5
BZT52C47
WV
47
44.0
50.0
5
100
750
1.0
0.1
35
10.0
12.0
5
BZT52C51
WW
51
48.0
54.0
5
100
750
1.0
0.1
38
10.0
12.0
5
www.shunyegroup.com
Surface mount zener diode
BZT52C2V4-BZT52C51
TYPICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified
www.shunyegroup.com
Surface mount zener diode
BZT52C2V4-BZT52C51
PACKAGE OUTLINE
Plastic surface mounted package
SOD-123
SOD-123
K
B
Dim
Min
Max
A
1.4
1.8
B
2.55
2.85
C
A
D
H
E
C
1.15 Typical
D
0.5
0.6
E
0.3
0.4
H
0.02
0.10
J
J
K
0.1 Typical
3.55
3.85
All Dimensions in mm
SOLDERING FOOTPRINT
Unit : mm
PACKAGE
INFORMATION
Device
Package
Shipping
BZT52C2V4-BZT52C51
SOD-123
3000/Tape&Reel
www.shunyegroup.com