TAK CHEONG SEM IC O N DU C TO R 500 mW DO-35 Hermetically Sealed Glass – High Voltage Switching Diodes Absolute Maximum Ratings Symbol Parameter Value Units 250 V -65 to +200 °C Operating Junction Temperature +175 °C Average Rectified Forward Current Non-repetitive Peak Forward Current Pulse Width = 1.0 Second Pulse Width = 1.0 µsecond 200 mA 1.0 4.0 A A VRRM Maximum Repetitive Reverse Voltage TSTG Storage Temperature Range TJ IF (AV) IFSM AXIAL LEAD DO35 TA = 25°C unless otherwise noted DEVICE MARKING DIAGRAM L BA Vx x L : Logo Device Code : TCBAVxx These ratings are limiting values above which the serviceability of the diode may be impaired. Thermal Characteristics Symbol PD RθJA Value Units Power Dissipation Parameter 500 mW Thermal Resistance, Junction to Ambient 300 °C/W Specification Features: DO-35 Package (JEDEC) Through-Hole Device Type Mounting Hermetically Sealed Glass Cathode Compression Bonded Construction Anode All external surfaces are corrosion resistant and leads are readily solderable RoHS Compliant ELECTRICAL SYMBOL Solder hot dip Tin (Sn) lead finish Cathode indicated by polarity band Electrical Characteristics Symbol BV IR VF TRR TA = 25°C unless otherwise noted Parameter Breakdown Voltage Reverse Leakage Current Forward Voltage Reverse Recovery Time Test Condition Limits Unit Min Max 120 --- Volts TCBAV20 200 --- Volts TCBAV21 250 --- Volts TCBAV19 IR=100µA TCBAV19 VR=100V --- 100 nA TCBAV20 VR=150V --- 100 nA TCBAV21 VR=200V --- 100 nA IF=100mA --- 1.0 Volts IF=200mA --- 1.25 Volts --- 50 nS --- 5.0 pF IF=IR=30mA RL=100Ω IRR=3mA C Capacitance VR=0V, f=1MHZ October 2006 / B Page 1 TCBAV19/TCBAV20/TCBAV21 ® ® TAK CHEONG SEM IC O N DU C TO R Package Outline Package Case Outline DO-35 DO-35 DIM Millimeters Inches Min Max Min Max A 0.46 0.55 0.018 0.022 B 3.05 5.08 0.120 0.200 C 25.40 38.10 1.000 1.500 D 1.53 2.28 0.060 0.090 Notes: 1. 2. All dimensions are within JEDEC standard. DO35 polarity denoted by cathode band. This datasheet presents technical data of Tak Cheong’s Switching Diodes. Complete specifications for the individual devices are provided in the form of datasheets. A comprehensive Selector Guide is included to simplify the task of choosing the best set of components required for a specific application. For additional information, please visit our website http://www.takcheong.com. Although information in this datasheet has been carefully checked, no responsibility for the inaccuracies can be assumed by Tak Cheong. Please consult your nearest Tak Cheong’s sales office for further assistance. Tak Cheong reserves the right to make changes without further notice to any products herein to further improve reliability, function or design, cost and productivity. TAK CHEONG ® and are registered trademarks of Tak Cheong Electronics (Holdings) Co., Ltd. October 2006 / B Page 2