tm TE CH T6323A 300mA Voltage Regulator FEATURES • Wide Input Range: 2.5V to 5.5V • Available Output Voltages: 1.5V / 1.8V / 2.5V / 2.8V / 3.0 / 3.3V • Low-Noise for RF Application • Quick Start-Up (Typically 50us) • Fast Response in Line/Load Transient • Standby Current : <0.01uA • TTL-Logic-Controlled Shutdown Input • Low Temperature Coefficient • Current Limiting Protection • Thermal Shutdown Protection • High Power Supply Rejection Ratio • Only 1uF Output Capacitor Required for Stability • Available Package (Lead-Free) : SOT-23-3, SOT-23-5, SOT-223, SOT-89, SC-82 GENERAL DESCRIPTION The T6323A is designed for portable RF and wireless applications with demanding performance and space requirements. The T6323A performance is optimized for batterypowered systems to deliver ultra low noise and low quiescent current. Regulator ground current increases only slightly in dropout, further prolonging the battery life. The T6323A also works with low-ESR ceramic capacitors, reducing the amount of board space necessary for power applications, critical in hand-held wireless devices. The T6323A consumes less than 0.01uA in shutdown mode and has fast turn-on time less than 50us. The other features include ultra low dropout voltage, high output accuracy, current limiting protection, and high ripple rejection ratio. Available in the SOT-23-3, SOT-23-5, SOT223, SC-82 and SOT -89 packages. PART NUMBER EXAMPLES T 6 3 2 3 A -1 8 A X G a APPLICATIONS • CDMA/GSM Cellular Handsets • Battery-Powered Equipment • Laptop, Palmtops, Notebook Computers • Hand-Held Instruments • PCMCIA Cards • Portable Information Appliances b c d a : Device Number b : Output Voltage 15=1.5V,18=1.8V, 25=2.5V, 28=2.8V, 30=3.0V, 33=3.3V c : Pin-out / function and Package AX=SOT-23-5(A), BX=SOT-23-5(B), CX=SOT-23-3(A), DX=SOT-89(A), EX=SOT-89(B), FX=SOT223(A), AU=SC-82(A) d : G=lead-free TM Technology Inc. reserves the right to change products or specifications without notice. P. 1 Publication Date: MAR. 2008 Revision: B tm TE CH T6323A PIN ARRANGEMENT (Top view) SOT23-5(A) T6323A-XXAXG VIN 1 GND 2 EN 3 5 SOT23-5(B) T6323A-XXBXG VOUT 4 NC SOT-89(A) T6323A-XXDXG 1 NC 2 GND 3 5 VIN GND 1 3 4 VOUT SOT-89(B) T6323A-XXEXG GND V IN 1 2 3 V IN 3 SOT-223(A) T6323A-XXFXG V OUT 2 VIN 2 VOUT GND 1 V OUT 3 V OUT GND 2 V IN 1 EN SOT23-3(A) T6323A-XXCXG SC-82(A) T6323A-XXAUG EN 1 4 VIN GND 2 3 VOUT PIN DESCRIPTION SYMBOL VOUT GND EN VIN NC DESCRIPTION Voltage output Ground pin Enable signal, high active Input supply pin. No connect TM Technology Inc. reserves the right to change products or specifications without notice. P. 2 Publication Date: MAR. 2008 Revision: B tm TE CH T6323A Absolute Maximum Ratings Supply Voltage …………………………………………………………. -0.3V to 6V EN Pin Input Voltage …………………………………………………… -0.3V to 6V Operating Juction Temperature ………………………………………… -55°C to +150°C Operating temperature range …………………………………………… -40°C to +125°C Storage temperature range ……………………………………………… -65°C to +150°C Lead temperature (soldering, 10sec) …………………………………… 260°C Power Dissipation, PD @ TA = 25°C : SOT-23-3/SOT-23-5………………………………………………………400mW SC-82 …………………………………………………………………… 300mW SOT-89 / SOT-223 ………………………………………………………500mW Package Thermal Resistance : SOT-23-3/SOT-23-5, θJA ……………………………………… …………250°C/W SC-82, θJA …………………………………………………… ……………333°C/W SOT-89 /SOT-223, θJA …………………………………………………… 200°C/W ESD Susceptibility HBM (Human Body Mode) …………………………………………………5KV MM (Machine Mode) …………………………………………………… …400V Electrical Characteristics ( VIN = VOUT + 1V, TA = 25°C, CIN = COUT = 1uF, unless otherwise noted ) Symbol VIN Description Conditions Min. Typ. Max Input Voltage ∆VOUT Output Voltage Accuracy IOUT Output current ILIM Current Limit IOUT=1mA Unit 2.5 - 5.5 V -2 - +2 % - 300 - mA RLoad =1 ohm EN≥ 1.2V, IOUT=0mA - 450 - mA - 90 130 uA ∆VLINE Line Regulation VIN= VOUT +1V to 5.5V, IOUT =1mA - 0.3 - % ∆VLOAD Load Regulation 1mA< IOUT < 300mA - 0.6 - % ISHDN Shutdown current EN = VIN - 0.01 1 uA IIBEN EN Input Bias Current EN = VIN or GND - 0 100 nA VENH EN Input High Voltage 1.2 - - V VENL EN Input Low Voltage - - 0.4 V f =100Hz - -60 - f =10KHz - -30 - - 165 - °C - 30 - °C IQ Quiescent Current PSRR Power Supply Rejection Rate COUT=1uF, IOUT =100mA TSD ∆TSD Thermal Shutdown Temperature Thermal Shutdown Temperature Hysteresis TM Technology Inc. reserves the right to change products or specifications without notice. P. 3 dB Publication Date: MAR. 2008 Revision: B tm TE CH T6323A Applications Information Like any voltage regulator, the external capacitors used for the T6323A must be carefully selected for regulator stability and performance. Using a capacitor whose value is > 1uF on the T6323A input and the amount of capacitance can be increased without limit. The input capacitor must be located a distance of not more than 0.5 inch from the input pin of the IC and returned to a clean analog ground. Any good quality ceramic or tantalum can be used for this capacitor. The capacitor with larger value and lower ESR (equivalent series resistance) provides better PSRR and linetransient response. The output capacitor must meet both requirements for minimum amount of capacitance and ESR in all voltage regulator application. The T6323A is designed specifically to work with low ESR ceramic output capacitor in space-saving and performance consideration. Using a ceramic capacitor whose value is at least 1uF with ESR is more than 20mΩ on the T6323A output ensures stability. The T6323A still works well with output capacitor of other types due to the wide stable ESR range. Output capacitor of larger capacitance can reduce noise and improve load transient response, stability and PSRR.The output capacitor should be located with in 0.5 inch from the VOUT pin of the T6323A and returned to a clean analog ground. Enable Function The T6323A features an voltage regulator enable/disable function. To assure the T6323A voltage regulator will switch on, the EN turn on control level must be greater than 1.2V. The T6323A voltage regulator will go into shutdown mode when the voltage on the EN pin falls below 0.4V. The T6323A equips a quick-discharge function to protect the system. When the regulator is turned off by EN pin, the internal MOSFET between VOUT and GND will be turned on to discharge output voltage quickly. If the enable function is not needed in a specific application, it may be tied to GND/VIN to keep the voltage regulator in a continuously on state. TM Technology Inc. reserves the right to change products or specifications without notice. P. 4 Publication Date: MAR. 2008 Revision: B tm TE CH T6323A Thermal Considerations Thermal protection limits power dissipation in T6323A. When the operating junction temperature exceeds 165°C, the OTP circuit starts the thermal shutdown function and turns the pass element off. The pass element turns on again after the junction temperature cools by 30°C. For continuous operation, do not exceed absolute maximum operatiog junction temperature 125°C. The power dissipation definition in device is shown as following formula : PD = (VIN - VOUT) x IOUT + VIN x IQ The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction to ambient. The maximum power dissipation can be calculated by following formula : PD(MAX) = ( TJ(MAX) - TA ) / θJA Where TJ(MAX) is the maximum operating junction temperature 125°C, TA is the ambient temperature and the θJA is the junction to ambient thermal resistance. For recommended operating conditions specification of T6323A, where TJ(MAX) is the maximum junction temperature of the die (125°C) and TA is the maximum ambient temperature. The junction to ambient thermal resistance θJA is layout dependent) for SOT-23-3/SOT-23-5 package is 250°C/W, SC-82 package is 333°C/W, SOT-89/ SOT-223 package is 300°C/W on standard JEDEC 51-3 thermal test board. The maximum power dissipation at TA = 25°C can be calculated by following formula : PD(MAX) = (125°C - 25°C)/250 = 400mW (SOT-23-3/SOT-23-5) PD(MAX) = (125°C - 25°C)/333 = 300mW (SC-82) PD(MAX) = (125°C - 25°C)/200 = 500mW (SOT-89/ SOT-223) The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θJA For T6323A packages. TM Technology Inc. reserves the right to change products or specifications without notice. P. 5 Publication Date: MAR. 2008 Revision: B tm TE CH T6323A PACKAGE DIMENSIONS SOT-23-3 B B1 B2 A1 A C1 C C2 F D I Symbol A A1 B B1 B2 C C1 C2 D E F G H I Min. 2.60 1.40 2.70 0.95 0.90 0 0.30 0.08 Dimension in mm Typ. 2.80 1.575 2.85 1.90(BSC) 0.95(BSC) 1.20 1.10 0.075 0.40 0.45 0.15 0.60(REF) 0~8° 5~15° G H E Max. 3.00 1.60 3.00 Min. 0.102 0.055 0.106 1.45 1.30 0.150 0.037 0.035 0 0.60 0.22 0.012 0.003 TM Technology Inc. reserves the right to change products or specifications without notice. Dimension in inch Typ. 0.110 0.062 0.112 0.075(BSC) 0.037(BSC) 0.047 0.043 0.003 0.015 0.018 0.006 0.023(REF) 0~8° 5~15° P. 6 Max. 0.118 0.063 0.118 0.057 0.051 0.06 0.023 0.009 Publication Date: MAR. 2008 Revision: B tm TE CH T6323A PACKAGE DIMENSIONS SOT-23-5 B B 1 B 2 A 1 C 1 A C C 2 F D I Symbol A A1 B B1 B2 C C1 C2 D E F G H I Min. 2.60 1.40 2.70 0.95 0.90 0 0.30 0.08 Dimension in mm Typ. 2.80 1.575 2.85 1.90(BSC) 0.95(BSC) 1.20 1.10 0.075 0.40 0.45 0.15 0.60(REF) 0~8° 5~15° G H Max. 3.00 1.60 3.00 Min. 0.102 0.055 0.106 1.45 1.30 0.150 0.037 0.035 0 0.60 0.22 0.012 0.003 TM Technology Inc. reserves the right to change products or specifications without notice. Dimension in inch Typ. 0.110 0.062 0.112 0.075(BSC) 0.037(BSC) 0.047 0.043 0.003 0.015 0.018 0.006 0.023(REF) 0~8° 5~15° P. 7 E Max. 0.118 0.063 0.118 0.057 0.051 0.06 0.023 0.009 Publication Date: MAR. 2008 Revision: B tm TE CH T6323A PACKAGE DIMENSIONS SC-82 B B 1 A 1 D A D 1 C 1 C C 2 F Symbol A A1 B B1 C C1 C2 D D1 E F G H I G H I Min. 1.80 1.15 1.80 0.80 0.80 0.00 0.15 0.35 0.20 0.08 Dimension in mm Typ. 1.30(BSC) 0.65(REF) 0~8° 5~15° Max. 2.45 1.35 2.20 Min. 0.071 0.045 0.071 1.10 1.00 0.10 0.40 0.50 0.46 0.26 0.031 0.031 0.000 0.006 0.014 0.008 0.003 TM Technology Inc. reserves the right to change products or specifications without notice. Dimension in inch Typ. 0.051(BSC) 0.025(REF) 0~8° 5~15° P. 8 E Max. 0.096 0.053 0.087 0.043 0.039 0.004 0.016 0.020 0.018 0.010 Publication Date: MAR. 2008 Revision: B tm TE CH T6323A PACKAGE DIMENSIONS SOT-89 D POLISHED(2X) D1 E B1 1 3 2 H L C B 10'(2X) A e e1 Symbol A B B1 C D D1 E H e e1 L Dimension in mm Min. Max. 1.40 1.60 0.44 0.56 0.36 0.48 0.35 0.44 4.40 4.60 1.35 1.83 2.29 2.60 3.94 4.25 1.50 BSC 3.00 BSC 0.89 1.2 Dimension in inch Min. Max. 0.055 0.063 0.017 0.022 0.014 0.019 0.013 0.017 0.173 0.181 0.053 0.072 0.090 0.102 0.155 0.167 0.059 BSC 0.118 BSC 0.035 0.047 TM Technology Inc. reserves the right to change products or specifications without notice. P. 9 Publication Date: MAR. 2008 Revision: B tm TE CH T6323A PACKAGE DIMENSIONS SOT-223 B B1 A1 A e e1 C1 C F C2 H D Symbol A A1 B B1 C C1 C2 D E e e1 F H Min. 6.70 3.30 6.30 2.90 1.50 0.02 0.66 0.75 0.23 Dimension in mm Typ. 7.00 3.50 6.50 3.00 1.60 0.70 2.30 4.6 0.30 0~10° Max. 7.30 3.70 6.70 3.10 1.80 1.70 0.10 0.84 0.35 E Min. 0.263 0.129 0.248 0.114 0.059 0.001 0.025 0.029 0.009 TM Technology Inc. reserves the right to change products or specifications without notice. Dimension in inch Typ. 0.275 0.137 0.255 0.118 0.062 0.027 0.090 0.181 0.011 0~10° P. 10 Max. 0.287 0.145 0.263 0.122 0.70 0.066 0.003 0.033 0.013 Publication Date: MAR. 2008 Revision: B