AAVID 372924M02000

Standard Products Found
Page 1 of 3
Push Pin Attachment Method
Part Number: 372924M02000
(Vis Number: 028086)
This part is in stock and available for immediate delivery:
Contact your local sales rep
BGA Surface Interface Heat Sink Finish Part Class
All
None
Green Anodize
A
Features and Benefits
• Configurations are available for a wide range of BGA package sizes
• All Heat Sinks utilize industry standard hole patterns
• Plastic push pins are standard for 1.5mm pc board and 2.5mm
thick BGA packages. Consult Aavid Thermalloy for versions
available with brass push pins for more rugged applications or
thicker devices
• Minimal diameter holes are necessary for mounting to PC Board
(see PCB Hole Pattern)
• Each Heat Sink utilizes a phase change pad as the interface for
optimal performance, unless otherwise noted
Width
Length
Height
37.4mm 37.4mm 6mm
Fin Thickness Fin Thickness
# of fins
# of fins
Base Thickness
Across Width Across Length
across width across length
1.4mm
1.5mm
1.3mm
9
9
Mechanical Outline Drawing
Unless otherwise shown, tolerances are ±0.38(±.015)
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2/25/2003
Standard Products Found
Page 2 of 3
Recommended PCB Hole Pattern
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2/25/2003
Standard Products Found
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Thermal Performance
*θn **θf
32.6 9.91
*Natural convection thermal resistance is based on a 75 °C heat sink temperature rise.
**Forced convection thermal resistance based on an entering 1.0 m/s (200 lfm) airflow.
Due to various heat dissipation paths within a BGA device, please test the heat sink in your application.
This data sheet represents only one of a broad range of products we make to cool electronics.
Our representatives can help you configure a complete cooling solution for your individual applications.
Visit us at www.aavidthermalloy.com • [email protected] • ©2002 Aavid Thermalloy, LLC
http://www.aavidthermalloy.com/bin/bga_disp_print.pl?partnum=028086&attach=&size=...
2/25/2003