AT5510 Preliminary Product Information 120mA, Current Sinking, 10-bit I2C DAC for VCM Driver Features General Description • 120mA current sink. • 2-wire (I2C-compatible) serial interface • 10-bit resolution • Integrated current sense resistor • 2.7V to 3.6V power supply • Power-down mode • Power-down to 0.5µA typical • Power-on reset • DFN-8 & WLCSP package The AT5510 is a single 10-bit DAC with 120mA output current sink capability. It operates from 2.7V to 5.5V supply. The DAC is controlled via 2-wire (I2C-compatible) serial interface that operates at clock rates up to 400KHz. Applications • Auto-focus of camera modules • Shutters • Lens covers • Image stabilization The AT5510 provides a power-down mode. The power-down mode can be enabled by PD pin or I2C interface. At power-down mode, the output current reduces to 1µA maximum. The AT5510 is designed for autofocus, image stabilization, and optical zoom applications in camera modules. The AT5510 is available in DFN-8 or WLCSP package. Block Diagram Aimtron reserves the right without notice to change this circuitry and specifications. 2F, No.10, Prosperity RD. II, Science-Based Industrial Park, Hsinchu 300,Taiwan, R.O.C. Tel: 886-3-563-0878 Fax: 886-3-563-0879 WWW: http://www.aimtron.com.tw 9/20/2007 REV:0.2 Email: [email protected] 1 AT5510 Preliminary Product Information 120mA, Current Sinking, 10-bit I2C DAC for VCM Driver Pin Configuration AGND VCC DGND DGND SDA SCL PD SINK DFN-8 SDA SCL AGND VCC SINK PD WLCSP Ordering Information Part number AT5510N_GRE AT5510G_PBF Package DFN-8, Green WLCSP-6, PBF Marking 5510,▲▲▲▲▲▲ MA△ ▲▲▲▲▲▲: Date Code △:serial number *For more marking information, contact out sales representative directly 2F, No.10, Prosperity RD. II, Science-Based Industrial Park, Hsinchu 300,Taiwan, R.O.C. Tel: 886-3-563-0878 Fax: 886-3-563-0879 WWW: http://www.aimtron.com.tw 9/20/2007 REV:0.2 Email: [email protected] 2 AT5510 Preliminary Product Information 120mA, Current Sinking, 10-bit I2C DAC for VCM Driver Pin Description DFN-8 Symbol Pin No. PD DGND SDA SCL DGND VCC AGND SINK 1 2 3 4 5 6 7 8 Descript Power down control pin Digital power ground I2C interface signal input I2C interface signal input Digital power ground Power supply Analog power ground Output current sink WLCSP-6 Symbol Pin No. PD SDA SCL SINK AGND VCC A1 A2 A3 B1 B2 B3 Descript Power down control pin I2C interface signal input I2C interface signal input Output current sink Analog power ground Power supply 2F, No.10, Prosperity RD. II, Science-Based Industrial Park, Hsinchu 300,Taiwan, R.O.C. Tel: 886-3-563-0878 Fax: 886-3-563-0879 WWW: http://www.aimtron.com.tw 9/20/2007 REV:0.2 Email: [email protected] 3 AT5510 Preliminary Product Information 120mA, Current Sinking, 10-bit I2C DAC for VCM Driver Absolute Maximum Ratings *1 (Ta=+250C) Parameter Condition Power Supply Voltage, VCC AGND to DGND SCL, SDA to DGND PD to DGND SINK to AGND Output Sink Current Thermal Resistance from Junction to Ambient θJA *2 — — — — — — DFN-8 Rated Value Min. Max. -0.3 +6.0 -0.3 +0.3 -0.3 VCC -0.3 VCC -0.3 VCC+0.3 -120 -50 WLCSP(4-Layer PCB) -- TBD — — — HBM MM -40 -65 -- +85 +150 150 Operating temperature TA Storage temperature Junction temperature TJ, MAX ESD Susceptibility *3 2 200 Unit V V V V V mA 0 C/W 0 C/W 0 C C 0 C KV V 0 1. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. The accuracy of θJA will be based on PC board layout. See details of “Thermal Considerations” in Application Information. 3. Devices are ESD sensitive. Handling precaution recommended. The Human Body model is a 100pF capacitor discharged through a 1.5KΩ resistor into each pin. Recommended Operating Conditions (Ta=+250C) Parameter Power supply voltage SCL, SDA voltage PD voltage Operating temperature* Symbol VCC VSCL VSDA VPD TA Values Unit Min. 2.5 Typ. -- Max. 5.5 Ｖ -- -- VCC Ｖ --20 -+25 VCC +85 Ｖ °C *Using X5R or X7R input capacitors. 2F, No.10, Prosperity RD. II, Science-Based Industrial Park, Hsinchu 300,Taiwan, R.O.C. Tel: 886-3-563-0878 Fax: 886-3-563-0879 WWW: http://www.aimtron.com.tw 9/20/2007 REV:0.2 Email: [email protected] 4 AT5510 Preliminary Product Information 120mA, Current Sinking, 10-bit I2C DAC for VCM Driver Electrical Characteristics (VCC= 2.7~3.6V,Ta =+25℃ , unless otherwise noted. ) Parameter Power Supply Power supply *1 Input current *2 Symbol VCC ICC ICCPD Condition ISINK,PD PD=1 To 10% of FS, coming out of power-down mode Unit Min. Typ. Max. 2.7 -2.3 0.5 3.6 3 2 V mA µA --- 3 120 --- mA mA -- 80 -- nA -- 200 -- µs PD=1 Output Characteristics Min. sink current ISINK,MIN Max. sink current ISINK,MAX Output current during PD Values Power-up time tPU PD Input Input current IPD -- -- ±1 µA H level input voltage VPDH 1.26 -- VCC +0.3 V L level input voltage SCA, SDL Input *3 VPDL -0.3 -- 0.54 V H level input voltage VINH 1.26 -- VCC +0.3 V L level input voltage Input current VINL IIN -0.3 -- --- 0.54 ±1 V µA Input hysteresis VSYST 0.05* VCC -- -- V -- -- 50 ns 10 bits resolution 117uA/LSB --- 117 10 ±1.5 --±4 µA Bits LSB Guaranteed monotonic over all codes -- -- ±1 LSB ------ 0 0.5 ±0.6 10 ±0.2 ------ mA mA % of µA/°C LSB/°C Glitch rejection DC Performance Least significant bit Resolution Integral nonlinearity LSB -INL Differential nonlinearity DNL Zero code error Offset error @Code 16 Gain error Offset error drift *3 Gain error drift *3 -Ios ---- All 0s loads to DAC 1. The maximum of VCC can achieve up to 5.5V. But if VCC is over 3.6V, the total electrical characteristics may not meet the specification above. 2. ICC specification is valid for all DAC codes. 3. Guaranteed by design and characterization. 2F, No.10, Prosperity RD. II, Science-Based Industrial Park, Hsinchu 300,Taiwan, R.O.C. Tel: 886-3-563-0878 Fax: 886-3-563-0879 WWW: http://www.aimtron.com.tw 9/20/2007 REV:0.2 Email: [email protected] 5 AT5510 Preliminary Product Information 120mA, Current Sinking, 10-bit I2C DAC for VCM Driver Typical Application Circuit VCC 2.7V~3.6V 6 10uF /6.3V VCM VCC SINK 0.1uF 1 ENABLE PD AT5510 SDA 3 SCL 4 I2C MASTER DEVICE AGND SDA DGND SCL DGND 8 7 5 2 I2C SLAVE DEVICE Figure 1 The output current can be set as ISINK = Ios + CODE * LSB, where ISINK is output driving current, Ios is the offset error and CODE is the data bits (D0-D9) shown in Table 2. The popular examples are shown in Table 1. Table 1: Code transfers to ISINK CODE Serial Data Bit ISINK (mA) 33 0x180210 4.36 252 0x180FC0 29.98 765 0x182FD0 90.01 1023 0x183FF0 120.19 * Ios=0.5mA, LSB=117µA. 2F, No.10, Prosperity RD. II, Science-Based Industrial Park, Hsinchu 300,Taiwan, R.O.C. Tel: 886-3-563-0878 Fax: 886-3-563-0879 WWW: http://www.aimtron.com.tw 9/20/2007 REV:0.2 Email: [email protected] 6 AT5510 Preliminary Product Information 120mA, Current Sinking, 10-bit I2C DAC for VCM Driver Terminology z Resolution Resolution of DAC is the number of bits to present the analog output signal. z Integral nonlinearity (INL) Integral nonlinearity is a measurement of the maximum deviation, in LSB, from a straight line passing through the endpoints of the DAC transfer function. A typical INL vs. code plot is shown in Figure 3. z Differential nonlinearity (DNL) Differential nonlinearity is the difference between the measured and ideal 1 LSB change by any two adjacent code. A typical DNL vs. code plot is shown in Figure 4. z Zero-code error Zero-code error is a measurement of the output error when zero code (0x0000) is loaded to the DAC register. The zero-code error is positive in AT5510. z Gain error Gain error is a measurement of the span error of the DAC. It is the deviation in slope of the DAC transfer characteristic from the ideal, expressed as percent of the full-scale range. z Offset error Offset error is a measurement of the difference between actual output current (ISINK) and ideal output current (Io). It is measured on the AT5510 with Code 16 loaded into the DAC register. 2F, No.10, Prosperity RD. II, Science-Based Industrial Park, Hsinchu 300,Taiwan, R.O.C. Tel: 886-3-563-0878 Fax: 886-3-563-0879 WWW: http://www.aimtron.com.tw 9/20/2007 REV:0.2 Email: [email protected] 7 AT5510 Preliminary Product Information 120mA, Current Sinking, 10-bit I2C DAC for VCM Driver Application Information Power-down mode AT5510 can be operated in power-down mode when PD pin is at high voltage level (1.26V~VCC) or soft power-down enable. The PD bit (R15) of input register in serial data can be written 1 to power down or 0 to enable AT5510. Table 2: Power-down mode DATA BYTE Bit 15 = 1 DATA BYTE Bit 15 = 0 PD = H PD = L Power-down Power-down Power-down Power-up Serial Interface Data Form The AT5510 is controlled using I2C 2-wire serial protocol. Data can be written to or read from the DAC at data rates up to 400KHz. The address byte consists of a 7-bit address plus a read/write bit shown in Figure 5. The address of the AT5510 is 0001100. The read/write bit is 0 if data is written to the AT5510, and 1 if data is read from the AT5510. The data byte has 16-bit shown in table 3, but not all bits of the input register data are used. The Bit 15 is power-down function; Bit 14 is unused; Bit 13 to Bit 4 correspond to the DAC data bits; Bit 3 to Bit 0 are unused. The details about write and read operation are shown in Figure 5 and 6, respectively. 2F, No.10, Prosperity RD. II, Science-Based Industrial Park, Hsinchu 300,Taiwan, R.O.C. Tel: 886-3-563-0878 Fax: 886-3-563-0879 WWW: http://www.aimtron.com.tw 9/20/2007 REV:0.2 Email: [email protected] 8 AT5510 Preliminary Product Information 120mA, Current Sinking, 10-bit I2C DAC for VCM Driver Figure 5: Write operation Figure 6: Read operation Table 3: Data format Serial Data-Words Serial Data Bits Input Register Function Serial Data-Words Serial Data Bits Input Register Function SD7 R15 PD SD6 R14 -- SD5 R13 D9 SD7 R7 D3 SD6 R6 D2 SD5 R5 D1 High Byte SD4 SD3 R12 R11 D8 D7 Low Byte SD4 SD3 R4 R3 D0 -- SD2 R10 D6 SD1 R9 D5 SD0 R8 D4 SD2 R2 -- SD1 R1 -- SD0 R0 -- * PD = soft power-down; -- = don’t care; D9 to D0 =DAC data. 2F, No.10, Prosperity RD. II, Science-Based Industrial Park, Hsinchu 300,Taiwan, R.O.C. Tel: 886-3-563-0878 Fax: 886-3-563-0879 WWW: http://www.aimtron.com.tw 9/20/2007 REV:0.2 Email: [email protected] 9 AT5510 Preliminary Product Information 120mA, Current Sinking, 10-bit I2C DAC for VCM Driver Package Outline : DFN-8 SYMBOL A A3 b D D1 E E1 e L MILLIMETERS MIN MAX 0.75 0.90 0.203 BSC. 0.25 0.35 3.00 BSC. 2.20 2.40 3.00 BSC. 1.40 1.60 0.65 BSC. 0.30 0.40 NOTES - 2F, No.10, Prosperity RD. II, Science-Based Industrial Park, Hsinchu 300,Taiwan, R.O.C. Tel: 886-3-563-0878 Fax: 886-3-563-0879 WWW: http://www.aimtron.com.tw 9/20/2007 REV:0.2 Email: [email protected] 10 AT5510 Preliminary Product Information 120mA, Current Sinking, 10-bit I2C DAC for VCM Driver Package Outline : WLCSP SYMBOL A A1 A2 b E D D1 E1 ZD ZE DIMENSION(mm) MIN NOM MAX 0.45 0.5 0.55 0.09 0.1 0.11 0.35 0.4 0.45 0.29 0.3 0.31 1.38 1.42 1.46 1.2 1.24 1.28 0.5 0.5 0.35 0.19 NOTES 2F, No.10, Prosperity RD. II, Science-Based Industrial Park, Hsinchu 300,Taiwan, R.O.C. Tel: 886-3-563-0878 Fax: 886-3-563-0879 WWW: http://www.aimtron.com.tw 9/20/2007 REV:0.2 Email: [email protected] 11 AT5510 Preliminary Product Information 120mA, Current Sinking, 10-bit I2C DAC for VCM Driver Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Large Body Small Body Pkg. thickness Pkg. thickness <2.5mm or Pkg. ≥2.5mm or Pkg. 3 volume ≥350mm3 volume <350mm Average ramp-up rate (TL to TP) Preheat -Temperature Min(Tsmin) -Temperature Max (Tsmax) -Time (min to max)(ts) Tsmax to TL -Ramp-up Rate Time maintained above: -Temperature (TL) -Time (tL) Peak Temperature(TP) Time within 5°C of actual Peak Temperature (tP) Ramp-down Rate Time 25°C to Peak Temperature 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 3°C/second max. 183°C 60-150 seconds 217°C 60-150 seconds 225+0/-5°C 10-30 seconds 240+0/-5°C 10-30 seconds 6°C/second max. 6 minutes max. Pb-Free Assembly Large Body Small Body Pkg. thickness Pkg. thickness <2.5mm or Pkg. ≥2.5mm or Pkg. 3 volume ≥350mm3 volume <350mm 245+0/-5°C 10-30 seconds 250+0/-5°C 20-40 seconds 6°C/second max. 8 minutes max. *All temperatures refer to topside of the package, measured on the package body surface. 2F, No.10, Prosperity RD. II, Science-Based Industrial Park, Hsinchu 300,Taiwan, R.O.C. Tel: 886-3-563-0878 Fax: 886-3-563-0879 WWW: http://www.aimtron.com.tw 9/20/2007 REV:0.2 Email: [email protected] 12